MPX2100DP [FREESCALE]
100kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors; 100kPa的片上温度补偿和校准硅压力传感器
| 型号： | MPX2100DP |
| 厂家： | 
Freescale |
| 描述： | 100kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors |
| 文件： | 总8页 (文件大小：302K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
M
O
T
O
R
O
L
A
Freescale Semiconductor, Inc.
Order this document
by MPX2100/D
SEMICONDUCTOR TECHNICAL DATA
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
1
O
C
S
0
n
o
0
-
k
P
a
M P X2 10 0
S E RI ES
C
p
o
h
i
p
T
e
d
s
m
p
e
&
r
a
t
C
u
r
e
m
c
e
n
s
a
P
t
e
a lib r at e d
e ns o r s
i
l
i
n
r
e
s
u
r
e
S
0 to 100 kPa (0 to 14.5 psi)
40 mV FULL SCALE SPAN
(TYPICAL)
The MPX2100 series device is a silicon piezoresistive pressure sensor providing a
highly accurate and linear voltage output — directly proportional to the applied pressure.
The sensor is a single, monolithic silicon diaphragm with the strain gauge and a thin–film
resistor network integrated on–chip. The chip is laser trimmed for precise span and offset
calibration and temperature compensation.
UNIBODY PACKAGE
Features
•
•
•
•
•
Temperature Compensated Over 0°C to +85°C
Easy–to–Use Chip Carrier Package Options
Available in Absolute, Differential and Gauge Configurations
Ratiometric to Supply Voltage
±0.25% Linearity (MPX2100D)
MPX2100A/D
CASE 344
Application Examples
•
•
•
•
•
•
•
Pump/Motor Controllers
Robotics
Level Indicators
Medical Diagnostics
Pressure Switching
Barometers
Altimeters
Figure 1 illustrates a block diagram of the internal circuitry on the stand–alone
pressure sensor chip.
MPX2100AP/GP
CASE 344B
V
S
3
T HIN FI L M
T EM PERATU R E
CO M PEN SATI O N
AN D
2
4
V
o
u
u
t
t
+
-
SE NSI NG
EL E ME NT
V
o
CA LI BRATI O N
CI RCU IT RY
MPX2100DP
CASE 344C
1
G
N
D
Figure 1. Temperature Compensated Pressure Sensor Schematic
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the sensor is directly proportional to the differential
pressure applied.
The absolute sensor has a built–in reference vacuum. The output voltage will decrease
as vacuum, relative to ambient, is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor increases with increasing
pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly,
output voltage increases as increasing vacuum is applied to the vacuum (P2) side
relative to the pressure (P1) side.
MPX2100ASX/GSX
CASE 344F
PIN NUMBER
1
2
Gnd
+V
3
4
V
S
–V
out
out
NOTE: Pin 1 is noted by the notch in
the lead.
REV 9
For More Information On This Product,
Motorola, Inc. 2002
Go to: www.freescale.com
Freescale Semiconductor, Inc.
MP X2 10 0 S E RIE S
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
MAXIMUM RATINGS(NOTE)
Rating
Symbol
Value
400
Unit
kPa
°C
Maximum Pressure (P1 > P2)
Storage Temperature
P
max
T
stg
–40 to +125
–40 to +125
Operating Temperature
T
A
°C
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS (V = 10 Vdc, T = 25°C unless otherwise noted, P1 > P2)
S
A
Characteristic
Symbol
Min
0
Typ
—
Max
100
16
Unit
kPa
Vdc
mAdc
mV
(1)
Pressure Range
P
OP
(2)
Supply Voltage
Supply Current
Full Scale Span
V
S
—
10
I
o
—
6.0
40
—
(3)
MPX2100A, MPX2100D
V
FSS
38.5
41.5
(4)
Offset
MPX2100D
MPX2100A Series
V
off
–1.0
–2.0
—
—
1.0
2.0
mV
Sensitivity
∆V/∆P
—
0.4
—
mV/kPa
(5)
Linearity
MPX2100D Series
MPX2100A Series
—
—
–0.25
–1.0
—
—
0.25
1.0
%V
FSS
(5)
Pressure Hysteresis (0 to 100 kPa)
—
—
—
—
±0.1
±0.5
—
—
—
%V
%V
%V
FSS
FSS
FSS
(5)
Temperature Hysteresis (–40°C to +125°C)
(5)
Temperature Effect on Full Scale Span
TCV
–1.0
–1.0
1000
1400
—
1.0
1.0
2500
3000
—
FSS
(5)
Temperature Effect on Offset
TCV
—
mV
off
Input Impedance
Z
in
—
Ω
Ω
Output Impedance
Z
out
—
(6)
Response Time (10% to 90%)
t
R
1.0
20
ms
ms
Warm–Up
—
—
—
—
(7)
Offset Stability
—
±0.5
—
%V
FSS
NOTES:
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self–heating.
