MPXAZ4115A6U [FREESCALE]
MEDIA RESISTANT, INTEGRATED SILICON PRESSURE SENSOR FOR MANIFOLD ABSOLUTE PRESSURE, ALTIMETER OR BAROMETER APPLICATIONS ON-CHIP SIGNAL CONDITIONED, TE; 媒体耐集成硅压力传感器用于歧管绝对压力，高度计或气压计的应用片上信号调理， TE
| 型号： | MPXAZ4115A6U |
| 厂家： | 
Freescale |
| 描述： | MEDIA RESISTANT, INTEGRATED SILICON PRESSURE SENSOR FOR MANIFOLD ABSOLUTE PRESSURE, ALTIMETER OR BAROMETER APPLICATIONS ON-CHIP SIGNAL CONDITIONED, TE |
| 文件： | 总7页 (文件大小：287K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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Freescale Semiconductor, Inc.
Order this document
by MPXAZ4115A/D
SEMICONDUCTOR TECHNICAL DATA
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
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M P XAZ 4 11 5A
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INTEGRATED
PRESSURE SENSOR
15 to 115 kPa (2.2 to 16.7 psi)
0.2 to 4.8 V Output
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Motorola’s MPXAZ4115A series sensor integrates on–chip, bipolar op amp circuitry and
thin film resistor networks to provide a high output signal and temperature compensation.
The small form factor and high reliability of on–chip integration make the Motorola pressure
sensor a logical and economical choice for the system designer.
SMALL OUTLINE PACKAGE
The MPXAZ4115A series piezoresistive transducer is a state–of–the–art, monolithic,
signal conditioned, silicon pressure sensor. This sensor combines advanced
micromachining techniques, thin film metallization, and bipolar semiconductor processing to
provide an accurate, high level analog output signal that is proportional to applied pressure.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure
sensor chip.
MPXAZ4115AC6U
CASE 482A
Features
•
•
•
Resistant to high humidity and common automotive media
1.5% Maximum Error over 0° to 85°C
Ideally suited for Microprocessor or Microcontroller–
Based Systems
•
•
Temperature Compensated from –40° to +125°C
Durable Thermoplastic (PPS) Surface Mount Package
MPXAZ4115A6U
CASE 482
Application Examples
•
•
•
•
Aviation Altimeters
Industrial Controls
Engine Control
PIN NUMBER
Weather Stations and Weather Reporting Devices
N/C
N/C
N/C
N/C
1
2
3
4
N/C
5
6
7
8
V
S
V
S
Gnd
V
out
NOTE: Pins 1, 5, 6, 7, and 8 are not
device connections. Do not connect to
external circuitry or ground. Pin 1 is
noted by the notch in the lead.
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Figure 1. Fully Integrated Pressure Sensor Schematic
Rev 0
For More Information On This Product,
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Motorola, Inc. 2001
Freescale Semiconductor, Inc.
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MAXIMUM RATINGS(NOTE)
Parametrics
Symbol
Value
400
Units
kPa
°C
Maximum Pressure (P1 u P2)
Storage Temperature
P
max
T
stg
–40° to +125°
–40° to +125°
Operating Temperature
T
A
°C
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS (V = 5.1 Vdc, T = 25°C unless otherwise noted, P1 u P2. Decoupling circuit shown in Figure 3
S
A
required to meet Electrical Specifications.)
Characteristic
Symbol
Min
15
Typ
—
Max
115
Unit
kPa
Pressure Range
P
OP
(1)
Supply Voltage
V
4.85
—
5.1
5.35
10
Vdc
S
Supply Current
I
o
7.0
mAdc
Vdc
(2)
Minimum Pressure Offset
@ V = 5.1 Volts
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
V
off
0.135
0.204
0.273
S
(3)
Full Scale Output
@ V = 5.1 Volts
V
FSO
4.725
4.521
4.794
4.590
4.863
4.659
Vdc
Vdc
S
(4)
Full Scale Span
V
FSS
@ V = 5.1 Volts
S
(5)
Accuracy
—
—
—
—
—
—
—
—
45.9
1.0
±1.5
—
%V
FSS
Sensitivity
V/P
mV/kPa
ms
(6)
Response Time
t
R
—
Output Source Current at Full Scale Output
I
o+
0.1
—
mAdc
ms
(7)
Warm–Up Time
—
—
20
—
(8)
Offset Stability
±ā0.5
—
%V
FSS
NOTES:
1. Device is ratiometric within this specified excitation range.
2. Offset (V ) is defined as the output voltage at the minimum rated pressure.
off
3. Full Scale Output (V
) is defined as the output voltage at the maximum or full rated pressure.
