MPC885CZP133 [FREESCALE]
Hardware Specifications; 硬件规格
| 型号： | MPC885CZP133 |
| 厂家： | 
Freescale |
| 描述： | Hardware Specifications |
| 文件： | 总92页 (文件大小：1505K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MPC885EC
Rev. 3, 07/2004
Freescale Semiconductor
MPC885/MPC880
Hardware Specifications
Contents
This hardware specification contains detailed information on
1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3. Maximum Tolerated Ratings . . . . . . . . . . . . . . . . . . . 9
4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . 10
5. Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6. DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7. Thermal Calculation and Measurement . . . . . . . . . . 12
8. Power Supply and Power Sequencing . . . . . . . . . . . 14
9. Layout Practices . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
10. Bus Signal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 15
11. IEEE 1149.1 Electrical Specifications . . . . . . . . . . . 44
12. CPM Electrical Characteristics . . . . . . . . . . . . . . . . . 46
13. UTOPIA AC Electrical Specifications . . . . . . . . . . . 69
15. FEC Electrical Characteristics . . . . . . . . . . . . . . . . . 71
16. Mechanical Data and Ordering Information . . . . . . . 75
17. Document Revision History . . . . . . . . . . . . . . . . . . . 89
power considerations, DC/AC electrical characteristics, and AC
timing specifications for the MPC885/MPC880 (refer to Table 1
for the list of devices). The MPC885 is the superset device of the
MPC885/MPC880 family. The CPU on the MPC885/MPC880 is
a 32-bit PowerPC™ core that incorporates memory management
units (MMUs) and instruction and data caches and that
implements the PowerPC instruction set.
1 Overview
The MPC885/880 is a versatile single-chip integrated
microprocessor and peripheral combination that can be used in a
variety of controller applications and communications and
networking systems. The MPC885/MPC880 provides enhanced
ATM functionality, an additional fast Ethernet controller, a USB,
and an encryption block.
© Freescale Semiconductor, Inc., 2004. All rights reserved.
Features
Table 1 shows the functionality supported by the members of the MPC885 family.
Table 1. MPC885 Family
Cache
Ethernet
Security
Engine
Part
SCC SMC USB
ATM Support
I Cache D Cache 10BaseT 10/100
MPC885
8 Kbyte 8 Kbyte Up to 3
8 Kbyte 8 Kbyte Up to 2
2
2
3
2
2
2
1
1
Serial ATM and
UTOPIA interface
Yes
No
MPC880
Serial ATM and
UTOPIA interface
2 Features
The MPC885/880 is comprised of three modules that each use the 32-bit internal bus: a MPC8xx core, a system
integration unit (SIU), and a communications processor module (CPM).
The following list summarizes the key MPC885/880 features:
•
•
Embedded MPC8xx core up to 133 MHz
Maximum frequency operation of the external bus is 80 MHz (in 1:1 mode)
— The 133-MHz core frequency supports 2:1 mode only.
— The 66-/80-MHz core frequencies support both the 1:1 and 2:1 modes.
•
Single-issue, 32-bit core (compatible with the PowerPC architecture definition) with thirty-two 32-bit
general-purpose registers (GPRs)
— The core performs branch prediction with conditional prefetch and without conditional execution.
— 8-Kbyte data cache and 8-Kbyte instruction cache (see Table 1)
– Instruction cache is two-way, set-associative with 256 sets in 2 blocks
– Data cache is two-way, set-associative with 256 sets
– Cache coherency for both instruction and data caches is maintained on 128-bit (4-word) cache
blocks.
– Caches are physically addressed, implement a least recently used (LRU) replacement algorithm, and
are lockable on a cache block basis.
— MMUs with 32-entry TLB, fully associative instruction and data TLBs
— MMUs support multiple page sizes of 4, 16, and 512 Kbytes, and 8 Mbytes; 16 virtual address spaces
and 16 protection groups
— Advanced on-chip emulation debug mode
•
Provides enhanced ATM functionality found on the MPC862 and MPC866 families and includes the
following:
— Improved operation, administration and maintenance (OAM) support
— OAM performance monitoring (PM) support
— Multiple APC priority levels available to support a range of traffic pace requirements
— Port-to-port switching capability without the need for RAM-based microcode
— Simultaneous MII (100BaseT) and UTOPIA (half- or full -duplex) capability
— Optional statistical cell counters per PHY
MPC885/MPC880 Hardware Specifications, Rev. 3
2
Freescale Semiconductor
Features
— UTOPIA L2-compliant interface with added FIFO buffering to reduce the total cell
transmission time and multi-PHY support. (The earlier UTOPIA L1 specification is also
supported.)
2
— Parameter RAM for both SPI and I C can be relocated without RAM-based microcode
— Supports full-duplex UTOPIA master (ATM side) and slave (PHY side) operations using a split
bus
— AAL2/VBR functionality is ROM-resident.
Up to 32-bit data bus (dynamic bus sizing for 8, 16, and 32 bits)
32 address lines
•
•
•
Memory controller (eight banks)
— Contains complete dynamic RAM (DRAM) controller
— Each bank can be a chip select or RAS to support a DRAM bank.
— Up to 30 wait states programmable per memory bank
— Glueless interface to DRAM, SIMMS, SRAM, EPROMs, Flash EPROMs, and other memory
devices
— DRAM controller programmable to support most size and speed memory interfaces
— Four CAS lines, four WE lines, and one OE line
— Boot chip-select available at reset (options for 8-, 16-, or 32-bit memory)
— Variable block sizes (32 Kbyte–256 Mbyte)
— Selectable write protection
— On-chip bus arbitration logic
•
General-purpose timers
— Four 16-bit timers or two 32-bit timers
— Gate mode can enable/disable counting.
— Interrupt can be masked on reference match and event capture
•
•
Two fast Ethernet controllers (FEC)—Two 10/100 Mbps Ethernet/IEEE 802.3 CDMA/CS that
interface through MII and/or RMII interfaces
System integration unit (SIU)
— Bus monitor
— Software watchdog
— Periodic interrupt timer (PIT)
— Clock synthesizer
— Decrementer and time base
— Reset controller
— IEEE 1149.1 test access port (JTAG)
•
Security engine is optimized to handle all the algorithms associated with IPsec, SSL/TLS, SRTP,
802.11i, and iSCSI processing. Available on the MPC885, the security engine contains a
crypto-channel, a controller, and a set of crypto hardware accelerators (CHAs). The CHAs are:
— Data encryption standard execution unit (DEU)
– DES, 3DES
– Two key (K1, K2, K1) or three key (K1, K2, K3)
– ECB and CBC modes for both DES and 3DES
MPC885/MPC880 Hardware Specifications, Rev. 3
Freescale Semiconductor
3
Features
— Advanced encryption standard unit (AESU)
– Implements the Rinjdael symmetric key cipher
– ECB, CBC, and counter modes
– 128-, 192-, and 256- bit key lengths
— Message digest execution unit (MDEU)
– SHA with 160- or 256-bit message digest
– MD5 with 128-bit message digest
– HMAC with either algorithm
— Crypto-channel supporting multi-command descriptor chains
— Integrated controller managing internal resources and bus mastering
— Buffer size of 256 bytes for the DEU, AESU, and MDEU, with flow control for large data sizes
Interrupts
•
•
— Six external interrupt request (IRQ) lines
— 12 port pins with interrupt capability
— 23 internal interrupt sources
— Programmable priority between SCCs
— Programmable highest priority request
Communications processor module (CPM)
— RISC controller
— Communication-specific commands (for example, GRACEFUL STOP TRANSMIT, ENTER HUNT MODE, and
RESTART TRANSMIT)
— Supports continuous mode transmission and reception on all serial channels
— 8-Kbytes of dual-port RAM
— Several serial DMA (SDMA) channels to support the CPM
— Three parallel I/O registers with open-drain capability
On-chip 16 × 16 multiply accumulate controller (MAC)
— One operation per clock (two-clock latency, one-clock blockage)
— MAC operates concurrently with other instructions
— FIR loop—Four clocks per four multiplies
•
•
•
Four baud rate generators
— Independent (can be connected to any SCC or SMC)
— Allow changes during operation
— Autobaud support option
Up to three serial communication controllers (SCCs) supporting the following protocols:
— Serial ATM capability on SCCs
— Optional UTOPIA port on SCC4
— Ethernet/IEEE 802.3 optional on the SCC(s) supporting full 10-Mbps operation
— HDLC/SDLC
— HDLC bus (implements an HDLC-based local area network (LAN))
— Asynchronous HDLC to support point-to-point protocol (PPP)
MPC885/MPC880 Hardware Specifications, Rev. 3
4
Freescale Semiconductor
Features
— AppleTalk
— Universal asynchronous receiver transmitter (UART)
— Synchronous UART
— Serial infrared (IrDA)
— Binary synchronous communication (BISYNC)
— Totally transparent (bit streams)
— Totally transparent (frame based with optional cyclic redundancy check (CRC))
Up to two serial management channels (SMCs) supporting the following protocols:
— UART (low-speed operation)
•
•
— Transparent
— General circuit interface (GCI) controller
— Provide management for BRI devices as GCI controller in time-division multiplexed (TDM)
channels
Universal serial bus (USB)—Supports operation as a USB function endpoint, a USB host controller,
or both for testing purposes (loop-back diagnostics)
— USB 2.0 full-/low-speed compatible
— The USB function mode has the following features:
– Four independent endpoints support control, bulk, interrupt, and isochronous data transfers.
– CRC16 generation and checking
– CRC5 checking
– NRZI encoding/decoding with bit stuffing
– 12- or 1.5-Mbps data rate
– Flexible data buffers with multiple buffers per frame
– Automatic retransmission upon transmit error
— The USB host controller has the following features:
– Supports control, bulk, interrupt, and isochronous data transfers
– CRC16 generation and checking
– NRZI encoding/decoding with bit stuffing
– Supports both 12- and 1.5-Mbps data rates (automatic generation of preamble token and data
rate configuration). Note that low-speed operation requires an external hub.
– Flexible data buffers with multiple buffers per frame
– Supports local loop back mode for diagnostics (12 Mbps only)
Serial peripheral interface (SPI)
•
•
•
— Supports master and slave modes
— Supports multiple-master operation on the same bus
2
Inter-integrated circuit (I C) port
— Supports master and slave modes
— Supports a multiple-master environment
Time-slot assigner (TSA)
— Allows SCCs and SMCs to run in multiplexed and/or non-multiplexed operation
— Supports T1, CEPT, PCM highway, ISDN basic rate, ISDN primary rate, user defined
MPC885/MPC880 Hardware Specifications, Rev. 3
Freescale Semiconductor
5
Features
— 1- or 8-bit resolution
— Allows independent transmit and receive routing, frame synchronization, and clocking
— Allows dynamic changes
— Can be internally connected to four serial channels (two SCCs and two SMCs)
Parallel interface port (PIP)
•
•
— Centronics interface support
— Supports fast connection between compatible ports on MPC885/880 and other MPC8xx devices
PCMCIA interface
— Master (socket) interface, release 2.1-compliant
— Supports two independent PCMCIA sockets
— 8 memory or I/O windows supported
•
Debug interface
— Eight comparators: four operate on instruction address, two operate on data address, and two operate on
data
— Supports conditions: = ≠ < >
— Each watchpoint can generate a break point internally.
Normal high and normal low power modes to conserve power
1.8-V core and 3.3-V I/O operation
•
•
•
The MPC885/880 comes in a 357-pin ball grid array (PBGA) package.
MPC885/MPC880 Hardware Specifications, Rev. 3
6
Freescale Semiconductor
Features
The MPC885 block diagram is shown in Figure 1.
Instruction
Bus
8-Kbyte
Instruction Cache
System Interface Unit (SIU)
Unified
Bus
Memory Controller
Instruction MMU
32-Entry ITLB
Embedded
MPC8xx
Processor
Core
Internal
Bus Interface Bus Interface
Unit Unit
External
8-Kbyte
Data Cache
System Functions
Data MMU
32-Entry DTLB
Load/Store
Bus
PCMCIA-ATA Interface
Slave/Master IF
Security Engine
Fast Ethernet
Controller
Controller
Channel
AESU DEU MDEU
DMAs
FIFOs
4
Interrupt
8-Kbyte
Parallel I/O
Timers Controllers Dual-Port RAM
10/100
BaseT
Media Access
Control
4 Baud Rate
Generators
32-Bit RISC Controller
and Program
Virtual IDMA
and
Serial DMAs
ROM
Parallel Interface Port
Timers
MIII/RMII
SCC4/
UTOPIA
I2C
USB
SCC2
SCC3
SMC1
SMC2
SPI
Time Slot Assigner
Serial Interface
Figure 1. MPC885 Block Diagram
MPC885/MPC880 Hardware Specifications, Rev. 3
Freescale Semiconductor
7
Features
The MPC880 block diagram is shown in Figure 2.
Instruction
Bus
8-Kbyte
Instruction Cache
System Interface Unit (SIU)
Unified
Bus
Memory Controller
Instruction MMU
32-Entry ITLB
Embedded
MPC8xx
Processor
Core
Internal
Bus Interface Bus Interface
Unit Unit
External
8-Kbyte
Data Cache
System Functions
Data MMU
32-Entry DTLB
Load/Store
Bus
PCMCIA-ATA Interface
Slave/Master IF
Fast Ethernet
Controller
DMAs
FIFOs
4
Interrupt
8-Kbyte
Parallel I/O
Timers Controllers Dual-Port RAM
10/100
BaseT
Media Access
Control
4 Baud Rate
Generators
32-Bit RISC Controller
and Program
Virtual IDMA
and
Serial DMAs
ROM
Parallel Interface Port
Timers
MIII/RMII
SCC4/
UTOPIA
I2C
USB
SCC3
SMC1
SMC2
SPI
Time Slot Assigner
Serial Interface
Figure 2. MPC880 Block Diagram
MPC885/MPC880 Hardware Specifications, Rev. 3
8
Freescale Semiconductor
Maximum Tolerated Ratings
3 Maximum Tolerated Ratings
This section provides the maximum tolerated voltage and temperature ranges for the MPC885/880. Table 2
displays the maximum tolerated ratings, and Table 3 displays the operating temperatures.
Table 2. Maximum Tolerated Ratings
Symbol
Value
Unit
Rating
Supply voltage 1
VDDH
VDDL
–0.3 to 4.0
–0.3 to 2.0
–0.3 to 2.0
<100
V
V
VDDSYN
V
Difference
between
VDDL and
VDDSYN
mV
Input voltage 2
Vin
GND – 0.3 to
VDDH
V
Storage temperature range
Tstg
–55 to +150
°C
1 The power supply of the device must start its ramp from 0.0 V.
2 Functional operating conditions are provided with the DC electrical specifications in Table 6. Absolute maximum
ratings are stress ratings only; functional operation at the maxima is not guaranteed. Stress beyond those listed may
affect device reliability or cause permanent damage to the device. See Section 8, “Power Supply and Power
Sequencing.”
Caution: All inputs that tolerate 5 V cannot be more than 2.5 V greater than VDDH. This restriction applies to power
up and normal operation (that is, if the MPC885/880 is unpowered, a voltage greater than 2.5 V must not be applied
to its inputs).
Table 3. Operating Temperatures
Rating
Symbol
Value
Unit
Temperature 1 (standard)
Temperature (extended)
TA(min)
Tj(max)
TA(min)
Tj(max)
0
°C
°C
°C
°C
95
–40
100
1 Minimum temperatures are guaranteed as ambient temperature, TA. Maximum temperatures are guaranteed as
junction temperature, Tj.
This device contains circuitry protecting against damage due to high-static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (for example, either GND or V ).
DD
MPC885/MPC880 Hardware Specifications, Rev. 3
Freescale Semiconductor
9
Thermal Characteristics
4 Thermal Characteristics
Table 4 shows the thermal characteristics for the MPC885/880.
