RC5532D [FAIRCHILD]

High Performance Dual Low Noise Operational Amplifier; 高性能双路低噪声运算放大器
RC5532D
型号: RC5532D
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

High Performance Dual Low Noise Operational Amplifier
高性能双路低噪声运算放大器

运算放大器
文件: 总12页 (文件大小:62K)
中文:  中文翻译
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www.fairchildsemi.com  
RC5 5 3 2 /RC5 5 3 2 A  
Hig h P e rfo rm a n c e Du a l Lo w No is e  
Op e ra t io n a l Am p lifie r  
Features  
Description  
• Small signal bandwidth – 10 MHz  
• Output drive capability – 600W, 10 VRMS  
• Input noise voltage – 5 nV/ Hz  
• DC voltage gain – 50,000  
• AC voltage gain – 2200 at 10 KHz  
• Power bandwidth – 140 KHz  
The RC5532 is a high performance, dual low noise opera-  
tional amplifier. Compared to standard dual operational  
amplifiers, such as the RC747, it shows better noise perfor-  
mance, improved output drive capability, and considerably  
higher small-signal and power bandwidths.  
This makes the device especially suitable for application in  
high quality and professional audio equipment, instrumenta-  
tion, control circuits, and telephone channel amplifiers.  
The op amp is internally compensated for gains equal to one.  
If very low noise is of prime importance, it is recommended  
that the RC5532A version be used which has guaranteed  
noise specifications.  
• Slew rate – 8 V/mS  
• Large supply voltage range – ±3V to ±20V  
Block Diagram  
Output A  
–Input A  
+V  
S
Output B  
B
A
+Input A  
–Input B  
+Input B  
–V  
S
65-5532-01  
Rev. 1.1.2  
RC5532/RC5532A  
PRODUCT SPECIFICATION  
Pin Assignments  
+V  
S
Output (A)  
–Input (A)  
+Input (A)  
1
2
3
4
8
+V  
S
8
Output (A)  
1
Output (B)  
–Input (B)  
7
7
Output (B)  
–Input (B)  
+Input (B)  
6
2
–Input (A)  
6
5
5
3
–V  
S
+Input (A)  
+Input (B)  
4
–V  
65-5532-03  
65-5532-02  
S
Absolute Maximum Ratings  
(beyond which the device may be damaged)  
1
Parameter  
Min.  
Typ.  
Max.  
±22  
±V  
Units  
V
Supply Voltage  
Input Voltage  
V
S
Differential Input Voltage  
0.5  
468  
833  
658  
125  
175  
150  
125  
70  
V
P T < 50°C  
D A  
PDIP  
mW  
CerDIP  
SOIC  
Junction Temperature  
PDIP  
°C  
CerDIP, TO-99  
Storage Temperature  
Operating Temperature  
-65  
-55  
0
°C  
°C  
RM5532/A  
RC5532/A  
Lead Soldering Temperature (10 sec)  
300  
°C  
Notes:  
1. Functional operation under any of these conditions is NOT implied.  
2. For supply voltages less than ±15V, the absolute maximum input voltage is equal to the supply voltage.  
3. Short circuit to ground on one amplifier only.  
Operating Conditions  
Parameter  
Min.  
Typ.  
45  
Max.  
Units  
q
JC  
Thermal resistance  
CerDIP  
TO-99  
PDIP  
°C/W  
50  
q
Thermal resistance  
160  
150  
190  
6.25  
8.33  
5.26  
°C/W  
JA  
CerDIP  
TO-99  
PDIP  
For T > 50°C Derate at  
mW/°C  
A
CerDIP  
TO-99  
2
PRODUCT SPECIFICATION  
RC5532/RC5532A  
DC Electrical Characteristics  
(V = ±15V and T = +25˚C unless otherwise noted)  
S
A
RM5532/5532A  
RC5532/5532A  
Typ. Max. Units  
Parameters  
Test Conditions  
Over Temperature  
Over Temperature  
Over Temperature  
Over Temperature  
Min. Typ. Max. Min.  
