TMC1175AN2B20 [FAIRCHILD]

ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24, DIP-24;
TMC1175AN2B20
型号: TMC1175AN2B20
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24, DIP-24

光电二极管 转换器
文件: 总20页 (文件大小:427K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
www.fairchildsemi.com  
TMC1175A  
Video A/D Converter  
8 bit, 40 Msps  
Features  
Description  
• 8-Bit resolution  
• 40 Msps conversion rate  
The TMC1175A analog-to-digital (A/D) converter employs  
a two-step flash architecture to convert analog signals into  
8-bit digital words at sample rates of up to 40 Msps  
(Megasamples per second). An integral Track/Hold circuit  
delivers excellent performance on signals with full-scale fre-  
quency components up to 12 MHz. Innovative architecture  
and submicron CMOS technology limit typical power dissi-  
pation to 100 mW.  
• Low power: 100mW at 20 Msps  
• Integral track/hold  
• Integral and differential linearity error 0.5 LSB  
• Single or dual +5 Volt supplies  
• Differential phase 0.5 degree  
• Differential gain 1.5%  
• Three-state TTL/CMOS-compatible outputs  
• Low cost  
Power may be derived from either single or dual +5V  
supplies. Internal voltage reference resistors allow self-bias  
operation. Input capacitance is very low, simplifying or  
eliminating input driving amplifiers. All digital three-state  
outputs are TTL- and CMOS-compatible.  
Applications  
• Video digitizing  
• VGA and CCD digitizing  
• LCD projection panels  
• Image scanners  
• Personal computer video boards  
• Multimedia systems  
The TMC1175A is available in 24-lead plastic SOIC, and  
28-lead J-lead PLCC packages. Performance specifications  
are guaranteed from -20°C to 75°C.  
• Low cost, high speed data conversion  
Block Diagram  
Coarse  
Quantizer  
Track/  
Hold  
V
IN  
VR+  
Digital  
Error-  
Corrector  
R
Reference  
Matrix  
T
D
7-0  
R
B
VR–  
Fine  
Quantizer  
OE  
CONV  
24453A  
REV. 1.3.3 2/28/02  
TMC1175A  
PRODUCT SPECIFICATION  
V
Functional Description  
DDA  
The TMC1175A 8-bit A/D converter uses a two-step archi-  
tecture to perform analog-to-digital conversion at rates up to  
40 Msps. The input signal is held in an integral track/hold  
stage during the conversion process. Operation is pipelined,  
with one input sample taken and one output word provided  
for each CONVert cycle.  
R+  
324  
VR+  
+2.6V  
R
T
The first step in the conversion process is a coarse 4-bit  
quantization. This determines the range of the subsequent  
fine 4-bit quantization step. To eliminate spurious codes, the  
fine 4-bit A/D quantizer output is gray-coded and converted  
to binary before it is combined with the coarse result to form  
a complete 8-bit result.  
RREF  
270Ω  
R
B
+0.6V  
VR–  
Analog Input and Voltage References  
The TMC1175A converts analog signals in the range R to  
R–  
81Ω  
B
R into digital data. Input signals outside that range produce  
T
“saturated” 00h or FFh output codes. The device will not be  
27010A  
damaged by signals within the range A  
GND  
to V .  
DDA  
Input voltage range is very flexible and extends from the +5  
Volt power supply to ground. Performance is specified over  
the optimom 2 volt input range: 0.6V to 2.6V. However, the  
part will function with a full-scale range from 1.0V to 5.0V.  
A reduced input range may simplify analog signal condition-  
ing circuitry, at the expense of additional noise sensitivity  
and reduced differential linearity. Increasing the range can  
improve differential linearity, but imposes a greater burden  
on the input signal conditioning circuitry.  
Figure 1. Reference Resistors  
at 5.0V, connecting VR+ to R and grounding  
With V  
DDA  
T
R
will provide an input range from 0.0V to 2.27V, while  
B
connecting R to V  
DDA  
and R to VR- produces a full scale  
B
T
range of 3.85V referenced to V . External resistors may  
DDA  
also be employed to provide arbitrary reference voltages, but  
they will not match the temperature coefficient of the on-  
chip resistors as well as R+ and R-, and will cause the con-  
verter transfer function to vary with temperature.  
In many applications, external voltage reference sources are  
connected to the R and R pins. R can be grounded. Gain  
and offset errors are directly related to the accuracy and sta-  
bility of the applied reference voltages.  
T
B
B
With this implementation, errors in the power supply voltage  
end up on the conversion data output.  
Because a two-step conversion process is employed, it is  
important that the references remain stable during the  
ENTIRE conversion process (two clock cycles). The refer-  
ence voltage can then be changed, but any conversion in  
progress during a reference change is invalid.  
Two reference pull-up and pull-down resistors connected to  
VR+ and VR– are provided internally for operation without  
external voltage reference circuitry (Figure 1). The reference  
voltages applied to R and R may be generated by connect-  
T
B
ing VR+ to R and VR- to R . The power supply voltage is  
T
B
divided by the on-chip resistors to bias the R and R points.  