Table 4. MPC885/880 Thermal Resistance Data
Environment
Single-layer board (1s)
Rating
Symbol
Value
Unit
2
Junction-to-ambient 1
Natural convection
RθJA
37
25
30
22
17
10
2
°C/W
3
Four-layer board (2s2p)
Single-layer board (1s)
Four-layer board (2s2p)
RθJMA
3
Airflow (200 ft/min)
RθJMA
3
RθJMA
Junction-to-board 4
RθJB
RθJC
ΨJT
5
Junction-to-case
Junction-to-package top 6
Natural convection
Airflow (200 ft/min)
ΨJT
2
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3 Per JEDEC JESD51-6 with the board horizontal
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed
pad packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated
value from the junction to the exposed pad without contact resistance.
6 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2.
5 Power Dissipation
Table 5 provides information on power dissipation. The modes are 1:1, where CPU and bus speeds are equal, and
2:1, where CPU frequency is twice bus speed.
Table 5. Power Dissipation (PD)
Bus
Mode
CPU
Frequency
Die Revision
Typical 1
Maximum 2
Unit
66 MHz
80 MHz
133 MHz
310
350
430
390
430
495
mW
mW
mW
1:1
2:1
0
1 Typical power dissipation at VDDL = VDDSYN = 1.8 V, and VDDH is at 3.3 V.
MPC885/MPC880 Hardware Specifications, Rev. 3
10
Freescale Semiconductor
DC Characteristics
2 Maximum power dissipation at VDDL = VDDSYN= 1.9 V, and VDDH is at 3.5 V.
NOTE
The values in Table 5 represent V
-based power dissipation and do not
DDL
include I/O power dissipation over V
. I/O power dissipation varies
DDH
widely by application due to buffer current, depending on external
circuitry.
The V
power dissipation is negligible.
DDSYN
6 DC Characteristics
Table 6 provides the DC electrical characteristics for the MPC885/880.
Table 6. DC Electrical Specifications
Characteristic
Symbol
Min
Max
Unit
Operating voltage
V
DDL (Core)
1.7
3.135
1.7
1.9
3.465
1.9
V
V
VDDH (I/O)
1
VDDSYN
V
Difference
between
VDDL and
VDDSYN
—
100
mV
Input high voltage (all inputs except EXTAL and EXTCLK) 2
Input low voltage 3
VIH
VIL
2.0
3.465
0.8
V
V
V
GND
EXTAL, EXTCLK input high voltage
VIHC
0.7*(VDD
VDDH
)
H
Input leakage current, Vin = 5.5 V (except TMS, TRST, DSCK and
DSDI pins) for 5-V tolerant pins 2
Iin
IIn
IIn
—
—
—
100
10
µA
µA
µA
Input leakage current, Vin = VDDH (except TMS, TRST, DSCK, and
DSDI)
Input leakage current, Vin = 0 V (except TMS, TRST, DSCK and DSDI
pins)
10
Input capacitance 4
Cin
—
20
—
pF
V
Output high voltage, IOH = –2.0 mA,
except XTAL and open-drain pins
VOH
2.4
Output low voltage
VOL
—
0.5
V
IOL = 2.0 mA (CLKOUT)
IOL = 3.2 mA 5
IOL = 5.3 mA 6
IOL = 7.0 mA (TXD1/PA14, TXD2/PA12)
IOL = 8.9 mA (TS, TA, TEA, BI, BB, HRESET, SRESET)
1 The difference between VDDL and VDDSYN cannot be more than 100 mV.
2 The signals PA[0:15], PB[14:31], PC[4:15], PD[3:15], PE(14:31), TDI, TDO, TCK, TRST, TMS, MII1_TXEN, MII_MDIO
are 5-V tolerant. The minimum voltage is still 2.0 V.
3 VIL(max) for the I2C interface is 0.8 V rather than the 1.5 V as specified in the I2C standard.
MPC885/MPC880 Hardware Specifications, Rev. 3
Freescale Semiconductor
11
Thermal Calculation and Measurement
4 Input capacitance is periodically sampled.
5 A(0:31), TSIZ0/REG, TSIZ1, D(0:31), IRQ(2:4), IRQ6, RD/WR, BURST, IP_B(3:7), PA(0:11), PA13, PA15, PB(14:31),
PC(4:15), PD(3:15), PE(14:31), MII1_CRS, MII_MDIO, MII1_TXEN, MII1_COL.
6 BDIP/GPL_B(5), BR, BG, FRZ/IRQ6, CS(0:7), WE(0:3), BS_A(0:3), GPL_A0/GPL_B0, OE/GPL_A1/GPL_B1,
GPL_A(2:3)/GPL_B(2:3)/CS(2:3), UPWAITA/GPL_A4, UPWAITB/GPL_B4, GPL_A5, ALE_A, CE1_A, CE2_A,
OP(0:3) BADDR(28:30)
7 Thermal Calculation and Measurement
For the following discussions, P = (VDDL × I
) + PI/O, where PI/O is the power dissipation of the I/O drivers.
D
DDL
NOTE
The V
power dissipation is negligible.
DDSYN
7.1 Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, TJ, in °C can be obtained from the following equation:
T = T + (R
× P )
D
J
A
θJA
where:
T = ambient temperature ºC
A
R
= package junction-to-ambient thermal resistance (ºC/W)
θJA
P = power dissipation in package
D
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy estimation
of thermal performance. However, the answer is only an estimate; test cases have demonstrated that errors of a factor
of two (in the quantity T –T ) are possible.
J
A
7.2 Estimation with Junction-to-Case Thermal Resistance
Historically, thermal resistance has frequently been expressed as the sum of a junction-to-case thermal resistance
and a case-to-ambient thermal resistance:
R
= R
+ R
θJC θCA
θJA
where:
R
R
R
= junction-to-ambient thermal resistance (ºC/W)
= junction-to-case thermal resistance (ºC/W)
= case-to-ambient thermal resistance (ºC/W)
θJA
θJC
θCA
R
is device-related and cannot be influenced by the user. The user adjusts the thermal environment to affect the
θJC
case-to-ambient thermal resistance, R
. For instance, the user can change the airflow around the device, add a
θCA
heat sink, change the mounting arrangement on the printed circuit board, or change the thermal dissipation on the
printed circuit board surrounding the device. This thermal model is most useful for ceramic packages with heat sinks
where some 90% of the heat flows through the case and the heat sink to the ambient environment. For most
packages, a better model is required.
MPC885/MPC880 Hardware Specifications, Rev. 3
12
Freescale Semiconductor
Thermal Calculation and Measurement
7.3 Estimation with Junction-to-Board Thermal Resistance
A simple package thermal model that has demonstrated reasonable accuracy (about 20%) is a two-resistor
model consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case
covers the situation where a heat sink is used or where a substantial amount of heat is dissipated from the
top of the package. The junction-to-board thermal resistance describes the thermal performance when most
of the heat is conducted to the printed circuit board. It has been observed that the thermal performance of
most plastic packages and especially PBGA packages is strongly dependent on the board temperature; see
Figure 3.
Figure 3. Effect of Board Temperature Rise on Thermal Behavior
If the board temperature is known, an estimate of the junction temperature in the environment can be made
using the following equation:
T = T + (R
× P )
D
J
B
θJB
where:
R
= junction-to-board thermal resistance (ºC/W)
θJB
T = board temperature ºC
B
P = power dissipation in package
D
If the board temperature is known and the heat loss from the package case to the air can be ignored,
acceptable predictions of junction temperature can be made. For this method to work, the board and board
mounting must be similar to the test board used to determine the junction-to-board thermal resistance,
namely a 2s2p (board with a power and a ground plane) and vias attaching the thermal balls to the ground
plane.
7.4 Estimation Using Simulation
When the board temperature is not known, a thermal simulation of the application is needed. The simple
two resistor model can be used with the thermal simulation of the application [2], or a more accurate and
complex model of the package can be used in the thermal simulation.
MPC885/MPC880 Hardware Specifications, Rev. 3
Freescale Semiconductor
13
Power Supply and Power Sequencing
7.5 Experimental Determination
To determine the junction temperature of the device in the application after prototypes are available, the thermal
characterization parameter (Ψ ) can be used to determine the junction temperature with a measurement of the
JT
temperature at the top center of the package case using the following equation:
T = T + (Ψ × P )
J
T
JT
D
where:
Ψ
= thermal characterization parameter
JT
T = thermocouple temperature on top of package
T
P = power dissipation in package
D
The thermal characterization parameter is measured per the JESD51-2 specification published by JEDEC using a 40
gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned
so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple
junction and over about 1 mm of wire extending from the junction. The thermocouple wire is placed flat against the
package case to avoid measurement errors caused by the cooling effects of the thermocouple wire.
7.6 References
Semiconductor Equipment and Materials International
805 East Middlefield Rd
(415) 964-5111
Mountain View, CA 94043
MIL-SPEC and EIA/JESD (JEDEC) specifications
(Available from Global Engineering Documents)
800-854-7179 or
303-397-7956
JEDEC Specifications
http://www.jedec.org
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine
Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47-54.
2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its
Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212-220.
8 Power Supply and Power Sequencing
This section provides design considerations for the MPC885/880 power supply. The MPC885/880 has a core voltage
(V
) and PLL voltage (V
), which both operate at a lower voltage than the I/O voltage V
. The I/O
DDL
DDSYN
DDH
section of the MPC885/880 is supplied with 3.3 V across V
and V (GND).
DDH
SS
The signals PA[0:15], PB[14:31], PC[4:15], PD[3:15], TDI, TDO, TCK, TRST_B, TMS, MII_TXEN, and
MII_MDIO are 5-V tolerant. All inputs cannot be more than 2.5 V greater than V . In addition, 5-V tolerant pins
DDH
can not exceed 5.5 V and remaining input pins cannot exceed 3.465 V. This restriction applies to power up/down
and normal operation.
One consequence of multiple power supplies is that when power is initially applied the voltage rails ramp up at
different rates. The rates depend on the nature of the power supply, the type of load on each power supply, and the
manner in which different voltages are derived. The following restrictions apply:
•
•
V
V
must not exceed V
during power up and power down.
DDL
DDL
DDH
must not exceed 1.9 V, and V
must not exceed 3.465 V.
DDH
MPC885/MPC880 Hardware Specifications, Rev. 3
14
Freescale Semiconductor
Layout Practices
These cautions are necessary for the long-term reliability of the part. If they are violated, the electrostatic discharge
(ESD) protection diodes are forward-biased, and excessive current can flow through these diodes. If the system
power supply design does not control the voltage sequencing, the circuit shown Figure 4 can be added to meet these
requirements. The MUR420 Schottky diodes control the maximum potential difference between the external bus and
core power supplies on power up, and the 1N5820 diodes regulate the maximum potential difference on power
down.
VDDH
VDDL
MUR420
1N5820
Figure 4. Example Voltage Sequencing Circuit
9 Layout Practices
Each V pin on the MPC885/880 should be provided with a low-impedance path to the board’s supply. Each GND
DD
pin should likewise be provided with a low-impedance path to ground. The power supply pins drive distinct groups
of logic on chip. The V power supply should be bypassed to ground using at least four 0.1 µF by-pass capacitors
DD
located as close as possible to the four sides of the package. Each board designed should be characterized and
additional appropriate decoupling capacitors should be used if required. The capacitor leads and associated printed
circuit traces connecting to chip V and GND should be kept to less than half an inch per capacitor lead. At a
DD
minimum, a four-layer board employing two inner layers as V and GND planes should be used.
DD
All output pins on the MPC885/880 have fast rise and fall times. Printed circuit (PC) trace interconnection length
should be minimized in order to minimize undershoot and reflections caused by these fast output switching times.
This recommendation particularly applies to the address and data buses. Maximum PC trace lengths of six inches
are recommended. Capacitance calculations should consider all device loads as well as parasitic capacitances due to
the PC traces. Attention to proper PCB layout and bypassing becomes especially critical in systems with higher
capacitive loads because these loads create higher transient currents in the V and GND circuits. Pull up all unused
DD
inputs or signals that will be inputs during reset. Special care should be taken to minimize the noise levels on the
PLL supply pins. For more information, please refer to the MPC885 User’s Manual, Section 14.4.3, “Clock
Synthesizer Power (V
, V
, V
)”.
DDSYN
SSSYN
SSSYN1
10 Bus Signal Timing
The maximum bus speed supported by the MPC885/880 is 80 MHz. Higher-speed parts must be operated in
half-speed bus mode (for example, an MPC885/880 used at 133 MHz must be configured for a 66 MHz bus). Table 7
shows the frequency ranges for standard part frequencies in 1:1 bus mode, and Table 8 shows the frequency ranges
for standard part frequencies in 2:1 bus mode.
MPC885/MPC880 Hardware Specifications, Rev. 3
15
Freescale Semiconductor
Bus Signal Timing
Table 7. Frequency Ranges for Standard Part Frequencies (1:1 Bus Mode)
Part Frequency 66 MHz
80 MHz
Min
Max
Min
Max
Core frequency
Bus frequency
40
40
66.67
66.67
40
40
80
80
Table 8. Frequency Ranges for Standard Part Frequencies (2:1 Bus Mode)
Part Frequency 66 MHz 80 MHz 133 MHz
Min
Max
Min
Max
Min
Max
Core frequency
Bus frequency
40
20
66.67
33.33
40
20
80
40
40
20
133
66
Table 9 provides the timings for the MPC885/880 at 33-, 40-, 66-, and 80-MHz bus operation.
The timing for the MPC885/880 bus shown assumes a 50-pF load for maximum delays and a 0-pF load for minimum
delays. CLKOUT assumes a 100-pF load maximum delay.
Table 9. Bus Operation Timings
33 MHz
40 MHz
66 MHz
80 MHz
Num
Characteristic
Unit
Min Max Min Max Min Max Min Max
B1
Bus period (CLKOUT), see Table 7
—
—
—
—
—
—
—
—
ns
ns
B1a EXTCLK to CLKOUT phase skew - If
CLKOUT is an integer multiple of
–2
+2
–2
+2
–2
+2
–2
+2
EXTCLK, then the rising edge of EXTCLK
is aligned with the rising edge of CLKOUT.
For a non-integer multiple of EXTCLK, this
synchronization is lost, and the rising
edges of EXTCLK and CLKOUT have a
continuously varying phase skew.
