MPX2202 [FREESCALE]
200kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors; 200kPa片上温度补偿和校准硅压力传感器
| 型号： | MPX2202 |
| 厂家： | 
Freescale |
| 描述： | 200kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors |
| 文件： | 总10页 (文件大小：339K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MPX2202
Rev 4, 08/2006
Freescale Semiconductor
Technical Data
200 kPa On-Chip Temperature
Compensated & Calibrated
Pressure Sensors
MPX2202
SERIES
The MPX2202/MPXV2202G device series is a silicon piezoresistive pressure
sensor providing a highly accurate and linear voltage output - directly
proportional to the applied pressure. The sensor is a single monolithic silicon
diaphragm with the strain gauge and a thin-film resistor network integrated on-
chip. The chip is laser trimmed for precise span and offset calibration and
temperature compensation. They are designed for use in applications such as
pump/motor controllers, robotics, level indicators, medical diagnostics, pressure
switching, barometers, altimeters, etc.
0 TO 200 kPA (0 TO 29 psi)
40 mV FULL SCALE SPAN
(TYPICAL)
SMALL OUTLINE PACKAGE
SURFACE MOUNT
Features
•
•
•
Temperature Compensated Over 0°C to +85°C
Easy-to-Use Chip Carrier Package Options
Available in Absolute, Differential and Gauge Configurations
Typical Applications
•
•
•
•
•
•
•
Pump/Motor Controllers
Robotics
Level Indicators
Medical Diagnostics
Pressure Switching
Barometers
MPXV2202GP
CASE 1369-01
MPXV2202DP
CASE 1351-01
Altimeters
SMALL OUTLINE PACKAGE
PIN NUMBERS
ORDERING INFORMATION
1
2
3
4
GND(1)
+VOUT
VS
5
6
7
8
N/C
N/C
N/C
N/C
Device
Type
MPX Series Packing
Order No. Options
Device
Marking
Options
Case No.
SMALL OUTLINE PACKAGE (MPX2202G SERIES)
Ported
Elements SMT
Differential, Dual Port,
SMT
UNIBODY PACKAGE (MPX2202 SERIES)
Gauge, Side Port,
1369
MPXV2202GP Trays MPXV2202GP
VS
1351
MPXV2202DP Trays MPXV2202DP
1. Pin 1 is noted by the notch in the lead.
Basic
Element
Absolute, Differential
Differential, Dual Port
Absolute, Gauge
344
MPX2202A
MPX2202D
—
—
—
—
MPX2202A
MPX2202D
UNIBODY PACKAGE PIN NUMBERS
1
2
GND(1)
3
4
VS
VS
Ported
Elements
344C
344B
344F
MPX2202DP
MPX2202DP
+VOUT
MPX2202AP
MPX2202GP
MPX2202AP
MPX2202GP
1. Pin 1 is noted by the notch in the lead.
Absolute, Gauge Axial
MPX2202ASX
MPX2202A
UNIBODY PACKAGES
MPX2202A/D
CASE 344-15
MPX2202AP/GP
CASE 344B-01
MPX2202DP
CASE 344C-01
MPX2202ASX
CASE 344F-01
© Freescale Semiconductor, Inc., 2006. All rights reserved.
Figure 1 illustrates a block diagram of the internal circuitry
on the stand-alone pressure sensor chip.
VS
3
Thin Film
Temperature
Compensation
And
Calibration
2
4
Vout+
Vout-
Sensing
Element
Circuitry
1
GND
Figure 1. Temperature Compensated Pressure Sensor Schematic
VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the sensor is directly
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
(P1) side relative to the vacuum (P2) side. Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum (P2) side relative to the pressure (P1) side.
proportional to the differential pressure applied.
The absolute sensor has a built-in reference vacuum. The
output voltage will decrease as vacuum, relative to ambient,
is drawn on the pressure (P1) side.