T
B
This sets-up the converter for operation in its nominal range  
from 0.6V to 2.6V.  
2
REV. 1.3.3 2/28/02  
PRODUCT SPECIFICATION  
TMC1175A  
remain valid for t  
(Output Hold Time), satisfying any  
hold time requirement of the receiving circuit. The new data  
Table 1. Output Coding  
Input Voltage  
HO  
Output  
FF  
become valid t  
of CONV.  
(Output Delay Time) after this rising edge  
DO  
R + 1 LSB  
T
R
FF  
T
The outputs of the TMC1175A are CMOS- and TTL-com-  
patible, and are capable of driving four low-power Schottky  
TTL (54/74LS) loads. An Output Enable control, OE, places  
the outputs in a high-impedance state when HIGH. The out-  
puts are enabled when OE is LOW.  
R 1 LSB  
FE  
T
• • •  
• • •  
80  
R + 128 LSB  
B
R + 127 LSB  
B
7F  
Power and Ground  
To minimize noise injection into the analog section, V  
DDA  
• • •  
• • •  
01  
R + 1 LSB  
B
may be connected to a separate regulated +5 volt supply.  
may be connected to a digital supply. Power up  
R
00  
B
V
DDD  
sequence is immaterial. Latch-up will not occur.  
R 1 LSB  
00  
B
Note:  
1. LSB = (R R ) / 255  
A
and D pins should be connected to a common  
GND  
GND  
T
B
ground plane. For optimum performance treat analog and  
digital PWB traces as transmission lines. Route analog  
connections cleanly to the TMC1175A. Segregate digital  
connections and if necessary terminate clocks to eliminate  
ringing. Prevent digital returm currents from flowing across  
analog input sections of the TMC1175A.  
Digital Inputs and Outputs  
Sampling of the applied input signal takes place on the fall-  
ing edge of the CONV signal (Figure 2). The output word is  
delayed by 2 1/2 CONV cycles. It is then available after the  
rising edge of CONV. The previous data on the output  
t
STO  
Sample N+3  
Sample N  
Sample N+2  
V
IN  
Sample N+1  
t
PWH  
1/f  
S
t
PWL  
CONV  
t
DO  
t
HO  
D
ORP  
ORN  
7-0  
Hi-Z  
Data N3  
Data N2  
Data N1  
Data N  
t
t
ENA  
DIS  
OE  
24455A  
Figure 2. Conversion Timing  
REV. 1.3.3 2/28/02  
3
TMC1175A  
PRODUCT SPECIFICATION  
V(1)  
V(2)  
V(3)  
V(4)  
Analog input  
External Clock  
S (1) C (1) S (2) C (2) S (3) C (3) S (4) C (4)  
Upper comparators block  
Upper data  
MD (0)  
MD (1)  
MD (2)  
MD (3)  
Lower reference voltage  
RV (0)  
RV (1)  
RV (2)  
RV (3)  
C (3)  
Lower comparators A block  
Lower data A  
S (1)  
H (1)  
C (1) S (3)  
H (3)  
LD (-1)  
LD (1)  
H (0)  
C (0) S (2)  
H (2)  
C (2) S (4)  
H (94)  
LD(2)  
Lower comparators B block  
Lower data B  
LD(-2)  
LD(0)  
Out(-2)  
Out(-1)  
Out(0)  
Out(1)  
Digital output  
65-7568  
Figure 3. Internal Timing  
Pin Assignments  
OE  
1
2
24  
23  
D
R
GND  
D
GND  
B
D
D
D
D
D
D
D
D
3
22 VR–  
0
1
2
3
4
5
6
7
18  
17  
16  
15  
V
V
V
VR26  
4
21  
20  
19  
18  
17  
A
A
V
V
DDA  
DDA  
DDD  
GND  
GND  
IN  
R
27  
28  
1
5
B
D
6
GND  
N/C  
N/C  
7
DDA  
14 CONV  
OE  
2
8
R
T
V
DDD  
13  
12  
D
3
9
16 VR+  
GND  
D
D
0
4
7
10  
11  
15  
14  
13  
V
V
V
DDA  
DDA  
DDD  
V
DDD  
CONV 12  
M7 Package  
R3 Package  
24454A  
4
REV. 1.3.3 2/28/02  
PRODUCT SPECIFICATION  
TMC1175A  
Pin Descriptions  
Pin Number  
M7 R3  
Pin Name  
Inputs  
Pin Type Pin Function Description  
V
19  
17  
23  
20  
R R  
Analog Input. The input voltage conversion range lies between the  
voltages applied to the RT and RB pins.  
IN  
T
B
R
2.6V  
0.6V  
Reference Voltage Top Input. R is the top input to the reference  
T
T
B
resistor ladder. A DC voltage applied to R defines the positive end  
T
of the V conversion range.  