Input Offset Voltage  
Input Offset Current  
Input Bias Current  
Supply Current  
0.5  
2.0  
3.0  
100  
200  
400  
700  
11  
0.5  
4.0  
5.0  
mV  
mV  
nA  
nA  
nA  
nA  
mA  
mA  
V
10  
150  
200  
800  
1000  
16  
200  
6.0  
200  
6.0  
13  
22  
Input Voltage Range  
±12  
±13  
±12  
±13  
Common Mode  
Rejection Ratio  
80  
100  
70  
100  
dB  
Power Supply  
Rejection Ratio  
86  
100  
80  
100  
dB  
Large Signal  
Voltage Gain  
R ³ 2 KW, V  
OUT  
= ±10V  
50  
25  
25  
15  
100  
50  
V/mV  
L
Over Temperature  
R ³ 600W, V = ±10V  
40  
15  
50  
L
OUT  
Over Temperature  
R ³ 600W  
20  
10  
Output Voltage Swing  
±12  
±15  
±12  
±13  
±16  
±13  
300  
±12  
±15  
±13  
±16  
V
L
R = 600W, V = ±18V  
L
S
R ³ 2kW  
L
Input Resistance  
(Diff. Mode)  
300  
38  
KW  
Short Circuit Current  
38  
mA  
Notes:  
1. Diodes protect the inputs against over-voltage. Therefore, unless current-limiting resistors are used, large currents will flow  
if the differential input voltage exceeds 0.6V. Maximum input current should be limited to ±10mA.  
2. Over Temperature: RM = 55 °C £ T £ 125°C; RC = 0°C £ T £70°C  
A
A
Electrical Characteristics  
(V = ±15V and T = +25°C )  
S
A
RC/RM5532  
RC/RM5532A  
Typ. Max. Units  
Parameters  
Test Conditions  
Min. Typ. Max. Min.  
Input Noise Voltage Density  
Input Noise Current Density  
Channel Separation  
F
F
F
F
= 30 Hz  
= 1 kHz  
= 30 Hz  
= 1 kHz  
8.0  
5.0  
2.7  
0.7  
110  
8.0  
5.0  
2.7  
0.7  
110  
12  
nV/  
ÖHz  
O
O
O
O
6.0  
pA/  
ÖHz  
F = 1 kHz, R = 5 kW  
dB  
S
3
RC5532/RC5532A  
PRODUCT SPECIFICATION  
AC Electrical Characteristics  
(V = ±15V and T = +25°C )  
S
A
Parameters  
Test Conditions  
A = 30 dB Closed Loop, F = 10 kHz,  
Min.  
Typ.  
Max.  
Units  
Output Resistance  
0.3  
W
V
R = 600W  
L
Overshoot  
Unity Gain, V = 100 mV  
IN p-p  
10  
%
C = 100 pF, R = 600W  
L
L
Gain  
F = 10 KHz  
2.2  
10  
V/mV  
MHz  
V/mS  
KHz  
Gain Bandwidth Product  
Slew Rate  
C = 100 pF, R = 600W  
L
L
8.0  
140  
100  
Power Bandwidth  
V
V
= ±10V  
OUT  
= ±14V, R = 600W, V = ±18V  
KHz  
OUT  
L
S
Test Circuits  
3
+V  
S
1
V
OUT  
5532A  
R
S
2
25½  
2
3
600½  
RF  
V
1
IN  
5532A  
V
OUT  
1K  
V
IN  
600½  
100 pF  
R
E
100 pF  
–V  
S
65-5532-04  
65-5532-05  
Figure 1. Closed Loop Frequency Response  
Figure 2. Follower, Transient Response  
4
PRODUCT SPECIFICATION  
RC5532/RC5532A  
Typical Performance Characteristics  
120  
60  
40  
20  
0
VS  
=
15V  
TA = +25 C  
RS = 10  
AV = 40 dB  
W
RF = 10 K  
RE = 100 W  
W
80  
40  
0-  
W
RF = 9 KW RE = 1 k  
RF = 1 K W RE  
=
40  
10  
-20  
100  
1K  
10K 100K  
F (Hz)  
1M  
10M  
1K  
10K 100K  
1M  
10M 100M  
1G  
F (Hz)  
Figure 3. Open Loop Gain vs. Frequency  
Figure 4. Closed Loop Gain vs. Frequency  
40  
30  
20  
10  
0
80  
VS  
=
15V  
VS  
=
15V  
60  
40  
20  
0
-55  
-25  
0
+25  
+50  
+75 +150  
100M  
100  
1K  
10K 100K  
1M  
10M  
F (Hz)  
TA ( C)  
Figure 5. Output Voltage Swing vs. Frequency  
Figure 6. Short Circuit Current vs. Temperature  
1.4  
12  
8
I
= 0  
VS  
=
15V  
oUT  
1.2  
0.8  
0.4  
0
4
0
-55  
-25  
0
+25  
+50  
+75 +150  
0
±10  
±20  
±30  
TA ( C)  
+VS/-VS (V)  
