LP3000 [FILTRONIC]

2 W POWER PHEMT; 2 W功率PHEMT
LP3000
型号: LP3000
厂家: FILTRONIC COMPOUND SEMICONDUCTORS    FILTRONIC COMPOUND SEMICONDUCTORS
描述:

2 W POWER PHEMT
2 W功率PHEMT

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LP 3 0 0 0  
2 W P OWER P HEMT  
DRAIN  
BOND  
PAD (4X)  
·
FEATURES  
¨
33.5 dBm Output Power  
at 1-dB Compression at 18 GHz  
7 dB Power Gain at 18 GHz  
30.5 dBm Output Power  
SOURCE  
BOND  
PAD (2x)  
¨
¨
at 1-dB Compression at 3.3V  
45% Power-Added Efficiency  
GATE  
BOND  
PAD (4X)  
¨
DIE SIZE: 28.3X16.5 mils (720x420 mm)  
DIE THICKNESS: 2.6 mils (65 mm)  
BONDING PADS: 1.9X2.4 mils (50x60 mm)  
·
DES CRIP TION AND AP P LICATIONS  
The LP3000 is an Aluminum Gallium Arsenide / Indium Gallium Arsenide (AlGaAs/InGaAs)  
Pseudomorphic High Electron Mobility Transistor (PHEMT), utilizing an Electron-Beam direct-  
write 0.25 mm by 3000 mm Schottky barrier gate. The recessed “mushroom” gate structure  
minimizes parasitic gate-source and gate resistances. The epitaxial structure and processing have  
been optimized for reliable high-power applications. The LP3000 is also available in a P100 flanged  
ceramic package and in the low cost plastic SOT89 package.  
Typical applications include commercial and other high-performance power amplifiers.  
·
ELECTRICAL S P ECIFICATIONS @ TAm b ie n t = 2 5 °C  
Parameter  
Symbol  
IDSS  
Test Conditions  
VDS = 2 V; VGS = 0 V  
VDS = 8 V; IDS = 50% IDSS  
VDS = 8 V; IDS = 50% IDSS  
VDS = 8 V; IDS = 50% IDSS  
VDS = 2 V; VGS = 1 V  
VDS = 2 V; VGS = 0 V  
VGS = -5 V  
Min  
800  
33  
Typ  
1060  
33.5  
6
Max  
Units  
mA  
dBm  
dB  
Saturated Drain-Source Current  
Power at 1-dB Compression  
Power Gain at 1-dB Compression  
Power-Added Efficiency  
Maximum Drain-Source Current  
Transconductance  
1100  
P-1dB  
G-1dB  
PAE  
IMAX  
GM  
4
45  
%
1700  
900  
15  
mA  
mS  
mA  
V
725  
Gate-Source Leakage Current  
Pinch-Off Voltage  
IGSO  
125  
-2.0  
VP  
VDS = 2 V; IDS = 10 mA  
IGS = 15 mA  
-0.25  
-12  
-1.2  
-15  
|VBDGS  
|
V
Gate-Source Breakdown  
Voltage Magnitude  
Gate-Drain Breakdown  
Voltage Magnitude  
|VBDGD  
|
IGD = 15 mA  
-12  
-16  
20  
V
Thermal Resistivity  
frequency=18 GHz  
QJC  
°C/W  
P h o n e : (408) 988-1845  
Fa x: (408) 970-9950  
h ttp :// www.filss.com  
Re vis e d : 1/18/01  
Em a il: sales@filss.com  
LP 3 0 0 0  
2 W P OWER P HEMT  
·
ABS OLUTE MAXIMUM RATINGS  
Parameter  
Symbol  
Test Conditions  
Min  
Max  
Units  
Drain-Source Voltage  
VDS  
12  
V
TAmbient = 22 ± 3 °C  
Gate-Source Voltage  
Drain-Source Current  
Gate Current  
VGS  
IDS  
-5  
2xIDSS  
30  
V
mA  
mA  
W
TAmbient = 22 ± 3 °C  
TAmbient = 22 ± 3 °C  
TAmbient = 22 ± 3 °C  
TAmbient = 22 ± 3 °C  
TAmbient = 22 ± 3 °C  
IG  
RF Input Power  
PIN  
1.2  
Channel Operating Temperature  
Storage Temperature  
Total Power Dissipation  
TCH  
TSTG  
PTOT  
175  
175  
6.0  
ºC  
-65  
ºC  
W
TAmbient = 22 ± 3 °C  
Notes:  
·
·
Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device.  
Power Dissipation defined as: PTOT º (PDC + PIN) – POUT, where  
PDC: DC Bias Power  
PIN: RF Input Power  
POUT: RF Output Power  
·
Absolute Maximum Power Dissipation to be de-rated as follows above 25°C:  
PTOT= 6.0W – (0.040W/°C) x THS  
where THS = heatsink or ambient temperature.  
·
·
·
HANDLING P RECAUTIONS  
To avoid damage to the devices care should be exercised during handling. Proper Electrostatic  
Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and  
testing. These devices should be treated as Class 1A (0-500 V). Further information on ESD control  
measures can be found in MIL-STD-1686 and MIL-HDBK-263.  
AS S EMBLY INS TRUCTIONS  
The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage  
temperature should be 280-290°C; maximum time at temperature is one minute. The recommended  
wire bond method is thermo-compression wedge bonding with 0.7 or 1.0 mil (0.018 or 0.025 mm)  
gold wire. Stage temperature should be 250-260°C.  
AP P LICATIONS NOTES & DES IGN DATA  
Applications Notes are available from your local Filtronic Sales Representative or directly from the  
factory. Complete design data, including S-parameters, noise data, and large-signal models are  
available on the Filtronic web site.  
All information and specifications are subject to change without notice.  
P h o n e : (408) 988-1845  
Fa x: (408) 970-9950  
h ttp :// www.filss.com  
Re vis e d : 1/18/01  
Em a il: sales@filss.com  

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