TK50P04M1 [FREESCALE]

MOSFETs Silicon N-Channel MOS (U-MOS-H); MOSFET的硅N沟道MOS (U - MOSI ?? ± -H )
TK50P04M1
型号: TK50P04M1
厂家: Freescale    Freescale
描述:

MOSFETs Silicon N-Channel MOS (U-MOS-H)
MOSFET的硅N沟道MOS (U - MOSI ?? ± -H )

晶体 晶体管 开关 脉冲
文件: 总8页 (文件大小:278K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TK50P04M1  
MOSFETs Silicon N-Channel MOS (U-MOS-H)  
1. Applications  
Switching Voltage Regulators  
Motor Drivers  
2. Features  
(1) High-speed switching  
(2) Low gate charge: QSW = 9.4 nC (typ.)  
(3) Low drain-source on-resistance: RDS(ON) = 6.7 m(typ.) (VGS = 10 V)  
(4) Low leakage current: IDSS = 10 µA (max) (VDS = 40 V)  
(5) Enhancement mode: Vth = 1.3 to 2.3 V (VDS = 10 V, ID = 0.5 mA)  
3. Packaging and Internal Circuit  
1: Gate  
2: Drain (heatsink)  
3: Source  
DPAK  
4. Absolute Maximum Ratings (Note) (T = 25unless otherwise specified)  
a
Characteristics  
Symbol  
Rating  
Unit  
V
Drain-source voltage  
Gate-source voltage  
Drain current (DC)  
Drain current (pulsed)  
Power dissipation  
VDSS  
VGSS  
ID  
40  
±20  
(Note 1)  
(Note 1)  
50  
A
IDP  
150  
(Tc = 25)  
PD  
60  
W
mJ  
A
Single-pulse avalanche energy  
Avalanche current  
(Note 2)  
EAS  
IAR  
65  
50  
Channel temperature  
Storage temperature  
Tch  
Tstg  
150  
-55 to 150  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
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5. Thermal Characteristics  
Characteristics  
Symbol  
Max  
Unit  
Channel-to-case thermal resistance  
Channel-to-ambient thermal resistance  
Rth(ch-c)  
Rth(ch-a)  
2.08  
125  
/W  
Note 1: Ensure that the channel temperature does not exceed 150.  
Note 2: VDD = 32 V, Tch = 25(initial), L = 20 µH, RG = 1.2 , IAR = 50 A  
Note: This transistor is sensitive to electrostatic discharge and should be handled with care.  
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6. Electrical Characteristics  
6.1. Static Characteristics (T = 25unless otherwise specified)  
a
Characteristics  
Gate leakage current  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
IGSS  
IDSS  
VGS = ±20 V, VDS = 0 V  
±0.1  
10  
µA  
Drain cut-off current  
VDS = 40 V, VGS = 0 V  
Drain-source breakdown voltage  
V(BR)DSS ID = 10 mA, VGS = 0 V  
V(BR)DSX ID = 10 mA, VGS = -20 V  
40  
25  
1.3  
V
Gate threshold voltage  
Vth  
VDS = 10 V, ID = 0.5 mA  
2.3  
10.2  
8.7  
Drain-source on-resistance  
RDS(ON) VGS = 4.5 V, ID = 25 A  
VGS = 10 V, ID = 25 A  
7.8  
6.7  
mΩ  
6.2. Dynamic Characteristics (T = 25unless otherwise specified)  
a
Characteristics  
Input capacitance  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
pF  
Ciss  
Crss  
Coss  
rg  
VDS = 10 V, VGS = 0 V, f = 1 MHz  
2600  
110  
420  
2.5  
22  
3.8  
Reverse transfer capacitance  
Output capacitance  
Gate resistance  
VDS = 10 V, VGS = 0 V, f = 5 MHz  
See Figure 6.2.1.  
Switching time (rise time)  
Switching time (turn-on time)  
Switching time (fall time)  
Switching time (turn-off time)  
tr  
ns  
ton  
tf  
29  
10  
toff  
77  
Fig. 6.2.1 Switching Time Test Circuit  
6.3. Gate Charge Characteristics (T = 25unless otherwise specified)  
a
Characteristics  
Symbol  
Qg  
Test Condition  
Min  
Typ.  
Max  
Unit  
nC  
Total gate charge (gate-source plus  
gate-drain)  
VDD 32 V, VGS = 10 V, ID = 50 A  
VDD 32 V, VGS = 5 V, ID = 50 A  
VDD 32 V, VGS = 10 V, ID = 50 A  
38  
20  
Gate-source charge 1  
Gate-drain charge  
Gate switch charge  
Qgs1  
Qgd  
8.0  
5.7  
9.4  
QSW  
6.4. Source-Drain Characteristics (T = 25unless otherwise specified)  
a
Characteristics  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
Reverse drain current (pulsed)  
Diode forward voltage  
(Note 3)  
IDRP  
150  
-1.2  
A
V
VDSF  
IDR = 50 A, VGS = 0 V  
Note 3: Ensure that the channel temperature does not exceed 150.  
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7. Marking  
Fig. 7.1 Marking  
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8. Characteristics Curves (Note)  
Fig. 8.1 I - V  
Fig. 8.2 I - V  
D DS  
D
DS  
Fig. 8.3 I - V  
Fig. 8.4  
V - V  
DS GS  
D
GS  
Fig. 8.5 |Y | - I  
Fig. 8.6  
R
- I  
fs  
D
DS(ON) D  
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Fig. 8.7  
R
DS(ON)  
- T  
Fig. 8.8  
I - V  
DR DS  
a
Fig. 8.9 Capacitance - V  
Fig. 8.10 V - T  
th a  
DS  
Fig. 8.11 P - T  
D
c
Fig. 8.12 Dynamic Input/Output Characteristics  
(Guaranteed Maximum)  
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Fig. 8.13 r /R  
- t  
w
th th(ch-c)  
(Guaranteed Maximum)  
Fig. 8.14 Safe Operating Area  
(Guaranteed Maximum)  
Fig. 8.15  
E
- T  
AS ch  
(Guaranteed Maximum)  
Fig. 8.16 Test Circuit/Waveform  
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,  
unless otherwise noted.  
7/8  
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Package Dimensions  
Unit: mm  
8/8  
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