FP6863 [FITIPOWER]
Slew Rate Limited Load Switch;
| 型号： | FP6863 |
| 厂家： | 
Fitipower |
| 描述： | Slew Rate Limited Load Switch |
| 文件： | 总10页 (文件大小：456K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
fitipower integrated technology lnc.
FP6863
Slew Rate Limited
Load Switch
Description
Features
The FP6863 is equipped an N-Channel MOSFET
switch which is designed for high-side load-switching
applications, and the device has a 65mΩ typical
RDS-ON and fault current is limited to typically 2.5A.
The FP6863 operates with an input voltage ranging
from 2.0V to 5.5V. It is suitable for both 3V and 5V
systems.
● Input Voltage Range: 2V to 5.5V
● Built-In N-Channel MOSFET: Typically 65mΩ
● Slew Rate Limited Turn On Time 1.5ms (5V)
● Fast Shutdown Load Discharge
● TTL/CMOS Input Logic Level
● Reverse Current Flow Blocking (No Body Diode)
● Output Can Be Forced Higher Than Input
(Off-State)
The FP6863 has a slew rate limited turn-on load
switch and offers a load discharge circuit in
shutdown to rapidly turn off output load when the
switch is disabled. The TTL and CMOS input logic
are compatible for chip enable. It also features an
under voltage lock out (UVLO) which turns the switch
off when an input under-voltage condition exists.
● 1.8V Typical Under-Voltage Lockout (UVLO)
● Low Supply Current:
27μA Typical at Switch On State
0.1μA Typical at Switch Off State
● Hot Plug-In Application (Soft-Start)
● Current Limit Protection
● Current Fold-Back in Short Circuit
● Thermal Shutdown Protection
Other additional features include thermal shutdown
to prevent catastrophic switch failure from high
loading current. Low quiescent current as 27μA in
operation mode and 0.1μA in shutdown mode makes
this device ideal for portable battery-operated
equipment.
Applications
● Digital Camera
● Hot Swap Supply
● Cellular Telephone
● Notebook computer
● Personal Digital Assistant
● Personal Communication Device
The FP6863 is available in low-profile, space-saving
TDFN-8 and SOT-23-5 packages requiring minimum
board space and smallest components.
Pin Assignments
Ordering Information
FP6863□□□
WD Package TDFN-8 (2X2mm)
TR: Tape/Reel
1
2
3
4
8
7
6
5
VIN
VIN
VIN
VIN
VIN
G: Green
VOUT
GND
Package Type
WD: TDFN-8 (2X2)
S5/AS5: SOT-23-5
EN
GND
TDFN-8 Marking
Part Number
Product Code
B2GG
FP6863WDG
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FP6863
SOT-23-5 Marking
Part Number
S5 Package (SOT-23-5)
Product Code
V1=
VIN
VIN
FP6863S5G
FP6863AS5G
B4G
5
1
4
3
2
EN GND VOUT
AS5 Package (SOT-23-5)
VIN
NC
5
1
4
3
2
VOUT GND EN
Figure 1. Pin Assignment of FP6863
Typical Application Circuit
VIN
VIN
VOUT
VOUT
COUT
0.1μF
CIN
10μF
FP6863
EN
GND
Figure 2. Typical Application Circuit of FP6863
Functional Pin Description
Pin Name
Pin Function
VIN
Input Power Supply.
Switch Output.
Ground Pin.
VOUT
GND
EN
Chip Enable. Pull the pin high to enable IC, and pull the pin low to shutdown IC. Do not let the pin floating.
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FP6863
Block Diagram
VIN
Current
Limiting
EN
BIAS
UVLO
Gate
Control
Charge
Pump
Oscillator
Output Voltage
Detection
VOUT
GND
Thermal
Protection
Shutdown Signal
Figure 3. Block Diagram of FP6863
Absolute Maximum Ratings
● VIN to GND -------------------------------------------------------------------------------------------------------- -0.3V to +6V
● EN to GND --------------------------------------------------------------------------------------------------------- -0.3V to +6V
● VOUT to GND ----------------------------------------------------------------------------------------------------- -0.3V to +6V
● Power Dissipation @TA=25℃, (PD)
TDFN-8 ------------------------------------------------------------------------------------------------- +1.25W
SOT-23-5 ----------------------------------------------------------------------------------------------- +0.4W
● Package Thermal Resistance, (θJA)
TDFN-8 ------------------------------------------------------------------------------------------------- +80°C/W
SOT-23-5 -----------------------------------------------------------------------------------------------
● Junction Temperature (TJ) -------------------------------------------------------------------------------------
● Lead Temperature (Soldering, 10 sec.) ---------------------------------------------------------------------
● Storage Temperature Range ----------------------------------------------------------------------------------
+250℃/W
+150℃
+260℃
-65℃ to +150℃
Note 1：Stresses beyond those listed under “Absolute Maximum Ratings" may cause permanent damage to the device.
