FT313HQ-R [FTDI]
USB2.0 HS Embedded Host Controller;型号: | FT313HQ-R |
厂家: | FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD. |
描述: | USB2.0 HS Embedded Host Controller |
文件: | 总67页 (文件大小:1647K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Document No.: FT_000589
FT313H USB2.0 HS Host Controller Datasheet Version 1.2
Clearance No.: FTDI# 318
Future Technology Devices
International Ltd
.
FT313H
(USB2.0 HS Embedded Host
Controller)
Low
application.
power
consumption
for
portable
The FT313H is a Hi-Speed Universal
Serial Bus (USB) Host Controller
compatible with Universal Serial Bus
Specification Rev 2.0 and supports
data transfer speeds of up to 480M
bit/s. The FT313H has the following
advanced features:
Supports bus interface I/O voltage from 1.62V
to 3.63V.
Supports hybrid power mode; VCC(3V3) is not
present, VCC(I/O) is powered.
Internal voltage regulator supplies 1.2v to the
digital core.
Single chip USB2.0 Hi-Speed compatible.
Supports Battery Charging Specification Rev
1.2.
Compatible to Enhanced Host Controller
Interface Specification Rev 1.0.
The downstream port can be configured as
SDP, CDP or DCP.
The USB1.1 host is integrated into the USB2.0
EHCI compatible host controller.
Supports VBUS power switching and over
current control.
Single USB host port.
-40°C to 85°C extended operating temperature
range.
Supports data transfer at high-speed (480M
bit/s), full-speed (12M bit/s), and low-speed
(1.5M bit/s).
Available in compact Pb-free 64 Pin QFN, LQFP
and TQFP packages (all RoHS compliant).
Supports the Isochronous, Interrupt, Control,
and Bulk transfers.
Supports the split transaction for high-speed
Hub and the preamble transaction for full-
speed Hub.
Supports multiple processor interfaces with 8-
bit or 16-bit bus: SRAM, NOR Flash, and
General multiplex.
Single configurable interrupt (INT) line for host
controller.
Integrated 24kB high speed RAM memory.
Supports DMA operation.
Integrated Phase-Locked Loop (PLL) supports
external 12MHz, 19.2MHz, and 24MHz crystal,
and direct external clock source input.
Neither the whole nor any part of the information contained in, or the product described in this manual, may be adapted or reproduced
in any material or electronic form without the prior written consent of the copyright holder. This product and its documentation are
supplied on an as-is basis and no warranty as to their suitability for any particular purpose is either made or implied. Future Technology
Devices International Ltd will not accept any claim for damages howsoever arising as a result of use or failure of this product. Your
statutory rights are not affected. This product or any variant of it is not intended for use in any medical appliance, device or system in
which the failure of the product might reasonably be expected to result in personal injury. This document provides preliminary
information that may be subject to change without notice. No freedom to use patents or other intellectual property rights is implied by
the publication of this document. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow
G41 1HH United Kingdom. Scotland Registered Company Number: SC136640
Copyright © 2013 Future Technology Devices International Limited
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Document No.: FT_000589
FT313H USB2.0 HS Host Controller Datasheet Version 1.2
Clearance No.: FTDI# 318
1 Typical Applications
TV/TV box
Printer
Media player
Tablet
Instrumentation
Set-top box
1.1 Part Numbers
Part Number
FT313HQ-x
FT313HL-x
Package
64 Pin QFN
64 Pin LQFP
64 Pin TQFP
FT313HP-x
Table 1-1 FT313H Numbers
Note: Packaging codes for x is:
-R: Taped and Reel, (QFN is 3000pcs, LQFP is 1000 pcs, TQFP is 2500pcs per reel)
-T: Tray packing, (QFN is 2600pcs, LQFP is 1600 pcs, TQFP is 2500pcs per tray)
For example: FT313HQ-R is 3000 QFN pcs in taped and reel packaging
1.2 USB Compliant
At the time of writing this datasheet, the FT313H was still to complete USB compliance testing.
