MPX5999D [FREESCALE]
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated; 集成硅压力传感器片上信号调节，温度补偿和校准
| 型号： | MPX5999D |
| 厂家： | 
Freescale |
| 描述： | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| 文件： | 总8页 (文件大小：165K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MPX5999D
Rev 5, 05/2005
Freescale Semiconductor
Technical Data
MPX5999D
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPX5999D piezoresistive transducer is a state-of-the-art pressure
sensor designed for a wide range of applications, but particularly for those
employing a microcontroller or microprocessor with A/D inputs. This patented,
single element transducer combines advanced micromachining techniques, thin-
film metallization and bipolar semiconductor processing to provide an accurate,
high level analog output signal that is proportional to applied pressure.
Figure 1 shows a block diagram of the internal circuitry integrated on the
stand-alone sensing chip.
SERIES
INTEGRATED
PRESSURE SENSOR
0 to 1000 kPa (0 to 150 psi)
0.2 to 4.7 V OUTPUT
Features
•
•
•
•
Temperature Compensated Over 0 to 85°C
Ideally Suited for Microprocessor or Microcontroller-Based Systems
Patented Silicon Shear Stress Strain Gauge
Durable Epoxy Unibody Element
MPX5999D
CASE 867-08
ORDERING INFORMATION(1)
MPX Series
PIN NUMBERS
1
2
3
Vout
GND
VS
4
5
6
N/C
N/C
N/C
Device
Type
Case
Type
Options
Order Number
Device Marking
Basic Element
Differential
867 MPX5999D
MPX5999D
NOTE: Pins 4, 5, and 6 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
1. The MPX5999D pressure sensor is available as an element only.
VS
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
Vout
Pins 4, 5, and 6 are NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
© Freescale Semiconductor, Inc., 2005. All rights reserved.
Table 1. Maximum Ratings(1)
Rating
Symbol
P1max
Tstg
Value
4000
Unit
kPa
°C
Maximum Pressure(2) (P2 ≤ 1 Atmosphere)
Storage Temperature
–40 to +125
–40 to +125
Operating Temperature
TA
°C
1. Extended exposure at the specified limits may cause permanent damage or degradation to the device.
2. This sensor is designed for applications where P1 is always greater than, or equal to P2. P2 maximum is 500 kPa.
Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 4 required to meet electrical specifications.)
Characteristic
Symbol
POP
VS
Min
0
Typ
—
Max
1000
5.25
10
Unit
kPa
Pressure Range(1)
Supply Voltage(2)
Supply Current
4.75
—
5.0
7.0
0.2
4.7
4.5
4.5
—
Vdc
IO
mAdc
Vdc
Zero Pressure Offset(3)
Full Scale Output(4)
Full Scale Span(5)
Sensitivity
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
Voff
VFSO
VFSS
V/P
—
0.088
4.587
—
0.313
4.813
—
Vdc
Vdc
—
—
mV/kPa
%VFSS
ms
Accuracy(6)
(0 to 85°C)
—
2.5
Response Time(7)
tR
—
1.0
0.1
20
—
Output Source Current at Full Scale Output
Warm-Up Time(8)
IO+
—
—
mAdc
ms
—
—
—
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
• TcSpan:
• TcOffset:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
8. Warm-up Time is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized.
Table 3. Mechanical Characteristics
Characteristics
Weight, Basic Element (Case 867)
Typ
Unit
4.0
grams
MPX5999D
Sensors
Freescale Semiconductor
2
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 4. The
output will saturate outside of the specified pressure range.
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
environments, while allowing the pressure signal to be
transmitted to the silicon diaphragm.
The MPX5999D pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 3 illustrates the differential or gauge configuration
in the basic chip carrier (Case 867). A fluoro silicone gel
isolates the die surface and wire bonds from harsh
5.0
Transfer Function:
4.5
V
V
out = VS*(0.000901*P+0.04) ± Error
S = 5.0 Vdc
4.0
3.5
3.0
2.5
Temperature = 0 to 85°C
TYP
MAX
MIN
2.0
1.5
1.0
0.5
0
100 200
400 500
700 800
1000 1100
900
0
300
600
Differential Pressure (kPa)
Figure 2. Output versus Pressure Differential
Stainless Steel
Silicone
Metal Cover
Die Coat
Die
P1
Wire Bond
Lead Frame
RTV Die
Bond
P2
Thermoplastic Case
Figure 3. Cross-Sectional Diagrams (not to scale)
+5 V
Output
Vout
Vs
IPS
1.0 µF
GND
470 pF
0.01 µF
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646)
MPX5999D
Sensors
Freescale Semiconductor
3
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
Pressure (P1)
Side Identifier
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The Freescale MPX
pressure sensor is designed to operate with positive
differential pressure applied, P1 > P2.
Part Number
Case Type
MPX5999D
867
Stainless Steel Cap
The Pressure (P1) side may be identified by using the
table below:
MPX5999D
Sensors
Freescale Semiconductor
4
PACKAGE DIMENSIONS
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
R
POSITIVE PRESSURE
(P1)
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
M
B
-A-
INCHES
DIM MIN MAX MIN
MILLIMETERS
N
L
MAX
16.00
13.56
5.59
A
B
C
D
F
0.595
0.630 15.11
0.534 13.06
PIN 1
1
2
3
4
5
6
0.514
0.200
0.027
0.048
SEATING
PLANE
-T-
0.220
0.033
0.064
5.08
0.68
1.22
0.84
1.63
G
J
S
G
J
L
M
N
R
S
0.100 BSC
2.54 BSC
F
0.014
0.695
0.016 0.36
0.725 17.65
0.40
18.42
D 6 PL
0.136 (0.005)
30˚ NOM
30˚ NOM
M
M
T A
0.475
0.430
0.090
0.495 12.07
0.450 10.92
12.57
11.43
2.66
0.105
2.29
STYLE 1:
PIN 1. VOUT
2. GROUND
STYLE 2:
PIN 1. OPEN
2. GROUND
STYLE 3:
PIN 1. OPEN
2. GROUND
3. VCC
4. V1
5. V2
3. -VOUT
4. VSUPPLY
5. +VOUT
6. OPEN
3. +VOUT
4. +VSUPPLY
5. -VOUT
6. VEX
6. OPEN
CASE 867-08
ISSUE N
BASIC ELEMENT
MPX5999D
Sensors
Freescale Semiconductor
5
NOTES
MPX5999D
Sensors
6
Freescale Semiconductor
NOTES
MPX5999D
Sensors
Freescale Semiconductor
7
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MPX5999D
Rev. 5
05/2005
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