MZ5010G_技术文档

MPVZ5010G

Rev 0, 09/2005

Freescale Semiconductor

Technical Data

Integrated Silicon Pressure Sensor

On-Chip Signal Conditioned,

Temperature Compensated and

Calibrated

MPVZ5010G

SERIES

The MPVZ5010G series piezoresistive transducers are state-of-the-art

monolithic silicon pressure sensors designed for the appliance, consumer,

healthcare, industrial and automotive market. The analog output can be read

directly into the A/D input of Freescale microcontrollers. This transducer

combines advanced micromachining techniques, thin-film metallization, and

bipolar processing to provide an accurate, high level analog output signal that is

proportional to the applied pressure. The axial port has been modified to

accommodate industrial grade tubing.

INTEGRATED

PRESSURE SENSOR

0 to 10 kPA (0 to 1019.78 mm H₂O)

0.2 to 4.7 V OUTPUT

SMALL OUTLINE PACKAGE

SURFACE MOUNT

Features

•

5.0% Maximum Error over 0° to 85°C

Temperature Compensated over -40° to +125°C

Durable Thermoplastic (PPS) Package

Available in Surface Mount (SMT) or Through-hole (DIP) Configurations

Application Examples

MPVZ5010GW6U

CASE 1735-01

MPVZ5010G6U/T1

CASE 482-01

•

Washing Machine Water Level Measurement (Reference AN1950)

Ideally Suited for Microprocessor or Microcontroller-Based Systems

Appliance Liquid Level and Pressure Measurement

Respiratory Equipment

SMALL OUTLINE PACKAGE

THROUGH-HOLE

ORDERING INFORMATION

J

Device

Type

Case

No.

MPVZ Series

Order No.

Packing

Options

Device

Marking

Surface Mount

Through-Hole

Surface Mount

Through-Hole

1735-01 MPVZ5010GW6U

1560-02 MPVZ5010GW7U

Rails

MZ5010GW

MZ5010G

MPVZ5010GW7U

CASE 1560-02

MPVZ5010G7U

CASE 482B-03

482-01

MPVZ5010G6U

MPVZ5010G6T1

Rails

Tape & Reel

Rails

482B-03 MPVZ5010G7U

PIN NUMBERS⁽¹⁾

1

2

3

4

N/C

V_S

5

N/C

6

GND

V_OUT

7

8

1. Pins 1, 5, 6, 7, and 8 are internal device

connections. Do not connect to external

circuitry or ground. Pin 1 is noted by the

notch in the lead.

V_S

Gain Stage #2

and

Ground

Reference

Shift Circuitry

Thin Film

Temperature

Compensation

and

Sensing

Element

V_out

Gain Stage #1

Pins 1 and 5 through 8 are NO CONNECTS

for surface mount package

GND

Pins 4, 5, and 6 are NO CONNECTS for

unibody package

Figure 1. Fully Integrated Pressure Sensor Schematic

Table 1. Maximum Ratings⁽¹⁾

Rating

Symbol

P_max

T_stg

Value

40

Unit

kPa

°C

Maximum Pressure (P1 > P2)

Storage Temperature

–40 to +125

Operating Temperature

T_A

°C

1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

MPVZ5010G

Sensors

Freescale Semiconductor

2

Table 2. Operating Characteristics (V_S= 5.0 Vdc, T_A= 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in

Figure 3 required to meet specification.)

Characteristic

Symbol

Min

Typ

Max

Unit

Pressure Range⁽¹⁾

P_OP

0

—

10

kPa

1019.78

mm H₂O

Supply Voltage⁽²⁾

Supply Current

V_S

I_o

4.75

—

5.0

0.2

5.25

10

Vdc

mAdc

Vdc

Minimum Pressure Offset⁽³⁾

@ V_S= 5.0 Volts

(0 to 85°C)

V_off

0

0.425

Full Scale Output⁽⁴⁾

@ V_S= 5.0 Volts

V_FSO

4.475

4.275

4.7

4.5

—

4.925

4.725

Vdc

Full Scale Span⁽⁵⁾

@ V_S= 5.0 Volts

V_FSS

Accuracy⁽⁶⁾

Sensitivity

—

±5.0

%V_FSS

V/P

450

—-

mV/kPa

4.413

mV/mm H₂O

Response Time⁽⁷⁾

t_R

I_O+

—

1.0

0.1

—-

ms

mAdc

ms

Output Source Current at Full Scale Output

Warm-Up Time⁽⁸⁾

20

Offset Stability⁽⁹⁾

—

±0.5

%V_FSS

1. 1.0 kPa (kiloPascal) equals 0.145 psi.