Table 1. Maximum Ratings(1)
Rating
Symbol
Pmax
Tstg
Value
800
Unit
kPa
°C
Maximum Pressure (P1 > P2)
Storage Temperature
Operating Temperature
-40 to +125
-40 to +125
TA
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX2202
Sensors
Freescale Semiconductor
2
Table 2. Operating Characteristics
(VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristics
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
0
-
200
kPa
Supply Voltage(2)
Supply Current
VS
—
10
16
Vdc
Io
—
6.0
40
-
mAdc
mV
Full Scale Span(3)
VFSS
38.5
41.5
Offset(4)
Voff
-1.0
—
—
1.0
—
mV
Sensitivity
∆V/∆P
0.2
mV/kPa
%VFSS
Linearity(5)
MPX2202D Series
MPX2202A Series
—
-0.6
-1.0
—
—
0.4
1.0
Pressure Hysteresis(5) (0 to 200 kPa)
—
—
—
—
± 0.1
± 0.5
—
-
%VFSS
%VFSS
%VFSS
mV
Temperature Hysteresis(5) (-40°C to +125°C)
Temperature Effect on Full Scale Span(5)
-
TCVFSS
TCVoff
-2.0
-1.0
2.0
1.0
Temperature Effect on Offset(5)
Input Impedance
—
Zin
Zout
tR
1000
1400
—
—
—
2500
3000
—
W
W
Output Impedance
Response Time(6) (10% to 90%)
Warm-Up
1.0
ms
—
—
—
—
20
—
—
ms
Offset Stability(7)
±0.5
%VFSS
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
• Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum
or maximum rated pressure, at 25°C.
• TcSpan:
• TcOffset:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX2202
Sensors
Freescale Semiconductor
3
LINEARITY
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale's specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives the
“best case” linearity error (lower numerical value), the
calculations required are burdensome.
Least
Square
Deviation
Least Squares Fit
Exaggerated
Performance
Curve
Straight Line
Deviation
End Point Straight
Line Fit
Offset
50
100
0
Pressure (% Fullscale)
Figure 2. Linearity Specification Comparison
ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION
Figure 3 shows the output characteristics of the MPX2202/
The effects of temperature on Full Scale Span and Offset
are very small and are shown under Operating
Characteristics.
MPXV2202G series at 25°C. The output is directly
proportional to the differential pressure and is essentially a
straight line.
40
35
30
25
20
15
10
5
VS = 10 Vdc
TA = 25°C
P1 > P2
TYP
Span
Range
(TYP)
MAX
MIN
0
-5
Offset
(TYP)
25
kPa
PSI
0
50
7.25
100
14.5
150
21.75
200
29
75
175
125
Pressure
Figure 3. Output versus Pressure Differential
MPX2202
Sensors
4
Freescale Semiconductor
Absolute
Die
Differential/gauge
Die
Stainless Steel
Metal Cover
Silicone Gel
Die Coat
Silicone Gel
Die Coat
Stainless Steel
Metal Cover
P1
P1
Epoxy
Case
Epoxy
Case
Wire Bond
Wire Bond
Lead Frame
Bond
DIE
Lead Frame
Die
Bond
Absolute Element
P2
Differential/Gauge Element
P2
Figure 4. Cross-Sectional Diagrams (Not to Scale)
Figure 4 illustrates an absolute sensing die (right) and the
differential or gauge die in the basic chip carrier (Case 344).
A silicone gel isolates the die surface and wire bonds from the
environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm.
qualification tests are based on use of dry air as the pressure
media. Media other than dry air may have adverse effects on
sensor performance and long term reliability. Contact the
factory for information regarding media compatibility in your
application.
The MPX2202/MPXV2202G series pressure sensor
operating characteristics and internal reliability and
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicone gel
which isolates the die from the environment. The differential
or gauge sensor is designed to operate with positive
differential pressure applied, P1 > P2. The absolute sensor is
designed for vacuum applied to P1 side.
Table 3. Pressure (P1)/Vacuum (P2) Side Identification
Table
Pressure (P1) Side
Part Number
MPX2202A/D
Case Type
Identifier
344
Stainless Steel Cap
The Pressure (P1) side may be identified by using the
table below:
MPX2202DP
344C
344B
344F
1369
1351
Side with Part Marking
Side with Port Attached
Side with Port Attached
Side with Port Attached
Side with Part Marking
MPX2202AP/GP
MPX2202ASX
MPXV2202GP
MPXV2202DP
MPX2202
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX2202
Sensors
6
Freescale Semiconductor
PACKAGE DIMENSIONS
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX2202
Sensors
Freescale Semiconductor
7
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
C
R
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
M
Z
1
4
2
3
INCHES
MILLIMETERS
B
-A-
DIM MIN MAX MIN
MAX
16.00
13.56
5.59
A
B
C
D
F
0.595
0.630 15.11
0.534 13.06
N
0.514
0.200
0.016
0.048
L
1
2
3
4
0.220
0.020
0.064
5.08
0.41
1.22
PIN 1
0.51
1.63
-T-
SEATING
PLANE
G
J
L
0.100 BSC
2.54 BSC
F
0.014
0.695
0.016 0.36
0.725 17.65
0.40
18.42
G
J
F
Y
M
N
R
Y
Z
30˚ NOM
30˚ NOM
D 4 PL
0.475
0.430
0.048
0.106
0.495 12.07
0.450 10.92
12.57
11.43
1.32
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
M
M
0.136 (0.005)
T A
0.052
0.118
1.22
2.68
3.00
STYLE 1:
PIN 1. GROUND
STYLE 2:
PIN 1.