B1b CLKOUT frequency jitter peak-to-peak
B1c Frequency jitter on EXTCLK
—
—
—
1
0.50
4
—
—
—
1
0.50
4
—
—
—
1
0.50
4
—
—
—
1
0.50
4
ns
%
B1d CLKOUT phase jitter peak-to-peak
ns
for OSCLK ≥ 15 MHz
CLKOUT phase jitter peak-to-peak
for OSCLK < 15 MHz
—
5
–
5
—
5
—
5
ns
ns
ns
B2
B3
CLKOUT pulse width low
(MIN = 0.4 × B1, MAX = 0.6 × B1)
12.1 18.2 10.0 15.0
12.1 18.2 10.0 15.0
6.1
6.1
9.1
9.1
5.0
5.0
7.5
7.5
CLKOUT pulse width high
(MIN = 0.4 × B1, MAX = 0.6 × B1)
B4
B5
CLKOUT rise time
CLKOUT fall time
—
—
4.00
4.00
—
—
4.00
4.00
—
—
4.00
4.00
—
—
4.00
4.00
ns
ns
MPC885/MPC880 Hardware Specifications, Rev. 3
16
Freescale Semiconductor
Bus Signal Timing
Table 9. Bus Operation Timings (continued)
33 MHz 40 MHz
Min Max Min Max Min Max Min Max
66 MHz
80 MHz
Num
Characteristic
Unit
B7
CLKOUT to A(0:31), BADDR(28:30),
RD/WR, BURST, D(0:31) output hold
(MIN = 0.25 × B1)
7.60
—
6.30
—
3.80
—
3.13
—
ns
B7a CLKOUT to TSIZ(0:1), REG, RSV, BDIP,
7.60
7.60
—
—
6.30
6.30
—
—
3.80
3.80
—
—
3.13
3.13
—
—
ns
ns
PTR output hold (MIN = 0.25 × B1)
B7b CLKOUT to BR, BG, FRZ, VFLS(0:1),
VF(0:2) IWP(0:2), LWP(0:1), STS output
hold (MIN = 0.25 × B1)
B8
CLKOUT to A(0:31), BADDR(28:30)
RD/WR, BURST, D(0:31) valid
(MAX = 0.25 × B1 + 6.3)
—
13.80
—
12.50
—
10.00
—
9.43
ns
B8a CLKOUT to TSIZ(0:1), REG, RSV, AT(0:3)
—
—
13.80
13.80
—
—
12.50
12.50
—
—
10.00
10.00
—
—
9.43
9.43
ns
ns
BDIP, PTR valid (MAX = 0.25 × B1 + 6.3)
B8b CLKOUT to BR, BG, VFLS(0:1), VF(0:2),
IWP(0:2), FRZ, LWP(0:1), STS valid 4
(MAX = 0.25 × B1 + 6.3)
B9
CLKOUT to A(0:31), BADDR(28:30),
RD/WR, BURST, D(0:31), TSIZ(0:1), REG,
RSV, AT(0:3), PTR High-Z
7.60 13.80 6.30 12.50 3.80 10.00 3.13 9.43
ns
(MAX = 0.25 × B1 + 6.3)
B11 CLKOUT to TS, BB assertion
7.60 13.60 6.30 12.30 3.80 9.80 3.13 9.13
ns
ns
(MAX = 0.25 × B1 + 6.0)
B11a CLKOUT to TA, BI assertion (when driven 2.50 9.30 2.50 9.30 2.50 9.30 2.50 9.30
by the memory controller or PCMCIA
interface) (MAX = 0.00 × B1 + 9.30 1)
B12 CLKOUT to TS, BB negation
7.60 12.30 6.30 11.00 3.80 8.50 3.13 7.92
ns
ns
(MAX = 0.25 × B1 + 4.8)
B12a CLKOUT to TA, BI negation (when driven 2.50 9.00 2.50 9.00 2.50 9.00
by the memory controller or PCMCIA
2.5
9.00
interface) (MAX = 0.00 × B1 + 9.00)
B13 CLKOUT to TS, BB High-Z
7.60 21.60 6.30 20.30 3.80 14.00 3.13 12.93 ns
(MIN = 0.25 × B1)
B13a CLKOUT to TA, BI High-Z (when driven by 2.50 15.00 2.50 15.00 2.50 15.00 2.5 15.00 ns
the memory controller or PCMCIA
interface) (MIN = 0.00 × B1 + 2.5)
B14 CLKOUT to TEA assertion
2.50 9.00 2.50 9.00 2.50 9.00 2.50 9.00
ns
(MAX = 0.00 × B1 + 9.00)
B15 CLKOUT to TEA High-Z (MIN = 0.00 × B1 2.50 15.00 2.50 15.00 2.50 15.00 2.50 15.00 ns
+ 2.50)
B16 TA, BI valid to CLKOUT (setup time)
6.00
—
6.00
—
6.00
—
6
—
ns
(MIN = 0.00 × B1 + 6.00)
MPC885/MPC880 Hardware Specifications, Rev. 3
17
Freescale Semiconductor
Bus Signal Timing
Table 9. Bus Operation Timings (continued)
33 MHz 40 MHz
Min Max Min Max Min Max Min Max
4.50
66 MHz
80 MHz
Num
Characteristic
Unit
B16a TEA, KR, RETRY, CR valid to CLKOUT
—
—
—
—
—
—
—
—
4.50
4.00
1.00
2.00
6.00
1.00
4.00
2.00
—
—
—
—
—
—
—
—
4.50
4.00
2.00
2.00
6.00
2.00
4.00
2.00
—
—
—
—
—
—
—
—
4.50
4.00
2.00
2.00
6.00
2.00
4.00
2.00
—
—
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
(setup time) (MIN = 0.00 × B1 + 4.5)
B16b BB, BG, BR, valid to CLKOUT (setup time) 4.00
2 (4MIN = 0.00 × B1 + 0.00)
B17 CLKOUT to TA, TEA, BI, BB, BG, BR valid 1.00
(hold time) (MIN = 0.00 × B1 + 1.00 3)
B17a CLKOUT to KR, RETRY, CR valid (hold
2.00
6.00
time) (MIN = 0.00 × B1 + 2.00)
B18 D(0:31) valid to CLKOUT rising edge
(setup time) 4 (MIN = 0.00 × B1 + 6.00)
B19 CLKOUT rising edge to D(0:31) valid (hold 1.00
time) 4 (MIN = 0.00 × B1 + 1.00 5)
B20 D(0:31) valid to CLKOUT falling edge
4.00
2.00
(setup time) 6 (MIN = 0.00 × B1 + 4.00)
B21 CLKOUT falling edge to D(0:31) valid
(hold time) 6 (MIN = 0.00 × B1 + 2.00)
B22 CLKOUT rising edge to CS asserted
7.60 13.80 6.30 12.50 3.80 10.00 3.13 9.43
GPCM ACS = 00 (MAX = 0.25 × B1 + 6.3)
B22a CLKOUT falling edge to CS asserted
GPCM ACS = 10, TRLX = 0
—
8.00
—
8.00
—
8.00
—
8.00
(MAX = 0.00 × B1 + 8.00)
B22b CLKOUT falling edge to CS asserted
GPCM ACS = 11, TRLX = 0, EBDF = 0
(MAX = 0.25 × B1 + 6.3)
7.60 13.80 6.30 12.50 3.80 10.00 3.13 9.43
ns
B22c CLKOUT falling edge to CS asserted
GPCM ACS = 11, TRLX = 0, EBDF = 1
(MAX = 0.375 × B1 + 6.6)
10.90 18.00 10.90 16.00 5.20 12.30 4.69 10.93 ns
B23 CLKOUT rising edge to CS negated
GPCM read access, GPCM write access
ACS = 00, TRLX = 0 and CSNT = 0
(MAX = 0.00 × B1 + 8.00)
2.00 8.00 2.00 8.00 2.00 8.00 2.00 8.00
ns
B24 A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 10, TRLX = 0
(MIN = 0.25 × B1 – 2.00)
5.60
13.20
—
—
—
4.30
10.50
—
—
—
1.80
5.60
—
—
—
1.13
4.25
—
—
—
ns
ns
B24a A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 11 TRLX = 0
(MIN = 0.50 × B1 – 2.00)
B25 CLKOUT rising edge to OE, WE(0:3)
9.00
9.00
9.00
9.00
ns
ns
asserted (MAX = 0.00 × B1 + 9.00)
B26 CLKOUT rising edge to OE negated
2.00 9.00 2.00 9.00 2.00 9.00 2.00 9.00
(MAX = 0.00 × B1 + 9.00)
MPC885/MPC880 Hardware Specifications, Rev. 3
18
Freescale Semiconductor
Bus Signal Timing
Table 9. Bus Operation Timings (continued)
33 MHz 40 MHz
Min Max Min Max Min Max Min Max
66 MHz
80 MHz
Num
Characteristic
Unit
B27 A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 10, TRLX = 1
(MIN = 1.25 × B1 – 2.00)
35.90
43.50
—
—
29.30
35.50
—
—
16.90
20.70
—
—
13.60
16.75
—
—
ns
B27a A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 11, TRLX = 1
(MIN = 1.50 × B1 – 2.00)
—
—
—
—
ns
ns
ns
ns
B28 CLKOUT rising edge to WE(0:3) negated
GPCM write access CSNT = 0
9.00
9.00
9.00
9.00
(MAX = 0.00 × B1 + 9.00)
B28a CLKOUT falling edge to WE(0:3) negated 7.60 14.30 6.30 13.00 3.80 10.50 3.13 9.93
GPCM write access TRLX = 0, CSNT = 1,
EBDF = 0 (MAX = 0.25 × B1 + 6.80)
B28b CLKOUT falling edge to CS negated
GPCM write access TRLX = 0, CSNT = 1
ACS = 10 or ACS = 11, EBDF = 0
(MAX = 0.25 × B1 + 6.80)
—
14.30
—
13.00
—
10.50
—
9.93
B28c CLKOUT falling edge to WE(0:3) negated 10.90 18.00 10.90 18.00 5.20 12.30 4.69 11.29 ns
GPCM write access TRLX = 0, CSNT = 1
write access TRLX = 0, CSNT = 1,
EBDF = 1 (MAX = 0.375 × B1 + 6.6)
B28d CLKOUT falling edge to CS negated
GPCM write access TRLX = 0, CSNT = 1,
ACS = 10, or ACS = 11, EBDF = 1
(MAX = 0.375 × B1 + 6.6)
—
18.00
—
18.00
—
12.30
—
11.30 ns
B29 WE(0:3) negated to D(0:31) High-Z GPCM 5.60
write access, CSNT = 0, EBDF = 0
—
—
—
—
4.30
10.50
4.30
—
—
—
—
1.80
5.60
1.80
5.60
—
—
—
—
1.13
4.25
1.13
4.25
—
—
—
—
ns
ns
ns
ns
(MIN = 0.25 × B1 – 2.00)
B29a WE(0:3) negated to D(0:31) High-Z GPCM 13.20
write access, TRLX = 0, CSNT = 1,
EBDF = 0 (MIN = 0.50 × B1 – 2.00)
B29b CS negated to D(0:31) High-Z GPCM write 5.60
access, ACS = 00, TRLX = 0 & CSNT = 0
(MIN = 0.25 × B1 – 2.00)
B29c CS negated to D(0:31) High-Z GPCM write 13.20
access, TRLX = 0, CSNT = 1, ACS = 10,
or ACS = 11 EBDF = 0
10.50
(MIN = 0.50 × B1 – 2.00)
B29d WE(0:3) negated to D(0:31) High-Z GPCM 43.50
write access, TRLX = 1, CSNT = 1,
—
—
35.50
35.50
—
—
20.70
20.70
—
—
16.75
16.75
—
—
ns
ns
EBDF = 0 (MIN = 1.50 × B1 – 2.00)
B29e CS negated to D(0:31) High-Z GPCM write 43.50
access, TRLX = 1, CSNT = 1, ACS = 10,
or ACS = 11 EBDF = 0
(MIN = 1.50 × B1 – 2.00)
MPC885/MPC880 Hardware Specifications, Rev. 3
19
Freescale Semiconductor
Bus Signal Timing
Table 9. Bus Operation Timings (continued)
33 MHz 40 MHz
Min Max Min Max Min Max Min Max
66 MHz
80 MHz
Num
Characteristic
Unit
B29f WE(0:3) negated to D(0:31) High-Z GPCM 5.00
write access, TRLX = 0, CSNT = 1,
—
3.00
—
0.00
—
0.00
—
ns
EBDF = 1 (MIN = 0.375 × B1 – 6.30)
B29g CS negated to D(0:31) High-Z GPCM write 5.00
access, TRLX = 0, CSNT = 1 ACS = 10 or
ACS = 11, EBDF = 1
—
3.00
—
0.00
—
0.00
—
ns
(MIN = 0.375 × B1 – 6.30)
B29h WE(0:3) negated to D(0:31) High-Z GPCM 38.40
write access, TRLX = 1, CSNT = 1,
—
—
31.10
31.10
—
—
17.50
17.50
—
—
13.85
13.85
—
—
ns
ns
EBDF = 1 (MIN = 0.375 × B1 – 3.30)
B29i CS negated to D(0:31) High-Z GPCM write 38.40
access, TRLX = 1, CSNT = 1, ACS = 10 or
ACS = 11, EBDF = 1
(MIN = 0.375 × B1 – 3.30)
B30 CS, WE(0:3) negated to A(0:31),
BADDR(28:30) Invalid GPCM write
access 7 (MIN = 0.25 × B1 – .00)
5.60
—
—
4.30
—
—
1.80
5.60
—
—
1.13
4.25
—
—
ns
ns
B30a WE(0:3) negated to A(0:31),
BADDR(28:30) Invalid GPCM, write
access, TRLX = 0, CSNT = 1, CS negated
to A(0:31) invalid GPCM write access
TRLX = 0, CSNT =1 ACS = 10, or
ACS == 11, EBDF = 0
13.20
10.50
(MIN = 0.50 × B1 – 2.00)
B30b WE(0:3) negated to A(0:31) invalid GPCM 43.50
BADDR(28:30) invalid GPCM write
access, TRLX = 1, CSNT = 1. CS negated
to A(0:31) invalid GPCM write access
TRLX = 1, CSNT = 1, ACS = 10, or
ACS == 11 EBDF = 0
—
—
—
35.50
—
—
—
20.70
—
—
—
16.75
—
—
—
ns
ns
ns
(MIN = 1.50 × B1 – 2.00)
B30c WE(0:3) negated to A(0:31),
BADDR(28:30) invalid GPCM write
access, TRLX = 0, CSNT = 1. CS negated
to A(0:31) invalid GPCM write access,
TRLX = 0, CSNT = 1 ACS = 10,
ACS == 11, EBDF = 1
8.40
6.40
2.70
1.70
(MIN = 0.375 × B1 – 3.00)
B30d WE(0:3) negated to A(0:31),
BADDR(28:30) invalidGPCM writeaccess
TRLX = 1, CSNT =1, CS negated to
A(0:31) invalid GPCM write access
TRLX = 1, CSNT = 1, ACS = 10 or 11,
EBDF = 1
38.67
31.38
17.83
14.19
MPC885/MPC880 Hardware Specifications, Rev. 3
20
Freescale Semiconductor
Bus Signal Timing
Table 9. Bus Operation Timings (continued)
33 MHz 40 MHz
66 MHz
80 MHz
Num
Characteristic
Unit
Min Max Min Max Min Max Min Max
B31 CLKOUT falling edge to CS valid, as
requested by control bit CST4 in the
corresponding word in the UPM
(MAX = 0.00 × B1 + 6.00)
1.50 6.00 1.50 6.00 1.50 6.00 1.50 6.00
ns
B31a CLKOUT falling edge to CS valid, as
requested by control bit CST1 in the
corresponding word in the UPM
(MAX = 0.25 × B1 + 6.80)
7.60 14.30 6.30 13.00 3.80 10.50 3.13 10.00 ns
B31b CLKOUT rising edge to CS valid, as
requested by control bit CST2 in the
corresponding word in the UPM
(MAX = 0.00 × B1 + 8.00)
1.50 8.00 1.50 8.00 1.50 8.00 1.50 8.00
7.60 13.80 6.30 12.50 3.80 10.00 3.13 9.40
ns
ns
B31c CLKOUT rising edge to CS valid, as
requested by control bit CST3 in the
corresponding word in the UPM
(MAX = 0.25 × B1 + 6.30)
B31d CLKOUT falling edge to CS valid, as
requested by control bit CST1 in the
corresponding word in the UPM EBDF = 1
(MAX = 0.375 × B1 + 6.6)
13.30 18.00 11.30 16.00 7.60 12.30 4.69 11.30 ns
B32 CLKOUT falling edge to BS valid, as
requested by control bit BST4 in the
corresponding word in the UPM
(MAX = 0.00 × B1 + 6.00)
1.50 6.00 1.50 6.00 1.50 6.00 1.50 6.00
ns
B32a CLKOUT falling edge to BS valid, as
requested by control bit BST1 in the
corresponding word in the UPM, EBDF = 0
(MAX = 0.25 × B1 + 6.80)
7.60 14.30 6.30 13.00 3.80 10.50 3.13 10.00 ns
B32b CLKOUT rising edge to BS valid, as
requested by control bit BST2 in the
corresponding word in the UPM
(MAX = 0.00 × B1 + 8.00)
1.50 8.00 1.50 8.00 1.50 8.00 1.50 8.00
ns
B32c CLKOUT rising edge to BS valid, as
requested by control bit BST3 in the
corresponding word in the UPM
(MAX = 0.25 × B1 + 6.80)
7.60 14.30 6.30 13.00 3.80 10.50 3.13 10.00 ns
13.30 18.00 11.30 16.00 7.60 12.30 4.49 11.30 ns
B32d CLKOUT falling edge to BS valid, as
requested by control bit BST1 in the
corresponding word in the UPM, EBDF = 1
(MAX = 0.375 × B1 + 6.60)
B33 CLKOUT falling edge to GPL valid, as
requested by control bit GxT4 in the
corresponding word in the UPM
(MAX = 0.00 × B1 + 6.00)
1.50 6.00 1.50 6.00 1.50 6.00 1.50 6.00
ns
MPC885/MPC880 Hardware Specifications, Rev. 3
21
Freescale Semiconductor
Bus Signal Timing
Table 9. Bus Operation Timings (continued)
33 MHz 40 MHz
Min Max Min Max Min Max Min Max
7.60 14.30 6.30 13.00 3.80 10.50 3.13 10.00 ns
66 MHz
80 MHz
Num
Characteristic
Unit
B33a CLKOUT rising edge to GPL valid, as
requested by control bit GxT3 in the
corresponding word in the UPM
(MAX = 0.25 × B1 + 6.80)
B34 A(0:31), BADDR(28:30), and D(0:31) to
CS valid, as requested by control bit CST4
in the corresponding word in the UPM
(MIN = 0.25 × B1 – 2.00)
5.60
13.20
20.70
5.60
—
—
—
—
—
—
—
4.30
10.50
16.70
4.30
—
—
—
—
—
—
—
1.80
5.60
9.40
1.80
5.60
9.40
1.80
—
—
—
—
—
—
—
1.13
4.25
6.80
1.13
4.25
7.40
1.13
—
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
ns
B34a A(0:31), BADDR(28:30), and D(0:31) to
CS valid, as requested by control bit CST1
in the corresponding word in the UPM
(MIN = 0.50 × B1 – 2.00)
B34b A(0:31), BADDR(28:30), and D(0:31) to
CS valid, as requested by CST2 in the
corresponding word in UPM
(MIN = 0.75 × B1 – 2.00)
B35 A(0:31), BADDR(28:30) to CS valid, as
requested by control bit BST4 in the
corresponding word in the UPM
(MIN = 0.25 × B1 – 2.00)
B35a A(0:31), BADDR(28:30), and D(0:31) to
BS valid, as requested by BST1 in the
corresponding word in the UPM
13.20
20.70
5.60
10.50
16.70
4.30
(MIN = 0.50 × B1 – 2.00)
B35b A(0:31), BADDR(28:30), and D(0:31) to
BS valid, as requested by control bit BST2
in the corresponding word in the UPM
(MIN = 0.75 × B1 – 2.00)
B36 A(0:31), BADDR(28:30), and D(0:31) to
GPL valid, as requested by control bit
GxT4 in the corresponding word in the
UPM (MIN = 0.25 × B1 – 2.00)
B37 UPWAIT valid to CLKOUT falling edge 8
6.00
1.00
7.00
—
—
—
—
6.00
1.00
7.00
7.00
—
—
—
—
6.00
1.00
7.00
7.00
—
—
—
—
6.00
1.00
7.00
7.00
—
—
—
—
ns
ns
ns
ns
(MIN = 0.00 × B1 + 6.00)
B38 CLKOUT falling edge to UPWAIT valid 8
(MIN = 0.00 × B1 + 1.00)
B39 AS valid to CLKOUT rising edge 9
(MIN = 0.00 × B1 + 7.00)
B40 A(0:31), TSIZ(0:1), RD/WR, BURST, valid 7.00
to CLKOUT rising edge
(MIN = 0.00 × B1 + 7.00)
B41 TS valid to CLKOUT rising edge (setup
7.00
—
7.00
—
7.00
—
7.00
—
ns
time) (MIN = 0.00 × B1 + 7.00)
MPC885/MPC880 Hardware Specifications, Rev. 3
22
Freescale Semiconductor
Bus Signal Timing
Table 9. Bus Operation Timings (continued)
33 MHz 40 MHz
Min Max Min Max Min Max Min Max
66 MHz
80 MHz
Num
Characteristic
Unit
B42 CLKOUT rising edge to TS valid (hold
2.00
—
—
2.00
—
—
2.00
—
—
2.00
—
—
ns
ns
time) (MIN = 0.00 × B1 + 2.00)
B43 AS negation to memory controller signals
negation (MAX = TBD)