2. Device is ratiometric within this specified excitation range.

3. Offset (V_off) is defined as the output voltage at the minimum rated pressure.

4. Full Scale Output (V_FSO) is defined as the output voltage at the maximum or full rated pressure.

5. Full Scale Span (V_FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the

minimum rated pressure.

6. Accuracy (error budget) consists of the following:

• Linearity:

Output deviation from a straight line relationship with pressure over the specified pressure range.

• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to

and from the minimum or maximum operating temperature points, with zero differential pressure applied.

• Pressure Hysteresis:

Output deviation at any pressure within the specified range, when this pressure is cycled to and from the

minimum or maximum rated pressure, at 25°C.

• TcSpan:

• TcOffset:

Output deviation over the temperature range of 0° to 85°C, relative to 25°C.

Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.

• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of V_FSS, at 25°C.

7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a

specified step change in pressure.

8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.

9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

MPVZ5010G

Sensors

Freescale Semiconductor

3

ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING

The performance over temperature is achieved by

integrating the shear-stress strain gauge, temperature

compensation, calibration and signal conditioning circuitry

onto a single monolithic chip.

Figure 2 illustrates the Differential or Gauge configuration

in the basic chip carrier (Case 482). A gel die coat isolates the

die surface and wire bonds from the environment, while

allowing the pressure signal to be transmitted to the sensor

diaphragm.

than dry air, may have adverse effects on sensor

performance and long-term reliability. Contact the factory for

information regarding media compatibility in your application.

Figure 3 shows the recommended decoupling circuit for

interfacing the integrated sensor to the A/D input of a

microprocessor or microcontroller. Proper decoupling of the

power supply is recommended.

Figure 4 shows the sensor output signal relative to

pressure input. Typical, minimum, and maximum output

curves are shown for operation over a temperature range of

0° to 85°C using the decoupling circuit shown in Figure 3. The

output will saturate outside of the specified pressure range.

The MPVZ5010G series pressure sensor operating

characteristics, internal reliability and qualification tests are

based on use of dry air as the pressure media. Media, other

Stainless

Steel Cap

Fluoro Silicone

Gel Die Coat

Die

+5 V

P1

Thermoplastic

Case

OUTPUT

V_out

Wire Bond

V_s

Lead

Frame

IPS

1.0 µF

GND

470 pF

0.01 µF

P2

Die Bond

Differential Sensing

Element

Figure 2. Cross-Sectional Diagram SOP

(not to scale)

Figure 3. Recommended Power Supply Decoupling

and Output Filtering

(For additional output filtering, please refer to

Application Note AN1646.)

5.0

Transfer Function (kPa):

_out= V_S× (0.09 × P + 0.04) ± 5.0% V_FSS

V

4.0

3.0

2.0

1.0

V_S= 5.0 Vdc

TEMP = 0 to 85°C

TYPICAL

MAX

MIN

0

8.0

2.0

4.0

Differential Pressure (kPa)

10

6.0

Figure 4. Output versus Pressure Differential

MPVZ5010G

Sensors

4

Freescale Semiconductor

Transfer Function (MPVZ5010G)

Nominal Transfer Value: V_out= V_Sx (0.09 x P + 0.04)

± (Pressure Error x Temp. Factor x 0.09 x V_S)

_S= 5.0 V ± 0.25 Vdc

P = kPa

V

Temperature Error Band

MPVZ5010G SERIES

4.0

3.0

2.0

1.0

0.0

Temp

Multiplier

–40

0 to 85

+125

3

1

3

Temperature

Error

Factor

–40

–20

0

20

40

60

80

100

120

140

Temperature in °C

NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.

Pressure Error Band

0.5

0.4

0.3

0.2

0.1

Pressure

Error

(kPa)

Pressure (kPa)

0

–0.1

–0.2

0

1

2

3

4

5

6

7

8

9

10

–0.3

–0.4

–0.5

Pressure

Error (Max)

±0.5 (kPa)

0 to 10 (kPa)

MPVZ5010G

Sensors

Freescale Semiconductor

5

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor is designed to operate with positive differential pressure

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing a gel die coat which

protects the die from harsh media. The MPX pressure sensor

applied, P1 > P2.

