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MPX53_09 [FREESCALE]

50 kPa Uncompensated Silicon Pressure Sensors; 50军未补偿硅压力传感器
MPX53_09
型号： MPX53_09
厂家： Freescale    Freescale
描述：

50 kPa Uncompensated Silicon Pressure Sensors
50军未补偿硅压力传感器

传感器 压力传感器
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Pressure  
MPX53  
Rev 7, 05/2009  
Freescale Semiconductor  
50 kPa Uncompensated  
Silicon Pressure Sensors  
MPX53  
Series  
The MPX53 series silicon piezoresistive pressure sensors provide a very  
accurate and linear voltage output, directly proportional to the applied  
pressure. These standard, low cost, uncompensated sensors permit  
manufacturers to design and add their own external temperature  
compensating and signal conditioning networks. Compensation techniques  
are simplified because of the predictability of Freescale's single element  
strain gauge design.  
0 to 50 kPa (0 to 7.25 psi)  
60 mV Full Scale Span  
(Typical)  
Application Examples  
• Air Movement Control  
• Environmental Control Systems  
• Level Indicators  
Features  
• Low Cost  
• Leak Detection  
• Patented Silicon Shear Stress Strain Gauge Design  
• Ratiometric to Supply Voltage  
• Easy to Use Chip Carrier Package Options  
• 60 mV Span (Typical)  
• Medical Instrumentation  
• Industrial Controls  
• Pneumatic Control Systems  
• Robotics  
• Differential and Gauge Options  
ORDERING INFORMATION  
Package  
Options  
Case  
No.  
# of Ports  
Single  
Pressure Type  
Differential  
Device  
Marking  
Device Name  
None  
Dual  
Gauge  
Absolute  
Unibody Package (MPX53 Series)  
MPX53D  
MPX53D  
Tape & Reel  
Rail  
344  
•
•
•
MPX53DP  
MPX53GP  
MPX53DP  
MPX53GP  
344C  
344B  
•
Rail  
•
•
•
•
Small Outline Package (MPXV53G Series)  
MPXV53GC7U  
MPXV53G  
Rail  
482C  
SMALL OUTLINE PACKAGE  
UNIBODY PACKAGES  
MPX53D  
CASE 344-15  
MPX53DP  
CASE 344C-01  
MPXV53GC7U  
CASE 482C-03  
MPX53GP  
CASE 344B-01  
© Freescale Semiconductor, Inc., 2007-2009. All rights reserved.  
Pressure  
Operating Characteristics  
Table 1. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)  
Characteristic  
Symbol  
POP  
VS  
Min  
0
Typ  
—
Max  
50  
Units  
kPa  
Pressure Range(1)  
Supply Voltage(2)  
Supply Current  
Full Scale Span(3)  
Offset(4)  
—
3.0  
6.0  
60  
6.0  
—
VDC  
IO  
—
mAdc  
mV  
VFSS  
VOFF  
ΔV/ΔΡ  
—
45  
90  
0
20  
35  
mV  
Sensitivity  
—
1.2  
—
—
mV/kPa  
%VFSS  
%VFSS  
%VFSS  
%VFSS/°C  
µV/°C  
%ZIN/°C  
Ω
Linearity  
–0.6  
—
0.4  
—
Pressure Hysteresis (0 to 50 kPa)  
Temperature Hysteresis  
—
±0.1  
±0.5  
—
—
—
—
Temperature Coefficient of Full Scale Span  
Temperature Coefficient of Offset  
Temperature Coefficient of Resistance  
Input Impedance  
TCVFSS  
TCVOFF  
TCR  
ZIN  
–0.22  
—
-0.16  
—
±15  
—
0.21  
355  
750  
—
0.27  
505  
1875  
—
—
Output Impedance  
ZOUT  
tR  
—
Ω
Response Time(5) (10% to 90%)  
Warm-Up Time(6)  
1.0  
20  
ms  
—
—
—
ms  
Offset Stability(7)  
—
—
±0.5  
—
%VFSS  
1. 1.0 kPa (kiloPascal) equals 0.145 psi.  
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional  
error due to device self-heating.  
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the  
minimum rated pressure.  
4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.  
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a  
specified step change in pressure.  
6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized.  
7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.  
MPX53  
Sensors  
2
Freescale Semiconductor  
Pressure  
Maximum Ratings  
Table 2. Maximum Ratings(1)  
Rating  
Symbol  
PMAX  
PBurst  
TSTG  
TA  
Value  
175  
Unit  
kPa  
kPa  
°C  
Maximum Pressure (P1 > P2)  
Burst Pressure (P1 > P2)  
Storage Temperature  
200  
–40 to +125  
–40 to +125  
Operating Temperature  
°C  
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.  
Figure 1 shows a schematic of the internal circuitry on the stand-alone pressure sensor chip.  