TBD
TBD
TBD
TBD
1 For part speeds above 50 MHz, use 9.80 ns for B11a.
2 The timing required for BR input is relevant when the MPC885/880 is selected to work with the internal bus arbiter.
The timing for BG input is relevant when the MPC885/880 is selected to work with the external bus arbiter.
3 For part speeds above 50 MHz, use 2 ns for B17.
4 The D(0:31) input timings B18 and B19 refer to the rising edge of the CLKOUT in which the TA input signal is asserted.
5 For part speeds above 50 MHz, use 2 ns for B19.
6 The D(0:31) input timings B20 and B21 refer to the falling edge of the CLKOUT. This timing is valid only for read
accesses controlled by chip-selects under control of the user-programmable machine (UPM) in the memory
controller, for data beats where DLT3 = 1 in the RAM words. (This is only the case where data is latched on the falling
edge of CLKOUT.)
7 The timing B30 refers to CS when ACS = 00 and to WE(0:3) when CSNT = 0.
8 The signal UPWAIT is considered asynchronous to the CLKOUT and synchronized internally. The timings specified in
B37 and B38 are specified to enable the freeze of the UPM output signals as described in Figure 20.
9 The AS signal is considered asynchronous to the CLKOUT. The timing B39 is specified in order to allow the behavior
specified in Figure 23.
MPC885/MPC880 Hardware Specifications, Rev. 3
23
Freescale Semiconductor
Bus Signal Timing
Figure 5 provides the control timing diagram.
2.0 V
2.0 V
CLKOUT
0.8 V
0.8 V
A
B
2.0 V
2.0 V
0.8 V
Outputs
0.8 V
A
B
2.0 V
0.8 V
2.0 V
0.8 V
Outputs
D
C
2.0 V
0.8 V
2.0 V
0.8 V
Inputs
D
C
2.0 V
0.8 V
2.0 V
0.8 V
Inputs
A
B
C
D
Maximum output delay specification
Minimum output hold time
Minimum input setup time specification
Minimum input hold time specification
Figure 5. Control Timing
Figure 6 provides the timing for the external clock.
CLKOUT
B1
B1
B3
B2
B4
B5
Figure 6. External Clock Timing
MPC885/MPC880 Hardware Specifications, Rev. 3
24
Freescale Semiconductor
Bus Signal Timing
Figure 7 provides the timing for the synchronous output signals.
CLKOUT
B8
B7
B9
B9
Output
Signals
B8a
B7a
Output
Signals
B8b
B7b
Output
Signals
Figure 7. Synchronous Output Signals Timing
Figure 8 provides the timing for the synchronous active pull-up and open-drain output signals.
CLKOUT
B13
B11
B12
B12
B15
TS, BB
TA, BI
TEA
B13
B11
B14
Figure 8. Synchronous Active Pull-Up Resistor and Open-Drain Outputs Signals Timing
MPC885/MPC880 Hardware Specifications, Rev. 3
25
Freescale Semiconductor
Bus Signal Timing
Figure 9 provides the timing for the synchronous input signals.
CLKOUT
B16
B17
B17
B17
TA, BI
B16
TEA, KR,
RETRY, CR
B16
BB, BG, BR
Figure 9. Synchronous Input Signals Timing
Figure 10 provides normal case timing for input data. It also applies to normal read accesses under the control of the
user-programmable machine (UPM) in the memory controller.
CLKOUT
B16
B17
TA
B18
B19
D[0:31]
Figure 10. Input Data Timing in Normal Case
MPC885/MPC880 Hardware Specifications, Rev. 3
26
Freescale Semiconductor
Bus Signal Timing
Figure 11 provides the timing for the input data controlled by the UPM for data beats where DLT3 = 1 in the UPM
RAM words. (This is only the case where data is latched on the falling edge of CLKOUT.)
CLKOUT
TA
B20
B21
D[0:31]
Figure 11. Input Data Timing when Controlled by UPM in the Memory Controller and DLT3 = 1
Figure 12 through Figure 15 provide the timing for the external bus read controlled by various GPCM factors.
CLKOUT
B11
B8
B12
TS
A[0:31]
CSx
B22
B23
B25
B26
B19
OE
B28
WE[0:3]
D[0:31]
B18
Figure 12. External Bus Read Timing (GPCM Controlled—ACS = 00)
MPC885/MPC880 Hardware Specifications, Rev. 3
27
Freescale Semiconductor
Bus Signal Timing
CLKOUT
B11
B8
B12
TS
A[0:31]
CSx
B23
B22
B24
B25
B26
B19
OE
B18
D[0:31]
Figure 13. External Bus Read Timing (GPCM Controlled—TRLX = 0, ACS = 10)
CLKOUT
TS
B11
B8
B12
B22
B22
A[0:31]
CSx
B23
B24
B25
B26
B19
OE
B18
D[0:31]
Figure 14. External Bus Read Timing (GPCM Controlled—TRLX = 0, ACS = 11)
MPC885/MPC880 Hardware Specifications, Rev. 3
28
Freescale Semiconductor
Bus Signal Timing
CLKOUT
B11
B12
TS
A[0:31]
CSx
B8
B23
B22
B27
B26
B19
OE
B27
B22 B22
B18
D[0:31]
Figure 15. External Bus Read Timing (GPCM Controlled—TRLX = 1, ACS = 10, ACS = 11)
MPC885/MPC880 Hardware Specifications, Rev. 3
29
Freescale Semiconductor
Bus Signal Timing
Figure 16 through Figure 18 provide the timing for the external bus write controlled by various GPCM factors.
CLKOUT
B11
B8
B12
TS
A[0:31]
CSx
B30
B22
B23
B25
B28
WE[0:3]
B26
B29
OE
B29
B8
B9
D[0:31]
Figure 16. External Bus Write Timing (GPCM Controlled—TRLX = 0, CSNT = 0)
MPC885/MPC880 Hardware Specifications, Rev. 3
30
Freescale Semiconductor
Bus Signal Timing
CLKOUT
TS
B11
B8
B12
B30 B30
A[0:31]
CSx
B22
B28 B28
B25
B23
B29 B29
WE[0:3]
B26
B29 B29f
OE
B28 B28
B8
B9
D[0:31]
Figure 17. External Bus Write Timing (GPCM Controlled—TRLX = 0, CSNT = 1)
MPC885/MPC880 Hardware Specifications, Rev. 3
31
Freescale Semiconductor
Bus Signal Timing
CLKOUT
B11
B12
TS
A[0:31]
CSx
B8
B30 B30
B22
B28 B28
B23
B25
B29 B29i
WE[0:3]
B26
B29 B29
OE
B29
B8
B28 B28
B9
D[0:31]
Figure 18. External Bus Write Timing (GPCM Controlled—TRLX = 1, CSNT = 1)
MPC885/MPC880 Hardware Specifications, Rev. 3
32
Freescale Semiconductor
Bus Signal Timing
Figure 19 provides the timing for the external bus controlled by the UPM.
CLKOUT
B8
A[0:31]
B31
B31
B31
B31
B31
CSx
B34
B34
B34
B32 B32
B32
B32
B32
BS_A[0:3],
BS_B[0:3]
B35 B36
B35
B35
B33
B33
GPL_A[0:5],
GPL_B[0:5]
Figure 19. External Bus Timing (UPM-Controlled Signals)
MPC885/MPC880 Hardware Specifications, Rev. 3
33
Freescale Semiconductor
Bus Signal Timing
Figure 20 provides the timing for the asynchronous asserted UPWAIT signal controlled by the UPM.
CLKOUT
B37
UPWAIT
B38
CSx
BS_A[0:3],
BS_B[0:3]
GPL_A[0:5],
GPL_B[0:5]
Figure 20. Asynchronous UPWAIT Asserted Detection in UPM-Handled Cycles Timing
Figure 21 provides the timing for the asynchronous negated UPWAIT signal controlled by the UPM.
CLKOUT
B37
UPWAIT
B38
CSx
BS_A[0:3],
BS_B[0:3]
GPL_A[0:5],
GPL_B[0:5]
Figure 21. Asynchronous UPWAIT Negated Detection in UPM-Handled Cycles Timing
MPC885/MPC880 Hardware Specifications, Rev. 3
34
Freescale Semiconductor
Bus Signal Timing
Figure 22 provides the timing for the synchronous external master access controlled by the GPCM.
CLKOUT
B41
B40
B42
TS
A[0:31],
TSIZ[0:1],
R/W, BURST
B22
CSx
Figure 22. Synchronous External Master Access Timing (GPCM Handled—ACS = 00)
Figure 23 provides the timing for the asynchronous external master memory access controlled by the GPCM.
CLKOUT
B39
AS
B40
A[0:31],
TSIZ[0:1],
R/W
B22
CSx
Figure 23. Asynchronous External Master Memory Access Timing (GPCM Controlled—ACS = 00)
Figure 24 provides the timing for the asynchronous external master control signals negation.
AS
B43
CSx, WE[0:3],
OE, GPLx,
BS[0:3]
Figure 24. Asynchronous External Master—Control Signals Negation Timing
MPC885/MPC880 Hardware Specifications, Rev. 3
35
Freescale Semiconductor
Bus Signal Timing
Table 10 provides the interrupt timing for the MPC885/880.
Table 10. Interrupt Timing
All Frequencies
Num
Characteristic 1
Unit
Min
Max
I39
I40
I41
I42
I43
IRQx valid to CLKOUT rising edge (setup time)
IRQx hold time after CLKOUT
IRQx pulse width low
6.00
2.00
ns
ns
ns
ns
—
3.00
IRQx pulse width high
3.00
IRQx edge-to-edge time
4 × TCLOCKOUT
1 The I39 and I40 timings describe the testing conditions under which the IRQ lines are tested when being defined as
level sensitive. The IRQ lines are synchronized internally and do not have to be asserted or negated with reference
to the CLKOUT.
The I41, I42, and I43 timings are specified to allow correct functioning of the IRQ lines detection circuitry and have
no direct relation with the total system interrupt latency that the MPC885/880 is able to support.
Figure 25 provides the interrupt detection timing for the external level-sensitive lines.
CLKOUT
I39
I40
IRQx
Figure 25. Interrupt Detection Timing for External Level Sensitive Lines
Figure 26 provides the interrupt detection timing for the external edge-sensitive lines.
CLKOUT
I41
I42
IRQx
I43
I43
Figure 26. Interrupt Detection Timing for External Edge Sensitive Lines
MPC885/MPC880 Hardware Specifications, Rev. 3
36
Freescale Semiconductor
Bus Signal Timing
Table 11 shows the PCMCIA timing for the MPC885/880.
Table 11. PCMCIA Timing
33 MHz 40 MHz
66 MHz
80 MHz
Num
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
A(0:31), REG valid to PCMCIA
20.70
—
16.70
—
9.40
—
7.40
—
ns
P44 strobe asserted 1
(MIN = 0.75 × B1 – 2.00)
A(0:31), REG valid to ALE
28.30
—
23.00
—
13.20
—
10.50
—
ns
P45 negation1
(MIN = 1.00 × B1 – 2.00)
CLKOUT to REG valid
(MAX = 0.25 × B1 + 8.00)
7.60
8.60
7.60
7.60
—
15.60
—
6.30
7.30
6.30
6.30
—
14.30
—
3.80
4.80
3.80
3.80
—
11.80
—
3.13
4.13
3.13
3.13
—
11.13
—
ns
ns
ns
ns
ns
P46
P47
P48
P49
CLKOUT to REG invalid
(MIN = 0.25 – B1 + 1.00)
CLKOUT to CE1, CE2 asserted
(MAX = 0.25 × B1 + 8.00)
15.60
15.60
11.00
14.30
14.30
11.00
11.80
11.80
11.00
11.13
11.13
11.00
CLKOUT to CE1, CE2 negated
(MAX = 0.25 × B1 + 8.00)
CLKOUT to PCOE, IORD,
P50 PCWE, IOWR assert time
(MAX = 0.00 × B1 + 11.00)
CLKOUT to PCOE, IORD,
P51 PCWE, IOWR negate time
(MAX = 0.00 × B1 + 11.00)
2.00
11.00
2.00
11.00
2.00
11.00
2.00
11.00
ns
CLKOUT to ALE assert time
P52
7.60
—
13.80
15.60
—
6.30
—
12.50
14.30
—
3.80
—
10.00
11.80
—
3.13
—
9.40
11.13
—
ns
ns
ns
(MAX = 0.25 × B1 + 6.30)
CLKOUT to ALE negate time
P53
(MAX = 0.25 × B1 + 8.00)
PCWE, IOWR negated to
P54 D(0:31) invalid 1
5.60
4.30
1.80
1.13
(MIN = 0.25 × B1 – 2.00)
WAITA and WAITB valid to
P55 CLKOUT rising edge1
(MIN = 0.00 × B1 + 8.00)
8.00
2.00
—
—
8.00
2.00
—
—
8.00
2.00
—
—
8.00
2.00
—
—
ns
ns
CLKOUT rising edge to WAITA
P56 and WAITB invalid1
(MIN = 0.00 × B1 + 2.00)
1 PSST = 1. Otherwise add PSST times cycle time.
PSHT = 0. Otherwise add PSHT times cycle time.
