MPX2200GP [FREESCALE]
200kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors; 200kPa片上温度补偿和校准硅压力传感器
| 型号： | MPX2200GP |
| 厂家： | 
Freescale |
| 描述： | 200kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors |
| 文件： | 总8页 (文件大小：208K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MPX2200
Rev 11, 12/2006
Freescale Semiconductor
Technical Data
200 kPa On-Chip Temperature
Compensated & Calibrated
Pressure Sensors
MPX2200
SERIES
The MPX2200 series device is a silicon piezoresistive pressure sensor
providing a highly accurate and linear voltage output - directly proportional to the
applied pressure. The sensor is a single monolithic silicon diaphragm with the
strain gauge and a thin-film resistor network integrated on-chip. The chip is laser
trimmed for precise span and offset calibration and temperature compensation.
They are designed for use in applications such as pump/motor controllers,
robotics, level indicators, medical diagnostics, pressure switching, barometers,
altimeters, etc.
0 TO 200 kPA (0 TO 29 psi)
40 mV FULL SCALE SPAN
(TYPICAL)
UNIBODY PACKAGES
Features
•
•
•
•
Temperature Compensated Over 0°C to +85°C
±0.25% Linearity (MPX2200D)
MPX2200A/D
CASE 344-15
Easy-to-Use Chip Carrier Package Options
Available in Absolute, Differential and Gauge Configurations
Typical Applications
•
•
•
•
•
•
•
Pump/Motor Controllers
Robotics
MPX2200AP/GP
CASE 344B-01
Level Indicators
Medical Diagnostics
Pressure Switching
Barometers
Altimeters
ORDERING INFORMATION(1)
Device
Type
MPX Series
Order Number
Device
Marking
MPX2200DP
CASE 344C-01
Options
Case No.
Basic
Element
Absolute, Differential
344
MPX2200A
MPX2200D
MPX2200A
MPX2200D
Ported
Differential
344C MPX2200DP
MPX2200DP
Elements
Absolute, Gauge
344B MPX2200AP
MPX2200GP
MPX2200AP
MPX2200GP
Gauge, Vacuum
344D MPX2200GVP
MPX2200GVP
MPX2200GVP
CASE 344D-01
1. MPX2200 series pressure sensors are available in absolute, differential and gauge
configurations. Devicesare available in the basic element package or with pressure
port fittings which provide printed circuit board mounting ease and barbed hose
pressure connections.
PIN NUMBER
3
4
1
2
GND1
VS
+VOUT
-VOUT
1. Pin 1 in noted by the notch in the lead.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
VS
3
Thin Film
2
4
Temperature
+VOUT
-VOUT
Sensing
Element
Compensation
and
Calibration
Circuitry
1
GND
Figure 1. Temperature Compensation Pressure Sensor Schematic
VOLTAGE OUTPUT VS. APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the sensor is directly
(P1) side relative to the vacuum (P2) side. Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum (P2) side relative to the pressure (P1) side.
Figure 1 illustrates a block diagram of the internal circuitry
on the stand-alone pressure sensor chip.
proportional to the differential pressure applied.
The absolute sensor has a built-in reference vacuum. The
output voltage will decrease as vacuum, relative to ambient,
is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
Table 1. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
PMAX
800
kPa
Storage Temperature
Operating Temperature
TSTG
TA
-40 to +125
-40 to +125
°C
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX2200
Sensors
Freescale Semiconductor
2
Table 2. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Differential Pressure Range(1)
Symbol
Min
Typ
Max
Units
POP
0
—
200
kPa
Supply Voltage(2)
Supply Current
VS
IO
—
—
10
6.0
40
16
—
VDC
mAdc
mV
Full Scale Span(3)
VFSS
VOFF
38.5
-1.0
—
41.5
1.0
—
Offset(4)
—
mV
Sensitivity
∆V/∆Ρ
0.2
mV/kPa
%VFSSl
Linearity(5)
MPX2200D Series
MPX2200A Series
—
-0.25
-1.0
—
—
0.25
1.0
Pressure Hysteresis(5)(0 to 200 kPa)
—
—
—
—
±0.1
±0.5
—
—
—
%VFSS
%VFSS
%VFSS
mV
Temperature Hysteresis(5)(- 40°C to +125°C)
Temperature Coefficient of Full Scale Span(5)
TCVFSS
TCVOFF
ZIN
-1.0
-1.0
1300
1400
—
1.0
Temperature Coefficient of Offset(5)
Input Impedance
—
1.0
—
2500
3000
—
W
Output Impedance
ZOUT
tR
—
W
Response Time(6) (10% to 90%)
Warm-Up Time
1.0
ms
—
—
—
—
20
—
—
ms
Offset Stability(7)
±0.5
%VFSS
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum related pressure.
