USB1T11ABQX [FAIRCHILD]

Universal Serial Bus Transceiver; 通用串行总线收发器
USB1T11ABQX
型号: USB1T11ABQX
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Universal Serial Bus Transceiver
通用串行总线收发器

总线驱动器 总线收发器 逻辑集成电路
文件: 总11页 (文件大小:560K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
November 1999  
Revised March 2005  
USB1T11A  
Universal Serial Bus Transceiver  
General Description  
Features  
The USB1T11A is a one chip generic USB transceiver. It is  
designed to allow 5.0V or 3.3V programmable and stan-  
dard logic to interface with the physical layer of the Univer-  
sal Serial Bus. It is capable of transmitting and receiving  
serial data at both full speed (12Mbit/s) and low speed  
(1.5Mbit/s) data rates.  
Complies with Universal Serial Bus specification 1.1  
Utilizes digital inputs and outputs to transmit and receive  
USB cable data  
Supports 12Mbit/s “Full Speed” and 1.5Mbit/s  
“Low Speed” serial data transmission  
Compatible with the VHDL “Serial Interface Engine”  
from USB Implementers' Forum  
The input and output signals of the USB1T11A conform  
with the “Serial Interface Engine”. Implementation of the  
Serial Interface Engine along with the USB1T11A allows  
the designer to make USB compatible devices with off-the-  
shelf logic and easily modify and update the application.  
Supports single-ended data interface  
Single 3.3V supply  
ESD Performance: Human Body Model  
9.5 kV on D , D pins only  
4 kV on all other pins  
16-lead Pb-Free MLP package saves space  
Ordering Code:  
Package  
Order Number  
Package Description  
Number  
USB1T11AM  
(Note 1)  
M14A  
M14A  
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
USB1T11AM_NL  
(Note 2)  
Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
USB1T11ABQX  
MLP16C Pb-Free 16-Terminal Molded Leadless Package (MLP), JEDEC MO-220, 3mm square  
USB1T11AMTC  
(Note 1)  
MTC14  
MTC14  
MTC14  
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
USB1T11AMTC_NL  
(Note 2)  
Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm  
Wide  
USB1T11AMTCX_NL  
(Note 2)  
Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm  
Wide  
Pb-Free package per JEDEC J-STD-020B.  
Note 1: Device also available in Tape and Reel. Specify by appending suffix letter Xto the ordering code.  
Note 2: _NLindicates Pb-Free package (per JEDEC J-STD-020B). Please use order number as indicated.  
The USB-IF Logos are trademarks of Universal Serial Bus Implementers Forum, Inc.  
© 2005 Fairchild Semiconductor Corporation  
DS500234  
www.fairchildsemi.com  
Connection Diagrams  
Logic Diagram  
Pin Assignments for SOIC and TSSOP  
Pin Assignments for MLP  
Pin Descriptions  
Pin Name  
I/O  
Description  
RCV  
O
Receive data. CMOS level output for USB differential input  
OE  
I
I
I
Output Enable. Active LOW, enables the transceiver to transmit data on the bus. When not  
active the transceiver is in receive mode.  
MODE  
Mode. When left unconnected, a weak pull-up transistor pulls it to VCC and in this GND, the  
VMO/FSEO pin takes the function of FSEO (Force SEO).  
VPO, VMO/FSEO  
Inputs to differential driver. (Outputs from SIE).  
MODE  
0
VPO  
VMO/FSEO  
RESULT  
Logic 0”  
SE0  
0
0
1
1
0
1
0
1
Logic 1”  
SEO  
1
0
0
1
1
0
1
0
1
SE0  
Logic 0”  
Logic 1”  
Illegal code  
VP, VM  
O
Gated version of D and D . Outputs are logic 0and logic 1. Used to detect single ended  
zero (SE0), error conditions, and interconnect speed. (Input to SIE).  
VP  
VM  
RESULT  
0
0
1
1
0
1
0
1
SE0  
Low Speed  
Full Speed  
Error  
D , D  
AI/O Data , Data . Differential data bus conforming to the Universal Serial Bus standard.  
