MPXV4006G7U [FREESCALE]
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned,Temperature Compensated and Calibrated; 集成硅压力传感器片上信号调节,温度补偿和校准型号: | MPXV4006G7U |
厂家: | Freescale |
描述: | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned,Temperature Compensated and Calibrated |
文件: | 总11页 (文件大小:319K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MPXV4006G
Rev 6, 01/2007
Freescale Semiconductor
Technical Data
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
The MPXV4006G series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of applications, but
particularly those employing a microcontroller or microprocessor with A/D inputs.
This sensor combines a highly sensitive implanted strain gauge with advanced
micromachining techniques, thin-film metallization, and bipolar processing to
provide an accurate, high level analog output signal that is proportional to the
applied pressure.
MPXV4006G
INTEGRATED
PRESSURE SENSOR
0 to 6 kPa (0 to 0.87 psi)
0.2 to 4.7 V OUTPUT
SMALL OUTLINE PACKAGE
THROUGH-HOLE
Features
•
•
•
Temperature Compensated over 10° to 60°C
Ideally Suited for Microprocessor or Microcontroller-Based Systems
Available in Gauge Surface Mount (SMT) or Through-hole (DIP)
Configurations
MPXV4006G7U
CASE 482B-03
MPXV4006GC7U
CASE 482C-03
•
Durable Thermoplastic (PPS) Package
MPXV4006G series pressure sensors are available in the basic element
SMALL OUTLINE PACKAGE
SURFACE MOUNT
package or with pressure ports. Two packing options are offered for the 482 and
482A case configurations.
ORDERING INFORMATION
Device
Type
Case MPX Series Order
No. No.
Packing
Options
Options
Marking
Basic
Element
Element Only
Element Only
Element Only
Axial Port
482 MPXV4006G6U
482 MPXV4006G6T1
482B MPXV4006G7U
482A MPXV4006GC6U
Rails
MPXV4006G
MPXV4006G6U/6T1 MPXV4006GC6U/C6T1
Tape & Reel MPXV4006G
CASE 482-01
CASE 482A-01
Rails
Rails
MPXV4006G
MPXV4006G
Ported
Element
Axial Port
482A MPXV4006GC6T1 Tape & Reel MPXV4006G
Axial Port
482C MPXV4006GC7U
1369 MPXV4006GP
1351 MPXV4006DP
Rails
Trays
Trays
MPXV4006G
MPXV4006G
MPXV4006G
Side Port
MPXV4006DP
CASE 1351-01
MPXV4006GP
CASE 1369-01
Dual Port
PIN NUMBERS(1)
1
2
3
4
N/C
VS
5
6
7
8
N/C
N/C
N/C
N/C
Gnd
Vout
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch i n the lead.
© Freescale Semiconductor, Inc., 2007. All rights reserved.
VS
Gain Stage #2
Thin Film
Temperature
Compensation
and
and
Ground
Reference
Shift Circuitry
Sensing
Element
Vout
Gain Stage #1
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for small outline package device
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
Table 1. Maximum Ratings(1)
Parametrics
Symbol
Pmax
Tstg
Value
Units
kPa
°C
Maximum Pressure (P1 >P2)
Storage Temperature
24
-30° to +100°
-10° to +60°
Operating Temperature
TA
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Table 2. Operating Characteristics
Characteristic
Symbol
POP
Min
0
Typ
—
Max
6.0
Unit
kPa
Vdc
Pressure Range
Supply Voltage(1)
Supply Current
VS
4.75
5.0
5.25
IS
—
—
—
10
—
mAdc
V
Full Scale Output(2)
(RF = 51kΩ)
(RF = 51kΩ)
VFSS
4.6
Offset(3)(5)
Sensitivity
Voff
0.100
0.225
0.430
V
V/P
—
—
—
766
—
—
mV/kPa
%VFSS
Accuracy(4)(5)
(10 to 60°C)
±5.0
1. Device is ratiometric within this specified excitation range.
2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure, at 25°C.
• Offset Stability:
Output deviation, after 1000 temperature cycles, -30 to 100°C, and 1.5 million pressure cycles, with
minimum rated pressure applied.
• TcSpan:
• TcOffset:
Output deviation over the temperature range of 10° to 60°C, relative to 25°C.
Output deviation with minimum pressure applied, over the temperature range of 10° to 60°C, relative to 25°C.
5. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV4006G, external mechanical stresses and mounting position can affect
the zero pressure output reading. To obtain the 5% FSS accuracy, the device output must be “autozeroed'' after installation. Autozeroing is
defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations.
MPXV4006G
Sensors
2
Freescale Semiconductor
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION, AND SIGNAL CONDITIONING
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 2 illustrates the gauge configuration in the basic
chip carrier (Case 482). A fluorosilicone gel isolates the die
surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the silicon diaphragm.
The MPXV4006G series sensor operating characteristics
are based on use of dry air as pressure media. Media, other
than dry air, may have adverse effects on sensor
from the factory. Contact the factory for information regarding
media tolerance in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4 shows the sensor output signal relative to
pressure input. Typical, minimum and maximum output
curves are shown for operation over a temperature range of
10°C to 60°C using the decoupling circuit shown in Figure 3.