IN  
R
23  
27  
Reference Voltage Bottom Input. R is the bottom input to the  
B
reference resistor ladder. A DC voltage applied to R defines the  
B
negative end of the V conversion range.  
IN  
VR+  
16  
22  
1
19  
26  
2
Reference Voltage Top Source. VR+ is the internal pull-up  
reference resistor for self-bias operations.  
VR–  
Reference Voltage Bottom Source. VR- is the internal pull-down  
reference resistor for self-bias operations.  
OE  
CMOS Output Enable. (CMOS-compatible) When LOW, D are enabled.  
7-0  
When HIGH, D  
are in a high-impedance state.  
7-0  
CONV  
12  
14  
CMOS Convert (Clock) Input. (CMOS-compatible) V is sampled on the  
IN  
falling edge of CONV.  
Outputs  
D
7-0  
103  
129,  
74  
CMOS/ Data Outputs (D7 = MSB). Eight-bit CMOS- and TTL-compatible  
TTL  
digital outputs. Data is output following the rising edge of CONV.  
Power  
V
V
A
14, 15, 18 17, 18,  
21  
+5V  
+5V  
Analog Supply Voltage. Independent +5 volt power connection to  
analog comparator circuits.  
DDA  
DDD  
GND  
11, 13  
13, 16  
Digital Supply Voltage. Independent +5 volt power connection to  
digital error correction and output drivers.  
20, 21  
2, 24  
24, 25  
3, 28  
0.0V  
0.0V  
Analog Ground. Connect to the system analog ground plane.  
Digital Ground. Connect to the system analog ground plane.  
D
GND  
No Connect  
N/C  
1, 8, 15,  
22  
open  
Not Connected.  
Bandwidth Specification Notes  
The specification for bandwidth of an A/D converter is some-  
what different from the normal frequency-response specifi-  
cation used in amplifiers and filters. An understanding of the  
differences will help in selecting converters properly for par-  
ticular applications.  
Sampling involves an aperture time, the time during which  
the track/hold is trying to capture the input signal and settle  
on a dc value to hold. It is analogous to the shutter speed of a  
camera: the shorter the aperture (or faster the shutter) the less  
the signal will be blurred, and the less uncertainty there will  
be in the quantized value.  
A/D conversion comprises two distinct processes: sampling  
and quantizing. Sampling is “grabbing” a snapshot of the  
input signal and holding it steady for quantizing. The quan-  
tizing process is approximating the analog input, which may  
be any value within the conversion range, with its nearest  
numerical value. While sampling is a high-frequency pro-  
cess, quantizing operates on a dc signal, held steady by the  
track/hold circuit. Therefore, the sampling process is what  
relates to the dynamic characteristics of the converter.  
For example, a 10 MHz sinewave with a 1V peak amplitude  
(2Vp-p) has a maximum slew rate of 2πfA at zero crossing,  
or 62.8V/µs. With an 8-bit A/D converter, q (the quantization  
step size) = 2V/255 = 7.8mV. The input signal will slew one  
LSB in 124ps. To limit the error (and noise) contribution due  
to aperture effects to 1/2LSB, the aperture must be shorter  
than 62ps.  
REV. 1.3.3 2/28/02  
5
TMC1175A  
PRODUCT SPECIFICATION  
This is the primary reason that the signal to noise ratio drops  
off as full scale frequency increases. Note, also, that the slew  
rate is directly proportional to signal amplitude, A. A/Ds will  
handle lower-amplitude signals of higher bandwidth.  
sample on these pixel values, not on the slewing between  
pixels. During the aperture time, the A/D sees essentially a  
dc signal, and classic bandwidth considerations are not  
important. As long as the input circuit can slew and settle to  
the new value in the prescribed period, an accurate conver-  
sion will be made.  
All this is of particular interest in applications such as digi-  
tizing analog VGA RGB signals, or the output of a CCD  
imaging chip. These data are effectively pre-sampled: there  
is a period of rapid slewing from one pixel value to another,  
followed by a relatively stable dc level before the signal  
slews to the next pixel value. The goal is, of course, to  
The TMC1175A is capable of slewing a full 2V and settling  
between samples taken as little as 25ns apart, making it ideal  
for digitizing analog VGA and CCD outputs.  