The Pressure (P1) side may be identified by using the

table below:

Pressure (P1)

Side Identifier

Part Number

Case Type

MPVZ5010GW6U

MPVZ5010GW7U

MPVZ5010G6U/T1

MPVZ5010G7U

1735-01

1560-02

482-01

Vertical Port Attached

Stainless Steel Cap

482B-03

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

shorting between solder pads.

0.100 TYP 8X

2.54

0.660

16.76

0.060 TYP 8X

1.52

0.300

7.62

inch

0.100 TYP 8X

2.54

mm SCALE 2:1

Figure 5. SOP Footprint (Case 482)

MPVZ5010G

Sensors

6

Freescale Semiconductor

PACKAGE DIMENSIONS

PAGE 1 OF 3

CASE 1735-01

ISSUE A

SMALL OUTLINE PACKAGE

MPVZ5010G

Sensors

Freescale Semiconductor

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PACKAGE DIMENSIONS

PAGE 2 OF 3

CASE 1735-01

ISSUE A

SMALL OUTLINE PACKAGE

MPVZ5010G

Sensors

Freescale Semiconductor

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PACKAGE DIMENSIONS

PAGE 3 OF 3

CASE 1735-01

ISSUE A

SMALL OUTLINE PACKAGE

MPVZ5010G

Sensors

Freescale Semiconductor

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PACKAGE DIMENSIONS

PAGE 1 OF 3

CASE 1560-02

ISSUE C

SMALL OUTLINE PACKAGE

MPVZ5010G

Sensors

Freescale Semiconductor

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PACKAGE DIMENSIONS

PAGE 2 OF 3

CASE 1560-02

ISSUE C

SMALL OUTLINE PACKAGE

MPVZ5010G

11

Sensors

Freescale Semiconductor

PACKAGE DIMENSIONS

PAGE 3 OF 3

CASE 1560-02

ISSUE C

SMALL OUTLINE PACKAGE

MPVZ5010G

Sensors

Freescale Semiconductor

12

PACKAGE DIMENSIONS

-A-

D ^{8 PL}

0.25 (0.010)

4

1

M

S

A

T

B

5

8

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

-B-

G

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.

INCHES

MIN MAX

MILLIMETERS

S

N

DIM

A

B

C

D

G

H

J

K

M

N

MIN

10.54

5.38

MAX

10.79

5.84

0.415 0.425

0.212 0.230

0.038 0.042

0.100 BSC

0.96

1.07

2.54 BSC

0.002 0.010

0.009 0.011

0.061 0.071

0.05

0.23

1.55

0˚

0.25

0.28

1.80

7˚

H

C

J

0˚

7˚

-T-

0.405 0.415

0.709 0.725

10.29

18.01

10.54

18.41

SEATING

PLANE

S

PIN 1 IDENTIFIER

K

M

CASE 482-01

ISSUE O

SMALL OUTLINE PACKAGE

-A-

NOTES:

4

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

5

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE

MOLD PROTRUSION.

-B-

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.

6. DIMENSION S TO CENTER OF LEAD WHEN

FORMED PARALLEL.

G

8

D 8 PL

1

M

S

A

0.25 (0.010)

T B

INCHES

MILLIMETERS

DIM MIN MAX MIN

MAX

10.79

5.59

DETAIL X

A

B

C

D

G

J

K

M

N

S

0.415

0.425 10.54

S

N

0.415

0.210

0.026

0.220

0.034

5.33

0.66

PIN 1 IDENTIFIER

0.864

0.100 BSC

2.54 BSC

0.009

0.100

0˚

0.011

0.120

15˚

0.23

2.54

0˚

0.28

3.05

15˚

C

0.405

0.540

0.415 10.29

0.560 13.72

10.54

14.22

SEATING

PLANE

-T-

K

M

J

DETAIL X

CASE 482B-03

ISSUE B

SMALL OUTLINE PACKAGE

MPVZ5010G

Sensors

Freescale Semiconductor

13

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MPVZ5010G

Rev. 0

09/2005


型号：	MZ5010G
厂家：	Freescale
描述：	Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated 集成硅压力传感器片上信号调节，温度补偿和校准传感器压力传感器温度补偿
文件：	总14页 (文件大小：376K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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