SUSPND  
I
Suspend. Enables a low power state while the USB bus is inactive. While the suspend pin is  
active it will drive the RCV pin to a logic 0state. Both D and D are 3-STATE.  
SPEED  
I
Edge rate control. Logic 1operates at edge rates for full speed.  
Logic 0operates edge rates for low speed.  
VCC  
3.0V to 3.6V power supply  
Ground reference  
GND  
www.fairchildsemi.com  
2
Functional Truth Table  
Input  
I/O  
Outputs  
VP  
VM  
Mode  
VPO  
VMO/FSEO  
OE  
SUSPND  
D
D
RCV  
Result  
0
0
0
0
0
0
1
0
0
1
Logic 0  
0
0
0
1
1
0
0
0
0
0
0
1
0
0
U
1
0
1
0
0
SEO  
Logic 1  
0
1
1
0
0
0
0
U
0
0
SEO  
1
1
1
1
X
X
0
0
1
1
X
X
0
1
0
1
X
X
0
0
0
0
1
1
0
0
0
0
0
1
0
0
1
1
Z
Z
0
1
0
1
Z
Z
U
0
0
0
0
1
SEO  
Logic 0  
1
1
0
Logic 1  
U
U
U
U
U
U
U
U
U
Illegal Code  
D /D Hi-Z  
D /D Hi-Z  
X
Z
U
Dont Care  
3-STATE  
Undefined State  
3
www.fairchildsemi.com  
Absolute Maximum Ratings(Note 3)  
Recommended Operating  
Conditions  
DC Supply Voltage (VCC  
DC Input Diode Current (IIK  
VI  
)
0.5V to 7.0V  
)
Supply Voltage VCC  
Input Voltage (VI)  
3.0V to 3.6V  
0V to 5.5V  
0V to VCC  
0V to VCC  
0
50 mA  
Input Voltage (VI)  
(Note 4)  
Input Range for AI/O (VAI/O  
Output Voltage (VO)  
)
0.5V to 5.5V  
Input Voltage (VI/O  
)
0.5V to VCC 0.5V  
Operating Ambient Temperature  
in free air (Tamb  
Output Diode Current (IOK  
)
)
40 C to 85 C  
VO VCC or VO  
Output Voltage (VO)  
(Note 4)  
0
50 mA  
0.5V to VCC 0.5V  
Output Source or Sink Current (IO)  
VP.VM, RCV pins  
VO 0 to VCC  
15 mA  
Output Source or Sink Current (IO)  
D /D pins  
Note 3: The Absolute Maximum Ratings are those values beyond which  
the safety of the device cannot be guaranteed. The device should not be  
operated at these limits. The parametric values defined in the Electrical  
Characteristic tables are not guaranteed at the absolute maximum rating.  
The Recommended Operating Conditionstable will define the conditions  
for actual device operation.  
VO 0 to VCC  
50 mA  
100 mA  
V
CC or GND Current (ICC, IGND  
)
Storage Temperature (TSTO  
)
60 C to 150 C  
Note 4: The input and output voltage ratings may be exceeded if the input  
and output clamp current ratings are observed.  