These synchronous timings define when the WAITx signals are detected in order to freeze (or relieve) the PCMCIA
current cycle. The WAITx assertion will be effective only if it is detected 2 cycles before the PSL timer expiration. See
Chapter 16, “PCMCIA Interface,” in the MPC885 PowerQUICC Family User’s Manual.
MPC885/MPC880 Hardware Specifications, Rev. 3
37
Freescale Semiconductor
Bus Signal Timing
Figure 27 provides the PCMCIA access cycle timing for the external bus read.
CLKOUT
TS
P44
A[0:31]
P46
P48
P45
P47
P49
P51
P52
REG
CE1/CE2
PCOE, IORD
ALE
P50
P53
P52
B18
B19
D[0:31]
Figure 27. PCMCIA Access Cycles Timing External Bus Read
MPC885/MPC880 Hardware Specifications, Rev. 3
38
Freescale Semiconductor
Bus Signal Timing
Figure 28 provides the PCMCIA access cycle timing for the external bus write.
CLKOUT
TS
P44
A[0:31]
P46
P48
P45
P47
P49
P51
P52
B9
REG
CE1/CE2
PCWE, IOWR
ALE
P50
P53
B8
P54
P52
D[0:31]
Figure 28. PCMCIA Access Cycles Timing External Bus Write
Figure 29 provides the PCMCIA WAIT signals detection timing.
CLKOUT
P55
P56
WAITx
Figure 29. PCMCIA WAIT Signals Detection Timing
MPC885/MPC880 Hardware Specifications, Rev. 3
39
Freescale Semiconductor
Bus Signal Timing
Table 12 shows the PCMCIA port timing for the MPC885/880.
Table 12. PCMCIA Port Timing
33 MHz 40 MHz
Min Max Min Max Min Max Min Max
66 MHz
80 MHz
Num
Characteristic
Unit
CLKOUT to OPx valid
(MAX = 0.00 × B1 + 19.00)
—
19.00
—
—
19.00
—
—
19.00
—
—
19.00 ns
P57
P58
P59
P60
HRESET negated to OPx drive 1
(MIN = 0.75 × B1 + 3.00)
25.70
5.00
1.00
21.70
5.00
1.00
14.40
5.00
1.00
12.40
5.00
1.00
—
—
—
ns
ns
ns
IP_Xx valid to CLKOUT rising edge
(MIN = 0.00 × B1 + 5.00)
—
—
—
CLKOUT rising edge to IP_Xx invalid
(MIN = 0.00 × B1 + 1.00)
—
—
—
1 OP2 and OP3 only.
Figure 30 provides the PCMCIA output port timing for the MPC885/880.
CLKOUT
P57
Output
Signals
HRESET
P58
OP2, OP3
Figure 30. PCMCIA Output Port Timing
Figure 31 provides the PCMCIA input port timing for the MPC885/880.
CLKOUT
P59
P60
Input
Signals
Figure 31. PCMCIA Input Port Timing
MPC885/MPC880 Hardware Specifications, Rev. 3
40
Freescale Semiconductor
Bus Signal Timing
Table 13 shows the debug port timing for the MPC885/880.
Table 13. Debug Port Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
DSCK cycle time
3 × TCLOCKO
-
-
D61
D62
UT
DSCK clock pulse width
1.25 × TCLO
CKOUT
D63 DSCK rise and fall times
0.00
8.00
5.00
0.00
0.00
3.00
ns
ns
ns
ns
ns
D64 DSDI input data setup time
D65 DSDI data hold time
D66 DSCK low to DSDO data valid
D67 DSCK low to DSDO invalid
15.00
2.00
Figure 32 provides the input timing for the debug port clock.
DSCK
D61
D62
D61
D62
D63
Figure 32. Debug Port Clock Input Timing
Figure 33 provides the timing for the debug port.
D63
DSCK
D64
D65
DSDI
D66
D67
DSDO
Figure 33. Debug Port Timings
MPC885/MPC880 Hardware Specifications, Rev. 3
41
Freescale Semiconductor
Bus Signal Timing
Table 14 shows the reset timing for the MPC885/880.
Table 14. Reset Timing
33 MHz 40 MHz
66 MHz
80 MHz
Num
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
CLKOUT to HRESET high
—
20.00
—
20.00
—
20.00
—
20.00
ns
R69 impedance
(MAX = 0.00 × B1 + 20.00)
CLKOUT to SRESET high
R70 impedance
—
20.00
—
—
20.00
—
—
20.00
—
—
20.00
—
ns
ns
(MAX = 0.00 × B1 + 20.00)
RSTCONF pulse width
(MIN = 17.00 × B1)
515.20
425.00
257.60
212.50
R71
R72
—
—
—
—
—
—
—
—
—
—
—
—
—
—
ns
Configuration data to HRESET
504.50
425.00
277.30
237.50
R73 rising edge setup time
(MIN = 15.00 × B1 + 50.00)
Configuration data to RSTCONF 350.00
R74 rising edge setup time
—
—
350.00
0.00
0.00
—
—
—
350.00
0.00
0.00
—
—
—
350.00
0.00
0.00
—
—
—
ns
ns
ns
ns
ns
ns
(MIN = 0.00 × B1 + 350.00)
Configuration data hold time after 0.00
R75 RSTCONF negation
(MIN = 0.00 × B1 + 0.00)
Configuration data hold time after 0.00
R76 HRESET negation
—
—
—
—
(MIN = 0.00 × B1 + 0.00)
HRESET and RSTCONF
R77 asserted to data out drive
(MAX = 0.00 × B1 + 25.00)
—
—
—
25.00
25.00
25.00
25.00
25.00
25.00
25.00
25.00
25.00
25.00
25.00
25.00
RSTCONF negated to data out
R78 high impedance
—
—
—
(MAX = 0.00 × B1 + 25.00)
CLKOUT of last rising edge
before chip three-states
R79 HRESET to data out high
impedance
—
—
—
(MAX = 0.00 × B1 + 25.00)
DSDI, DSCK setup
R80
90.90
0.00
—
—
—
75.00
0.00
—
—
—
45.50
0.00
—
—
—
37.50
0.00
—
—
—
ns
ns
ns
(MIN = 3.00 × B1)
DSDI, DSCK hold time
R81
(MIN = 0.00 × B1 + 0.00)
SRESET negated to CLKOUT
R82 rising edge for DSDI and DSCK
sample (MIN = 8.00 × B1)
242.40
200.00
121.20
100.00
MPC885/MPC880 Hardware Specifications, Rev. 3
42
Freescale Semiconductor
Bus Signal Timing
Figure 34 shows the reset timing for the data bus configuration.
HRESET
R71
R76
RSTCONF
R73
R74
R75
D[0:31] (IN)
Figure 34. Reset Timing—Configuration from Data Bus
Figure 35 provides the reset timing for the data bus weak drive during configuration.
CLKOUT
R69
HRESET
R79
RSTCONF
R77
R78
D[0:31] (OUT)
(Weak)
Figure 35. Reset Timing—Data Bus Weak Drive During Configuration
MPC885/MPC880 Hardware Specifications, Rev. 3
43
Freescale Semiconductor
IEEE 1149.1 Electrical Specifications
Figure 36 provides the reset timing for the debug port configuration.
CLKOUT
R70
R82
R80
SRESET
R80
R81
R81
DSCK, DSDI
Figure 36. Reset Timing—Debug Port Configuration
11 IEEE 1149.1 Electrical Specifications
Table 15 provides the JTAG timings for the MPC885/880 shown in Figure 37 to Figure 40.
Table 15. JTAG Timing
All
Frequencies
Num
Characteristic
Unit
Min
Max
J82
J83
J84
J85
J86
J87
J88
J89
J90
J91
J92
J93
J94
J95
J96
TCK cycle time
100.00
40.00
0.00
5.00
25.00
—
—
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
TCK clock pulse width measured at 1.5 V
TCK rise and fall times
10.00
—
TMS, TDI data setup time
TMS, TDI data hold time
—
TCK low to TDO data valid
27.00
—
TCK low to TDO data invalid
0.00
—
TCK low to TDO high impedance
TRST assert time
20.00
—
100.00
40.00
—
TRST setup time to TCK low
—
TCK falling edge to output valid
TCK falling edge to output valid out of high impedance
TCK falling edge to output high impedance
Boundary scan input valid to TCK rising edge
TCK rising edge to boundary scan input invalid
50.00
50.00
50.00
—
—
—
50.00
50.00
—
MPC885/MPC880 Hardware Specifications, Rev. 3
44
Freescale Semiconductor
IEEE 1149.1 Electrical Specifications
TCK
J82
J83
J82
J83
J84
J84
Figure 37. JTAG Test Clock Input Timing
TCK
TMS, TDI
TDO
J85
J86
J87
J88
J89
Figure 38. JTAG Test Access Port Timing Diagram
TCK
J91
J90
TRST
Figure 39. JTAG TRST Timing Diagram
MPC885/MPC880 Hardware Specifications, Rev. 3
45
Freescale Semiconductor
CPM Electrical Characteristics
TCK
J92
J93
J94
Output
Signals
Output
Signals
J95
J96
Output
Signals
Figure 40. Boundary Scan (JTAG) Timing Diagram
12 CPM Electrical Characteristics
This section provides the AC and DC electrical specifications for the communications processor module (CPM) of
the MPC885/880.
12.1 PIP/PIO AC Electrical Specifications
Table 16 provides the PIP/PIO AC timings as shown in Figure 41 to Figure 45.
Table 16. PIP/PIO Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
21
22
23
24
25
26
27
28
29
30
31
Data-in setup time to STBI low
0
—
—
—
—
—
—
4.5
—
—
—
25
ns
clk
clk
ns
clk
clk
clk
clk
ns
ns
ns
Data-In hold time to STBI high
0
STBI pulse width
1.5
STBO pulse width
1 clk – 5 ns
Data-out setup time to STBO low
Data-out hold time from STBO high
STBI low to STBO low (Rx interlock)
STBI low to STBO high (Tx interlock)
Data-in setup time to clock high
Data-in hold time from clock high
Clock low to data-out valid (CPU writes data, control, or direction)
2
5
—
2
15
7.5
—
MPC885/MPC880 Hardware Specifications, Rev. 3
46
Freescale Semiconductor
CPM Electrical Characteristics
DATA-IN
21
22
23
STBI
27
24
STBO
Figure 41. PIP Rx (Interlock Mode) Timing Diagram
DATA-OUT
25
26
24
STBO
(Output)
28
23
STBI
(Input)
Figure 42. PIP Tx (Interlock Mode) Timing Diagram
DATA-IN
21
22
23
24
STBI
(Input)
STBO
(Output)
Figure 43. PIP Rx (Pulse Mode) Timing Diagram
MPC885/MPC880 Hardware Specifications, Rev. 3
47
Freescale Semiconductor
CPM Electrical Characteristics
DATA-OUT
25
26
24
23
STBO
(Output)
STBI
(Input)
Figure 44. PIP TX (Pulse Mode) Timing Diagram
CLKO
DATA-IN
29
30
31
DATA-OUT
Figure 45. Parallel I/O Data-In/Data-Out Timing Diagram
12.2 Port C Interrupt AC Electrical Specifications
Table 17 provides the timings for port C interrupts.
Table 17. Port C Interrupt Timing
33.34 MHz
Num
Characteristic
Unit
Min
Max
35
36
Port C interrupt pulse width low (edge-triggered mode)
Port C interrupt minimum time between active edges
55
55
—
—
ns
ns
MPC885/MPC880 Hardware Specifications, Rev. 3
48
Freescale Semiconductor
CPM Electrical Characteristics
Figure 46 shows the port C interrupt detection timing.
36
Port C
(Input)
35
Figure 46. Port C Interrupt Detection Timing
12.3 IDMA Controller AC Electrical Specifications
Table 18 provides the IDMA controller timings as shown in Figure 47 to Figure 50.
Table 18. IDMA Controller Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
40
41
42
43
44
45
46
DREQ setup time to clock high
DREQ hold time from clock high
7
TBD
—
—
—
12
12
20
15
—
ns
ns
ns
ns
ns
ns
ns
1
SDACK assertion delay from clock high
SDACK negation delay from clock low
—
SDACK negation delay from TA low
—
SDACK negation delay from clock high
—
TA assertion to falling edge of the clock setup time (applies to external TA)
7
1 Applies to high-to-low mode (EDM=1)
CLKO
(Output)
41
40
DREQ
(Input)
Figure 47. IDMA External Requests Timing Diagram
MPC885/MPC880 Hardware Specifications, Rev. 3
49
Freescale Semiconductor
CPM Electrical Characteristics
CLKO
(Output)
TS
(Output)
R/W
(Output)
42
43
DATA
46
TA
(Input)
SDACK
Figure 48. SDACK Timing Diagram—Peripheral Write, Externally-Generated TA
CLKO
(Output)
TS
(Output)
R/W
(Output)
42
44
DATA
TA
(Output)
SDACK
Figure 49. SDACK Timing Diagram—Peripheral Write, Internally-Generated TA
MPC885/MPC880 Hardware Specifications, Rev. 3
50
Freescale Semiconductor
CPM Electrical Characteristics
CLKO
(Output)
TS
(Output)
R/W
(Output)
42
45
DATA
TA
(Output)
SDACK
Figure 50. SDACK Timing Diagram—Peripheral Read, Internally-Generated TA
12.4 Baud Rate Generator AC Electrical Specifications
Table 19 provides the baud rate generator timings as shown in Figure 51.
Table 19. Baud Rate Generator Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
50
51
52
BRGO rise and fall time
BRGO duty cycle
BRGO cycle
—
40
40
10
60
—
ns
%
ns
50
50
BRGOX
51
51
52
Figure 51. Baud Rate Generator Timing Diagram
MPC885/MPC880 Hardware Specifications, Rev. 3
51
Freescale Semiconductor
CPM Electrical Characteristics
12.5 Timer AC Electrical Specifications
Table 20 provides the general-purpose timer timings as shown in Figure 52.
Table 20. Timer Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
61
62
63
64
65
TIN/TGATE rise and fall time
TIN/TGATE low time
10
1
—
—
—
—
25
ns
clk
clk
clk
ns
TIN/TGATE high time
TIN/TGATE cycle time
CLKO low to TOUT valid
2
3
3
CLKO
60
61
63
62
TIN/TGATE
(Input)
61
64
65
TOUT
(Output)
Figure 52. CPM General-Purpose Timers Timing Diagram
12.6 Serial Interface AC Electrical Specifications
Table 21 provides the serial interface timings as shown in Figure 53 to Figure 57.