3. Full Scale Span (V
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
FSS
minimum rated pressure.
4. Offset (V ) is defined as the output voltage at the minimum rated pressure.
off
5. Accuracy (error budget) consists of the following:
•
•
Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
•
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
•
•
TcSpan:
TcOffset:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
2
Motorola Sensor Device Data
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
M
P
X
2
1
0
0
S
E
R
I
E
S
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
LINEARITY
Linearity refers to how well a transducer’s output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
L EA S T S Q UA RE S FI T
E X AG G E RATE D
P E RFO RMA NC E
CU RV E
STR AI G HT L IN E
D EVI ATIO N
L EA S T
S Q UA RE
DE V I ATI O N
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola’s
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
E ND P O IN T
S TRA I G HT L IN E FI T
O FFS E T
5 0
P RE S SU RE (% FUL L SC AL E )
1 00
0
Figure 2. Linearity Specification Comparison
ON–CHIP TEMPERATURE COMPENSATION and CALIBRATION
Figure 3 shows the output characteristics of the MPX2100
series at 25°C. The output is directly proportional to the
differential pressure and is essentially a straight line.
The effects of temperature on Full Scale Span and Offset
are very small and are shown under Operating Characteris-
tics.
40
V
T
=
1 0 V dc
= °C 25
P 2
S
35
30
25
20
A
P 1
>
T
Y
P
S PA N
RA NG E
(T YP )
MA X
15
10
5
MI N
0
O FFS E T
-
ā
0
2
5
5 0
7 .2 5
7
5
1
0
0
kP a
P SI
(
T
Y
P
)
3
.
6
2
1
0
.
8
7
1
4
.
5
Figure 3. Output versus Pressure Differential
SIL IC O N E G EL DI FF ER EN TI AL /G AU G E
D IE CO AT DI E
S I LI CO NE G E L
DI E CO AT
A B SO L UTE
DI E
S TA INL E SS S TE EL
M ETA L CO V E R
S TA I NL E SS STE EL
ME TAL C O VER
P
1
P
1
EP O XY
C ASE
E P OX Y
CA S E
W
I
R
E
B
O
N
D
W IR E B O ND
L EA D FRA ME
DI E
B O ND
L
E
A
D
F
R
A
M
E
D IE
BO N D
DI FF ER EN TI AL /G AU G E E LEM E NT
P 2
A B SO L UTE E LE M EN T
P 2
Figure 4. Cross–Sectional Diagrams (Not to Scale)
Figure 4 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX2100 series pressure sensor operating charac-
teristics and internal reliability and qualification tests are
based on use of dry air as the pressure media. Media other
than dry air may have adverse effects on sensor perfor-
mance and long term reliability. Contact the factory for in-
formation regarding media compatibility in your application.
Motorola Sensor Device Data
3
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
MP X2 10 0 S E RIE S
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicone gel
which isolates the die. The differential or gauge sensor is
designed to operate with positive differential pressure
applied, P1 > P2. The absolute sensor is designed for
vacuum applied to P1 side.
The Pressure (P1) side may be identified by using the
table below:
Part Number
Case Type
344
Pressure (P1) Side Identifier
Stainless Steel Cap
MPX2100A
MPX2100D
MPX2100DP
MPX2100AP
MPX2100ASX
344C
Side with Part Marking
Side with Port Attached
Side with Port Attached
MPX2100GP
344B
MPX2100GSX
344F
ORDERING INFORMATION
MPX2100 series pressure sensors are available in absolute, differential and gauge configurations. Devices are available in
the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose
pressure connections.
MPX Series
Order Number
Device Marking
Device Type
Options
Case Type
Basic Element
Absolute, Differential
344
MPX2100A
MPX2100D
MPX2100A
MPX2100D
Ported Elements
Differential, Dual Port
Absolute, Gauge
344C
344B
MPX2100DP
MPX2100DP
MPX2100AP
MPX2100GP
MPX2100AP
MPX2100GP
Absolute, Gauge Axial
344F
MPX2100ASX
MPX2100GSX
MPX2100A
MPX2100D
4
Motorola Sensor Device Data
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
M P X2 1 0 0 SE R I ES
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
PACKAGE DIMENSIONS
N O TE S :
C
1. D I MEN S I ON I N G A ND TO LE R AN C IN G PE R AS ME
Y 14. 5M, 199 4.