Equivalent Circuits and Threshold Level  
V
V
DD  
DD  
p
p
Data or  
Control  
Input  
Output  
n
n
27011B  
GND  
27014B  
GND  
Figure 5. Equivalent Digital Output Circuit  
Figure 4. Equivalent Digital Input Circuit  
V
DDA  
tENA  
V
IN  
tDIS  
OE  
0.5V  
Three-State  
Outputs  
2.0V  
0.8V  
65-1175A-07  
0.5V  
High Impedance  
A
GND  
27052A  
Figure 7. Threshold Levels for Three-State Measurements  
Figure 6. Equivalent Analog Input Circuit  
6
REV. 1.3.3 2/28/02  
PRODUCT SPECIFICATION  
TMC1175A  
Absolute Maximum Ratings  
(beyond which the device may be damaged)1  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
V
Power Supply Voltages  
V
V
V
A
Measured to A  
Measured to D  
Measured to V  
Measured to D  
-0.5  
-0.5  
-0.5  
-0.5  
7.0  
7.0  
0.5  
0.5  
DDA  
DDD  
DDA  
GND  
GND  
GND  
DDD  
GND  
V
Digital Inputs  
Applied Voltage2  
Forced Current3,4  
Analog Inputs  
Applied Voltage2  
Forced Current3,4  
Outputs  
Applied Voltage2  
Forced Current3,4  
Short Circuit Duration  
Temperature  
Measured to D  
Measured to A  
Measured to D  
-0.5  
V
V
V
+ 0.5  
V
GND  
GND  
GND  
DDD  
-10.0  
10.0  
mA  
-0.5  
+ 0.5  
V
DDA  
-10.0  
10.0  
mA  
-0.5  
-6.0  
+ 0.5  
V
DDD  
6.0  
1
mA  
sec  
Single output in HIGH state to ground  
Operating, Ambient  
Junction  
-20  
-65  
110  
150  
150  
300  
220  
°C  
°C  
°C  
°C  
°C  
Storage  
Lead Soldering  
Vapor Phase Soldering  
Notes:  
10 seconds  
1 minute  
1. Functional operation under any of these conditions is NOT implied. Performance and reliability are guaranteed only if  
operating conditions are not exceeded.  
2. Applied voltage must be current limited to specified range.  
3. Forcing voltage must be limited to specified range.  
4. Current is specified as conventional current flowing into the device  
REV. 1.3.3 2/28/02  
7
TMC1175A  
PRODUCT SPECIFICATION  
.
Operating Conditions  
Parameter  
Min  
4.75  
4.75  
-0.1  
Nom  
5.0  
5.0  
0
Max  
5.25  
5.25  
0.1  
Units  
V
DDD  
V
DDA  
A
GND  
Digital Power Supply Voltage  
Analog Power Supply Voltage  
Analog Ground (Measured to  
V
V
V
D
GND  
)
f
t
t
Conversion Rate  
TMC1175A-20  
TMC1175A-30  
TMC1175A-40  
TMC1175A-20  
TMC1175A-30  
TMC1175A-40  
TMC1175A-20  
TMC1175A-30  
TMC1175A-40  
20  
30  
40  
Msps  
Msps  
Msps  
ns  
S
CONV Pulsewidth, HIGH  
CONV Pulsewidth, LOW  
15  
13  
12  
15  
12  
12  
2.0  
0
PWH  
PWL  
ns  
ns  
ns  
ns  
ns  
V
V
V
V
V
Reference Voltage, Top  
Reference Voltage, Bottom  
Reference Voltage Differential  
Analog Input Range  
2.6  
0.6  
V
V
RT  
RB  
DDA  
3.0  
V
V
1.0  
5.0  
V
RT- RB  
V
RB  
V
RT  
V
IN  
IH  
Input Voltage, Logic HIGH  
0.7 x  
V
V
DDD  
V
DDD  
V
Input Voltage, Logic LOW  
GND  
0.3 x  
V
IL  
V
DDD  
-4.0  
4.0  
I
I
Output Current, Logic HIGH  
Output Current, Logic LOW  
Ambient Temperature, Still Air  
mA  
mA  
°C  
OH  
OL  
T
A
-20  
75  
Electrical Characteristics  
Parameter  
Conditions  
Min  
Typ1 Max Units  
I
Power Supply Current1  
V
= V  
DDA  
= Max, C  
= 35pF  
DD  
DDD  
LOAD  
f = 20Msps  
20  
25  
30  
30  
35  
40  
mA  
mA  
mA  
S
f = 30Msps  
S
f = 40Msps  
S
I
Power Supply Current,  
Quiescent  
V
= V  
DDD DDA  
= Max  
DDQ  
CONV = LOW  
CONV = HIGH  
7
18  
20  
mA  
mA  
10  
P
Total Power Dissipation  
V
DDD  
= V  
DDA  
= Max, C  
= 35pF  
D
LOAD  
f = 20Msps  
100  
125  
150  
4
160  
185  
210  
mW  
mW  
mW  
pF  
S
f = 30Msps  
S
f = 40Msps  
S
C
R
Input Capacitance, Analog  
Input Resistance  
CONV = LOW  
CONV = HIGH  
AI  
12  
pF  
500  
1000  
kΩ  
IN  
8
REV. 1.3.3 2/28/02  
PRODUCT SPECIFICATION  
TMC1175A  
Electrical Characteristics (continued)  
Parameter  
Conditions  
Min  
Typ1 Max Units  
I
Input Current, Analog  
Reference Resistance  
Input Current, HIGH  
Input Current, LOW  
Hi-Z Output Leakage  
Hi-Z Output Leakage  
Short-Circuit Current  
Output Voltage, HIGH  
1
340  
5
µA  
CB  
R
200  
270  
REF  
I
I
I
I
I
V
V
V
V
= Max, V = V  
IN DDD  
µA  
µA  
µA  
µA  
mA  
V
IH  
DDD  
DDD  
DDD  
DDD  
= Max, V = 0V  
IN  
5
IL  
= Max, V = V  
IN DDD  
5
OZH  
OZL  
OS  
= Max, V = 0V  
IN  
5
-30  
V
I
I
I
I
= -100µA  
= -2.5mA  
= Max  
V
-0.3  
DDD  
OH  
OH  
OH  
OH  
OL  
3.5  
V
2.4  
V
V
Output Voltage, LOW  
= Max  
0.4  
10  
V
OL  
C
C
Digital Input Capacitance  
Digital Output Capacitance  
4
pF  
pF  
DI  
10  
DO  
Note:  
1. Typical values with V  
= V  
DDA  
= Nom and T = Nom, Minimum/Maximum values with V  
DDD  
= V = Max and T = Min.  