Copyright © 2013 Future Technology Devices International Limited
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Document No.: FT_000589
FT313H USB2.0 HS Host Controller Datasheet Version 1.2
Clearance No.: FTDI# 318
2 FT313H Block Diagram
DMA
Controller
VCC(I/O)
X1/CLKIN
AD[15:0]
RAM 24KB
A[7:0]
ALE/ADV_N
X2
MEMORY ARBITER
PLL
FREQSEL1
CLE
FT313H
Interface
Control
Logic
FREQSEL2
AGND
CS_N/CE_N
RD_N/RE_N/
OE_N
EHCI
Compatible
Host Controller
POR
WR_N/WE_N
INT
RESET_N
GND
DREQ
VCC(1V2)
ATX
REGULATOR
DACK
VBUS
VOUT(1V2)
TESTEN
BCD
CPE0
CPE1
VCC(3V3)
PSW_N
OC_N RREF DP DM AGND
Figure 2-1 FT313H Block Diagram
For a description of each function please refer to Section 4.
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Document No.: FT_000589
FT313H USB2.0 HS Host Controller Datasheet Version 1.2
Clearance No.: FTDI# 318
Table of Contents
1
Typical Applications...................................................................... 2
1.1 Part Numbers...................................................................................... 2
1.2 USB Compliant.................................................................................... 2
FT313H Block Diagram ................................................................. 3
Device Pin Out and Signal Description.......................................... 7
3.1 Pin Out – 64pin QFN ........................................................................... 7
3.2 Pin Out – 64pin LQFP.......................................................................... 8
3.3 Pin Out – 64pin TQFP.......................................................................... 9
3.4 Pin Description ................................................................................. 10
Function Description................................................................... 14
4.1 Microcontroller Bus Interface ........................................................... 14
4.2 SRAM bus interface mode ................................................................. 15
4.3 NOR bus interface mode ................................................................... 16
4.4 General multiplex bus interface mode .............................................. 16
4.5 Interface mode lock.......................................................................... 16
4.6 DMA controller.................................................................................. 16
4.7 EHCI host controller ......................................................................... 17
2
3
4
4.8 System clock..................................................................................... 17
4.8.1 Phase Locked Loop (PLL) clock multiplier ...................................................................... 17
4.9 Power management.......................................................................... 18
4.9.1 Power up and reset sequence...................................................................................... 18
4.9.2 Power supply............................................................................................................. 18
4.9.3 ATX reference voltage ................................................................................................ 18
4.9.4 Power modes ............................................................................................................ 18
4.10
BCD mode ...................................................................................... 19
5
Host controller specific registers................................................ 20
5.1 Overview of registers ....................................................................... 20
5.2 EHCI operational registers................................................................ 21
5.2.1 HCCAPLENGTH register (address = 00h)....................................................................... 21
5.2.2 HCSPARAMS register (address = 04h).......................................................................... 21
5.2.3 HCCPARAMS register (address = 08h).......................................................................... 22
5.2.4 USBCMD register (address = 10h) ............................................................................... 22
5.2.5 USBSTS register (address = 14h) ................................................................................ 24
5.2.6 USBINTR register (address = 18h)............................................................................... 25
5.2.7 FRINDEX register (address = 1Ch)............................................................................... 26
5.2.8 PERIODICLISTADDR register (address = 24h) ............................................................... 26
5.2.9 ASYNCLISTADDR register (address = 28h).................................................................... 26
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Clearance No.: FTDI# 318
5.2.10
POSTSC register (address = 30h)............................................................................. 27
5.3 Configuration registers..................................................................... 29
5.3.1 EOTTIME register (address = 34h)............................................................................... 29
5.3.2 CHIPID register (address = 80h) ................................................................................. 30
5.3.3 HWMODE register (address = 84h) .............................................................................. 30
5.3.4 EDGEINTC register (address = 88h)............................................................................. 31
5.3.5 SWRESET register (address = 8Ch).............................................................................. 31