Figure 7. Supply Current vs. Supply Voltage  
Figure 8. Input Bias Current vs. Temperature  
5
RC5532/RC5532A  
PRODUCT SPECIFICATION  
Typical Performance Characteristics (continued)  
15  
10  
5
15  
10  
5
TA = +25 C  
TA = +25 C  
RL = 600W  
0
0
-5  
-5  
-10  
-15  
-10  
-15  
0
±5  
±15  
±20  
0
±5  
±15  
±20  
±10  
±10  
+VS/-VS (V)  
+VS/-VS (V)  
Figure 9. Output Voltage Swing vs. Supply Voltage  
Figure 10. Common Mode Input Range vs. Supply Voltage  
10  
8
140  
120  
100  
80  
VS  
=
15V  
6
4
TA = +25 C  
Output  
Input  
2
0
VS  
=
15V  
60  
40  
20  
0
-2  
-4  
-6  
-8  
-10  
TA = +25 C  
W
RL = 600  
AV = +1  
CL = 100 pF  
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5  
0
50  
100  
150 200  
Time (µS)  
Time (nS)  
Figure 11. Follower Large Signal Pulse Response  
Figure 12. Transient Response Output Voltage vs. Time  
100  
10  
1
VS  
=
15V  
TA = +25 C  
RS = 10  
AV = 40 dB  
W
0.1  
10  
100  
1K  
10K  
F (Hz)  
100K  
1M  
Figure 13. Input Noise Density vs. Frequency  
6
PRODUCT SPECIFICATION  
RC5532/RC5532A  
Notes:  
7
RC5532/RC5532A  
PRODUCT SPECIFICATION  
Notes:  
8
PRODUCT SPECIFICATION  
RC5532/RC5532A  
Mechanical Dimensions  
8-Lead Ceramic DIP Package  
Notes:  
Inches  
Millimeters  
Min. Max.  
Symbol  
Notes  
1. Index area: a notch or a pin one identification mark shall be located  
adjacent to pin one. The manufacturer's identification shall not be  
used as pin one identification mark.  
Min.  
Max.  
A
.200  
.023  
.065  
.015  
.405  
.310  
.36  
1.14  
.20  
5.08  
.58  
2. The minimum limit for dimension "b2" may be .023 (.58mm) for leads  
number 1, 4, 5 and 8 only.  
b1  
b2  
c1  
D
.014  
.045  
.008  
8
2, 8  
1.65  
.38  
3. Dimension "Q" shall be measured from the seating plane to the base  
plane.  
8
4
10.29  
7.87  
4. This dimension allows for off-center lid, meniscus and glass overrun.  
E
.220  
5.59  
4
5. The basic pin spacing is .100 (2.54mm) between centerlines. Each  
pin centerline shall be located within ±.010 (.25mm) of its exact  
longitudinal position relative to pins 1 and 8.  
5, 9  
7
e
.100 BSC  
.300 BSC  
2.54 BSC  
7.62 BSC  
eA  
L
.125  
.200  
.060  
3.18  
5.08  
1.52  
6. Applies to all four corners (leads number 1, 4, 5, and 8).  
Q
s1  
a
.015  
.005  
90¡  
.38  
.13  
90¡  
3
6
7. "eA" shall be measured at the center of the lead bends or at the  
centerline of the leads when "a" is 90¡.  
105¡  
105¡  
8. All leads – Increase maximum limit by .003 (.08mm) measured at the  
center of the flat, when lead finish applied.  
9. Six spaces.  
D
4
1
8
Note 1  
E
5
s1  
eA  
e
A
Q
c1  
a
L
b2  
b1  
9
RC5532/RC5532A  
PRODUCT SPECIFICATION  
Mechanical Dimensions (continued)  
8-Lead Plastic DIP Package  
Notes:  
Inches  
Millimeters  
Min. Max.  
Symbol  
Notes  
1. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
Min.  
Max.  
2. "D" and "E1" do not include mold flashing. Mold flash or protrusions  
shall not exceed .010 inch (0.25mm).  
A
.210  
.38  
5.33  
A1  
A2  
B
.015  
.115  
.014  
.045  
.008  
3. Terminal numbers are for reference only.  
.195  
.022  
.070  
.015  
2.93  
.36  
4.95  
.56  
4. "C" dimension does not include solder finish thickness.  
