TK8P25DA [FREESCALE]

MOSFETs Silicon N-Channel MOS (π-MOS); MOSFET的硅N沟道MOS (I ?? - ?? MOSI ²)
TK8P25DA
型号: TK8P25DA
厂家: Freescale    Freescale
描述:

MOSFETs Silicon N-Channel MOS (π-MOS)
MOSFET的硅N沟道MOS (I ?? - ?? MOSI ²)

文件: 总8页 (文件大小:335K)
中文:  中文翻译
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TK8P25DA  
MOSFETs Silicon N-Channel MOS (π-MOS)  
1. Applications  
Switching Voltage Regulators  
2. Features  
(1) Low drain-source on-resistance: RDS(ON) = 0.41 (typ.)  
(2) Low leakage current: IDSS = 10 µA (max) (VDS = 250 V)  
(3) Enhancement mode: Vth = 1.5 to 3.5 V (VDS = 10 V, ID = 1 mA)  
3. Packaging and Internal Circuit  
1: Gate (G)  
2: Drain (D)  
3: Source (S)  
DPAK  
4. Absolute Maximum Ratings (Note) (T = 25unless otherwise specified)  
a
Characteristics  
Symbol  
VDSS  
Rating  
250  
Unit  
V
Drain-source voltage  
Gate-source voltage  
VGSS  
±20  
Drain current (DC)  
Drain current (pulsed)  
Power dissipation  
(Note 1)  
(Note 1)  
ID  
IDP  
PD  
7.5  
30  
A
(Tc = 25)  
55  
W
mJ  
A
Single-pulse avalanche energy  
Avalanche current  
(Note 2)  
(Note 3)  
(Note 1)  
(Note 1)  
EAS  
IAR  
IDR  
IDRP  
Tch  
45  
7.5  
7.5  
30  
Reverse drain current (DC)  
Reverse drain current (pulsed)  
Channel temperature  
150  
Storage temperature  
Tstg  
-55 to 150  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
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5. Thermal Characteristics  
Characteristics  
Symbol  
Max  
Unit  
Channel-to-case thermal resistance  
Channel-to-ambient thermal resistance  
Rth(ch-c)  
Rth(ch-a)  
2.27  
125  
/W  
Note 1: Ensure that the channel temperature does not exceed 150.  
Note 2: VDD = 50 V, Tch = 25(initial), L = 1.33 mH, RG = 25 , IAR = 7.5 A  
Note 3: Repetitive rating; pulse width limited by maximum channel temperature  
Note: This transistor is sensitive to electrostatic discharge and should be handled with care.  
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6. Electrical Characteristics  
6.1. Static Characteristics (T = 25unless otherwise specified)  
a
Characteristics  
Gate leakage current  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
IGSS  
IDSS  
VGS = ±20 V, VDS = 0 V  
±1  
10  
µA  
Drain cut-off current  
VDS = 250 V, VGS = 0 V  
Drain-source breakdown voltage  
Gate threshold voltage  
V(BR)DSS ID = 10 mA, VGS = 0 V  
Vth VDS = 10 V, ID = 1 mA  
RDS(ON) VGS = 10 V, ID = 3.8 A  
250  
1.5  
V
3.5  
0.5  
Drain-source on-resistance  
0.41  
6.2. Dynamic Characteristics (T = 25unless otherwise specified)  
a
Characteristics  
Input capacitance  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
pF  
Ciss  
Crss  
Coss  
rg  
VDS = 100 V, VGS = 0 V, f = 1 MHz  
550  
5.1  
40  
Reverse transfer capacitance  
Output capacitance  
Gate resistance  
VDS = OPEN, f = 1 MHz  
See Figure 6.2.1.  
5.8  
28  
Switching time (rise time)  
Switching time (turn-on time)  
Switching time (fall time)  
Switching time (turn-off time)  
tr  
ns  
ton  
tf  
32  
16  
toff  
66  
Fig. 6.2.1 Switching Time Test Circuit  
6.3. Gate Charge Characteristics (T = 25unless otherwise specified)  
a
Characteristics  
Symbol  
Qg  
Test Condition  
Min  
Typ.  
16  
Max  
Unit  
nC  
Total gate charge (gate-source plus  
gate-drain)  
VDD 200 V, VGS = 10 V, ID = 7.5 A  
Gate-source charge 1  
Gate-drain charge  
Qgs1  
Qgd  
3.3  
5.3  
6.4. Source-Drain Characteristics (T = 25unless otherwise specified)  
a
Characteristics  
Diode forward voltage  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
VDSF  
trr  
IDR = 7.5 A, VGS = 0 V  
-1.7  
V
Reverse recovery time  
IDR = 7.5 A, VGS = 0 V  
150  
ns  
-dIDR/dt = 100 A/µs  
Reverse recovery charge  
Qrr  
Irr  
0.8  
11  
µC  
Peak reverse recovery current  
A
3/8  
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7. Marking  
Fig. 7.1 Marking  
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8. Characteristics Curves (Note)  
Fig. 8.1 I - V  
Fig. 8.2 I - V  
D DS  
D
DS  
Fig. 8.3 I - V  
Fig. 8.4  
V - V  
DS GS  
D
GS  
Fig. 8.5 |Y | - I  
Fig. 8.6  
R
- I  
fs  
D
DS(ON) D  
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Fig. 8.7  
R
DS(ON)  
- T  
Fig. 8.8  
I - V  
DR DS  
a
Fig. 8.9 C - V  
Fig. 8.10 V - T  
th a  
DS  
Fig. 8.11 P - T  
D
c
Fig. 8.12 Dynamic Input/Output Characteristics  
(Guaranteed Maximum)  
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Fig. 8.13 r /R  
- t  
w
th th(ch-c)  
(Guaranteed Maximum)  
Fig. 8.14 Safe Operating Area  
(Guaranteed Maximum)  
Fig. 8.15  
E
- T  
AS ch  
(Guaranteed Maximum)  
Fig. 8.16 Test Circuit/Waveform  
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Package Dimensions  
Unit: mm  
Weight: 0.36 g (typ.)  
8/8  
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