RB521S_10 [FORMOSA]
200mA Surface Mount Small Signal Schottky Diodes-30V; 200毫安表面贴装小信号肖特基二极管， 30V
| 型号： | RB521S_10 |
| 厂家： | 
FORMOSA MS |
| 描述： | 200mA Surface Mount Small Signal Schottky Diodes-30V |
| 文件： | 总7页 (文件大小：110K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Small Signal Schottky Diode
Formosa MS
RB521S
List
1
2
2
2
2
3
4
4
4
5
6
6
7
List.................................................................................................
Package outline...............................................................................
Features..........................................................................................
Mechanical data...............................................................................
Maximum ratings .............................................................................
Rating and characteristic curves........................................................
Pinning information...........................................................................
Marking...........................................................................................
Suggested solder pad layout.............................................................
Packing information..........................................................................
Reel packing....................................................................................
Suggested thermal profiles for soldering processes.............................
High reliability test capabilities...........................................................
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-221662
Issued Date
2008/02/10
Revised Date
2010/05/10
Revision
B
Page.
7
Page 1
Small Signal Schottky Diode
Formosa MS
RB521S
200mA Surface Mount Small Signal
Schottky Diodes-30V
Package outline
Features
SOD-523FL
• Low current rectification and high speed switching.
• Extremely small surface mount type.
• Up to 200mA current capability.
0.051(1.30)
0.043(1.10)
• Low forward voltage drop (VF = 0.5V typ. @200mA)
• Silicon epitaxial planar chip, metal silicon junction.
• Lead-free parts meet exceeds environmental
standards of MIL-STD-19500 /228
• Suffix "-H" indicates Halogen-free parts, ex. RB521S-H.
0.028(0.70)
0.020(0.50)
Mechanical data
0.067(1.70)
0.059(1.50)
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-523FL
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
Dimensions in inches and (millimeters)
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.002 gram
Maximum ratings and Electrical Characteristics (AT TA=25oC unless otherwise noted)
PARAMETER
Repetitive peak reverse voltage
Continuous reverse voltage
Mean rectifying current
CONDITIONS
Symbol MIN. TYP. MAX. UNIT
VRM
VR
IO
30
30
V
V
200
mA
IFSM
Forward surge current
1000
mA
60Hz for 1cycle
oC
oC
Operating temperature
Storage temperature
TJ
-40
-40
+125
+125
TSTG
Forward voltage
Reverse current
Diode capacitance
IF = 200 mA
VF
IR
0.50
30
V
VR = 10 V
uA
pF
4.0
CT
VR = 10 V, f = 1MHz
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-221662
Issued Date
2008/02/10
Revised Date
2010/05/10
Revision
B
Page.
7
Page 2
Rating and characteristic curves (RB521S)
FIG.2 - TYPICAL REVERSE
FIG.1-TYPICAL FORWARD
CHARACTERISTICS
CHARACTERISTICS
1000mA
100mA
10mA
1mA
1mA
Ta=125oC
Ta=75oC
100uA
10uA
1uA
Ta=25oC
Ta=-25oC
100uA
10uA
100nA
10nA0
5
10
REVERSE VOLTAGE,(V)
15
20
25
30
35
1uA
0
0.1 0.2
0.3 0.4 0.5 0.6 0.7
FORWARD VOLTAGE,(V)
FIG.4- DERATING CURVE
FIG.3-TYPICAL TERMINALS CAPACITANCE
100
f=1MHz
10
1
0
5
10
15
20
25
30
35
REVERSE VOLTAGE,(V)
AMBIENT TEMPERATURE,(°C)
(mounting on glass epoxy PCBs)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-221662
Issued Date
2008/02/10
Revised Date
2010/05/10
Revision
B
Page.
7
Page 3
Small Signal Schottky Diode
Formosa MS
RB521S
Pinning information
Pin
Simplified outline
Symbol
Pin1 cathode
Pin2 anode
1
2
1
2
Marking
Type number
RB521S
Marking code
C
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
A
B
C
SOD-523FL
0.032 (0.80)
0.024 (0.60)
0.044 (1.10)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-221662
Issued Date
2008/02/10
Revised Date
2010/05/10
Revision
B
Page.
