2Q168137-2010-10F [FOXCONN]
IC Socket, BGA1681, 1681 Contact(s), LEAD FREE;
| 型号： | 2Q168137-2010-10F |
| 厂家： | 
FOXCONN |
| 描述： | IC Socket, BGA1681, 1681 Contact(s), LEAD FREE |
| 文件： | 总1页 (文件大小：159K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SPECIFICATIONS
Burn-in & test socket
BITS Series
Clamshell, BGA/LGA Type
1.27 mm [.05”] Pitch
Mechanical
Durability: 10’000 cycles min.
Actuation force: 1.5kgf max.
DUT Heat Dissipation: 150W max. under 6 CFM.
41x41 Grid Size Max.
Compressed Contact Design
Electrical
Current Rating: 1Amp/pin min.
Dielectric Withstanding Voltage: 650V A.C for 60 sec.
Insulation Resistance: 1000MW min.
Contact Resistance: 300mW max.
Hast: Pass 130℃ at 85% RH, 168 hours duration
THB: Pass 85℃ at 85% RH, 1000 hours duration
Bake : Pass 150℃ for 168 hours
Physical
Cover & Base: Thermoplastic, UL 94V-0
Contact: Copper alloy
Contact Plating: See “ORDERING INFORMATION”
Operating Temperature: 150℃ max.
DRAWING
ORDERING INFORMATION
PRODUCT NO.: 2 Q * * * * 3 * - 2 0 * 0 - 1 0 F
Pin Counts
LF Code
F=LF
1681=1681 Pos.
1368=1368 Pos
Tail Plating
Pick-up Design
3=Au
0=None
Contact Plating
3=30m” Gold Plating
7=15m” Gold Plating
Package
1=Soft Tray
Chip/Burn-in Board
Chip Spec.
0=None
2=BGA/LGA
Pitch
Design Type
0=1.27 mm
1=Type #1
2=Type #2
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
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