DDA A  
DDD  
A
Switching Characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
ns  
t
t
t
t
t
Sampling Time Offset  
Output Hold Time  
2
5
5
8
STO  
HO  
C
C
= 15pF  
= 15pF  
ns  
LOAD  
Output Delay Time  
Output Enable Time  
Output Disable Time  
20  
27  
42  
ns  
DO  
LOAD  
ns  
ENA  
DIS  
ns  
REV. 1.3.3 2/28/02  
9
TMC1175A  
PRODUCT SPECIFICATION  
System Performance Characteristics  
Parameter  
Conditions  
Min Typ1 Max Units  
E
Integral Linearity Error,  
Independent  
V
RT  
V
RB  
= 2.6V  
= 0.6V  
0.5  
1
LSB  
LI  
E
LD  
Differential Linearity Error  
V
RT  
V
RB  
= 2.6V  
= 0.6V  
0.3  
1
LSB  
BW  
Bandwidth2  
TMC1175A-20  
TMC1175A-30  
TMC1175A-40  
10  
12  
12  
MHz  
MHz  
MHz  
E
E
E
Aperture Error  
30  
-25  
40  
ps  
mV  
mV  
%
AP  
OT  
OB  
Offset Voltage, Top  
Offset Voltage, Bottom  
Differential Gain  
R V for most positive code transition  
IN  
-8  
-42  
60  
T
R V for most negative code transition  
B IN  
30  
dg  
f = 14.3Msps  
S
1.5  
2.7  
NTSC 40 IRE Mod Ramp  
V
V
= +5.0V, T =25°C  
DDA  
= 2.6V, V  
A
= 0.6V  
RB  
RT  
dp  
Differential Phase  
f = 14.3Msps  
NTSC 40 IRE Mod Ramp  
0.5  
1.0  
deg  
S
V
V
= +5.0V, T =25°C  
DDA  
= 2.6V, V  
A
= 0.6V  
RB  
RT  
SNR3 Signal-to-Noise Ratio  
f = 20Msps, V = 2.6V, V  
= 0.6V  
= 0.6V  
S
RT  
RB  
f
IN  
f
IN  
f
IN  
f
IN  
= 1.24MHz  
= 2.48MHz  
= 6.98MHz  
= 10.0MHz  
44  
43  
41  
37  
48  
47  
45  
42  
dB  
dB  
dB  
dB  
f = 30Msps, V = 2.6V, V  
S
RT  
RB  
f
IN  
f
IN  
f
IN  
f
IN  
f
IN  
= 1.24MHz  
= 2.48MHz  
= 6.98MHz  
= 10.0MHz  
= 12.0MHz  
42  
40  
38  
33  
30  
47  
45  
43  
39  
37  
dB  
dB  
dB  
dB  
dB  
f = 40Msps, V = 2.6V, V  
= 0.6V  
S
RT  
RB  
f
IN  
f
IN  
f
IN  
f
IN  
f
IN  
= 1.24MHz  
= 2.48MHz  
= 6.98MHz  
= 10.0MHz  
= 12.0MHz  
40  
38  
36  
34  
32  
45  
43  
41  
38  
36  
dB  
dB  
dB  
dB  
dB  
10  
REV. 1.3.3 2/28/02  
PRODUCT SPECIFICATION  
TMC1175A  
System Performance Characteristics (continued)  
Parameter  
Conditions  
Min Typ1 Max Units  
SFDR4 Spurious-Free Dynamic  
Range  
f = 20Msps, V = 2.6V, V  
= 0.6V  
= 0.6V  
S
RT  
RB  
f
IN  
f
IN  
f
IN  
f
IN  
= 1.24MHz  
= 2.48MHz  
= 6.98MHz  
= 10.0MHz  
46  
44  
41  
38  
52  
51  
45  
43  
dB  
dB  
dB  
dB  
f = 30Msps, V = 2.6V, V  
S
RT  
RB  
f
IN  
f
IN  
f
IN  
f
IN  
f
IN  
= 1.24MHz  
= 2.48MHz  
= 6.98MHz  
= 10.0MHz  
= 12.0MHz  
42  
40  
37  
35  
34  
49  
45  
41  
40  
39  
dB  
dB  
dB  
dB  
dB  
f = 40Msps, V = 2.6V, V  
= 0.6V  
S
RT  
RB  
f
IN  
f
IN  
f
IN  
f
IN  
f
IN  
= 1.24MHz  
= 2.48MHz  
= 6.98MHz  
= 10.0MHz  
= 12.0MHz  
40  
39  
38  
36  
36  
44  
43  
41  
40  
39  
dB  
dB  
dB  
dB  
dB  
Notes:  
1. Values shown in Typ column are typical for V  
DDD  
= V = +5V and T = 25°C.  