2. C O N TR O LL IN G D I MEN S I ON : I N C H .
R
3. D I MEN S I ON -A - I S I N CL U SI V E O F TH E
S TO P R I NG . MO LD S TO P RI N G N O T TO EX C EED
16. 00 (0 .63 0).
M
O
L
D
M
Z
1
4
2
3
INCHES
DIM MIN MAX
MILLIMETERS
B
–A–
MIN
15. 11
13. 06
5. 08
MAX
1 6. 00
1 3. 56
5 .5 9
A
B
C
D
F
0. 595
0. 514
0. 200
0. 016
0. 048
0. 630
0. 534
0. 220
0. 020
0. 064
N
L
1
2
3
4
PIN 1
0. 41
1. 22
0 .5 1
1 .6 3
–T–
SEATING
PLANE
G
J
0. 100 ꢀB SC
2. 54ꢀ B SC
F
0. 014
0. 695
0. 016
0. 725
0. 36
17. 65
0 .4 0
1 8. 42
G
J
L
F
Y
M
N
R
Y
Z
30ꢀ ꢀ ꢀꢀ N O M
3
0
ꢀ
ꢀ
ꢀ
ꢀ
N
O
M
_
_
D 4 PL
0
.
4
7
5
0. 495
0. 450
0. 052
0. 118
1
2
.
0
7
1 2. 57
11 .4 3
1 .3 2
0. 430
0. 048
0. 106
10. 92
1. 22
2. 68
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. “F” 8 PL
M
M
T A
0
.
1
3
6
ꢀ
(
0
.
0
0
5
)
3
.
0
0
S
T
Y
L
E
1
:
S TY LE 2:
P IN 1. V
S
T
Y
L
E
3
:
PIN 1. G R OU N D
2. + O U TPU T
3. + SU PPL Y
4. - O U TPU T
P IN 1. G N D
2. -V O U T
3. V S
C C
2. - S UP P LY
3. + S U PP LY
4. G R O U N D
4
.
+
V
O
U
T
CASE 344–15
ISSUE Z
N
O
T
E
S
:
–A–
SEATING
PLANE
1. D I MEN S I ON I N G A ND TO LE R AN C IN G PE R AN S I
Y 14. 5, 198 2.
2. C O N TR O LL IN G D I MEN S I ON : I N C H .
–T–
U
L
R
INCHES
DIM MIN MAX
MILLIMETERS
H
MIN
29. 08
17. 40
7. 75
MAX
2 9. 85
1 8. 16
8 .2 6
A
B
C
D
F
1. 145
0. 685
0. 305
0. 016
0. 048
1. 175
0. 715
0. 325
0. 020
0. 064
N
B
PORT #1
POSITIVE
PRESSURE
(P1)
–Q–
0. 41
1. 22
0 .5 1
1 .6 3
G
H
J
0
.
1
0
0
ꢀ
B
S
C
2
.
5
4
ꢀ
B
S
C
0. 182
0. 014
0. 695
0. 290
0. 420
0. 153
0. 153
0. 230
0. 220
0. 194
0. 016
0. 725
0. 300
0. 440
0. 159
0. 159
0. 250
0. 240
4. 62
0. 36
17. 65
7. 37
10. 67
3. 89
3. 89
5. 84
5. 59
4 .9 3
0 .4 1
1 8. 42
7 .6 2
11 .1 8
4 .0 4
4 .0 4
6 .3 5
6 .1 0
K
L
1
2
3 4
PIN 1
N
P
Q
R
S
U
K
–P–
S
M
S
0
.
2
5
ꢀ
(
0
.
0
1
0
)
T
Q
J
F
0. 910 ꢀB SC
23. 11ꢀ BS C
G
C
D 4 PL
M
S
S
Q
0 .1 3 ꢀ (0 . 00 5 )
T S
S TY LE 1:
P IN 1. G R O U N D
2. + O U TP U T
3. + S U PP LY
4. - O U TP U T
CASE 344B–01
ISSUE B
Motorola Sensor Device Data
5
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
MP X2 10 0 S E RIE S
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
PACKAGE DIMENSIONS — CONTINUED
N O TE S :
–A–
1. D I MEN S I ON I N G A ND TO LE R AN C I N G PE R AN S I
Y 14. 5M, 198 2.