7
Page 4
Small Signal Schottky Diode
Formosa MS
RB521S
Packing information
P0
P1
d
E
F
W
B
A
P
D2
D1
T
C
W1
D
unit:mm
Symbol
SOD-523FL
Item
Tolerance
Carrier width
Carrier length
Carrier depth
Sprocket hole
A
B
C
d
0.1
0.1
0.1
0.1
0.90
1.94
0.76
1.50
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
D
2.0
min
0.2
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
178.00
50.00
13.00
1.75
3.50
2.00
4.00
2.00
0.23
8.00
D1
D2
E
F
P
P0
P1
T
W
W1
Reel width
9.50
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-221662
Issued Date
2008/02/10
Revised Date
2010/05/10
Revision
Page.
7
B
Page 5
Small Signal Schottky Diode
Formosa MS
RB521S
Reel packing
COMPONENT
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
CARTON
SIZE
(m/m)
APPROX.
PACKAGE REEL SIZE REEL
(pcs)
SPACING
(m/m)
BOX
(pcs)
CARTON GROSS WEIGHT
(pcs)
(kg)
SOD-523FL
7"
3,000
4.0
178
30,000 183*183*123
382*262*387 240,000
9.5
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5oC~40oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Tsmin
tS
Preheat
Ramp-down
25
t25oC to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(TL to TP)
<3oC/sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(ts)
150oC
200oC
60~120sec
Tsmax to TL
-Ramp-upRate
<3oC/sec
Time maintained above:
-Temperature(TL)
-Time(tL)
217oC
60~260sec
Peak Temperature(TP)
255oC-0/+5oC
Time within 5oC of actual Peak
Temperature(tP)
10~30sec
Ramp-down Rate
<6oC/sec
Time 25oC to Peak Temperature
<6minutes
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-221662
Issued Date
2008/02/10
Revised Date
2010/05/10
Revision
B
Page.
7
Page 6
Small Signal Schottky Diode
Formosa MS
RB521S
High reliability test capabilities
Item Test
1. Solder Resistance
Conditions
Reference
MIL-STD-750D
METHOD-2031
at 260±5OC for 10±2sec.
immerse body into solder 1/16"±1/32"
at 245±5OC for 5 sec.
2. Solderability
MIL-STD-202F
METHOD-208
VR=80% rate at TJ=125OC for 168 hrs.
Rated average rectifier current at TA=25OC for 500hrs.
3. High Temperature Reverse Bias
4. Forward Operation Life
5. Intermittent Operation Life
6. Pressure Cooker
MIL-STD-750D
METHOD-1038
MIL-STD-750D
METHOD-1027
TA = 25OC, IF = IO
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
JESD22-A102
15PSIG at TA=121OC for 4 hrs.
-55OC to +125OC dwelled for 30 min.
7. Temperature Cycling
8. Thermal Shock
MIL-STD-750D
METHOD-1051
and transferred for 5min. total 10 cycles.
0OC for 5 min. rise to 100OC for 5 min. total 10 cycles.
60Hz for 1cycle
MIL-STD-750D
METHOD-1056
9. Forward Surge
MIL-STD-750D
METHOD-4066-2
at TA=85OC, RH=85% for 1000hrs.
at 175OC for 1000 hrs.
10. Humidity
MIL-STD-750D
METHOD-1021
11. High Temperature Storage Life
MIL-STD-750D
METHOD-1031
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-221662
Issued Date
2008/02/10
Revised Date
2010/05/10
Revision
B
Page.
7
Page 7
相关型号：
RB521VM-40FHTE-17
Rectifier Diode, Schottky, 1 Element, 0.2A, 40V V(RRM), Silicon, SC-90A, 2 PIN
ROHM
RB521ZS8A30TE61
Rectifier Diode, Schottky, 4 Element, 0.1A, 30V V(RRM), Silicon, DFN1608-8, 8 PIN
ROHM
©2020 ICPDF网 联系我们和版权申明