3
+VS  
2
+VOUT  
Sensor  
4
-VOUT  
1
GND  
Figure 1. Uncompensated Pressure Sensor Schematic  
Voltage Output versus Applied Differential Pressure  
The differential voltage output of the sensor is directly  
proportional to the differential pressure (P1) relative to the  
vacuum side (P2). Similarly, output voltage increases as  
increasing vacuum is applied to the vacuum side (P2) relative  
to the pressure side (P1).  
MPX53  
Sensors  
Freescale Semiconductor  
3
Pressure  
Temperature Compensation  
Figure 2 shows the typical output characteristics of the  
MPX53 series over temperature.  
LINEARITY  
Linearity refers to how well a transducer's output follows  
the equation: Vout = Voff + (sensitivity x P) over the operating  
pressure range (see Figure 3). There are two basic methods  
for calculating nonlinearity: (1) end point straight line fit or  
(2) a least squares best line fit. While a least squares fit gives  
the “best case” linearity error (lower numerical value), the  
calculations required are burdensome.  
The piezoresistive pressure sensor element is a  
semiconductor device which gives an electrical output signal  
proportional to the pressure applied to the device. This device  
uses a unique transverse voltage diffused semiconductor  
strain gauge which is sensitive to stresses produced in a thin  
silicon diaphragm by the applied pressure.  
Because this strain gauge is an integral part of the silicon  
diaphragm, there are no temperature effects due to  
differences in the thermal expansion of the strain gauge and  
the diaphragm, as are often encountered in bonded strain  
gauge pressure sensors. However, the properties of the  
strain gauge itself are temperature dependent, requiring that  
the device be temperature compensated if it is to be used  
over an extensive temperature range.  
Temperature compensation and offset calibration can be  
achieved rather simply with additional resistive components, or  
by designing your system using the MPX2053 series sensors.  
Several approaches to external temperature  
Conversely, an end point fit will give the “worst case” error  
(often more desirable in error budget calculations) and the  
calculations are more straightforward for the user.  
Freescale’s specified pressure sensor linearities are based  
on the end point straight line method measured at the  
midrange pressure.  
Figure 4 illustrates the differential or gauge configuration in  
the unibody chip carrier (Case 344). A silicone gel isolates the  
die surface and wire bonds from the environment, while allowing  
the pressure signal to be transmitted to the silicon diaphragm.  
The MPX53 series pressure sensor operating  
characteristics and internal reliability and qualification tests  
are based on use of dry air as the pressure media. Media  
other than dry air may have adverse effects on sensor  
performance and long term reliability. Refer to application  
note AN3728, for more information regarding media  
compatibility.  
compensation over –40 to +125°C and 0 to +80°C are  
presented in Freescale Application Note, AN840.  
100  
MPX53  
S = 3 Vdc  
P1 > P2  
+25°C  
90  
V
80  
70  
60  
50  
40  
–40°C  
Span  
Range  
(Typ)  
+125ºC  
30  
20  
10  
0
Offset  
(Typ)  
0
0
1
2
3
20  
4
5
6
7
50  
8
PSI  
kPa  
10  
30  
40  
Pressure Differential  
Figure 2. Output vs. Pressure Differential  
90  
80  
Linearity  
70  
60  
Stainless Steel  
Metal Cover  
Silicone  
Die Coat  
Die  
Actual  
P1  
P2  
Epoxy  
Case  
Span  
Wire Bond  
50  
40  
(VFSS  
)
Theoretical  
30  
20  
RTV Die  
Bond  
Lead Frame  
Offset  
(VOFF  
10  
0
)
0
MAX  
POP  
Pressure (kPa)  
Figure 3. Linearity Specification Comparison  
Figure 4. Unibody Package — Cross-Sectional Diagram  
(Not to Scale)  
MPX53  
Sensors  
4
Freescale Semiconductor  
Pressure  
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE  
Freescale designates the two sides of the pressure sensor  
as the Pressure (P1) side and the Vacuum (P2) side. The  
Pressure (P1) side is the side containing silicone gel which  
isolates the die from the environment. The Freescale MPX  
pressure sensor is designed to operate with positive  
differential pressure applied, P1 > P2.  
Pressure (P1) Side  
Identifier  
Part Number  
Case Type  
MPX53D  
344  
Stainless Steep Cap  
Side with Port Marking  
Side with Port Attached  
Side with Port Attached  
MPX53DP  
344C  
344B  
482C  
MPX53GP  
The Pressure (P1) side may be identified by using the  
following table.  
MPXV53 Series  
MPX53  
Sensors  
Freescale Semiconductor  
5
Pressure  
PACKAGE DIMENSIONS  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
C
R
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD  
STOP RING. MOLD STOP RING NOT TO EXCEED  
16.00 (0.630).  
