KLFM130-MT [FORMOSA]
Chip Low Leakage Schottky Barrier Rectifier;
| 型号： | KLFM130-MT |
| 厂家： | 
FORMOSA MS |
| 描述： | Chip Low Leakage Schottky Barrier Rectifier |
| 文件： | 总7页 (文件大小：63K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Chip Low Leakage Schottky Barrier Rectifier
Formosa MS
KLFM120-MT THRU KLFM140-MT
List
1
2
2
2
2
3
4
4
4
5
6
6
7
List.................................................................................................
Package outline...............................................................................
Features..........................................................................................
Mechanical data...............................................................................
Maximum ratings .............................................................................
Rating and characteristic curves........................................................
Pinning information...........................................................................
Marking...........................................................................................
Suggested solder pad layout.............................................................
Packing information..........................................................................
Reel packing....................................................................................
Suggested thermal profiles for soldering processes.............................
High reliability test capabilities...........................................................
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-12164Q
Issued Date
2013/12/17
Revised Date
-
Revision
A
Page.
7
Page 1
Chip Low Leakage Schottky Barrier Rectifier
Formosa MS
KLFM120-MT THRU KLFM140-MT
1.0A Surface Mount Low Leakage
Package outline
Schottky Barrier Rectifiers - 20V - 40V
SOD-123T
Features
• Low profile surface mounted application in order to
optimize board space.
0.156(3.9)
0.140(3.5)
0.012(0.3) Typ.
• Extra low reverse leakage current
• High surge capability.
• Guardring for overvoltage protection.
• Very tiny plastic SMD package.
• Ultra high-speed switching.
0.075(1.9)
0.060(1.5)
• Silicon epitaxial planar chip, metal silicon junction.
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
• Suffix "-H" indicates Halogen free parts, ex. ΚLFM120-MT-H.
0.067(1.7)
0.051(1.3)
0.008(0.20)Typ.
0.040 (1.0)
0.024 (0.6)
0.096(2.4)
0.080(2.0)
0.024(0.6)Typ.
Mechanical data
• Epoxy : UL94-V0 rated flame retardant
0.064(1.6)
0.048(1.2)
0.036(0.9)
0.020(0.5)
• Case : Molded plastic, SOD-123T / MINI SMA
• Terminals :Plated terminals, solderable per MIL-STD-750,
Method 2026
0.052(1.3)
0.036(0.9)
0.0375(0.95)
0.0296(0.75)
• Polarity : Indicated by cathode band
• Mounting Position : Any
0.044(1.10)
0.028(0.70)
• Weight : Approximated 0.018 gram
Dimensions in inches and (millimeters)
Maximum ratings and Electrical Characteristics (AT TA=25oC unless otherwise noted)
MAX.
Symbol
IO
TYP.
UNIT
A
MIN.
PARAMETER
CONDITIONS
Forward rectified current
See Fig.1
1.0
25
50
Forward surge current
8.3ms single half sine-wave (JEDEC methode)
A
IFSM
VR = VRRM, TJ = 25OC
IR
μA
pF
Reverse current
Diode capacitance
32
f=1MHz and applied 10V DC reverse voltage
CJ
OC
Storage temperature
TSTG
+175
-65
Operating
temperature
TJ, (OC)
*1
*3
VR
(V)
*4
VF
(V)
*2
VRMS
SYMBOLS
VRRM
(V)
*1 Repetitive peak reverse voltage
*2 RMS voltage
(V)
KLFM120-MT
KLFM130-MT
KLFM140-MT
20
30
40
14
20
*3 Continuous reverse voltage @IR=100μA
*4 Maximum forward voltage@IF=1.0A
21
28
30
40
0.50
-55 to +150
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-12164Q
Issued Date
2013/12/17
Revised Date
-
Revision
A
Page.
7
Page 2
Rating and characteristic curves (KLFM120-MT THRU KLFM140-MT)
FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE
FIG.2-TYPICAL FORWARD
CHARACTERISTICS
1.2
1.0
0.8
0.6
50
10
3.0
1.0
0.4
0.2
0
0
20
40
60
80
100
120
140
160
180
200
LEAD TEMPERATURE,(°C)
TJ=25 C
Pulse Width 300us
1% Duty Cycle
0.1
.01
FIG.3-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
8.3ms Single Half
TJ=25 C
Sine Wave
JEDEC method
.1
.3
.5
.7
.9 1.1 1.3 1.5
FORWARD VOLTAGE,(V)
FIG.5 - TYPICAL REVERSE
CHARACTERISTICS
100
10
NUMBER OF CYCLES AT 60Hz
FIG.4-TYPICAL DIODE CAPACITANCE
150
125
100
75
1.0
0.1
f=1MHz
0.01
TJ=25°C
50
0.001
0
20
40
60
80
100
25
PERCENT OF RATED PEAK REVERSE VOLTAGE,(%)
0
0
.5
10
15
20
25
30
REVERSE VOLTAGE,(V)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-12164Q
Issued Date
2013/12/17
Revised Date
-
Revision
A
Page.
