MP3V5100GC6U [FREESCALE]
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated; 集成硅压力传感器片上信号调节，温度补偿和校准
| 型号： | MP3V5100GC6U |
| 厂家： | 
Freescale |
| 描述： | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| 文件： | 总9页 (文件大小：106K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Pressure
MP3V5100
Rev 0, 4/2009
Freescale Semiconductor
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
MP3V5100
Series
0 to 100 kPa (0 to 14.5 psi)
0.1 to 3.1 V Output
The MP3V5100 series piezoresistive transducers are state-of-the-art
monolithic silicon pressure sensors designed for a wide range of applications,
but particularly those employing a microcontroller or microprocessor with A/D
inputs. This transducer combines advanced micromachining techniques,
thin-film metallization, and bipolar processing to provide an accurate, high
level analog output signal that is proportional to the applied pressure.
Application Examples
•
•
•
•
Process Control
Patient Monitoring
Pump/Motor Control
Pressure Switching
Features
• 2.5% Maximum Error Over 0° to 85°C
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Thermoplastic (PPS) Surface Mount Package
• Patented Silicon Shear Stress Strain Gauge
• Available in Differential and Gauge Configurations
ORDERING INFORMATION
# of Ports
Single
Pressure Type
Differential Absolute
Package
Options
Case
No.
Device
Marking
Device Name
None
Dual
Gauge
Small Outline Package (MP3V5100 Series)
MP3V5100GC6U
MP3V5100GC6T1
MP3V5100GP
MP3V5100G
MP3V5100G
MP3V5100GP
Rails
Tape & Reel
Trays
482A
482A
1369
•
•
•
•
•
•
SMALL OUTLINE PACKAGE
MP3V5100GC6U/C6T1
CASE 482A-01
MP3V5100GP
CASE 1369-01
© Freescale Semiconductor, Inc., 2009. All rights reserved.
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 3 required to meet specification.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
0
—
100
kPa
Supply Voltage(2)
Supply Current
VS
Io
2.7
—
3.0
7.0
3.3
10
Vdc
mAdc
Vdc
Minimum Pressure Offset(3)
@ VS = 3.0 Volts
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
Voff
0.11
0.18
0.25
Full Scale Output(4)
@ VS = 3.0 Volts
VFSO
VFSS
—
2.81
—
2.88
2.7
—
2.95
—
Vdc
Vdc
Full Scale Span(5)
@ VS = 3.0 Volts
Accuracy(6)
Sensitivity
—
%VFSS
2.5
—
V/P
tR
—
—
27
mV/kPa
ms
Response Time(7)
1.0
—
Output Source Current at Full Scale Output
IO+
—
—
—
—
0.1
20
—
—
—
mAdc
ms
Warm-Up Time(8)
Offset Stability(9)
—
±0.5
%VFSS
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
TcSpan:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to
25°C.
TcOffset:
Variation from Nominal:
The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MP3V5100
Sensors
2
Freescale Semiconductor
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
Storage Temperature
Pmax
400
kPa
Tstg
TA
–40 to +125
–40 to +125
°C
°C
Operating Temperature
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
2
VS
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Thin Film
Temperature
Compensation
and
4
Sensing
Element
Vout
Gain Stage #1
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for Small Outline Package Device
GND
3
Figure 1. Integrated Pressure Sensor Schematic
MP3V5100
Sensors
Freescale Semiconductor
3
Pressure
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 2 illustrates the Differential or Gauge configuration
in the basic chip carrier (Case 482). A fluorosilicone gel
isolates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the
sensor diaphragm.
The MP3V5100 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
Figure 4 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 3. The
output will saturate outside of the specified pressure range.
Stainless
Steel Cap
Fluoro Silicone
Gel Die Coat
Die
P1
Thermoplastic
Case
Wire Bond
Lead
Frame
P2
Die Bond
Differential Sensing
Element
Figure 2. Cross-Sectional Diagram SOP
(not to scale)
+3 V
OUTPUT
Vout
Vs
IPS
1.0 μF
GND
470 pF
0.01 μF
Figure 3. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646.)