DC Electrical Characteristics (Digital Pins)  
Over recommended range of supply voltage and operating free air temperature (unless otherwise noted). V  
CC  
3.0V to 3.6V  
Limits  
Symbol  
Parameter  
Test Conditions  
Temp  
Min  
40 C to 85 C  
Unit  
Typ  
Max  
INPUT LEVELS:  
V
V
LOW Level Input Voltage  
HIGH Level Input Voltage  
OUTPUT LEVELS:  
0.8  
V
V
IL  
2.0  
IH  
V
LOW Level Output Voltage  
I
I
I
I
4 mA  
0.4  
0.1  
OL  
OL  
OL  
OH  
OH  
V
V
20  
A
V
HIGH Level Output Voltage  
4 mA  
2.4  
OH  
20  
A
V
0.1  
CC  
LEAKAGE CURRENT:  
Input Leakage Current  
Supply Current (Full Speed)  
Supply Current (Low Speed)  
Quiescent Current  
I
I
I
I
V
V
V
V
V
V
3.0 to 3.6  
5
5
A
mA  
mA  
L
CC  
CC  
CC  
CC  
IN  
3.0 to 3.6  
3.0 to 3.6  
3.0 to 3.6  
CCFS  
CCLS  
CCQ  
5
5
mA  
A
V
or GND  
CC  
I
Supply Current in Suspend  
3.0 to 3.6; Mode  
V
CC  
10  
CCS  
CC  
www.fairchildsemi.com  
4
DC Electrical Characteristics (D /D Pins)  
Over recommended range of supply voltage and operating free air temperature (unless otherwise noted). V  
3.0V to 3.6V  
Limits  
CC  
Symbol  
Parameter  
Test Conditions  
Temp  
Min  
40 C to 85 C  
Units  
Typ  
Max  
INPUT LEVELS:  
V
V
V
Differential Input Sensitivity  
Differential Common Mode Range  
Single Ended Receiver Threshold  
OUTPUT LEVELS:  
|(D ) (D )|  
Includes V Range  
0.2  
0.8  
0.8  
V
V
V
DI  
2.5  
2.0  
CM  
SE  
DI  
V
V
V
Static Output LOW Voltage  
Static Output HIGH Voltage  
Differential Crossover  
R
R
of 1.5 k to 3.6V  
of 15 k to GND  
0.3  
3.6  
2.0  
V
V
V
OL  
OH  
CR  
L
2.8  
1.3  
L
LEAKAGE CURRENT:  
I
High Z State Data Line Leakage Current 0V  
CAPACITANCE:  
V
3.3V  
5
A
OZ  
IN  
C
(Note 6)  
Transceiver Capacitance  
Capacitance Match  
Pin to GND  
10  
10  
pF  
%
IN  
OUTPUT RESISTANCE:  
Z
(Note 5) Driver Output Resistance  
Resistance Match  
Steady State Drive  
4
20  
10  
DRV  
%
Note 5: Excludes external resistor. In order to comply with USB Specification 1.1, external series resistors of 24  
1% each on D and D are recom-  
mended. This specification is guaranteed by design and statistical process distribution.  
Note 6: This specification is guaranteed by design and statistical process distribution.  
AC Electrical Characteristics (D /D Pins, Full Speed)  
Over recommended range of supply voltage and operating free air temperature (unless otherwise noted). V  
CL 50 pF; RL 1.5 k on D to VCC  
3.0V to 3.6V  
CC  
Limits  
40 C to 85 C  
Typ Max  
Symbol  
Parameter  
Test Condition  
Temp  
Min  
Units  
DRIVER CHARACTERISTICS:  
10% and 90%  
ns  
t
t
t
Rise Time  
Figure 1  
Figure 1  
4
4
20  
20  
R
Fall Time  
F
Rise/Fall Time Matching  
Output Signal Crossover Voltage  
DRIVER TIMINGS:  
Driver Propagation Delay  
(t /t )  
90  
1.3  
110  
2.0  
%
V
RFM  
r f  
V
CRS  
t
t
t
Figure 2  
Figure 2  
Figure 4  
18  
18  
13  
ns  
ns  
ns  
PLH  
PLH  
PHZ  
(VPO, VMO/FSEO to D /D  
Driver Disable Delay  
)
t
t
(OE to D /D  
Driver Enable Delay  
(OE to D /D  
)
Figure 4  
Figure 4  
13  
17  
ns  
ns  
PLZ  
PZH  
t
)
Figure 4  
17  
ns  
PZL  
RECEIVER TIMINGS:  
Receiver Propagation Delay  
(D , D to RCV)  
t
t
t
t
Figure 3  
Figure 3  
Figure 3  
Figure 3  
16  
19  
8
ns  
ns  
ns  
ns  
PLH  
PHL  
PLH  
PHL  
Single-ended Receiver Delay  
(D , D to VP, VM)  
8
5