FSO
4. Full Scale Span (V
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
FSS
minimum rated pressure.
5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25°C due to all sources of error including the following:
•
•
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential
pressure applied.
•
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from
minimum or maximum rated pressure at 25°C.
•
•
TcSpan:
TcOffset:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative
to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
8. Offset Stability is the product’s output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.
2
Motorola Sensor Device Data
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+ 5
V
F LU O R O SILI C ON E
GE L D IE CO AT
DI E
STA I NL ES S
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P
O U TPU T
Vo ut
P
1
V s
WI R E BO ND
THE RM O PL A S TIC
CA S E
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A BS OL UT E E LEM E NT
SEAL ED VAC U U M R EFE RE NC E
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Figure 3. Recommended power supply decoupling
and output filtering.
Figure 2. Cross Sectional Diagram SOP
(not to scale)
For additional output filtering, please refer to
Application Note AN1646.
Figure 2 illustrates the absolute sensing chip in the basic
chip carrier (Case 482).
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D in-
put of a microprocessor or microcontroller. Proper decoup-
ling of the power supply is recommended.
5
.
0
M
A
X
TR AN SFE R FUN CTI O N:
= * V (. 0 0 9* P - .0 9 5±) E rr or
4. 5
4. 0
V
o ut
s
V
=
5
.
1
V
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P
=
0
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t
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8
5
3. 5
3. 0
2. 5
2. 0
1. 5
1. 0
0. 5
0
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Figure 4. Output versus Absolute Pressure
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical minimum and maximum output curves
are shown for operation over a temperature range of 0 to
85°C using the decoupling circuit shown in Figure 3. The
output will saturate outside of the specified pressure range.
A gel die coat isolates the die surface and wire bonds
from the environment, while allowing the pressure signal
to be transmitted to the sensor diaphragm. The gel die
coat and durable polymer package provide a media resis-
tant barrier that allows the sensor to operate reliably in
high humidity conditions as well as environments contain-
ing common automotive media. Contact the factory for
more information regarding media compatibility in your
specific application.
Motorola Sensor Device Data
3
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Transfer Function (MPXAZ4115A)
Nominal Transfer Value: Vout = VS x (0.009 x P – 0.095)
± (Pressure Error x Temp. Factor x 0.009 x VS)
VS = 5.1 ± 0.25 Vdc
Temperature Error Band
MPXAZ4115A Series
4. 0
3. 0
2. 0
1. 0
0. 0
B re a k P oi nt s
Temp
Multiplier
-
4 0
t o 8 5
3
1
0
1 25
Te mp er a tur e
Er ro r
F act or
3
-
4
0
-2 0
0
2 0
4
0
6
0
8
0
1
0
0
1
2
0
1
4
0
Te mp er at u re in ° C
NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C
Pressure Error Band
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2
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4
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2
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(
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-Ă 2. 0
-Ă 3. 0
1
5
t
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1
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(
k
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.
5
(
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ORDERING INFORMATION — SMALL OUTLINE PACKAGE
Device Type
Options
Case No.
482
MPX Series Order No.
MPXAZ4115A6U
Packing Options
Rails
Marking
MPXAZ4115A
MPXAZ4115A
MPXAZ4115A
MPXAZ4115A
Basic Element
Absolute, Element Only
Absolute, Element Only
Absolute, Axial Port
Absolute, Axial Port
482
MPXAZ4115A6T1
MPXAZ4115AC6U
MPXAZ4115AC6T1
Tape and Reel
Rails
Ported Element
482A
482A
Tape and Reel
4
Motorola Sensor Device Data
For More Information On This Product,
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Freescale Semiconductor, Inc.
M P XA Z4 1 1 5A SE R I ES
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must
be the correct size to ensure proper solder connection inter-
face between the board and the package. With the correct
fottprint, the packages will self–align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and short-
ing between solder pads.
