MPXH6300AC6U [FREESCALE]
High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure; 高温度精度集成硅压力传感器，用于测量绝对压力
| 型号： | MPXH6300AC6U |
| 厂家： | 
Freescale |
| 描述： | High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure |
| 文件： | 总11页 (文件大小：264K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MPXH6300A
Rev 4, 01/2007
Freescale Semiconductor
Technical Data
High Temperature Accuracy
Integrated Silicon Pressure Sensor
for Measuring Absolute Pressure,
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
MPXH6300A
SERIES
INTEGRATED
PRESSURE SENSOR
20 to 304 kPa (3.0 to 42 psi)
0.3 to 4.9 V OUTPUT
The Freescale MPXH6300A series sensor integrates on-chip, bipolar op amp
circuitry and thin film resistor networks to provide a high output signal and
temperature compensation. The small form factor and high reliability of on-chip
integration make the Freescale pressure sensor a logical and economical choice
for the system designer.
SUPER SMALL OUTLINE PACKAGES
The MPXH6300A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output signal
that is proportional to applied pressure.
MPXH6300A6U/6T1
CASE 1317-04
Figure 1 shows a block diagram of the internal circuitry integrated on a
pressure sensor chip.
Features
•
•
•
•
•
•
Improved Accuracy at High Temperature
Available in Small and Super Small Outline Packages
MPXH6300AC6U/C6T1
CASE 1317A-03
1.5% Maximum Error over 0° to 85°C
Ideally suited for Microprocessor or Microcontroller-Based Systems
Temperature Compensated from –40° to +125°C
Durable Thermoplastic (PPS) Surface Mount Package
PIN NUMBERS(1)
Application Examples
1
2
3
4
N/C
VS
5
6
7
8
N/C
N/C
N/C
N/C
•
•
Industrial Controls
Engine Control/Manifold Absolute Pressure (MAP)
GND
VOUT
ORDERING INFORMATION
Device
Type
Case
No.
MPX Series
Order No.
Packing
Options
Device
Marking
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
Options
Absolute,
Basic
1317 MPXH63000A6U
Rails
MPXH6300A
Element Element Only
Absolute,
1317 MPXH6300A6T1
Tape & Reel MPXH6300A
Element Only
Ported
Absolute,Axial 1317A MPXH6300AC6U
Rails
MPXH6300A
Element Port
Absolute,Axial 1317A MPXH300AC6T1 Tape & Reel MPXH6300A
Port
© Freescale Semiconductor, Inc., 2007. All rights reserved.
VS
Thin Film
Temperature
Compensation
and
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Sensing
Element
Vout
Gain Stage #1
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for small outline package devices
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
Table 1. Maximum Ratings(1)
Rating
Symbol
PMAX
TSTG
TA
Value
Unit
kPa
°C
Maximum Pressure (P1 > P2)
1200
–40 to +125
–40 to +125
0.5
Storage Temperature
Operating Temperature
°C
Output Source Current @ Full Scale Output(2)
Output Sink Current @ Minimum Pressure Offset2
Io+
mAdc
mAdc
Io–
–0.5
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2. Maximum Output Current is controlled by effective impedance from Vout to GND or Vout to VS in the application circuit.
MPXH6300A
Sensors
Freescale Semiconductor
2
Table 2. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2.)
Characteristic
Symbol
POP
VS
Min
20
Typ
—
Max
304
Unit
kPa
Pressure Range
Supply Voltage(1)
Supply Current
4.74
—
5.1
5.46
10
Vdc
Io
6.0
mAdc
Vdc
Minimum Pressure Offset
@ VS = 5.1 Volts(2)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
Voff
0.241
0.306
0.371
Full Scale Output
VFSO
4.847
4.476
4.912
4.606
4.977
4.736
Vdc
Vdc
@ VS = 5.1 Volts(3)
Full Scale Span
VFSS
@ VS = 5.1 Volts(4)
Accuracy(5)
—
V/P
tR
—
—
—
—
—
—
16.2
1.0
1.5
—
—
—
—
%VFSS
mV/kPa
ms
Sensitivity
Response Time(6)
Warm-Up Time(7)
Offset Stability(8)
—
20
ms
—
0.25
%VFSS
1. Device is ratiometric within this specified excitation range.
2. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25°C due to all sources of error including the following:
Linearity:Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or
maximum rated pressure, at 25°C.