The output will saturate outside of the specified pressure
range.
performance and long-term reliability. Internal reliability and
qualification test for dry air, and other media, are available
Fluorosilicone
Gel Die Coat
Stainless
Steel Cap
Die
+5 V
P1
Wire
OUTPUT
Vout
Thermoplastic
Case
Bond
Vs
IPS
Lead
Frame
1.0 µF
0.01 µF
GND
470 pF
P2
Differential Sensing
Element
Die Bond
Figure 3. Recommended Power Supply Decoupling
and Output Filtering Recommendations
(For additional output filtering, please refer to
Application Note AN1646.)
Figure 2. Cross Sectional Diagram SOP
(Not to Scale)
5
Transfer Function:
4.5
4
V
out = VS*[(0.1533*P) + 0.045] 5% VFSS
VS = 5.0 V 0.25 Vdc
TEMP = 10 to 60° C
3.5
3
Typical
2.5
2
Max
1.5
1
Min
0.5
0
0
3
6
Differential Pressure (kPa)
See Note 5 in Operating Characteristics
Figure 4. Output versus Pressure Differential
MPXV4006G
Sensors
Freescale Semiconductor
3
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor designed to operate with positive differential pressure
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The pressure sensor is
applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Table 3. Pressure (P1)/Vacuum (P2) Side Identification Table
Part Number
MPXV4006G6U/T1
Case Type
482
Pressure (P1) Side Identifier
Stainless Steel Cap
MPXV4006GC6U/T1
MPXV4006G7U
MPXV4006GC7U
MPXV4006GP
482A
Side with Port Attached
Stainless Steel Cap
482B
482C
1369
Side with Port Attached
Side with Port Attached
Side with Part Marking
MPXV4006DP
1351
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
0.100 TYP
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
inch
mm
0.100 TYP 8X
2.54
Figure 5. SOP Footprint (Case 482)
MPXV4006G
Sensors
4
Freescale Semiconductor
PACKAGE DIMENSIONS
-A-
D 8 PL
0.25 (0.010)
4
1
M
S
S
A
T
B
5
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
-B-
G
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
INCHES
MIN MAX
MILLIMETERS
S
N
DIM
A
B
C
D
G
H
J
K
M
N
MIN
10.54
10.54
5.38
MAX
10.79
10.79
5.84
0.415 0.425
0.415 0.425
0.212 0.230
0.038 0.042
0.100 BSC
0.96
1.07
2.54 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0.05
0.23
1.55
0˚
0.25
0.28
1.80
7˚
H
C
J
0˚
7˚
-T-
0.405 0.415
0.709 0.725
10.29
18.01
10.54
18.41
SEATING
PLANE
S
PIN 1 IDENTIFIER
K
M
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
SURFACE MOUNT
-A-
D 8 PL
4
M
S
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
0.25 (0.010)
T
B
5
8
N
-B-
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
G
1
INCHES
MIN MAX
MILLIMETERS
DIM
A
B
C
D
G
H
J
K
M
N
MIN
10.54
10.54
12.70
0.96
MAX
10.79
10.79
13.21
1.07
S
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
W
2.54 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0.05
0.23
1.55
0˚
0.25
0.28
1.80
7˚
V
0˚
7˚
C
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
11.28
18.01
6.22
2.92
11.38
18.41
6.48
3.17
S
V
W
H
J
-T-
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
SURFACE MOUNT
MPXV4006G
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
-A-
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
4
5
8
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
-B-
G
D 8 PL
1
M
S
S
A
0.25 (0.010)
T B
INCHES
MILLIMETERS
DIM MIN MAX MIN
MAX
10.79
10.79
5.59
DETAIL X
A
B
C
D
G
J
K
M
N
S
0.415
0.425 10.54
0.425 10.54
S
N
0.415
0.210
0.026
0.220
0.034
5.33
0.66
PIN 1 IDENTIFIER
0.864
0.100 BSC
2.54 BSC
0.009
0.100
0˚
0.011
0.120
15˚
0.23
2.54
0˚
0.28
3.05
15˚
C
0.405
0.540
0.415 10.29
0.560 13.72
10.54
14.22
SEATING
PLANE
-T-
K
M
J
DETAIL X
CASE 482B-03
ISSUE B
SMALL OUTLINE PACKAGE
THROUGH-HOLE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
-A-
4
5
8
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
N
-B-
D 8 PL
G
M
S
S
A
INCHES
MILLIMETERS
0.25 (0.010)
T B
1
DIM MIN MAX MIN
MAX
10.79
10.79
13.21
0.864
A
B
C
D
G
J
K
M
N
S
0.415
0.425 10.54
0.425 10.54
0.520 12.70
DETAIL X
0.415
0.500
0.026
S
W
0.034
0.66
0.100 BSC
2.54 BSC
0.009
0.100
0˚
0.011
0.120
15˚
0.23
2.54
0˚
0.28
3.05
15˚
V
PIN 1
IDENTIFIER
0.444
0.540
0.245
0.115
0.448 11.28
0.560 13.72
11.38
14.22
6.48
3.17
C
V
W
0.255
0.125
6.22
2.92
SEATING
PLANE
-T-
K
M
J
DETAIL X
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
THROUGH-HOLE
MPXV4006G
Sensors
Freescale Semiconductor
6
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
SURFACE MOUNT
MPXV4006G
Sensors
Freescale Semiconductor
7
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
SURFACE MOUNT
MPXV4006G
Sensors
Freescale Semiconductor
8
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
SURFACE MOUNT
MPXV4006G
Sensors
Freescale Semiconductor
9
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
SURFACE MOUNT
MPXV4006G
Sensors
Freescale Semiconductor
10
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© Freescale Semiconductor, Inc. 2007. All rights reserved.
MPXV4006G
Rev. 6
01/2007
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