5. Symbol "N" is the maximum number of terminals.  
B1  
C
1.14  
.20  
1.78  
.38  
4
2
D
.348  
.005  
.300  
.240  
.430  
.325  
.280  
8.84  
.13  
10.92  
D1  
E
7.62  
6.10  
8.26  
7.11  
2
5
E1  
e
.100 BSC  
2.54 BSC  
eB  
L
.430  
.160  
10.92  
4.06  
.115  
2.92  
N
8¡  
8¡  
D
1
4
E1  
D1  
5
8
e
E
A2  
A
A1  
C
L
eB  
B1  
B
10  
PRODUCT SPECIFICATION  
RC5532/RC5532A  
Mechanical Dimensions (continued)  
8-Lead Metal Can IC Header Package  
øD  
Inches  
Millimeters  
Symbol  
Notes  
Min.  
Max.  
Min.  
Max.  
øD1  
A
.165  
.016  
.016  
.335  
.305  
.110  
.185  
.019  
4.19  
.41  
4.70  
.48  
øb  
1, 5  
1, 5  
F
L1  
øb1  
øD  
øD1  
øD2  
e
.021  
.375  
.335  
.41  
.53  
9.52  
8.51  
Q
A
8.51  
7.75  
2.79  
.160  
4.06  
L2  
.200 BSC  
.100 BSC  
5.08 BSC  
2.54 BSC  
e1  
F
.040  
.034  
1.02  
.86  
L
øb  
k
.027  
.69  
k1  
L
L1  
L2  
Q
a
.027  
.500  
.045  
.750  
.050  
.69  
12.70  
1.14  
19.05  
1.27  
2
1
1
1
BASE and  
SEATING  
PLANE  
REFERENCE  
PLANE  
.250  
.010  
45¡ BSC  
6.35  
.25  
45¡ BSC  
øb1  
.045  
1.14  
e
Notes:  
1. (All leads) øb applies between L1 & L2. øb1 applies between  
L2 & .500 (12.70mm) from the reference plane. Diameter is  
uncontrolled in L1 & beyond .500 (12.70mm) from the  
reference plane.  
e1  
øD2  
2. Measured from the maximum diameter of the product.  
3. Leads having a maximum diameter .019 (.48mm) measured in  
gauging plane, .054 (1.37mm) +.001 (.03mm) –.000 (.00mm)  
below the reference plane of the product shall be within  
.007 (.18mm) of their true position relative to a maximum width  
tab.  
4. The product may be measured by direct methods or by gauge.  
a
5. All leads – increase maximum limit by .003 (.08mm) when lead  
finish is applied.  
k
k1  
11  
RC5532/RC5532A  
PRODUCT SPECIFICATION  
Ordering Information  
Product Number  
RC5532D/RC5532AD  
RC5532N/RC5532AN  
RM5532D/RM5532AD  
RM5532D/883B  
Temperature Range  
0°C to +70°C  
Screening  
Commercial  
Commercial  
Commercial  
Military  
Package  
8 Pin Ceramic DIP  
8 Pin Plastic DIP  
0°C to +70°C  
-55°C to +125°C  
-55°C to +125°C  
-55°C to +125°C  
-55°C to +125°C  
-55°C to +125°C  
-55°C to +125°C  
8 Pin Ceramic DIP  
8 Pin Ceramic DIP  
8 Pin Ceramic DIP  
8 Pin TO-99 Metal Can  
8 Pin TO-99 Metal Can  
8 Pin TO-99 Metal Can  
RM5532AD/883B  
RM5532T/RM5532AT  
RM5532T/883B  
Military  
Commercial  
Military  
RM5532AT/883B  
Military  
Note:  
1. /883B suffix denotes MIL-STD-883, Par. 1.2.1 compliant device.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES  
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body,  
or (b) support or sustain life, and (c) whose failure to  
perform when properly used in accordance with  
instructions for use provided in the labeling, can be  
reasonable expected to result in a significant injury of the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be  
reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
Fairchild Semiconductor  
Corporation  
Fairchild Semiconductor  
Europe  
Fairchild Semiconductor  
Hong Kong Ltd.  
National Semiconductor  
Japan Ltd.  
Americas  
Fax: +49 (0) 1 80-530 85 86  
13th Floor, Straight Block,  
Ocean Center, 5 Canto Rd.  
Tsimshatsui, Kowloon  
Hong Kong  
Tel:81-3-5620-6175  
Fax:81-3-5620-6179  
Customer Response Center  
Tel:1-888-522-5372  
Email: europe.support@nsc.com  
Deutsch Tel: +49 (0) 8 141-35-0  
English Tel: +44 (0) 1 793-85-68-56  
Italy  
Tel: +39 (0) 2 57 5631  
Tel:+852 2737-7200  
Fax:+852 2314-0061  
www.fairchildsemi.com  
2/98 0.0m  
Stock#DS30005532  
Ó 1998 Fairchild Semiconductor Corporation  

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