AOT264L [FREESCALE]

60V N-Channel MOSFET; 60V N沟道MOSFET
AOT264L
型号: AOT264L
厂家: Freescale    Freescale
描述:

60V N-Channel MOSFET
60V N沟道MOSFET

文件: 总6页 (文件大小:606K)
中文:  中文翻译
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AOT264L/AOB264L  
60V N-Channel MOSFET  
General Description  
The AOT264L/AOB264L combines advanced trench  
MOSFET technology with a low resistance package to  
provide extremely low RDS(ON).This device is ideal for boost converters and synchronous rectifiers for consumer,  
ting.  
telecom, industrial power supplies and LED backligh  
Features  
VDS  
60V  
ID (at VGS=10V)  
RDS(ON) (at VGS=10V)  
RDS(ON) (at VGS = 6V)  
140A  
< 3.2m(< 3.0mΩ )  
< 3.5m(< 3.3mΩ )  
TO-263  
D2PAK  
TO220  
D
D
D
G
G
G
S
D
S
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
Maximum  
60  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
V
VGS  
±20  
TC=25°C  
140  
Continuous Drain  
Current G  
ID  
TC=100°C  
110  
A
A
Pulsed Drain Current C  
IDM  
480  
19  
TA=25°C  
TA=70°C  
Continuous Drain  
Current  
Avalanche Current C  
Avalanche energy L=0.1mH C  
IDSM  
15  
IAS, IAR  
100  
A
EAS, EAR  
500  
mJ  
TC=25°C  
Power Dissipation B  
TC=100°C  
333  
PD  
W
167  
TA=25°C  
2.1  
PDSM  
W
°C  
Power Dissipation A  
1.3  
TA=70°C  
Junction and Storage Temperature Range  
TJ, TSTG  
-55 to 175  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
12  
Max  
15  
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Ambient A D  
Maximum Junction-to-Case  
t
10s  
RθJA  
Steady-State  
Steady-State  
48  
60  
RθJC  
0.35  
0.45  
* Surface mount package TO263  
1/6  
www.freescale.net.cn  
AOT264L/AOB264L  
60V N-Channel MOSFET  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Units  
STATIC PARAMETERS  
ID=250µA, VGS=0V  
BVDSS  
Drain-Source Breakdown Voltage  
60  
V
VDS=60V, VGS=0V  
1
IDSS  
Zero Gate Voltage Drain Current  
µA  
5
TJ=55°C  
VDS=0V, VGS= ±20V  
VDS=VGS ID=250µA  
VGS=10V, VDS=5V  
VGS=10V, ID=20A  
TO220  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
100  
3.2  
nA  
V
VGS(th)  
ID(ON)  
2.2  
2.7  
480  
A
2.4  
4
3.2  
4.8  
TJ=125°C  
VGS=6V, ID=20A  
TO220  
2.7  
2.3  
3.5  
3.0  
3.3  
RDS(ON)  
Static Drain-Source On-Resistance  
mΩ  
VGS=10V, ID=20A  
TO263  
VGS=6V, ID=20A  
TO263  
2.6  
80  
VDS=5V, ID=20A  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
S
V
A
IS=1A,VGS=0V  
Maximum Body-Diode Continuous CurrentG  
0.65  
1
140  
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
5500 6960 8400  
pF  
pF  
pF  
VGS=0V, VDS=30V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
840  
30  
VGS=0V, VDS=0V, f=1MHz  
VGS=10V, VDS=30V, ID=20A  
0.4  
62  
0.9  
1.4  
94  
SWITCHING PARAMETERS  
Qg(10V) Total Gate Charge  
78  
25  
5
nC  
nC  
nC  
ns  
ns  
ns  
ns  
Qgs  
Qgd  
tD(on)  
tr  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
23  
7
VGS=10V, VDS=30V, RL=1.5,  
RGEN=3Ω  
tD(off)  
tf  
45  
8
trr  
IF=20A, dI/dt=500A/µs  
IF=20A, dI/dt=500A/µs  
18  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
26  
34  
ns  
Qrr  
105  
nC  
155  
202  
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The  
Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application depends  
on the user's specific board design, and the maximum temperature of 175°C may be used if the PCB allow s it.  
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
dissipation limit for cases where additional heatsinking is used.  
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low frequency and duty cycles to keep  
initial TJ =25°C.  
D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink,  
assuming a maximum junction temperature of TJ(MAX)=175°C. The SOA curve provides a single pulse ratin g.  
G. The maximum current rating is package limited.  