4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
• Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure with the specified range, when this pressure is cycled to and from the minimum
or maximum rated pressure at 25°C.
• TcSpan:
• TcOffset:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected
to a specified step change in pressure.
7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX2200
Sensors
Freescale Semiconductor
3
LINEARITY
“best case” linearity error (lower numerical value), the
calculations required are burdensome.
Linearity refers to how well a transducer's output follows
the equation: VOUT = VOFF + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives the
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
Least Squares Fit
Exaggerated
Performance
Curve
Straight Line
Deviation
Least
Square
Deviation
End Point Straight
Line Fit
Offset
50
100
0
Pressure (% Fullscale)
Figure 2. Linearity Specification Comparison
ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION
Figure 3 shows the output characteristics of the MPX2102/
The effects of temperature on Full Scale Span and Offset
are very small and are shown under Operating
Characteristics.
MPXV2102G series at 25°C. The output is directly
proportional to the differential pressure and is essentially a
straight line.
40
35
30
25
20
15
10
5
VS = 10 VDCTA
= 25°C
P1 > P2
TYP
Span
Range
(TYP)
MAX
MIN
0
-5
Offset
(TYP)
kPa
PSI
0
25
50
7.25
75
100 125
14.5
Pressure
150
21.75
175 200
29
Figure 3. Output vs. Pressure Differential
MPX2200
Sensors
4
Freescale Semiconductor
Absolute
Die
Differential/Gauge
Die
Stainless Steel
Metal Cover
Silicone Gel
Die Coat
Silicone Gel
Die Coat
Stainless Steel
Metal Cover
P1
P1
Epoxy
Case
Epoxy
Case
Wire Bond
Wire Bond
Lead Frame
Bond
Die
Lead Frame
Differential/Gauge Element
P2
Die
Bond
Absolute Element
P2
Figure 4. Cross Sectional Diagrams (Not to Scale)
Figure 4 illustrates an absolute sensing die (right) and the
differential or gauge die in the basic chip carrier (Case 344).
A silicone gel isolates the die surface and wire bonds from the
environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm.
The MPX2200 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicone gel
which isolates the die from the environment. The differential
or gauge sensor is designed to operate with positive
differential pressure applied, P1 > P2. The absolute sensor is
designed for vacuum applied to P1 side.
Table 3. Pressure (P1) Side Delineation
Part Number
MPX2200A/D
MPX2200DP
Case Type Pressure (P1) Side Identifier
344
Stainless Steep Cap
Side with Part Marking
Side with Port Attached
Stainless Steep Cap
344C
344B
344D
MPX2200AP/GP
MPX2200GVP
The Pressure (P1) side may be identified by using
Figure 3.
MPX2200
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
C
R
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
M
Z
1
4
2
3
INCHES
MILLIMETERS
B
-A-
DIM MIN MAX MIN
MAX
16.00
13.56
5.59
A
B
C
D
F
0.595
0.630 15.11
0.534 13.06
N
0.514
0.200
0.016
0.048
L
1
2
3
4
0.220
0.020
0.064
5.08
0.41
1.22
PIN 1
0.51
1.63
-T-
SEATING
PLANE
G
J
L
0.100 BSC
2.54 BSC
F
0.014
0.695
0.016 0.36
0.725 17.65
0.40
18.42
G
J
F
Y
M
N
R
Y
Z
30˚ NOM
30˚ NOM
D 4 PL
0.475
0.430
0.048
0.106
0.495 12.07
0.450 10.92
12.57
11.43
1.32
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
M
M
0.136 (0.005)
T A
0.052
0.118
1.22
2.68
3.00
STYLE 1:
PIN 1. GROUND
STYLE 2:
PIN 1.