STYLE 3:
VCC
PIN 1. GND
2. -VOUT
3. VS
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
2. - SUPPLY
3. + SUPPLY
4. GROUND
4. +VOUT
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
NOTES:
SEATING
PLANE
-A-
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-T-
U
L
R
INCHES
DIM MIN MAX
MILLIMETERS
H
MIN
29.08
17.40
7.75
MAX
29.85
18.16
8.26
A
B
C
D
F
1.145
0.685
0.305
0.016
0.048
1.175
0.715
0.325
0.020
0.064
N
B
PORT #1
-Q-
POSITIVE
PRESSURE
(P1)
0.41
1.22
0.51
1.63
G
H
J
K
L
N
P
Q
R
S
U
0.100 BSC
2.54 BSC
0.182
0.014
0.695
0.290
0.420
0.153
0.153
0.230
0.220
0.194
0.016
0.725
0.300
0.440
0.159
0.159
0.250
0.240
4.62
0.36
17.65
7.37
10.67
3.89
3.89
5.84
5.59
4.93
0.41
18.42
7.62
11.18
4.04
4.04
6.35
6.10
1
2 3 4
PIN 1
K
-P-
S
M
S
0.25 (0.010)
T Q
J
F
0.910 BSC
23.11 BSC
G
C
D 4 PL
M
S
S
0.13 (0.005)
T S
Q
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX2202
Sensors
Freescale Semiconductor
8
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
-A-
U
V
PORT #1
2. CONTROLLING DIMENSION: INCH.
W
L
R
H
INCHES
DIM MIN MAX
MILLIMETERS
PORT #2
MIN MAX
29.08 29.85
17.40 18.16
10.29 11.05
PORT #1
PORT #2
VACUUM
(P2)
POSITIVE PRESSURE
(P1)
A
B
C
D
F
1.145
0.685
0.405
0.016
0.048
1.175
0.715
0.435
0.020
0.064
N
-Q-
0.41
1.22
0.51
1.63
G
H
J
K
L
N
P
Q
R
S
U
V
W
0.100 BSC
2.54 BSC
SEATING
PLANE
SEATING
PLANE
B
0.182
0.014
0.695
0.290
0.420
0.153
0.153
0.063
0.220
0.194
0.016
0.725
0.300
0.440
0.159
0.159
0.083
0.240
4.62
0.36
4.93
0.41
1
2 3 4
17.65 18.42
7.37 7.62
10.67 11.18
PIN 1
K
-P-
M
S
0.25 (0.010)
T Q
3.89
3.89
1.60
5.59
4.04
4.04
2.11
6.10
-T-
-T-
S
F
J
G
C
0.910 BSC
23.11 BSC
D 4 PL
0.248
0.310
0.278
0.330
6.30
7.87
7.06
8.38
M
S
S
0.13 (0.005)
T S
Q
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
NOTES:
-T-
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
C
A
U
-Q-
E
INCHES
MILLIMETERS
DIM MIN MAX MIN
MAX
28.45
19.30
16.51
0.51
A
B
C
D
E
F
1.080
1.120 27.43
0.760 18.80
0.650 16.00
0.740
0.630
0.016
0.160
0.048
0.020
0.180
0.064
0.41
4.06
1.22
N
S
B
V
4.57
1.63
G
J
0.100 BSC
2.54 BSC
R
0.014
0.220
0.070
0.150
0.150
0.440
0.695
0.840
0.182
0.016
0.240
0.080
0.160
0.160
0.36
5.59
1.78
3.81
3.81
0.41
6.10
K
N
P
Q
R
S
U
V
PORT #1
PIN 1
2.03
4.06
POSITIVE
-P-
PRESSURE
(P1)
M
M
0.25 (0.010)
T Q
4
3
2
1
4.06
0.460 11.18
0.725 17.65
0.860 21.34
11.68
18.42
21.84
4.92
K
0.194
4.62
F
J
G
STYLE 1:
D 4 PL
0.13 (0.005)
PIN 1. GROUND
2. V (+) OUT
3. V SUPPLY
4. V (-) OUT
M
S
S
T P
Q
CASE 344F-15
ISSUE B
UNIBODY PACKAGE
MPX2202
Sensors
Freescale Semiconductor
9
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MPX2202
Rev. 4
08/2006
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