www.fairchildsemi.com  
AC Electrical Characteristics (D /D Pins, Low Speed)  
Over recommended range of supply voltage and operating free air temperature (unless otherwise noted). V  
CL 200 pF to 600 pF; RL 1.5k on D to VCC  
3.0V to 3.6V  
CC  
Limits  
T
40 C to 85 C  
Symbol  
Parameter  
Test Conditions  
Unit  
amb  
Min  
Typ  
Max  
DRIVER CHARACTERISTICS:  
10% and 90%  
t
t
t
Rise Time  
Figure 1  
Figure 1  
75  
75  
80  
1.3  
300  
300  
120  
2.0  
ns  
LR  
Fall Time  
LF  
Rise/Fall Time Matching  
Output Signal Crossover Voltage  
DRIVER TIMINGS:  
Driver Propagation Delay  
(t /t )  
%
V
RFM  
r f  
V
CRS  
t
t
t
Figure 2  
Figure 2  
Figure 4  
300  
300  
13  
ns  
ns  
ns  
PLH  
PHL  
PHZ  
(VPO, VMO/FSEO to D /D  
Driver Disable Delay  
)
t
t
(OE to D /D  
Driver Enable Delay  
(OE to D /D  
)
Figure 4  
Figure 4  
13  
ns  
ns  
PLZ  
205  
PZH  
t
)
Figure 4  
205  
ns  
PZL  
RECEIVER TIMINGS:  
Receiver Propagation Delay  
(D , D to RCV)  
t
t
t
t
Figure 3  
Figure 3  
Figure 3  
Figure 3  
18  
18  
28  
28  
ns  
ns  
ns  
ns  
PLH  
PHL  
PLH  
PHL  
Single-ended Receiver Delay  
(D , D to VP, VM)  
www.fairchildsemi.com  
6
AC Waveforms  
VOL and VOH are the typical output voltage drops that occur with the output load. (VCC never goes below 3.0V)  
FIGURE 1. Rise and Fall Times  
FIGURE 2. VPI, VMO/FSEO to D /D  
FIGURE 3. D /D to RCV, VP/VM  
FIGURE 4. OE to D /D  
Test Circuits and Waveforms  
Load for VM/VP and RCV  
Load for Enable and Disable Times  
Note:  
V
V
0 for t  
, t  
PZH PHZ  
V
for t  
, t  
PZL PLZ  
CC  
Load for D /D  
Test  
S1  
CL 50 pF, Full Speed  
D /LS Close  
D /LS Open  
D /FS Open  
CL 200 pF, Low Speed (Min Timing)  
CL 600 pF, Low Speed (Max Timing)  
1.5 k on D (Low Speed) or D (Full Speed) only D /FS Close  
7
www.fairchildsemi.com  
Tape and Reel Specification  
Tape Format for MLP  
Package  
Tape  
Number  
Cavities  
125 (typ)  
2500  
Cavity  
Status  
Empty  
Filled  
Cover Tape  
Status  
Designator  
Section  
Leader (Start End)  
Sealed  
BQX  
Carrier  
Sealed  
Trailer (Hub End)  
75 (typ)  
Empty  
Sealed  
TAPE DIMENSIONS inches (millimeters)  
REEL DIMENSIONS inches (millimeters)  
A
N
W1  
W2  
Tape Size  
(mm)  
(Typical)  
(mm)  
(mm)  
(Max)  
(mm)  
12 mm  
330  
178  
12.4  
18.4  
www.fairchildsemi.com  
8
Physical Dimensions inches (millimeters) unless otherwise noted  
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
Package Number M14A  
9
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
Pb-Free 16-Terminal Molded Leadless Package (MLP), JEDEC MO-220, 3mm square  
Package Number MLP16C  
www.fairchildsemi.com  
10  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
Package Number MTC14  
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and  
Fairchild reserves the right at any time without notice to change said circuitry and specifications.  
LIFE SUPPORT POLICY  
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the  
body, or (b) support or sustain life, and (c) whose failure  
to perform when properly used in accordance with  
instructions for use provided in the labeling, can be rea-  
sonably expected to result in a significant injury to the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
www.fairchildsemi.com  
11  
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