0 . 10 0ꢀTY Pꢀ 8X
2 . 54
0 .6 6 0
1 6. 7 6
0. 06 0ꢀTY Pꢀ 8X
1. 52
0 .3 0 0
7 . 62
i
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c
h
0 .1 0 0 ꢀTY Pꢀ 8 X
2 . 54
m
m
S
C
A
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ꢀ
2
:
1
Figure 5. SOP Footprint (Case 482)
Motorola Sensor Device Data
5
For More Information On This Product,
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Freescale Semiconductor, Inc.
M P XAZ 41 15 A S E RIE S
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
SMALL OUTLINE PACKAGE DIMENSIONS
–A–
D 8 PL
N O TE S :
4
M
S
S
A
0 .2 5 ꢀ (0 . 01 0 )
T B
1. D I MEN S IO N I N G A ND TO LE R AN C I NG PE R AN S I
Y 14. 5M, 198 2.
2. C O N TR O LL IN G D I MEN S I ON : I N CH .
5
8
3. D I MEN S IO N
P R OT R U SI O N .
A
A ND
B
D
O
N
O
T
I
N
C
L
U
D
E
M
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–B–
4. MA XI MU M MO LD P RO T R U SI O N 0 .1 5 (0 .0 06 ).
5. A LL V ERT IC A L S U RFA C E_S T5YP IC AL D R AF T.
G
1
INCHES
DIM MIN MAX
MILLIMETERS
MIN
10. 54
10. 54
5. 38
MAX
10 .7 9
10 .7 9
5 .8 4
S
N
A
B
C
D
G
H
J
K
M
N
S
0. 415
0. 415
0. 212
0. 038
0. 425
0. 425
0. 230
0. 042
0
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9
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1
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0
7
0
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1
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ꢀ
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0. 009
0. 061
0ꢀ ꢀ
0. 010
0. 011
0. 071
7ꢀ ꢀ
0. 05
0. 23
1. 55
0ꢀ ꢀ
0 .2 5
0 .2 8
1 .8 0
7 ꢀꢀ
H
C
_
_
_
_
J
–T–
0. 405
0. 709
0. 415
0. 725
10. 29
18. 01
10 .5 4
18 .4 1
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
CASE 482–01
ISSUE O
–A–
D 8 PL
N
O
T
E
S
:
1. D I MEN S IO N I N G A ND TO LE R AN C I N G PE R AN S I
Y 14. 5M, 198 2.
2. C O N TR O LL IN G D I MEN S I ON : I N CH .
4
M
S
S
A
0
.
2
5
ꢀ
(
0
.
0
1
0
)
T
B
5
8
3. D I MEN S IO N
P R OT R U SI O N .
A
A
N
D
B
D
O
N
O
T
I
N
C
L
U
D
E
M
O
L
D
N
–B–
4. MA XI MU M MO LD P RO T R U SI O N 0 .1 5 (0 .0 06 ).
5. A LL V ERT IC A L S U RFA C E_S T5YP IC AL D R AF T.
G
INCHES
MILLIMETERS
1
DIM MIN MAX
MIN
10. 54
10. 54
12. 70
0. 96
MAX
10 .7 9
10 .7 9
13 .2 1
1 .0 7
A
B
C
D
G
H
J
K
M
N
S
0. 415
0. 415
0. 500
0. 038
0. 425
0. 425
0. 520
0. 042
S
W
0
.
1
0
0
ꢀ
B
S
C
2
.
5
4
ꢀ
B
S
C
0. 002
0. 009
0. 061
0ꢀ ꢀ
0. 010
0. 011
0. 071
7ꢀ ꢀ
0. 05
0. 23
1. 55
0ꢀ ꢀ
0 .2 5
0 .2 8
1 .8 0
7 ꢀꢀ
V
_
_
_
_
0. 444
0. 709
0. 245
0. 115
0. 448
0. 725
0. 255
0. 125
11. 28
18. 01
6. 22
11 .3 8
18 .4 1
6 .4 8
C
V
W
2
.
9
2
3
.
1
7
H
J
–T–
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
CASE 482A–01
ISSUE A
6
Motorola Sensor Device Data
For More Information On This Product,
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Freescale Semiconductor, Inc.
M P XA Z4 1 1 5A SE R I ES
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
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MPXAZ4115A/D
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