Recommended Operating Conditions
● Supply Voltage (VIN) --------------------------------------------------------------------------------------------- +2V to +5.5V
● Operation Temperature Range -------------------------------------------------------------------------------- -40°C to +85°C
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FP6863
Electrical Characteristics
(VIN=5V, CIN=COUT=1µF, TA=25℃, unless otherwise specified.)
Parameter
Operation Voltage
Symbol
VIN
Conditions
Min
Typ
Max
Unit
V
2
5.5
120
45
Switch On Resistance (Note2)
Supply Current
RDS(ON)
ISW_ON
ISW_OFF
VIL
VIN=2V to 5V, IOUT=1A
Switch on, VOUT = Open
Switch off, VOUT = Open
Switch off
65
27
mΩ
µA
V
0.1
1
0.8
EN Threshold
VIH
Switch on
2.0
EN Input Current
IEN
VEN = 0V to 5.5V
VEN = 0V, RLOAD = 0Ω
1
1
µA
µA
μs
ms
A
VOUT Leakage Current
Output Turn-On Delay Time
Output Turn-On Rise Time
Current Limit
ILKG
TD
600
2.5
TON
10% to 90% of VOUT rising
1.5
1.5
0.9
1.6
5
ILIM
2.5
1.35
1.8
3.5
2.5
2
VOUT = 0V, measured prior
to thermal shutdown
Short Circuit Fold-Back Current
ISC-FB
VUVLO
ΔVUVLO
TSD
A
VIN increasing
Hysteresis
V
Under Voltage Lockout
Threshold
50
mV
°C
°C
Ω
130
20
Thermal Shutdown Threshold
(Note2)
ΔTSD
ROUT
Hysteresis
VEN=Low
Output Pull-down Resistance
during OFF (Note2)
92.5
150
Note 2：Guarantee by design.
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FP6863
Typical Performance Curves
VEN
VEN
VOUT
VOUT
IOUT
IOUT
Figure 4. Turn-On response (VIN=3V, RLOAD=6Ω)
Figure 5. Turn-On response (VIN=5V, RLOAD=10Ω)
VEN
VEN
VOUT
VOUT
IOUT
IOUT
Figure 6. Turn-Off response (VIN=3V, RLOAD=6Ω)
Figure 7. Turn-Off response (VIN=5V, RLOAD=10Ω)
40
35
30
25
20
15
120
5v
3v
100
80
60
40
20
0
10
VIN=VEN=5V
CIN=COUT=10µF
RLOAD=Open
VIN=5V
CIN=10µF
COUT=10µF
5
0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (DEG_C)
Temperature (DEC_C)
Figure 8. Supply Current vs. Temperatureµ
Figure 9. On-Resistance vs. Temperature
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FP6863
Typical Performance Curves (Continued)
2.0
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
VIH
VIL
1.5
1.0
0.5
0.0
VIN=5V, VEN=0V
CIN=10µF
COUT=10µF
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
-40
-20
0
20
40
60
80
100
VIN (V)
Temperature (DEG_C)
Figure 10. VEN Threshold vs. Input Voltage
Figure 11. OFF Supply Current vs. Temperature
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FP6863
Functional Description
The FP6863 is a single, current-limited switch
designed for high-side load-switching applications.
It has one switch with enable control input. The
switch has a moderate turn on slew rate feature,
which reduces inrush current when the MOSFET is
turned on.
Chip Enable Input
The switch will be disabled when the EN pin is
under logic low condition. During this condition,
the internal circuitry and MOSFET will be turned off,
and reduce the supply current to 0.1μA typical.
The maximum guaranteed voltage for logic low at
the EN pin is 0.8V. A 2V minimum guaranteed
voltage at the EN pin will turn the FP6863 on.
Floating the EN input may cause unpredictable
operation.
The FP6863 operates from 2.0V to 5.5V input
voltage range and guarantees a minimum 1.5A
output current.
Independent current limit and
thermal shutdown circuit permit the switch to operate
independently and improve system robustness.