MP3V5100
Sensors
Freescale Semiconductor
4
Pressure
Transfer Function:
V
= V *(0.009 * P+0.06) ± (Pressure Error *Temp. Factor * 0.009 * V )
3
2
out
S
S
V
= 3.0 Vdc
S
TEMP = 0 to 85°C
PE = 2.5
TM = 1
TYPICAL
MAX
MIN
1
0
0
100
Differential Pressure (kPa)
Figure 4. Output versus Pressure Differential
Transfer Function
Nominal Transfer Value: Vout = VS x (0.009 x P + 0.06)
± (Pressure Error x Temp. Factor x 0.009 x VS)
S = 3.0 V ± 0.30 Vdc
V
Temperature Error Band
MP3V5100 SERIES
4.0
Temp
Multiplier
3.0
–40
0 to 85
+125
3
1
3
Temperature
Error
Factor
2.0
1.0
0.0
–40
–20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.
MP3V5100
Sensors
Freescale Semiconductor
5
Pressure
Pressure Error Band
3
2
1
Pressure
Pressure (kPa)
Error
(kPa)
0
0
100
–1
–2
–3
Pressure
Error (Max)
±2.5 kPa
0 to 100 kPa
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The pressure
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table:
Pressure (P1)
Part Number
Case Type
Side Identifier
Side with Port Attached
Side with Port Attached
MP3V5100GC6U/C6T1
MP3V5100GP
482A
1369
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
0.100 TYP 8X
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
inch
0.100 TYP 8X
2.54
mm SCALE 2:1
Figure 5. Small Outline Package Footprint
MP3V5100
Sensors
6
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
-A-
D 8 PL
4
1
M
S
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
0.25 (0.010)
T
B
5
8
N
-B-
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
G
INCHES
MIN MAX
MILLIMETERS
DIM
A
B
C
D
G
H
J
K
M
N
MIN
10.54
10.54
12.70
0.96
MAX
10.79
10.79
13.21
1.07
S
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
W
2.54 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0.05
0.23
1.55
0˚
0.25
0.28
1.80
7˚
V
0˚
7˚
C
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
11.28
18.01
6.22
2.92
11.38
18.41
6.48
3.17
S
V
W
H
J
-T-
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
MP3V5100
Sensors
Freescale Semiconductor
7
Pressure
PACKAGE DIMENSIONS
2 PLACES 4 TIPS
0.008 (0.20) C A
B
E
A
GAGE
PLANE
e
5
8
4
1
e/2
.014 (0.35)
θ
L
A1
D
F
DETAIL G
NOTES:
1. CONTROLLING DIMENSION: INCH.
8X b
0.004 (0.1)
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
4. DIMENSION "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
M
C
A
B
E1
B
INCHES
DIM MIN MAX
0.300
A1 0.002
MILLIMETERS
MIN
7.11
MAX
7.62
0.25
N
T
∅
A
0.330
0.010
0.042
0.485
K
0.05
0.96
b
D
E
0.038
0.465
0.717 BSC
1.07
12.32
11.81
18.21 BSC
E1 0.465
0.485
11.81
2.54 BSC
12.32
A
M
e
F
K
L
M
N
P
T
θ
0.100 BSC
0.245
0.120
0.061
0.270
0.080
0.009
0.115
0˚
0.255
0.130
0.071
0.290
0.090
0.011
0.125
7˚
6.22
3.05
1.55
6.86
2.03
0.23
2.92
0˚
6.47
3.30
1.80
7.36
2.28
0.28
3.17
7˚
8X
0.004 (0.1)
P
DETAIL G
SEATING
PLANE
C
CASE 1369-01
ISSUE O
SMALL OUTLINE PACKAGE
MP3V5100
Sensors
Freescale Semiconductor
8
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© Freescale Semiconductor, Inc. 2009. All rights reserved.
MP3V5100
Rev. 0
4/2008
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