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.  
2/6  
www.freescale.net.cn  
AOT264L/AOB264L  
60V N-Channel MOSFET  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
100  
80  
60  
40  
20  
0
100  
80  
60  
40  
20  
0
10V  
6V  
VDS=5V  
4.5V  
4V  
125°C  
25°C  
Vgs=3.5V  
4
1
2
3
VGS(Volts)  
4
5
6
0
1
2
3
5
V
DS (Volts)  
Figure 2: Transfer Characteristics (Note E)  
Fig 1: On-Region Characteristics (Note E)  
6
4
2
0
2.2  
2
VGS=10V  
ID=20A  
1.8  
1.6  
1.4  
1.2  
1
VGS=4.5V  
VGS=10V  
VGS=6V  
ID=20A  
0.8  
0
5
10  
15  
D (A)  
20  
25  
30  
0
25  
50  
75  
100 125 150 175 200  
I
Temperature (°C)  
Figure 3: On-Resistance vs. Drain Current and Gate  
Voltage (Note E)  
Figure 4: On-Resistance vs. Junction Temperature  
(Note E)  
8
6
4
2
0
1.0E+02  
1.0E+01  
ID=20A  
125°C  
1.0E+00  
125°C  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
25°C  
25°C  
2
4
6
8
10  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
VGS (Volts)  
VSD (Volts)  
Figure 6: Body-Diode Characteristics (Note E)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
(Note E)  
3/6  
www.freescale.net.cn  
AOT264L/AOB264L  
60V N-Channel MOSFET  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
10  
10000  
8000  
6000  
4000  
2000  
0
VDS=30V  
ID=20A  
8
Ciss  
6
4
Coss  
2
Crss  
0
0
10  
20  
30  
40  
g (nC)  
50  
60  
70  
80  
0
10  
20  
30  
VDS (Volts)  
40  
50  
60  
Q
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
600  
500  
400  
300  
200  
1000.0  
100.0  
10.0  
1.0  
10µs  
RDS(ON)  
limited  
TJ(Max)=175°C  
TC=25°C  
100µs  
1ms  
10ms  
DC  
TJ(Max)=175°C  
TC=25°C  
0.1  
0.0  
0.01  
0.1  
1
10  
100  
0.001  
0.01  
0.1  
1
10  
VDS (Volts)  
Pulse Width (s)  
Figure 10: Single Pulse Power Rating Junction-to-  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
Case (Note F)  
10  
1
D=Ton/T  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
T
J,PK=TC+PDM.ZθJC.RθJC  
θJC=0.45°C/W  
R
PD  
0.1  
0.01  
Ton  
T
Single Pulse  
0.0001  
0.00001  
0.001  
0.01  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
0.1  
1
10  
4/6  
www.freescale.net.cn  
AOT264L/AOB264L  
60V N-Channel MOSFET  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
1000  
100  
10  
400  
300  
200  
100  
0
TA=25°C  
TA=100°C  
TA=150°C  
TA=125°C  
1
10  
100  
1000  
0
25  
50  
75  
100  
125  
150  
175  
Time in avalanche, tA (µs)  
T
CASE (°C)  
Figure 12: Single Pulse Avalanche capability (Note  
C)  
Figure 13: Power De-rating (Note F)  
150  
120  
90  
60  
30  
0
1000  
100  
10  
TA=25°C  
1
0
25  
50  
75  
CASE (°C)  
Figure 14: Current De-rating (Note F)  
100  
125  
150  
175  
0.001  
0.1  
10  
Pulse Width (s)  
1000  
T
Figure 15: Single Pulse Power Rating Junction-to-  
Ambient (Note H)  
10  
1
D=Ton/T  
TJ,PK=TA+PDM.ZθJA.RθJA  
θJA=60°C/W  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
R
0.1  
PD  
0.01  
0.001  
Ton  
Single Pulse  
1
T
0.01  
0.1  
10  
100  
1000  
Pulse Width (s)  
Figure 16: Normalized Maximum Transient Thermal Impedance (Note H)  
5/6  
www.freescale.net.cn  
AOT264L/AOB264L  
60V N-Channel MOSFET  
Gate Charge Test Circuit & Waveform  
Vgs  
Qg  
10V  
+
VDC  
+
Qgs  
Qgd  
Vds  
VDC  
-
-
DUT  
Vgs  
Ig  
Charge  
Resistive Switching Test Circuit & Waveforms  
RL  
Vds  
Vds  
90%  
10%  
+
DUT  
Vdd  
Vgs  
VDC  
Rg  
-
Vgs  
Vgs  
td(on)  
t
r
td(off)  
t
f
ton  
toff  
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms  
L
EAR= 1/2 LIA2R  
BVDSS  
Vds  
Id  
Vgs  
Vds  
+
Vgs  
Vdd  
I AR  
VDC  
Id  
Rg  
-
DUT  
Vgs  
Vgs  
Diode Recovery Test Circuit & Waveforms  
Qrr = - Idt  
Vds +  
Vds -  
Ig  
DUT  
Vgs  
trr  
L
Isd  
I F  
Isd  
Vgs  
dI/dt  
I RM  
+
Vdd  
VDC  
Vdd  
-
Vds  
6/6  
www.freescale.net.cn  

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