Current Limiting and Short-Circuit Protection
Input and Output
The current limit circuitry prevents damage to the
MOSFET switch and the hub downstream port but
can deliver load current up to the current limit
threshold of minimum 1.5A through the switch of
FP6863. When a heavy load or short circuit is
applied and a large transient current exceeds the
current limit threshold, the FP6863 will enter short
circuit protection to fold back the output current to
1.35A in typical until the fault is removed.
VIN is the power source connection to the internal
circuitry and the drain of the MOSFET. VOUT is the
source of the MOSFET. In normal application,
current flows through the switch from VIN to VOUT
toward the load. If VOUT is greater than VIN,
current will flow from VOUT to VIN and cause the
MOSFET bidirectional. There is no parasitic body
diode between drain and source of the MOSFET.
The FP6863 will prevent reverse current flow if
VOUT externally forced a higher voltage than VIN
when the device is disabled (VEN < 0.8V).
Shutdown Output Discharge
The FP6863 has a shutdown output discharge
circuit to rapidly turn off the output load when the
switch is disabled through the EN pin.
D
S
D
S
Thermal Shutdown
Thermal shutdown is employed to protect the device
from damage when the die temperature exceed safe
margins mainly due to short-circuit or current-limit.
Thermal shutdown function will shut off the switch if
the die temperature reaches 130ºC. The power
switch will auto-recover when the IC is cooling
G
G
FP6863
Normal MOSFET
down.
about 20ºC.
The thermal hysteresis temperature is
Under Voltage Lockout
Under voltage-lockout (UVLO) circuit prevents the
output switch from turning on until input voltage
exceeds approximately 1.8V.
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FP6863
Application Information
Input Capacitor
Power Dissipation
A 1μF or above low-ESR ceramic capacitor for input
capacitor is recommended for general application.
Input capacitor is not necessary for operation, but it is
useful to prevent from affecting upstream circuits such
as noisy supply voltage or output short. Output short
circuit may cause ringing on the input terminal (from
source lead inductance) to destroy the internal control
circuitry. The input transient must not exceed 6V of
the absolute maximum supply voltage even for a short
duration.
The device’s junction temperature depends on
several factors such as the load, PCB layout,
ambient temperature and package type. The
output pin of FP6863 can deliver current up to
1.5A, respectively over the full operating junction
temperature range.
However, the maximum
output current must be decreased at higher
ambient temperature to ensure the junction
temperature does not exceed 125°C. With all
possible conditions, the junction temperature
must be within the range specified under
operating conditions. Power dissipation can be
calculated based on the output current and the
RDS-ON of switch as below:
Output Capacitor
A 0.1μF or above capacitor between VOUT and GND is
recommended. Standard bypass methods should be
used to minimize inductance and resistance between
the bypass capacitor and the downstream connector to
reduce EMI and decouple voltage drop caused when
downstream transients.
ꢀꢁ=RꢁSꢂOꢃꢄꢅOUT
2
Although the devices are rated for 1.5A of output
current, but the application may limit the amount
of output current based on the total power
dissipation and the ambient temperature. The
final operating junction temperature for any set of
conditions can be estimated by the following
thermal equation:
TꢈꢆMAꢇ)ꢂTA
ꢀꢁꢆMAꢇ)
=
θꢈA
Where TJ(MAX) is the maximum operation junction
temperature, TA is the ambient temperature and
the θJA is the junction to ambient thermal
resistance.
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FP6863
Outline Information
TDFN-8 Package (2mm x 2mm) (Unit: mm)
DIMENSION IN MILLIMETER
SYMBOLS
UNIT
MIN
0.70
0.00
0.18
1.95
1.95
0.20
0.18
0.45
1.10
0.55
MAX
0.80
0.05
0.25
2.05
2.05
0.45
0.30
0.55
1.25
0.65
A
A1
A2
D
E
a
b
e
D1
E1
Carrier Dimensions
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fitipower integrated technology lnc.
FP6863
Outline Information (Continued)
SOT-23-5 Package (Unit: mm)
DIMENSION IN MILLIMETER
SYMBOLS
UNIT
MIN
0.90
0.00
0.90
0.30
2.80
2.60
1.50
0.90
1.80
0.30
MAX
1.45
0.15
1.30
0.50
3.00
3.00
1.70
1.00
2.00
0.60
A
A1
A2
B
D
E
E1
e
e1
L
Note：Followed From JEDEC MO-178-C.
Carrier Dimensions
Life Support Policy
Fitipower’s products are not authorized for use as critical components in life support devices or other medical systems.
FP6863-1.2-FEB-2012
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