Table 21. SI Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
70
71
L1RCLK, L1TCLK frequency (DSC = 0) 1, 2
—
SYNCCLK
/2.5
MHz
L1RCLK, L1TCLK width low (DSC = 0) 2
P + 10
P + 10
—
—
—
ns
ns
ns
ns
ns
3
71a L1RCLK, L1TCLK width high (DSC = 0)
72
73
74
L1TXD, L1ST(1–4), L1RQ, L1CLKO rise/fall time
15.00
—
L1RSYNC, L1TSYNC valid to L1CLK edge (SYNC setup time)
L1CLK edge to L1RSYNC, L1TSYNC, invalid (SYNC hold time)
20.00
35.00
—
MPC885/MPC880 Hardware Specifications, Rev. 3
52
Freescale Semiconductor
CPM Electrical Characteristics
Table 21. SI Timing (continued)
Characteristic
All Frequencies
Num
Unit
Min
Max
75
76
77
78
L1RSYNC, L1TSYNC rise/fall time
L1RXD valid to L1CLK edge (L1RXD setup time)
—
15.00
—
ns
ns
17.00
13.00
10.00
10.00
10.00
10.00
10.00
0.00
L1CLK edge to L1RXD invalid (L1RXD hold time)
—
ns
4
L1CLK edge to L1ST(1–4) valid
45.00
45.00
45.00
55.00
55.00
42.00
ns
78A L1SYNC valid to L1ST(1–4) valid
ns
79
80
L1CLK edge to L1ST(1–4) invalid
L1CLK edge to L1TXD valid
ns
ns
80A L1TSYNC valid to L1TXD valid 4
ns
81
82
L1CLK edge to L1TXD high impedance
L1RCLK, L1TCLK frequency (DSC =1)
ns
—
16.00 or
SYNCCLK
/2
MHz
83
L1RCLK, L1TCLK width low (DSC =1)
P + 10
P + 10
—
—
—
ns
ns
83a L1RCLK, L1TCLK width high (DSC = 1)3
84
85
86
87
88
L1CLK edge to L1CLKO valid (DSC = 1)
L1RQ valid before falling edge of L1TSYNC4
L1GR setup time2
30.00
—
ns
1.00
42.00
42.00
—
L1TCLK
ns
—
L1GR hold time
—
ns
L1CLK edge to L1SYNC valid (FSD = 00) CNT = 0000, BYT = 0,
DSC = 0)
0.00
ns
1 The ratio SyncCLK/L1RCLK must be greater than 2.5/1.
2 These specs are valid for IDL mode only.
3 Where P = 1/CLKOUT. Thus for a 25-MHz CLKO1 rate, P = 40 ns.
4 These strobes and TxD on the first bit of the frame become valid after L1CLK edge or L1SYNC, whichever comes later.
MPC885/MPC880 Hardware Specifications, Rev. 3
53
Freescale Semiconductor
CPM Electrical Characteristics
L1RCLK
(FE=0, CE=0)
(Input)
71
70
71a
72
L1RCLK
(FE=1, CE=1)
(Input)
RFSD=1
75
74
L1RSYNC
(Input)
73
77
L1RXD
(Input)
BIT0
76
78
79
L1ST(4-1)
(Output)
Figure 53. SI Receive Timing Diagram with Normal Clocking (DSC = 0)
MPC885/MPC880 Hardware Specifications, Rev. 3
54
Freescale Semiconductor
CPM Electrical Characteristics
L1RCLK
(FE=1, CE=1)
(Input)
72
83a
82
L1RCLK
(FE=0, CE=0)
(Input)
RFSD=1
75
L1RSYNC
(Input)
73
74
77
L1RXD
(Input)
BIT0
76
78
79
L1ST(4-1)
(Output)
84
L1CLKO
(Output)
Figure 54. SI Receive Timing with Double-Speed Clocking (DSC = 1)
MPC885/MPC880 Hardware Specifications, Rev. 3
55
Freescale Semiconductor
CPM Electrical Characteristics
L1TCLK
(FE=0, CE=0)
(Input)
71
70
72
L1TCLK
(FE=1, CE=1)
(Input)
73
TFSD=0
75
74
L1TSYNC
(Input)
80a
BIT0
80
81
L1TXD
(Output)
79
78
L1ST(4-1)
(Output)
Figure 55. SI Transmit Timing Diagram (DSC = 0)
MPC885/MPC880 Hardware Specifications, Rev. 3
56
Freescale Semiconductor
CPM Electrical Characteristics
L1RCLK
(FE=0, CE=0)
(Input)
72
83a
82
L1RCLK
(FE=1, CE=1)
(Input)
TFSD=0
75
L1RSYNC
(Input)
73
74
81
L1TXD
(Output)
BIT0
80
78a
79
L1ST(4-1)
(Output)
78
84
L1CLKO
(Output)
Figure 56. SI Transmit Timing with Double Speed Clocking (DSC = 1)
MPC885/MPC880 Hardware Specifications, Rev. 3
57
Freescale Semiconductor
CPM Electrical Characteristics
Figure 57. IDL Timing
MPC885/MPC880 Hardware Specifications, Rev. 3
58
Freescale Semiconductor
CPM Electrical Characteristics
12.7 SCC in NMSI Mode Electrical Specifications
Table 22 provides the NMSI external clock timing.
Table 22. NMSI External Clock Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
100 RCLK1 and TCLK1 width high 1
1/SYNCCLK
—
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
101 RCLK1 and TCLK1 width low
1/SYNCCLK + 5
102 RCLK1 and TCLK1 rise/fall time
—
15.00
50.00
50.00
—
103 TXD1 active delay (from TCLK1 falling edge)
104 RTS1 active/inactive delay (from TCLK1 falling edge)
105 CTS1 setup time to TCLK1 rising edge
106 RXD1 setup time to RCLK1 rising edge
107 RXD1 hold time from RCLK1 rising edge 2
108 CD1 setup time to RCLK1 rising edge
0.00
0.00
5.00
5.00
5.00
5.00
—
—
—
1 The ratios SyncCLK/RCLK1 and SyncCLK/TCLK1 must be greater than or equal to 2.25/1.
2 Also applies to CD and CTS hold time when they are used as external sync signals.
Table 23 provides the NMSI internal clock timing.
Table 23. NMSI Internal Clock Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
100 RCLK1 and TCLK1 frequency 1
0.00
—
SYNCCLK/3
MHz
ns
102 RCLK1 and TCLK1 rise/fall time
—
30.00
30.00
—
103 TXD1 active delay (from TCLK1 falling edge)
104 RTS1 active/inactive delay (from TCLK1 falling edge)
105 CTS1 setup time to TCLK1 rising edge
106 RXD1 setup time to RCLK1 rising edge
107 RXD1 hold time from RCLK1 rising edge 2
108 CD1 setup time to RCLK1 rising edge
0.00
0.00
40.00
40.00
0.00
40.00
ns
ns
ns
—
ns
—
ns
—
ns
1 The ratios SyncCLK/RCLK1 and SyncCLK/TCLK1 must be greater than or equal to 3/1.
2 Also applies to CD and CTS hold time when they are used as external sync signals
MPC885/MPC880 Hardware Specifications, Rev. 3
59
Freescale Semiconductor
CPM Electrical Characteristics
Figure 58 through Figure 60 show the NMSI timings.
RCLK1
102
102
101
106
100
RxD1
(Input)
107
108
CD1
(Input)
107
CD1
(SYNC Input)
Figure 58. SCC NMSI Receive Timing Diagram
TCLK1
102
102
101
100
TxD1
(Output)
103
105
RTS1
(Output)
104
104
CTS1
(Input)
107
CTS1
(SYNC Input)
Figure 59. SCC NMSI Transmit Timing Diagram
MPC885/MPC880 Hardware Specifications, Rev. 3
60
Freescale Semiconductor
CPM Electrical Characteristics
TCLK1
102
102
101
100
TxD1
(Output)
103
RTS1
(Output)
104
107
104
105
CTS1
(Echo Input)
Figure 60. HDLC Bus Timing Diagram
12.8 Ethernet Electrical Specifications
Table 24 provides the Ethernet timings as shown in Figure 61 to Figure 63.
Table 24. Ethernet Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
120 CLSN width high
121 RCLK1 rise/fall time
122 RCLK1 width low
123 RCLK1 clock period 1
124 RXD1 setup time
125 RXD1 hold time
40
—
—
15
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
40
80
20
5
120
—
—
126 RENA active delay (from RCLK1 rising edge of the last data bit)
127 RENA width low
10
100
—
—
—
128 TCLK1 rise/fall time
15
—
129 TCLK1 width low
40
99
—
130 TCLK1 clock period1
101
50
50
50
131 TXD1 active delay (from TCLK1 rising edge)
132 TXD1 inactive delay (from TCLK1 rising edge)
133 TENA active delay (from TCLK1 rising edge)
6.5
10
MPC885/MPC880 Hardware Specifications, Rev. 3
61
Freescale Semiconductor
CPM Electrical Characteristics
Table 24. Ethernet Timing (continued)
Characteristic
All Frequencies
Num
Unit
Min
Max
134 TENA inactive delay (from TCLK1 rising edge)
138 CLKO1 low to SDACK asserted 2
10
—
—
50
20
20
ns
ns
ns
139 CLKO1 low to SDACK negated 2
1 The ratios SyncCLK/RCLK1 and SyncCLK/TCLK1 must be greater than or equal to 2/1.
2 SDACK is asserted whenever the SDMA writes the incoming frame DA into memory.
CLSN(CTS1)
(Input)
120
Figure 61. Ethernet Collision Timing Diagram
RCLK1
121
121
124
123
Last Bit
RxD1
(Input)
125
126
127
RENA(CD1)
(Input)
Figure 62. Ethernet Receive Timing Diagram
MPC885/MPC880 Hardware Specifications, Rev. 3
62
Freescale Semiconductor
CPM Electrical Characteristics
TCLK1
128
128
129
131
121
TxD1
(Output)
132
133
134
TENA(RTS1)
(Input)
RENA(CD1)
(Input)
(NOTE 2)
NOTES:
1. Transmit clock invert (TCI) bit in GSMR is set.
2. If RENA is negated before TENA or RENA is not asserted at all during transmit, then the
CSL bit is set in the buffer descriptor at the end of the frame transmission.
Figure 63. Ethernet Transmit Timing Diagram
12.9 SMC Transparent AC Electrical Specifications
Table 25 provides the SMC transparent timings as shown in Figure 64.
Table 25. SMC Transparent Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
150 SMCLK clock period 1
151 SMCLK width low
151A SMCLK width high
152 SMCLK rise/fall time
100
50
50
—
10
20
5
—
—
—
15
50
—
—
ns
ns
ns
ns
ns
ns
ns
153 SMTXD active delay (from SMCLK falling edge)
154 SMRXD/SMSYNC setup time
155 RXD1/SMSYNC hold time
1
SyncCLK must be at least twice as fast as SMCLK.
MPC885/MPC880 Hardware Specifications, Rev. 3
63
Freescale Semiconductor
CPM Electrical Characteristics
SMCLK
152
152
151
151
150
SMTXD
(Output)
NOTE
154
153
155
SMSYNC
154
155
SMRXD
(Input)
NOTE:
1. This delay is equal to an integer number of character-length clocks.
Figure 64. SMC Transparent Timing Diagram
12.10SPI Master AC Electrical Specifications
Table 26 provides the SPI master timings as shown in Figure 65 and Figure 66.
Table 26. SPI Master Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
160 MASTER cycle time
4
2
1024
512
—
tcyc
tcyc
ns
ns
ns
ns
ns
ns
161 MASTER clock (SCK) high or low time
162 MASTER data setup time (inputs)
163 Master data hold time (inputs)
164 Master data valid (after SCK edge)
165 Master data hold time (outputs)
166 Rise time output
15
0
—
—
0
10
—
—
—
15
167 Fall time output
15
MPC885/MPC880 Hardware Specifications, Rev. 3
64
Freescale Semiconductor
CPM Electrical Characteristics
SPICLK
(CI=0)
(Output)
161
161
167
166
166
167
160
SPICLK
(CI=1)
(Output)
163
162
SPIMISO
(Input)
msb
Data
165
lsb
msb
164
167
166
SPIMOSI
(Output)
msb
Data
lsb
msb
Figure 65. SPI Master (CP = 0) Timing Diagram
SPICLK
(CI=0)
(Output)
161
161
167
166
167
160
SPICLK
(CI=1)
(Output)
163
162
166
SPIMISO
(Input)
msb
167
Data
165
lsb
msb
164
166
SPIMOSI
(Output)
msb
Data
lsb
msb
Figure 66. SPI Master (CP = 1) Timing Diagram
MPC885/MPC880 Hardware Specifications, Rev. 3
65
Freescale Semiconductor
CPM Electrical Characteristics
12.11SPI Slave AC Electrical Specifications
Table 27 provides the SPI slave timings as shown in Figure 67 and Figure 68.
Table 27. SPI Slave Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
170 Slave cycle time
2
—
—
—
—
—
—
—
50
tcyc
ns
171 Slave enable lead time
172 Slave enable lag time
15
15
1
ns
173 Slave clock (SPICLK) high or low time
174 Slave sequential transfer delay (does not require deselect)
175 Slave data setup time (inputs)
tcyc
tcyc
ns
1
20
20
—
176 Slave data hold time (inputs)
ns
177 Slave access time
ns
SPISEL
(Input)
172
171
174
SPICLK
(CI=0)
(Input)
173
182
181
182
173
170
SPICLK
(CI=1)
(Input)
177
181
180
178
Undef
SPIMISO
(Output)
msb
175
Data
lsb
msb
msb
179
176
181 182
lsb
SPIMOSI
(Input)
msb
Data
Figure 67. SPI Slave (CP = 0) Timing Diagram
MPC885/MPC880 Hardware Specifications, Rev. 3
66
Freescale Semiconductor
CPM Electrical Characteristics
SPISEL
(Input)
172
174
171
170
SPICLK
(CI=0)
(Input)
173
182
181
173
181
SPICLK
(CI=1)
(Input)
177
182
180
178
SPIMISO
(Output)
msb
msb
msb
Undef
175
Data
lsb
179
176
msb
181 182
Data
SPIMOSI
(Input)
lsb
Figure 68. SPI Slave (CP = 1) Timing Diagram
12.12I2C AC Electrical Specifications
2
Table 28 provides the I C (SCL < 100 KHz) timings.
Table 28. I2C Timing (SCL < 100 KHZ)
All Frequencies
Num
Characteristic
Unit
Min
Max
200 SCL clock frequency (slave)
0
100
100
—
—
—
—
—
—
—
1
KHz
KHz
µs
200 SCL clock frequency (master) 1
202 Bus free time between transmissions
203 Low period of SCL
1.5
4.7
4.7
4.0
4.7
4.0
0
µs
204 High period of SCL
µs
205 Start condition setup time
206 Start condition hold time
207 Data hold time
µs
µs
µs
208 Data setup time
250
—
ns
209 SDL/SCL rise time
µs
MPC885/MPC880 Hardware Specifications, Rev. 3
67
Freescale Semiconductor
CPM Electrical Characteristics
Table 28. I2C Timing (SCL < 100 KHZ) (continued)
Characteristic
All Frequencies
Num
Unit
Min
Max
210 SDL/SCL fall time
—
300
—
ns
211
Stop condition setup time
4.7
µs
1 SCL frequency is given by SCL = BRGCLK_frequency / ((BRG register + 3) × pre_scaler × 2).
The ratio SyncClk/(BRGCLK/pre_scaler) must be greater or equal to 4/1.
2
Table 29 provides the I C (SCL > 100 KHz) timings.
Table 29. I2C Timing (SCL > 100 KHZ)
All Frequencies
Num
Characteristic
Expression
Unit
Min
Max
200 SCL clock frequency (slave)
200 SCL clock frequency (master) 1
202 Bus free time between transmissions
203 Low period of SCL
fSCL
fSCL
—
0
BRGCLK/48
Hz
Hz
s
BRGCLK/16512
1/(2.2 × fSCL)
1/(2.2 × fSCL)
1/(2.2 × fSCL)
1/(2.2 × fSCL)
1/(2.2 × fSCL)
0
BRGCLK/48
—
—
—
s
204 High period of SCL
—
—
s
205 Start condition setup time
206 Start condition hold time
207 Data hold time
—
—
s
—
—
s
—
—
—
s
208 Data setup time
—
1/(40 × fSCL)
—
s
209 SDL/SCL rise time
—
1/(10 × fSCL)
1/(33 × fSCL)
—
s
210 SDL/SCL fall time
—
—
s
211
Stop condition setup time
—
1/2(2.2 × fSCL)
s
1 SCL frequency is given by SCL = BrgClk_frequency / ((BRG register + 3) × pre_scaler × 2).
The ratio SyncClk/(Brg_Clk/pre_scaler) must be greater or equal to 4/1.
MPC885/MPC880 Hardware Specifications, Rev. 3
68
Freescale Semiconductor
UTOPIA AC Electrical Specifications
2
Figure 69 shows the I C bus timing.