7
Page 3
Chip Low Leakage Schottky Barrier Rectifier
Formosa MS
KLFM120-MT THRU KLFM140-MT
Pinning information
Pin
Simplified outline
Symbol
Pin1 cathode
Pin2 anode
1
2
1
2
Marking
Type number
Marking code
KLFM120-MT
KLFM130-MT
KLFM140-MT
K12
K13
K14
Suggested solder pad layout
0.016 (0.40)
0.024 (0.60)
0.056 (1.40)
0.048 (1.20)
0.083 (2.10)
0.037 (0.95)
0.040(1.00)
0.041 (1.05)
0.041 (1.05)
Dimensions in inches and (millimeters)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-12164Q
Issued Date
2013/12/17
Revised Date
-
Revision
A
Page.
7
Page 4
Chip Low Leakage Schottky Barrier Rectifier
Formosa MS
KLFM120-MT THRU KLFM140-MT
Packing information
P0
P1
d
E
F
W
B
A
P
D2
D1
T
C
W1
D
unit:mm
Symbol
SOD-123T
Item
Tolerance
Carrier width
A
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
1.90
3.90
1.68
1.50
-
Carrier length
B
Carrier depth
C
Sprocket hole
d
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
D
D1
D
-
178.00
62.00
13.00
1.75
3.50
4.00
4.00
2.00
0.23
8.00
11.40
D1
D2
E
F
P
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
P0
P1
T
W
W1
Reel width
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-12164Q
Issued Date
2013/12/17
Revised Date
-
Revision
Page.
7
A
Page 5
Chip Low Leakage Schottky Barrier Rectifier
Formosa MS
KLFM120-MT THRU KLFM140-MT
Reel packing
COMPONENT
SPACING
INNER
BOX
REEL
DIA,
CARTON
SIZE
APPROX.
GROSS WEIGHT
PACKAGE
SOD-123T
REEL SIZE
7"
CARTON
(pcs)
REEL
(pcs)
BOX
(pcs)
(m/m)
(m/m)
(m/m)
(kg)
(m/m)
4.0
2,500
25,000
183*123*183
178
382*257*387
200,000
10.5
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5oC~40oC Humidity=55% 25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Tsmin
tS
Preheat
Ramp-down
25
t25oC to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(TL to TP)
<3oC/sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(ts)
150oC
200oC
60~120sec
Tsmax to TL
-Ramp-upRate
<3oC/sec
Time maintained above:
-Temperature(TL)
-Time(tL)
217oC
60~260sec
Peak Temperature(TP)
255oC-0/+5oC
Time within 5oC of actual Peak
Temperature(tP)
10~30sec
Ramp-down Rate
<3oC/sec
Time 25oC to Peak Temperature
<6minutes
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-12164Q
Issued Date
2013/12/17
Revised Date
-
Revision
A
Page.
7
Page 6
Chip Low Leakage Schottky Barrier Rectifier
Formosa MS
KLFM120-MT THRU KLFM140-MT
High reliability test capabilities
Item Test
Conditions
at 260 5OC for 10 2sec.
Reference
1. Solder Resistance
MIL-STD-750D
METHOD-2031
at 245 5OC for 5 sec.
2. Solderability
MIL-STD-202F
METHOD-208
VR=80% rate at TJ=150OC for 168 hrs.
Rated average rectifier current at TA=25OC for 500hrs.
3. High Temperature Reverse Bias
4. Forward Operation Life
5. Intermittent Operation Life
6. Pressure Cooker
MIL-STD-750D
METHOD-1038
MIL-STD-750D
METHOD-1027
TA = 25OC, IF = IO
MIL-STD-750D
METHOD-1036
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
JESD22-A102
15PSIG at TA=121OC for 4 hrs.
MIL-STD-750D
METHOD-1051
-55OC to +125OC dwelled for 30 min.
and transferred for 5min. total 10 cycles.
7. Temperature Cycling
8. Forward Surge
MIL-STD-750D
METHOD-4066-2
8.3ms single half sine-wave , one surge.
at TA=85OC, RH=85% for 1000hrs.
at 175OC for 1000 hrs.
MIL-STD-750D
METHOD-1021
9. Humidity
MIL-STD-750D
METHOD-1031
10. High Temperature Storage Life
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-12164Q
Issued Date
2013/12/17
Revised Date
-
Revision
A
Page.
7
Page 7
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