2. C O N TR O LL IN G D I MEN S I ON : I N CH .
V
U
PORT #1
W
L
R
H
INCHES
DIM MIN MAX
MILLIMETERS
PORT #2
MIN
29. 08
17. 40
10. 29
0. 41
MAX
29. 85
18. 16
11. 05
0. 51
PORT #1
POSITIVE PRESSURE
(P1)
PORT #2
VACUUM
(P2)
A
B
C
D
F
1. 145
0. 685
0. 405
0. 016
0. 048
1. 175
0. 715
0. 435
0. 020
0. 064
N
–Q–
1. 22
1. 63
G
H
J
0. 100 ꢀB SC
2
.
5
4
ꢀ
B
S
C
SEATING
PLANE
SEATING
PLANE
B
0. 182
0. 014
0. 695
0. 290
0. 420
0. 153
0. 153
0. 063
0. 220
0. 194
0. 016
0. 725
0. 300
0. 440
0. 159
0. 159
0. 083
0. 240
4. 62
0. 36
17. 65
7. 37
10. 67
3. 89
3. 89
1. 60
5. 59
4. 93
0. 41
18. 42
7. 62
11. 18
4. 04
4. 04
2. 11
1
2
3
4
K
L
PIN 1
K
–P–
N
P
Q
R
S
U
V
W
M
S
0
.
2
5
ꢀ
(
0
.
0
1
0
)
T
Q
–T–
J
–T–
S
F
6
.
1
0
G
C
0
.
9
1
0
ꢀ
B
S
C
2
3
.
1
1
ꢀ
B
S
C
D 4 PL
0. 248
0. 310
0. 278
0. 330
6. 30
7. 87
7. 06
8. 38
M
S
S
0
.
1
3
ꢀ
(
0
.
0
0
5
)
T
S
Q
S
T
Y
L
E
1
:
P IN 1. G R O U N D
2. + O U TP U T
3. + S UP P LY
4. - O U TP U T
CASE 344C–01
ISSUE B
N
O
T
E
S
:
–T–
1. D I MEN S IO N I N G A ND TO LE R AN C IN G PE R
A NS I Y 14. 5M, 198 2.
2. C O N TR O LL IN G D I MEN S I ON : I N C H .
C
A
U
–Q–
E
INCHES
DIM MIN MAX
MILLIMETERS
MIN
27. 43
18. 80
16. 00
0. 41
MAX
28 .4 5
19 .3 0
16 .5 1
0 .5 1
A
B
C
D
E
F
1. 080
0. 740
0. 630
0. 016
0. 160
0. 048
1. 120
0. 760
0. 650
0. 020
0. 180
0. 064
N
B
4. 06
1. 22
4 .5 7
1 .6 3
V
G
J
0
.
1
0
0
ꢀ
B
S
C
2
.
5
4
ꢀ
B
S
C
R
0. 014
0. 220
0. 070
0. 150
0. 150
0. 440
0. 695
0. 840
0. 182
0. 016
0. 240
0. 080
0. 160
0. 160
0. 460
0. 725
0. 860
0. 194
0. 36
5. 59
0 .4 1
6 .1 0
K
N
P
Q
R
S
U
V
PORT #1
PIN 1
1. 78
3. 81
2 .0 3
4 .0 6
POSITIVE
PRESSURE
(P1)
–P–
M
M
0
.
2
5
ꢀ
(
0
.
0
1
0
)
T
Q
4
3
2
1
3
.
8
1
4
.
0
6
S
11. 18
17. 65
21. 34
4. 62
11 .6 8
18 .4 2
21 .8 4
4 .9 2
K
F
J
G
S TY LE 1:
P IN 1. G R O U N D
D 4 PL
0. 13 ꢀ( 0 . 00 5 )
2. V (+ ) O U T
3. V S UP P LY
4. V (- ) O U T
M
S
S
Q
T
P
CASE 344F–01
ISSUE B
6
Motorola Sensor Device Data
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
M P X2 1 0 0 SE R I ES
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
NOTES
Motorola Sensor Device Data
7
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
MP X2 10 0 S E RIE S
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different
applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by
customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed,
intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life,
or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase
or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent
regarding the design or manufacture of the part. Motorola and the Stylized M Logo are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
MOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective
owners.
E Motorola, Inc. 2002.
How to reach us:
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1–303–675–2140 or 1–800–441–2447
JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3–20–1, Minami–Azabu. Minato–ku, Tokyo 106–8573 Japan. 81–3–3440–3569
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852–26668334
Technical Information Center: 1–800–521–6274
HOME PAGE: http://www.motorola.com/semiconductors/
For More Information On This Product,
◊
MPX2100/D
Go to: www.freescale.com
相关型号：
MPX2100GVP
100 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors
FREESCALE
MPX2100_08
100 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors
FREESCALE
©2020 ICPDF网 联系我们和版权申明