DDA A  
2. Bandwidth is the frequency up to which a full-scale sinewave can be digitized without spurious codes.  
3. SNR values do not include the harmonics of the fundamental frequency.  
4. SFDR is the ratio in dB of fundamental amplitude to the harmonic with the highest amplitude.  
REV. 1.3.3 2/28/02  
11  
TMC1175A  
PRODUCT SPECIFICATION  
Typical Performance Characteristics  
60  
50  
40  
30  
20  
30  
25  
20  
15  
10  
5
f
f
f
= 20 Msps  
= 30 Msps  
= 40 Msps  
s
s
s
10  
0
0
0
2
4
6
8
10  
12  
0
10  
20  
30  
40  
Figure 8. Typical I  
DD  
vs f  
Figure 9. Typical SFDR vs f and f  
IN  
S
S
50  
40  
30  
20  
10  
50  
40  
30  
20  
f
f
f
= 20 Msps  
= 30 Msps  
= 40 Msps  
f
f
= 20 Msps  
= 33 Msps  
s
s
s
s
s
10  
0
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
0
2
4
6
8
10  
12  
Figure 10. Typical SNR vs f and f  
IN  
Figure 11. Typical SNR vs Full Scale Input Range  
S
Applications Discussion  
The circuit in Figure 12 employs a band-gap reference to  
generate a variable RT reference voltages for the  
The circuit in Figure 13 shows self-bias of R and R by  
T B  
connection to VR+ and VR-. This sets up a 0.6 to 2.6 Volt  
TMC1175A as well as a bias voltage to offset the wideband  
input amplifier to mid-range. An "offset adjust"  
is also shown for varying the mid-range voltage level.  
The operational amplifier in the reference circuitry is a  
standard 741-type.  
input range for V . The input range is susceptible to power  
IN  
supply variation since the voltages on R and R are directly  
T
B
derived from V . The video input is AC-coupled and  
DDA  
biased at a adjustable midpoint of the A/D input range.  
This circuit offers the advantage of minimum support  
circuitry for the most cost-sensitive applications.  
The voltage reference at R can be adjusted from 0.0 to 2.4  
T
volts while R is grounded. Diodes are used to restrict the  
In Figure 14, an external band-gap reference sets R to +1.2  
T
B
wideband amplifier output to between -0.7V and V  
DD  
Volts while R is grounded. The internal pull-up resistor,  
B
+0.7V. Diode protection is good practice to limit the analog  
input voltage at V to the safe operating range.  
IN  
R+, provides the bias current for the band-gap reference. The  
A/D converter input is biased to the mid-point of the input  
range.  
12  
REV. 1.3.3 2/28/02  
PRODUCT SPECIFICATION  
TMC1175A  
Regulated +5V  
+5V  
0.1µF  
0.1µF  
1kΩ  
LM385  
V
V
DDD  
+5V  
DDA  
0.1µF  
Gain Adjust  
VR+  
R
T
20Ω  
2V  
+
2kΩ  
0.1mF  
-
1kΩ  
0.1µF  
TMC1175A  
R
B
D
7-0  
1kΩ  
VR-  
Wideband  
Op-amp  
+
-
OE  
Video  
Input  
V
IN  
CONV  
455Ω  
75Ω  
A
D
GND  
GND  
455Ω  
+5V  
27056A  
Figure 12. Typical Interface Circuit-High Performance  
Grounding  
+5V  
0.1µF  
0.1µF  
The TMC1175A has separate analog and digital  
circuits. To keep digital system noise from the A/D  
converter, it is recommended that power supply voltages  
V
V
DDD  
DDA  
Offset  
Adjust  
+5V  
2.2kΩ  
VR+  
(V  
and V  
) originate from separate sources with  
regulated, and that ground connections (D and  
GND  
DDD  
DDA  
R
T
V
DDA  
0.1µF  
TMC1175A  
A ) be made to the analog ground plane. Power supply  
GND  
2kΩ  
R
pins should be individually decoupled at the pin. The digital  
circuitry that gets its input from the TMC1175A should be  
referred to the system digital ground plane.  