SDA
202
203
204
208
205
207
SCL
206
209
210
211
Figure 69. I2C Bus Timing Diagram
13 UTOPIA AC Electrical Specifications
Table 30, Table 31, and Table 32, show the AC electrical specifications for the UTOPIA interface.
Table 30. UTOPIA Master (Muxed Mode) Electrical Specifications
Num
Signal Characteristic
Direction
Min
Max
Unit
U1
UtpClk rise/fall time (internal clock option)
Output
4 ns
50
ns
%
Duty cycle
Frequency
50
33
MHz
ns
U2
UTPB, SOC, RxEnb, TxEnb, RxAddr, and TxAddr active delay (and
PHREQ and PHSEL active delay in multi-PHY mode)
Output
2 ns
16 ns
U3
U4
UTPB, SOC, Rxclav and Txclav setup time
UTPB, SOC, Rxclav and Txclav hold time
Input
Input
4 ns
1 ns
ns
ns
Table 31. UTOPIA Master (Split Bus Mode) Electrical Specifications
Num
Signal Characteristic
Direction
Min
Max
Unit
U1
UtpClk rise/fall time (Internal clock option)
Output
4 ns
50
ns
%
Duty cycle
Frequency
50
33
MHz
ns
U2
UTPB, SOC, RxEnb, TxEnb, RxAddr and TxAddr active delay
(PHREQ and PHSEL active delay in multi-PHY mode)
Output
2 ns
16 ns
U3
U4
UTPB_Aux, SOC_Aux, Rxclav and Txclav setup time
UTPB_Aux, SOC_Aux, Rxclav and Txclav hold time
Input
Input
4 ns
1 ns
ns
ns
MPC885/MPC880 Hardware Specifications, Rev. 3
69
Freescale Semiconductor
UTOPIA AC Electrical Specifications
Table 32. UTOPIA Slave (Split Bus Mode) Electrical Specifications
Num
Signal Characteristic
Direction
Min
Max
Unit
U1
UtpClk rise/fall time (external clock option)
Duty cycle
Input
4 ns
60
ns
%
40
Frequency
33
MHz
ns
U2
U3
UTPB, SOC, Rxclav and Txclav active delay
Output
Input
2 ns
4 ns
16 ns
UTPB_AUX, SOC_Aux, RxEnb, TxEnb, RxAddr, and TxAddr setup
time
ns
U4
UTPB_AUX, SOC_Aux, RxEnb, TxEnb, RxAddr, and TxAddr hold
time
Input
1 ns
ns
Figure 70 shows signal timings during UTOPIA receive operations.
U1
U1
UtpClk
U2
PHREQn
U3
U4
RxClav
RxEnb
High-Z at MPHY
High-Z at MPHY
U2
UTPB
SOC
U3
U4
Figure 70. UTOPIA Receive Timing
MPC885/MPC880 Hardware Specifications, Rev. 3
70
Freescale Semiconductor
USB Electrical Characteristics
Figure 71 shows signal timings during UTOPIA transmit operations.
U1
U1
UtpClk
U2
PHSELn
TxClav
U3
U4
High-Z at MPHY
High-Z at Multi-PHYP
U2
TxEnb
UTPB
SOC
U2
Figure 71. UTOPIA Transmit Timing
14 USB Electrical Characteristics
This section provides the AC timings for the USB interface.
14.1 USB Interface AC Timing Specifications
The USB Port uses the transmit clock on SCC1. Table 33 lists the USB interface timings.
Table 33. USB Interface AC Timing Specifications
All Frequencies
Name
Characteristic
Unit
Min
Max
1
US1 USBCLK frequency of operation
Low speed
Full speed
6
48
MHz
MHz
US4 USBCLK duty cycle (measured at 1.5 V)
45
55
%
1 USBCLK accuracy should be ±500 ppm or better. USBCLK may be stopped to conserve power.
15 FEC Electrical Characteristics
This section provides the AC electrical specifications for the fast Ethernet controller (FEC). Note that the timing
specifications for the MII signals are independent of system clock frequency (part speed designation). Also, MII
signals use TTL signal levels compatible with devices operating at either 5.0 V or 3.3 V.
MPC885/MPC880 Hardware Specifications, Rev. 3
71
Freescale Semiconductor
FEC Electrical Characteristics
15.1 MII and Reduced MII Receive Signal Timing
The receiver functions correctly up to a MII_RX_CLK maximum frequency of 25 MHz + 1%. The reduced MII
(RMII) receiver functions correctly up to a RMII_REFCLK maximum frequency of 50 MHz + 1%. There is no
minimum frequency requirement. In addition, the processor clock frequency must exceed the MII_RX_CLK
frequency – 1%.
Table 34 provides information on the MII and RMII receive signal timing.
Table 34. MII Receive Signal Timing
Num
Characteristic
Min
Max
Unit
M1
M2
M3
M4
MII_RXD[3:0], MII_RX_DV, MII_RX_ERR to MII_RX_CLK setup
MII_RX_CLK to MII_RXD[3:0], MII_RX_DV, MII_RX_ER hold
MII_RX_CLK pulse width high
5
5
—
—
ns
ns
35%
35%
4
65% MII_RX_CLK period
65% MII_RX_CLK period
MII_RX_CLK pulse width low
M1_RMII RMII_RXD[1:0], RMII_CRS_DV, RMII_RX_ERR to RMII_REFCLK
setup
—
ns
M2_RMII RMII_REFCLK to RMII_RXD[1:0], RMII_CRS_DV, RMII_RX_ERR
hold
2
—
ns
Figure 72 shows MII receive signal timing.
M3
MII_RX_CLK (input)
M4
MII_RXD[3:0] (inputs)
MII_RX_DV
MII_RX_ER
M1
M2
Figure 72. MII Receive Signal Timing Diagram
15.2 MII and Reduced MII Transmit Signal Timing
The transmitter functions correctly up to a MII_TX_CLK maximum frequency of 25 MHz +1%. The RMII
transmitter functions correctly up to a RMII_REFCLK maximum frequency of 50 MHz +1%. There is no minimum
frequency requirement. In addition, the processor clock frequency must exceed the MII_TX_CLK frequency – 1%.
MPC885/MPC880 Hardware Specifications, Rev. 3
72
Freescale Semiconductor
FEC Electrical Characteristics
Table 35 provides information on the MII and RMII transmit signal timing.
Table 35. MII Transmit Signal Timing
Num
Characteristic
Min
Max
Unit
M5
M6
MII_TX_CLK to MII_TXD[3:0], MII_TX_EN, MII_TX_ER invalid
MII_TX_CLK to MII_TXD[3:0], MII_TX_EN, MII_TX_ER valid
5
—
4
—
25
—
ns
ns
ns
M20_R RMII_TXD[1:0], RMII_TX_EN to RMII_REFCLK setup
MII
M21_R RMII_TXD[1:0], RMII_TX_EN data hold from RMII_REFCLK rising
2
—
ns
MII
edge
M7
MII_TX_CLK and RMII_REFCLK pulse width high
35%
65%
MII_TX_CLK or
RMII_REFCLK
period
M8
MII_TX_CLK and RMII_REFCLK pulse width low
35%
65%
MII_TX_CLK or
RMII_REFCLK
period
Figure 73 shows the MII transmit signal timing diagram.
M7
MII_TX_CLK (input)
RMII_REFCLK
M5
M8
MII_TXD[3:0] (outputs)
MII_TX_EN
MII_TX_ER
M6
Figure 73. MII Transmit Signal Timing Diagram
15.3 MII Async Inputs Signal Timing (MII_CRS, MII_COL)
Table 36 provides information on the MII async inputs signal timing.
Table 36. MII Async Inputs Signal Timing
Num
Characteristic
Min
Max
Unit
M9
MII_CRS, MII_COL minimum pulse width
1.5
—
MII_TX_CLK period
MPC885/MPC880 Hardware Specifications, Rev. 3
73
Freescale Semiconductor
FEC Electrical Characteristics
Figure 74 shows the MII asynchronous inputs signal timing diagram.
MII_CRS, MII_COL
M9
Figure 74. MII Async Inputs Timing Diagram
15.4 MII Serial Management Channel Timing (MII_MDIO, MII_MDC)
Table 37 provides information on the MII serial management channel signal timing. The FEC functions correctly
with a maximum MDC frequency in excess of 2.5 MHz. The exact upper bound is under investigation.
Table 37. MII Serial Management Channel Timing
Num
Characteristic
Min
Max
Unit
M10 MII_MDC falling edge to MII_MDIO output invalid (minimum
propagation delay)
0
—
ns
M11 MII_MDC falling edge to MII_MDIO output valid (max prop delay)
M12 MII_MDIO (input) to MII_MDC rising edge setup
M13 MII_MDIO (input) to MII_MDC rising edge hold
M14 MII_MDC pulse width high
—
10
25
—
—
ns
ns
ns
0
40%
40%
60% MII_MDC period
60% MII_MDC period
M15 MII_MDC pulse width low
Figure 75 shows the MII serial management channel timing diagram.
M14
MM15
MII_MDC (output)
M10
MII_MDIO (output)
M11
MII_MDIO (input)
M12
M13
Figure 75. MII Serial Management Channel Timing Diagram
MPC885/MPC880 Hardware Specifications, Rev. 3
74
Freescale Semiconductor
Mechanical Data and Ordering Information
16 Mechanical Data and Ordering Information
Table 38 identifies the available packages and operating frequencies for the MPC885/880 derivative devices.
Table 38. Available MPC885/880 Packages/Frequencies
Package Type
Plastic ball grid array
ZP suffix — Leaded
VR suffix — Lead-Free are available as needed
Temperature (Tj) Frequency (MHz)
Order Number
0°C to 95°C
66
KMPC885ZP66
KMPC880ZP66
MPC885ZP66
MPC880ZP66
80
KMPC885ZP80
KMPC880ZP80
MPC885ZP80
MPC880ZP80
133
66
KMPC885ZP133
KMPC880ZP133
MPC885ZP133
MPC880ZP133
Plastic ball grid array
CZP suffix — Leaded
CVR suffix — Lead-Free are available as needed
-40°C to 100°C
KMPC885CZP66
KMPC880CZP66
MPC885CZP66
MPC880CZP66
133
KMPC885CZP133
KMPC880CZP133
MPC885CZP133
MPC880CZP133
MPC885/MPC880 Hardware Specifications, Rev. 3
75
Freescale Semiconductor
Mechanical Data and Ordering Information
16.1 Pin Assignments
Figure 76 shows the top-view pinout of the PBGA package. For additional information, see the MPC885
PowerQUICC Family User’s Manual.
NOTE: This is the top view of the device.
W
V
U
T
TRST
TMS
PA10
PB25
PB23
PC11
PA8
PC8
PA5
PB17
PC7
PA13
PB16
PC4
PC13
PB15
PA11
PE21
PE31
PE17
PE24
PE30
PE14
PE15
PD5
PD6
PE28
PD12
PD4
PE27
PA4
PD7
PA3
PE22
PB28
PB22
PA7 PB19
PB31
PE23
PB27
PB14
PC12
TCK
TDO
PB24
TDI
PC10
PB21
PA6 MII1_COL PC6
PD15
PE29
PD14
PE16
PD13
PA0
PD9
PD10
PD11
PA1
PB29
PC15
PA9
VDDL
VDDH
PC9 PB20
PB18 MII1_CRS PC5
VDDL
PD3
PE19 MII1_TXEN PA2
PE25
PE26
R
P
N
M
L
VDDL
VDDL
VDDH
VDDL
GND
PE20
IRQ7
PD8
PC14
PB26
PA14
N/C
A4
PE18
D8
VDDH
VDDH
GND
GND
MII_MDIO PB30
PA12
PA15
A0
IRQ1
D12
D23
D0
GND
A2
A3
A1
A5
IRQ0
D13
D27
D4
VDDL
VDDH
VDDH
D1
D17
D9
VDDH
GND
GND
VDDL
VDDL
A7
A9
A8
A6
D10
D14
D19
D6
D11
D3
D2
K
J
VDDL
GND
A10
A14
A27
A21
A25
A18
A26
BSA2
WE3
A11
A16
A19
A29
A30
A28
A31
BSA1
WE0
A12
A15
A20
A23
A22
TSIZ1
A13
D5
D15
D18
D21
D25
D29
D30
IPA5
A17
D22
D28
D16
D20
D24
D7
H
G
F
VDDH
VDDL
GND
A24
GND
GND
VDDH
VDDL
VDDH
VDDL
TSIZ0
BSA3
WE1
CLKOUT
IPA2
D26
D31
IPA3
VDDH
E
D
C
B
A
VDDL
VDDL
VSSSYN
IPA6
IPA4
BSA0 GPL_AB2 CS6
CS3
CS1
CS0
WR
BI
TA
BR
BG
BB
IRQ6
BURST
IRQ2
IPB1
IPB3
IPB4
ALEB
IPB2
IPB7
AS
MODCK1 EXTAL RSTCONF IPA7
WE2
CS4
CS7
CE2_A
CE1_A
GPL_A5
GPL_A4
IRQ4
ALEA
OP1 BADDR28 TEXP WAIT_B VSSSYN1 IPA1
OP0 BADDR29 HRESET PORESETVDDLSYN IPA0
GPL_A0
TEA
OE
GPL_AB3 CS5
CS2
GPL_B4
BDIP
TS
IRQ3
IPB5
IPB0
IPB6 BADDR30MODCK2 EXTCLK XTAL SRESET WAIT_A
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
Figure 76. Pinout of the PBGA Package
MPC885/MPC880 Hardware Specifications, Rev. 3
76
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39 contains a list of the MPC885 input and output signals and shows multiplexing and pin assignments.