TcSpan:Output deviation over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXH6300A
Sensors
Freescale Semiconductor
3
Figure 2 illustrates the absolute sensing chip in the basic
Super Small Outline chip carrier (Case 1317). Figure 3
illustrates a typical application circuit (output source current
operation).
Figure 4 shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85°C temperature
range. The output will saturate outside of the rated pressure
range.
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MPXH6300A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
Fluoro Silicone
Gel Die Coat
Stainless Steel Cap
Die
P1
Wire Bond
Thermoplastic Case
Lead Frame
Absolute Element
Die Bond
Sealed Vacuum Reference
Figure 2. Cross Sectional Diagram SSOP
(not to scale)
+5.1 V
VS Pin 2
MPXH6300A
100 nF
VOUT Pin 4
To ADC
47 pF
51 K
GND Pin 3
Figure 3. Typical Application Circuit
(Output Source Current Operation)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
Transfer Function:
V
V
out = Vs*(.00318*P-.00353) ± Error
S = 5.1 Vdc
Temperature = 0 to 85°C
MAX
TYP
MIN
Pressure (Reference to Sealed Vacuum) in kPa
Figure 4. Output versus Absolute Pressure
MPXH6300A
Sensors
4
Freescale Semiconductor
Transfer Function (MPXH6300A)
Nominal Transfer Value: Vout = VS x (0.00318 x P - 0.00353)
± (Pressure Error x Temp Factor x 0.00318 x VS)
V
S = 5.1 0.36 Vdc
Temperature Error Band
MPXH6300A Series
4.0
Break Points
Temp
Multiplier
3.0
-40
0 to 85
125
3
1
3
Temperature
2.0
Error
Factor
1.0
0.0
-40
-20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C.
Pressure Error Band
Error Limits for Pressure
4.0
3.0
2.0
1.0
0.0
Pressure (in kPa)
20
60
100
140
180
220
260
300
-1.0
-2.0
-3.0
-4.0
Pressure
20 to 304 (kPa)
Error (Max)
±4.0 (kPa)
SURFACE MOUNTING INFORMATION
Minimum Recommended Footprint for Super Small Outline Packages
Surface mount board layout is a critical portion of the total
0.050
1.27
TYP
0.387
9.83
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.150
3.81
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 5. SSOP Footprint (Case 1317 and 1317A)
MPXH6300A
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
PAGE 1 OF 3
CASE 1317-04
ISSUE F
SUPER SMALL OUTLINE PACKAGE
MPXH6300A
Sensors
Freescale Semiconductor
6
PACKAGE DIMENSIONS
PAGE 2 OF 3
CASE 1317-04
ISSUE F
SUPER SMALL OUTLINE PACKAGE
MPXH6300A
Sensors
Freescale Semiconductor
7
PACKAGE DIMENSIONS
PAGE 3 OF 3
CASE 1317-04
ISSUE F
SUPER SMALL OUTLINE PACKAGE
MPXH6300A
Sensors
Freescale Semiconductor
8
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1317A-03
ISSUE C
SUPER SMALL OUTLINE PACKAGE
MPXH6300A
Sensors
Freescale Semiconductor
9
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1317A-03
ISSUE C
SUPER SMALL OUTLINE PACKAGE
MPXH6300A
Sensors
Freescale Semiconductor
10
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© Freescale Semiconductor, Inc. 2007. All rights reserved.
MPXH6300A
Rev. 4
01/2007
相关型号：
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MPXH6400A_07
High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure
FREESCALE
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