B
D
7-0  
0.1µF  
VR-  
560Ω  
0.1µF  
OE  
Video  
Input  
CONV  
V
IN  
Printed Circuit Board Layout  
10µF  
75Ω  
A
D
GND  
GND  
Designing with high performance mixed-signal circuits  
demands printed circuits with ground planes. Wire-wrap is  
not an option, even for breadboarding. Overall system per-  
formance is strongly influenced by the board layout. Capac-  
itive coupling from digital to analog circuits may result in  
poor A/D conversion. Consider the following suggestions  
when doing the layout:  
24458A  
Figure 13. Typical Interface Circuit Low Cost  
+5V  
0.1µF  
0.1µF  
1. Keep the critical analog traces (V , R , R , VR+,  
V
V
DDD  
IN  
T
B
DDA  
VR-) as short as possible and as far as possible from all  
digital signals. The TMC1175A should be located near  
the board edge, close to the analog input connectors.  
VR+  
R
T
TMC1175A  
0.1µF  
LM385  
2. The power plane for the TMC1175A should be sepa-  
rate from that which supplies the rest of the digital cir-  
cuitry. A single power plane should be used for all of  
R
B
1kΩ  
D
7-0  
VR-  
10µF  
RF  
Input  
OE  
V
IN  
the V  
DD  
pins. If the power supply for the TMC1175A  
CONV  
is the same as that of the system's digital circuitry,  
power to the TMC1175A should be decoupled with  
ferrite beads and 0.1µF capacitors to reduce noise.  
56Ω  
1kΩ  
A
D
GND  
GND  
24457A  
Figure 14. Typical Interface Circuit Stabilized Reference  
3. The ground plane should be solid, not cross-hatched.  
Connections to the ground plane should have very  
short leads.  
REV. 1.3.3 2/28/02  
13  
TMC1175A  
PRODUCT SPECIFICATION  
4. Decoupling capacitors should be applied liberally to  
6. CONV should be handled carefully. Jitter and noise on  
this clock may degrade performance. Terminate the  
clock line at the CONV input, if required, to eliminate  
overshoot and ringing.  
V
DD  
pins. Remember that not all power supply pins are  
created equal. They supply different circuits on the inte-  
grated circuit, each of which generate varying amounts  
and types of noise. For best results, use 0.1µF ceramic  
capacitors. Lead lengths should be minimized. Ceramic  
chip capacitors are the best choice.  
Evaluation Board  
An evaluation board is available that implements good inter-  
face practices and provide a convenient testbed for develop-  
ing system applications and circuit variations. An on-board  
D/A converter is provided to reconstruct the digitized signal  
and to evaluate converter performance.  
5. If the digital power supply has a dedicated power plane  
layer, it should not be placed under the TMC1175A, the  
voltage reference, or the analog inputs. Capacitive cou-  
pling of digital power supply noise from this layer to the  
TMC1175A and its related analog circuitry can have an  
adverse effect on performance.  
Contact your sales representative for information.  
14  
REV. 1.3.3 2/28/02  
PRODUCT SPECIFICATION  
TMC1175A  
Mechanical Dimensions  
24 Lead SOIC (5.4 mm) Package  
Inches  
Millimeters  
Min. Max.  
Symbol  
Notes  
Min.  
Max.  
.067  
.004  
1.70  
0.10  
A
.075  
.012  
1.90  
0.31  
A1  
B
.014  
.006  
.587  
.205  
.295  
.020  
.012  
.610  
.220  
.319  
0.36  
0.15  
0.51  
0.30  
C
14.90  
5.20  
15.50  
5.60  
D
E
7.50  
8.10  
E1  
e
.050 BSC  
1.27 BSC  
0.25  
0.41  
0.50  
1.27  
.010  
.016  
.020  
.050  
h
L
24  
24  
N
8
α°  
ccc  
8
0
-
0
-
0.10  
.004  
24  
13  
E1  
E
12  
1
D
h x 45°  
C
A1  
SEATING PLANE -C-  
A
α
L
e
B
LEAD COPLANARITY  
ccc C  
REV. 1.3.3 2/28/02  
15  
TMC1175A  
PRODUCT SPECIFICATION  
Mechanical Dimensions (continued)  
28 Lead PLCC Package  
Notes:  
Inches  
Millimeters  
Symbol  
Notes  
1. All dimensions and tolerances conform to ANSI Y14.5M-1982  
Min.  
Max.  
Min.  
Max.  