STYLE 3:
VCC
PIN 1. GND
2. -VOUT
3. VS
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
2. - SUPPLY
3. + SUPPLY
4. GROUND
4. +VOUT
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
NOTES:
SEATING
PLANE
-A-
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-T-
U
L
R
INCHES
DIM MIN MAX
MILLIMETERS
H
MIN
29.08
17.40
7.75
MAX
29.85
18.16
8.26
A
B
C
D
F
1.145
0.685
0.305
0.016
0.048
1.175
0.715
0.325
0.020
0.064
N
B
PORT #1
-Q-
POSITIVE
0.41
1.22
0.51
1.63
PRESSURE
(P1)
G
H
J
K
L
N
P
Q
R
S
U
0.100 BSC
2.54 BSC
0.182
0.014
0.695
0.290
0.420
0.153
0.153
0.230
0.220
0.194
0.016
0.725
0.300
0.440
0.159
0.159
0.250
0.240
4.62
0.36
17.65
7.37
10.67
3.89
3.89
5.84
5.59
4.93
0.41
18.42
7.62
11.18
4.04
4.04
6.35
6.10
1
2 3 4
PIN 1
K
-P-
S
M
S
0.25 (0.010)
T Q
J
F
0.910 BSC
23.11 BSC
G
C
D 4 PL
M
S
S
0.13 (0.005)
T S
Q
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX2200
Sensors
Freescale Semiconductor
6
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
-A-
U
V
PORT #1
2. CONTROLLING DIMENSION: INCH.
W
L
R
H
INCHES
DIM MIN MAX
MILLIMETERS
PORT #2
MIN MAX
29.08 29.85
17.40 18.16
10.29 11.05
PORT #1
PORT #2
VACUUM
(P2)
POSITIVE PRESSURE
(P1)
A
B
C
D
F
1.145
0.685
0.405
0.016
0.048
1.175
0.715
0.435
0.020
0.064
N
-Q-
0.41
1.22
0.51
1.63
G
H
J
K
L
N
P
Q
R
S
U
V
W
0.100 BSC
2.54 BSC
SEATING
PLANE
SEATING
PLANE
B
0.182
0.014
0.695
0.290
0.420
0.153
0.153
0.063
0.220
0.194
0.016
0.725
0.300
0.440
0.159
0.159
0.083
0.240
4.62
0.36
4.93
0.41
1
2 3 4
17.65 18.42
7.37 7.62
10.67 11.18
PIN 1
K
-P-
M
S
0.25 (0.010)
T Q
3.89
3.89
1.60
5.59
4.04
4.04
2.11
6.10
-T-
-T-
S
F
J
G
C
0.910 BSC
23.11 BSC
D 4 PL
0.248
0.310
0.278
0.330
6.30
7.87
7.06
8.38
M
S
S
0.13 (0.005)
T S
Q
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
-A-
U
SEATING
PLANE
INCHES
MILLIMETERS
-T-
L
DIM MIN MAX MIN
MAX
29.85
18.16
8.26
PORT #2
VACUUM
(P2)
A
B
C
D
F
1.145
1.175 29.08
0.715 17.40
H
R
POSITIVE
PRESSURE
(P1)
0.685
0.305
0.016
0.048
0.325
0.020
0.064
7.75
0.41
1.22
0.51
1.63
N
-Q-
G
H
J
K
L
N
P
Q
R
S
U
0.100 BSC
2.54 BSC
0.182
0.014
0.695
0.290
0.420
0.153
0.153
0.230
0.220
0.194
0.016
4.62
0.36
4.93
0.41
18.42
7.62
11.18
4.04
4.04
6.35
6.10
0.725 17.65
0.300 7.37
0.440 10.67
B
0.159
0.158
0.250
0.240
3.89
3.89
5.84
5.59
1
2 3 4
K
PIN 1
S
0.910 BSC
23.11 BSC
C
F
-P-
G
D
J
M
S
0.25 (0.010)
T Q
4 PL
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
M
S
S
Q
0.13 (0.005)
T S
CASE 344D-01
ISSUE B
UNIBODY PACKAGE
MPX2200
Sensors
Freescale Semiconductor
7
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MPX2200
Rev. 11
12/2006
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