Table 39. Pin Assignments
Name
A[0:31]
Pin Number
Type
Bidirectional
M16, N18, N19, M19, M17, M18, L16, L19, L17, L18, K19, K18, K17,
K16, J19, J17, J18, J16, E19, H18, H17, G19, F17, G17, H16, F19, D19, Three-state
H19, E18, G18, F18, D18
D[0:31]
P2, M1, L1, K2, N1, K4, H3, F2, P1, L4, L3, L2, N3, N2, K3, K1, J2, M4, Bidirectional
J1, J3, H2, H1, J4, M3, G2, G1, G3, M2, H4, F1, E1, F3
Three-state
TSIZ0
REG
G16
Bidirectional
Three-state
TSIZ1
E17
D13
C10
A13
A12
C12
Bidirectional
Three-state
RD/WR
BURST
Bidirectional
Three-state
Bidirectional
Three-state
BDIP
GPL_B5
Output
TS
Bidirectional
Active pull-up
TA
Bidirectional
Active pull-up
TEA
BI
B12
D12
Open-drain
Bidirectional
Active pull-up
IRQ2
RSV
B10
C7
Bidirectional
Three-state
IRQ4
KR
Bidirectional
Three-state
RETRY
SPKROUT
CR
A11
Input
IRQ3
BR
BG
BB
D11
C11
B11
Bidirectional
Bidirectional
Bidirectional
Active pull-up
FRZ
D10
Bidirectional
IRQ6
IRQ0
IRQ1
IRQ7
N4
P3
P4
Input
Input
Input
MPC885/MPC880 Hardware Specifications, Rev. 3
77
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Pin Number
B14, C14, A15, D14, C16, A16
Name
CS[0:5]
Type
Output
Output
CS6
D15
B16
B18
CE1_B
CS7
Output
Output
CE2_B
WE0
BS_B0
IORD
WE1
BS_B1
IOWR
E16
C17
B19
Output
Output
Output
WE2
BS_B2
PCOE
WE3
BS_B3
PCWE
BS_A[0:3]
D17, C18, C19, F16
B17
Output
Output
GPL_A0
GPL_B0
OE
GPL_A1
GPL_B1
A18
Output
Output
GPL_A[2:3]
GPL_B[2:3]
CS[2:3]
D16, A17
UPWAITA
GPL_A4
B13
A14
Bidirectional
Bidirectional
UPWAITB
GPL_B4
GPL_A5
PORESET
RSTCONF
HRESET
SRESET
XTAL
C13
B3
D4
B4
A3
A4
D5
G4
A5
Output
Input
Input
Open-drain
Open-drain
Analog output
Analog input (3.3 V only)
Output
EXTAL
CLKOUT
EXTCLK
Input (3.3 V only)
MPC885/MPC880 Hardware Specifications, Rev. 3
78
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
TEXP
Pin Number
Type
C4
Output
Output
Output
Output
Input
ALE_A
CE1_A
CE2_A
B7
B15
C15
A2
WAIT_A
SOC_Split1
WAIT_B
C3
B1
Input
Input
IP_A0
UTPB_Split01
IP_A1
C1
F4
Input
Input
UTPB_Split11
IP_A2
IOIS16_A
UTPB_Split21
IP_A3
E3
Input
Input
Input
Input
Input
UTPB_Split31
IP_A4
D2
UTPB_Split41
IP_A5
D1
UTPB_Split51
IP_A6
E2
UTPB_Split61
IP_A7
D3
UTPB_Split71
ALE_B
DSCK/AT1
D8
Bidirectional
Three-state
IP_B[0:1]
IWP[0:1]
VFLS[0:1]
A9, D9
Bidirectional
IP_B2
IOIS16_B
AT2
C8
C9
B9
Bidirectional
Three-state
IP_B3
IWP2
VF2
Bidirectional
Bidirectional
Bidirectional
IP_B4
LWP0
VF0
IP_B5
LWP1
VF1
A10
MPC885/MPC880 Hardware Specifications, Rev. 3
79
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
IP_B6
DSDI
AT0
Pin Number
Type
Bidirectional
A8
B8
B6
Three-state
IP_B7
PTR
AT3
Bidirectional
Three-state
OP0
Bidirectional
UtpClk_Split1
OP1
C6
D6
Output
OP2
Bidirectional
MODCK1
STS
OP3
MODCK2
DSDO
A6
A7
Bidirectional
Output
BADDR30
REG
BADDR[28:29] C5, B5
Output
AS
D7
Input
PA15
N16
Bidirectional
USBRXD
PA14
USBOE
P17
W11
P16
W9
Bidirectional
(Optional: open-drain)
PA13
RXD2
Bidirectional
PA12
TXD2
Bidirectional
(Optional: open-drain)
PA11
Bidirectional
RXD4
(Optional: open-drain)
MII1-TXD0
RMII1-TXD0
PA10
W17
Bidirectional
MII1-TXER
TIN4
(Optional: open-drain)
CLK7
PA9
T15
Bidirectional
L1TXDA
RXD3
(Optional: open-drain)
PA8
W15
Bidirectional
L1RXDA
TXD3
(Optional: open-drain)
MPC885/MPC880 Hardware Specifications, Rev. 3
80
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
Pin Number
Type
Bidirectional
PA7
CLK1
L1RCLKA
BRGO1
TIN1
V14
PA6
CLK2
TOUT1
U13
Bidirectional
Bidirectional
PA5
W13
CLK3
L1TCLKA
BRGO2
TIN2
PA4
CTS4
MII1-TXD1
RMII1-TXD1
U4
W2
T4
Bidirectional
Bidirectional
Bidirectional
Bidirectional
Bidirectional
PA3
MII1-RXER
RMII1-RXER
BRGO3
PA2
MII1-RXDV
RMII1-CRS_DV
TXD4
PA1
U1
U3
V3
MII1-RXD0
RMII1-RXD0
BRGO4
PA0
MII1-RXD1
RMII1-RXD1
TOUT4
PB31
Bidirectional
SPISEL
(Optional: open-drain)
MII1 - TXCLK
RMII1-REFCLK
PB30
SPICLK
P18
T19
V19
Bidirectional
(Optional: open-drain)
PB29
SPIMOSI
Bidirectional
(Optional: open-drain)
PB28
Bidirectional
SPIMISO
BRGO4
(Optional: open-drain)
MPC885/MPC880 Hardware Specifications, Rev. 3
81
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
PB27
I2CSDA
BRGO1
Pin Number
Type
Bidirectional
U19
R17
V17
(Optional: open-drain)
PB26
I2CSCL
BRGO2
Bidirectional
(Optional: open-drain)
PB25
Bidirectional
(Optional: open-drain)
RXADDR31
TXADDR3
SMTXD1
PB24
U16
Bidirectional
(Optional: open-drain)
TXADDR31
RXADDR3
SMRXD1
PB23
W16
Bidirectional
(Optional: open-drain)
TXADDR21
RXADDR2
SDACK1
SMSYN1
PB22
V15
U14
Bidirectional
(Optional: open-drain)
TXADDR41
RXADDR4
SDACK2
SMSYN2
PB21
Bidirectional
SMTXD2
TXADDR1 1
BRG01
(Optional: open-drain)
RXADDR1
PHSEL[1]
PB20
T13
Bidirectional
SMRXD2
L1CLKOA
TXADDR01
RXADDR0
PHSEL[0]
(Optional: open-drain)
PB19
MII1-RXD3
RTS4
V13
T12
Bidirectional
(Optional: open-drain)
PB18
Bidirectional
(Optional: open-drain)
RXADDR41
TXADDR4
RTS2
L1ST2
MPC885/MPC880 Hardware Specifications, Rev. 3
82
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
PB17
Pin Number
Type
Bidirectional
W12
L1ST3
(Optional: open-drain)
BRGO2
RXADDR11
TXADDR1
PHREQ[1]
PB16
V11
Bidirectional
L1RQa
(Optional: open-drain)
L1ST4
RTS4
RXADDR01
TXADDR0
PHREQ[0]
PB15
U10
Bidirectional
TXCLAV
BRG03
RXCLAV
PB14
U18
R19
Bidirectional
Bidirectional
RXADDR21
TXADDR2
PC15
DREQ0
RTS3
L1ST1
TXCLAV
RXCLAV
PC14
R18
Bidirectional
DREQ1
RTS2
L1ST2
PC13
MII1-TXD3
SDACK1
V10
T18
Bidirectional
Bidirectional
PC12
MII1-TXD2
TOUT1
PC11
USBRXP
V16
U15
Bidirectional
Bidirectional
PC10
USBRXN
TGATE1
PC9
CTS2
T14
Bidirectional
Bidirectional
PC8
W14
CD2
TGATE2
MPC885/MPC880 Hardware Specifications, Rev. 3
83
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
Pin Number
Type
Bidirectional
PC7
V12
U11
T10
CTS4
L1TSYNCB
USBTXP
PC6
CD4
Bidirectional
Bidirectional
L1RSYNCB
USBTXN
PC5
CTS3
L1TSYNCA
SDACK2
PC4
CD3
L1RSYNCA
W10
U8
U7
U6
U5
R2
T2
Bidirectional
Bidirectional
Bidirectional
Bidirectional
Bidirectional
Bidirectional
Bidirectional
Bidirectional
Bidirectional
PD15
L1TSYNCA
UTPB0
PD14
L1RSYNCA
UTPB1
PD13
L1TSYNCB
UTPB2
PD12
L1RSYNCB
UTPB3
PD11
RXD3
RXENB
PD10
TXD3
TXENB
PD9
TXD4
UTPCLK
U2
R3
PD8
RXD4
MII-MDC
RMII-MDC
PD7
W3
Bidirectional
RTS3
UTPB4
MPC885/MPC880 Hardware Specifications, Rev. 3
84
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
Pin Number
Type
Bidirectional
PD6
W5
V6
RTS4
UTPB5
PD5
Bidirectional
CLK8
L1TCLKB
UTPB6
PD4
CLK4
UTPB7
W4
T9
Bidirectional
Bidirectional
PD3
CLK7
TIN4
SOC
PE31
U9
Bidirectional
CLK8
(Optional: open-drain)
L1TCLKB
MII1-RXCLK
PE30
W7
Bidirectional
L1RXDB
MII1-RXD2
(Optional: open-drain)
PE29
MII2-CRS
T8
V5
Bidirectional
(Optional: open-drain)
PE28
Bidirectional
TOUT3
MII2-COL
(Optional: open-drain)
PE27
V4
Bidirectional
RTS3
(Optional: open-drain)
L1RQB
MII2-RXER
RMII2-RXER
PE26
T1
T3
V8
Bidirectional
(Optional: open-drain)
L1CLKOB
MII2-RXDV
RMII2-CRS_DV
PE25
RXD4
MII2-RXD3
L1ST2
Bidirectional
(Optional: open-drain)
PE24
Bidirectional
SMRXD1
BRGO1
MII2-RXD2
(Optional: open-drain)
MPC885/MPC880 Hardware Specifications, Rev. 3
85
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
PE23
SMSYN2
TXD4
MII2-RXCLK
L1ST1
Pin Number
Type
Bidirectional
V2
V1
V9
(Optional: open-drain)
PE22
TOUT2
MII2-RXD1
RMII2-RXD1
SDACK1
Bidirectional
(Optional: open-drain)
PE21
Bidirectional
SMRXD2
TOUT1
(Optional: open-drain)
MII2-RXD0
RMII2-RXD0
RTS3
PE20
R4
Bidirectional
L1RSYNCA
SMTXD2
CTS3
(Optional: open-drain)
MII2-TXER
PE19
T6
Bidirectional
L1TXDB
(Optional: open-drain)
MII2-TXEN
RMII2-TXEN
PE18
R1
W8
Bidirectional
(Optional: open-drain)
L1TSYNCA
SMTXD1
MII2-TXD3
PE17
Bidirectional
TIN3
(Optional: open-drain)
CLK5
BRGO3
SMSYN1
MII2-TXD2
PE16
T7
Bidirectional
L1RCLKB
CLK6
(Optional: open-drain)
TXD3
MII2-TXCLK
RMII2-REFCLK
PE15
W6
Bidirectional
TGATE1
MII2-TXD1
RMII2-TXD1
MPC885/MPC880 Hardware Specifications, Rev. 3
86
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Pin Number
Name
PE14
Type
Bidirectional
V7
RXD3
MII2-TXD0
RMII2-TXD0
TMS
V18
T16
Input
Input
TDI
DSDI
TCK
U17
Input
DSCK
TRST
W18
T17
Input
TDO
Output
DSDO
MII1_CRS
MII_MDIO
T11
P19
T5
Input
Bidirectional
Output
MII1_TXEN
RMII1_TXEN
MII1_COL
VSSSYN1
VSSSYN
VDDLSYN
GND
U12
C2
E4
Input
PLL analog VDD and GND
Power
Power
B2
G6, G7, G8, G9, G10, G11, G12, G13, H7, H8, H9, H10, H11, H12, H13, Power
H14, J7, J8, J9, J10, J11, J12, J13, K7, K8, K9, K10, K11, K12, K13, L7,
L8, L9, L10, L11, L12, L13, M7, M8, M9, M10, M11, M12, M13, N7, N8,
N9, N10, N11, N12, N13, N14, P7, P13, R16
VDDL
E5, E6, E9, E11, E14, G15, H5, J5, J15, K15, L5, M15, N5, R6, R9, R10, Power
R12, R15
VDDH
E7, E8, E10, E12, E13, E15, F5, F6, F7, F8, F9, F10, F11, F12, F13,
F14, F15, G5, G14, H6, H15, J6, J14, K5, K6, K14, L6, L14, L15, M5,
M6, M14, N6, N15, P5, P6, P8, P9, P10, P11, P12, P14, P15, R5, R7,
R8, R11, R13, R14
Power
N/C
N17
No-connect
1 ESAR mode only.
MPC885/MPC880 Hardware Specifications, Rev. 3
87
Freescale Semiconductor
Mechanical Data and Ordering Information
16.2 Mechanical Dimensions of the PBGA Package
Figure 77 shows the mechanical dimensions of the PBGA package.
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M—1994.
3. MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A.
4. DATUM A, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
Figure 77. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package
MPC885/MPC880 Hardware Specifications, Rev. 3
88
Freescale Semiconductor
Document Revision History
17 Document Revision History
Table 40 lists significant changes between revisions of this hardware specification.
Table 40. Document Revision History
Revision
Number
Date
Changes
0
02/2003
04/2003
Initial revision.
0.1
Added pinout and pinout assignments table. Added the USB timing to Section 14. Added
the Reduced MII to Section 15. Removed the Data Parity. Made some changes to the
Features list.
0.2
05/2003
Made the changes to the RMII Timing, Made sure all the VDDL, VDDH, and GND show up
on the pinout diagram. Changed the SPI Master Timing Specs. 162 and 164.
0.3
0.4
0.5
0.6
0.7
0.8
05/2003
5/2003
5/2003
6/2003
7/2003
8/2003
Corrected the signals that had overlines on them.
Changed the pin descriptions for PD8 and PD9.
Changed some more typos, put in the phsel and phreq pins. Corrected the USB timing.
Changed the pin descriptions per the June 22 spec.
Added the RxClav and TxClav signals to PC15.
Added the Reference to USB 2.0 to the Features list and removed 1.1 from USB on the
block diagrams.
0.9
1.0
8/2003
9/2003
Changed the USB description to full-/low-speed compatible.
Added the DSP information in the Features list
Fixed table formatting.
Nontechnical edits.
Released to the external web.
2.0
3.0
12/2003
Changed the maximum operating frequency to 133 MHz.
Put in the orderable part numbers that are orderable.
Put the timing in the 80 MHz column.
Rounded the timings to hundredths in the 80 MHz column.
Put the pin numbers in footnotes by the maximum currents in Table 6.
Changed 22 and 41 in the Timing.
Put in the Thermal numbers.
7/22/2004
• Added sentence to Spec B1A about EXTCLK and CLKOUT being in Alignment for
Integer Values
• Added a footnote to Spec 41 specifying that EDM = 1
• Added RMII1_EN under M1II_EN in Table 36 Pin Assignments
• Added a tablefootnote to Table 6 DC Electrical Specifications about meeting the VIL
Max of the I2C Standard
• Put the new part numbers in the Ordering Information Section
MPC885/MPC880 Hardware Specifications, Rev. 3
89
Freescale Semiconductor
Document Revision History
THIS PAGE INTENTIONALLY LEFT BLANK
MPC885/MPC880 Hardware Specifications, Rev. 3
90
Freescale Semiconductor
Document Revision History
THIS PAGE INTENTIONALLY LEFT BLANK
MPC885/MPC880 Hardware Specifications, Rev. 3
Freescale Semiconductor
91
Information in this document is provided solely to enable system and software implementers to use
Freescale Semiconductor products. There are no express or implied copyright licenses granted
hereunder to design or fabricate any integrated circuits or integrated circuits based on the information
in this document.
How to Reach Us:
USA/Europe/Locations Not Listed:
Freescale Semiconductor
Literature Distribution Center
P.O. Box 5405,
Freescale Semiconductor reserves the right to make changes without further notice to any products
herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the
suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any
and all liability, including without limitation consequential or incidental damages. “Typical” parameters
which may be provided in Freescale Semiconductor data sheets and/or specifications can and do
vary in different applications and actual performance may vary over time. All operating parameters,
including “Typicals” must be validated for each customer application by customer’s technical experts.
Freescale Semiconductor does not convey any license under its patent rights nor the rights of others.
Freescale Semiconductor products are not designed, intended, or authorized for use as components
in systems intended for surgical implant into the body, or other applications intended to support or
sustain life, or for any other application in which the failure of the Freescale Semiconductor product
could create a situation where personal injury or death may occur. Should Buyer purchase or use
Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall
indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and
distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney
fees arising out of, directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was
negligent regarding the design or manufacture of the part.
Denver, Colorado 80217
1-480-768-2130
(800) 521-6274
Japan:
Freescale Semiconductor Japan Ltd.
Technical Information Center
3-20-1, Minami-Azabu, Minato-ku
Tokyo 106-8573, Japan
81-3-3440-3569
Asia/Pacific:
Freescale Semiconductor Hong Kong Ltd.
2 Dai King Street
Tai Po Industrial Estate
Tai Po, N.T. Hong Kong
852-26668334
Home Page:
www.freescale.com
Learn More: For more information about Freescale Semiconductor products, please visit
www.freescale.com
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. The described
product contains a PowerPC processor core. The PowerPC name is a trademark of IBM Corp. and
used under license. All other product or service names are the property of their respective owners.
© Freescale Semiconductor, Inc. 2004.
MPC885EC
Rev. 3
07/2004
相关型号：
©2020 ICPDF网 联系我们和版权申明