2. Corner and edge chamfer (J) = 45°  
A
.165  
.090  
.020  
.013  
.026  
.485  
.450  
.180  
.120  
4.19  
2.29  
.51  
4.57  
3.05  
3. Dimension D1 and E1 do not include mold protrusion. Allowable  
protrusion is .101" (.25mm)  
A1  
A2  
B
.021  
.032  
.495  
.456  
.33  
.53  
B1  
.66  
.81  
D/E  
D1/E1  
D3/E3  
e
12.32  
11.43  
12.57  
11.58  
3
2
.300 BSC  
.050 BSC  
.042 .048  
7.62 BSC  
1.27 BSC  
1.07 1.22  
J
ND/NE  
N
7
7
28  
28  
ccc  
.004  
0.10  
E
E1  
J
D
D1  
D3/E3  
B1  
J
e
A
A1  
C LEAD COPLANARITY  
B
A2  
ccc C  
16  
REV. 1.3.3 2/28/02  
TMC1175A  
PRODUCT SPECIFICATION  
Ordering Information  
Conversion  
Package  
Product Number  
TMC1175AM7C20  
TMC1175AM7C30  
TMC1175AM7C40  
TMC1175AR3C20  
TMC1175AR3C30  
TMC1175AR3C40  
Rate  
Temperature Range  
T = -20°C to 75°C  
Screening  
Commercial  
Commercial  
Commercial  
Commercial  
Commercial  
Commercial  
Package  
Marking  
20 Msps  
30 Msps  
40 Msps  
20 Msps  
30 Msps  
40 Msps  
24-Lead SOIC  
24-Lead SOIC  
24-Lead SOIC  
28-Lead PLCC  
28-Lead PLCC  
28-Lead PLCC  
1175AM7C20  
1175AM7C30  
1175AM7C40  
1175AR3C20  
1175AR3C30  
1175AR3C40  
A
T = -20°C to 75°C  
A
T = -20°C to 75°C  
A
T = -20°C to 75°C  
A
T = -20°C to 75°C  
A
T = -20°C to 75°C  
A
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY  
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY  
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER  
DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES  
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body,  
or (b) support or sustain life, or (c) whose failure to perform  
when properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to  
result in significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be  
reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
www.fairchildsemi.com  
2/28/02 0.0m 002  
Stock#DS7001175A  
2002 Fairchild Semiconductor Corporation  
Product Folder - Fairchild P/N TMC1175x20 - 20MSPS 8-Bit Video A/D Converter  
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Contents  
How to order products  
General description | Features | Applications |  
Product status/pricing/packaging  
Dotted line  
Product Change Notices  
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The TMC1175A analog-to-digital (A/D)  
converter employs a two-step flash architecture  
to convert analog signals into 8-bit digital  
words at sample rates of up to 40 Msps  
(Megasamples per second). An integral  
Track/Hold circuit delivers excellent  
performance on signals with full-scale  
frequency components up to 12 MHz.  
Innovative architecture and submicron CMOS  
technology limit typical power dissipation to  
100 mW.  
Dotted line  
Quality and reliability  
This page  
Print version  
Dotted line  
Design tools  
technical information  
buy products  
technical support  
my Fairchild  
Power may be derived from either single or  
dual +5V supplies. Internal voltage reference  
resistors allow self-bias operation. Input  
capacitance is very low, simplifying or  
eliminating input driving amplifiers. All digital  
three-state outputs are TTL- and CMOS-  
compatible.  
company  
The TMC1175A is available in 24-pin plastic  
SOIC, and 28-lead J-lead PLCC packages.  
Performance specifications are guaranteed  
from -20°C to 75°C.  
back to top  
Features  
Product Folder - Fairchild P/N TMC1175x20 - 20MSPS 8-Bit Video A/D Converter  
8-Bit resolution  
40 Msps conversion rate  
Low power: 100mW at 20 Msps  
Integral track/hold  
Integral and differential linearity error  
0.5 LSB  
Single or dual +5 Volt supplies  
Differential phase 0.5 degree  
Differential gain 1.5%  
Three-state TTL/CMOS-compatible  
outputs  
Low cost  
back to top  
Applications  
Video digitizing  
VGA and CCD digitizing  
LCD projection panels  
Image scanners  
Personal computer video boards  
Multimedia systems  
Low cost, high speed data conversion  
back to top  
Product status/pricing/packaging  
Product  
Product status  
Pricing* Package type Leads Packing method  
TMC1175AN2B20  
TMC1175AM7C20  
TMC1175AN2C20  
Lifetime Buy  
Full Production  
Lifetime Buy  
N/A  
DIP  
24  
24  
24  
RAIL  
RAIL  
RAIL  
$2.84 SOIC-Wide  
$11.41  
N/A  
DIP  
CDIP  
PLCC  
N/A  
Not recommended for new  
designs  
TMC1175AB2F20  
TMC1175AR3C20  
TMC1175AC3F20  
24  
28  
RAIL  
RAIL  
Full Production  
$9.69  
N/A  
Not recommended for new  
designs  
N/A  
BLISTER PK  
* 1,000 piece Budgetary Pricing  
back to top  
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Product Folder - Fairchild P/N TMC1175x20 - 20MSPS 8-Bit Video A/D Converter  

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