M
Z
1
4
2
3
INCHES  
MILLIMETERS  
B
-A-  
DIM MIN MAX MIN  
MAX  
16.00  
13.56  
5.59  
A
B
C
D
F
0.595  
0.630 15.11  
0.534 13.06  
N
0.514  
0.200  
0.016  
0.048  
L
1
2
3
4
0.220  
0.020  
0.064  
5.08  
0.41  
1.22  
PIN 1  
0.51  
1.63  
-T-  
SEATING  
PLANE  
G
J
L
0.100 BSC  
2.54 BSC  
F
0.014  
0.695  
0.016 0.36  
0.725 17.65  
0.40  
18.42  
G
J
F
Y
M
N
R
Y
Z
30˚ NOM  
30˚ NOM  
D 4 PL  
0.136 (0.005)  
0.475  
0.430  
0.048  
0.106  
0.495 12.07  
0.450 10.92  
12.57  
11.43  
1.32  
DAMBAR TRIM ZONE:  
THIS IS INCLUDED  
WITHIN DIM. "F" 8 PL  
M
M
T A  
0.052  
0.118  
1.22  
2.68  
3.00  
CASE 344-15  
ISSUE AA  
UNIBODY PACKAGE  
NOTES:  
SEATING  
PLANE  
-A-  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
-T-  
U
L
R
INCHES  
DIM MIN MAX  
MILLIMETERS  
H
MIN  
29.08  
17.40  
7.75  
MAX  
29.85  
18.16  
8.26  
A
B
C
D
F
1.145  
0.685  
0.305  
0.016  
0.048  
1.175  
0.715  
0.325  
0.020  
0.064  
N
B
PORT #1  
-Q-  
POSITIVE  
PRESSURE  
(P1)  
0.41  
1.22  
0.51  
1.63  
G
H
J
K
L
N
P
Q
R
S
U
0.100 BSC  
2.54 BSC  
0.182  
0.014  
0.695  
0.290  
0.420  
0.153  
0.153  
0.230  
0.220  
0.194  
0.016  
0.725  
0.300  
0.440  
0.159  
0.159  
0.250  
0.240  
4.62  
0.36  
17.65  
7.37  
10.67  
3.89  
3.89  
5.84  
5.59  
4.93  
0.41  
18.42  
7.62  
11.18  
4.04  
4.04  
6.35  
6.10  
1
2 3 4  
PIN 1  
K
-P-  
S
M
S
0.25 (0.010)  
T Q  
J
F
0.910 BSC  
23.11 BSC  
G
C
D 4 PL  
M
S
S
0.13 (0.005)  
T S  
Q
4
- OUTPUT  
CASE 344B-01  
ISSUE B  
UNIBODY PACKAGE  
MPX53  
Sensors  
Freescale Semiconductor  
6
Pressure  
PACKAGE DIMENSIONS  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
-A-  
U
V
PORT #1  
2. CONTROLLING DIMENSION: INCH.  
W
L
R
H
INCHES  
DIM MIN MAX  
MILLIMETERS  
PORT #2  
MIN MAX  
29.08 29.85  
17.40 18.16  
10.29 11.05  
PORT #1  
PORT #2  
VACUUM  
(P2)  
POSITIVE PRESSURE  
(P1)  
A
B
C
D
F
1.145  
0.685  
0.405  
0.016  
0.048  
1.175  
0.715  
0.435  
0.020  
0.064  
N
-Q-  
0.41  
1.22  
0.51  
1.63  
G
H
J
K
L
N
P
Q
R
S
U
V
W
0.100 BSC  
2.54 BSC  
SEATING  
PLANE  
SEATING  
PLANE  
B
0.182  
0.014  
0.695  
0.290  
0.420  
0.153  
0.153  
0.063  
0.220  
0.194  
0.016  
0.725  
0.300  
0.440  
0.159  
0.159  
0.083  
0.240  
4.62  
0.36  
4.93  
0.41  
1
2 3 4  
17.65 18.42  
7.37 7.62  
10.67 11.18  
PIN 1  
K
-P-  
M
S
0.25 (0.010)  
T Q  
3.89  
3.89  
1.60  
5.59  
4.04  
4.04  
2.11  
6.10  
-T-  
-T-  
S
F
J
G
C
0.910 BSC  
23.11 BSC  
D 4 PL  
0.248  
0.310  
0.278  
0.330  
6.30  
7.87  
7.06  
8.38  
M
S
S
0.13 (0.005)  
T S  
Q
CASE 344C-01  
ISSUE B  
UNIBODY PACKAGE  
CASE 482C-03  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPX53  
Sensors  
Freescale Semiconductor  
7
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© Freescale Semiconductor, Inc. 2009. All rights reserved.  
MPX53  
Rev. 7  
05/2009  

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