AS0A623-H8RN-7H [FOXCONN]
Card Edge Connector;
| 型号： | AS0A623-H8RN-7H |
| 厂家： | 
FOXCONN |
| 描述： | Card Edge Connector |
| 文件： | 总1页 (文件大小：132K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SPECIFICATIONS
DDRIII SO DIMM Socket
AS Series
8.0mm Height
SMT Type
0.60mm Pitch
204 Pos.
Mechanical
Contact Retention Force: 0.10kg min.
Durability : 25 Cycles
Electrical
Voltage Rating: 25V
Current Rating: 0.5A
Contact Resistance: 50mΩ max.
Dielectric Withstanding Voltage: 250V AC/1 min.
Insulation Resistance: 100M
Ω
Physical
Housing: Thermoplastic, UL 94V-0 rated in Ivory Color
Contact: Copper alloy
Plating: See “ORDERING INFORMATION”
Metal Spring: Copper alloy
Operating Temperature: -55
℃
to +85℃
DRAWING
70.00
4.70
66.80
33.40
6.80
DIM.
A
DIM.
B
2.00
3.00
POS.NO. 204
POS.NO.
2
11.30
1.10
3.10
1.60
0.60
POS.NO.
1
3.00
76.8
74.0
POS.NO. 203
DIM.
B
DIM.
A
66.80
RECOMMEDED P.C.B LAYOUT
DIM.
A
DIM.
B
1.65
1.35
25.9
POS.NO.
2
POS.NO. 204
0.60
POS.NO. 203
POS.NO.
DIM.
1
8.00
DIM.
B
A
68.00
71.6
ORDERING INFORMATION
PRODUCT NO.: A S 0 A6 2 * - H 8 * N - * H
Memory Module Socket
AS0A62* - H8SN- * H 21.00
39.00
H=HALOGEN
/LEAD FREE
Package Code
39.00
DIM.A
21.00
DIM.B
AS0A62* - H8RN- * H
P/ N
Horizontal Type
Single Row
4=Soft Tray
7=Tape Reel
No. Of Pos.
A6=204 Pos.
N=Normal Type
SMT Type
S=Standard
R=Reverse
Contact Area Plating
1=Gold Flash
Y=5u"Gold Plating
6=10u"Gold Plating
7=15u"Gold Plating
3=30u"Gold Plating
8=8.0mm Height
H=DDR SODIMM
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
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