5.3.6 MEMADDR register (address = 90h)............................................................................. 33
5.3.7 DATAPORT register (address = 92h) ............................................................................ 33
5.3.8 DATASESSION register (address = 94h)....................................................................... 33
5.3.9 CONFIG register (address = 96h) ................................................................................ 33
5.3.10
5.3.11
5.3.12
AUX_MEMADDR register (address = 98h).................................................................. 35
AUX_DATAPORT register (address = 9Ah) ................................................................. 35
SLEEPTIMER register (address = 9Ch) ...................................................................... 35
5.4 Interrupt registers............................................................................ 35
5.4.1 HCINTSTS register (address = A0h)............................................................................. 35
5.4.2 HCINTEN register (address = A4h)............................................................................... 37
5.5 USB testing registers........................................................................ 38
5.5.1 TESTMODE register (address = 50h)............................................................................ 38
5.5.2 TESTPMSET1 register (address = 70h) ......................................................................... 39
5.5.3 TESTPMSET2 register (address = 74h) ......................................................................... 39
6
Devices Characteristics and Ratings........................................... 40
6.1 Absolute Maximum Ratings............................................................... 40
6.2 DC Characteristics............................................................................. 41
6.3 AC Characteristics............................................................................. 44
6.4 Timing .............................................................................................. 46
6.4.1 PIO timing ................................................................................................................ 46
6.4.2 DMA timing............................................................................................................... 52
7
Application Examples ................................................................. 53
7.1 Examples of Bus Interface connection.............................................. 54
7.1.1 16-Bit SRAM asynchronous bus interface ...................................................................... 54
7.1.2 8-Bit SRAM asynchronous bus interface........................................................................ 54
7.1.3 16-Bit NOR asynchronous bus interface........................................................................ 55
7.1.4 8-Bit NOR asynchronous bus interface.......................................................................... 55
7.1.5 16-Bit General Multiplex asynchronous bus interface...................................................... 55
7.1.6 8-Bit General Multiplex asynchronous bus interface........................................................ 56
8
Package Parameters................................................................... 57
8.1 FT313H Package Markings................................................................ 57
8.1.1 QFN-64 .................................................................................................................... 57
8.1.2 LQFP-64 ................................................................................................................... 58
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Document No.: FT_000589
FT313H USB2.0 HS Host Controller Datasheet Version 1.2
Clearance No.: FTDI# 318
8.1.3 TQFP-64 ................................................................................................................... 59
8.2 QFN-64 Package Dimensions ............................................................ 60
8.3 LQFP-64 Package Dimensions........................................................... 61
8.4 TQFP-64 Package Dimensions........................................................... 62
8.5 Solder Reflow Profile ........................................................................ 63
9
FTDI Chip Contact Information................................................... 64
Appendix A – References........................................................................... 65
Appendix B - List of Figures and Tables..................................................... 65
Appendix C - Revision History.................................................................... 67
Copyright © 2013 Future Technology Devices International Limited
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Document No.: FT_000589
FT313H USB2.0 HS Host Controller Datasheet Version 1.2
Clearance No.: FTDI# 318
3 Device Pin Out and Signal Description
3.1 Pin Out – 64pin QFN
AGND
AD0
1
PSW_N
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
AGND
2
AD1
3
VOUT(1V2)
X2
AD2
AD3
4
5
X1/CLKIN
AGND
VCC(I/O)
6
FTD
I
AD4
7
FREQSEL2
AD5
AD6
8
FREQSEL1
RESET_N
CLE
XXXXX
XXXXX
9
AD7
10
11
12
13
14
15
16
FT313H
Q
ALE/ADV_N
AD8
AD9
DACK
DREQ
YYWW
-B
AD10
AD11
VCC(I/O)
A7
VCC(I/O)
AD12
A6
Figure 3-1 Pin Configuration QFN64 (top-down view)
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Document No.: FT_000589
FT313H USB2.0 HS Host Controller Datasheet Version 1.2
Clearance No.: FTDI# 318
3.2 Pin Out – 64pin LQFP
48
1
2
AGND
AD0
PSW_N
47
AGND
46
3
AD1
VOUT(1V2)
45
X2
4
AD2
44
5
AD3
X1/CLKIN
43
6
FTD
I
VCC(I/O)
AD4
AGND
42
41
40
39
38
37
36
35
34
33
7
FREQSEL2
FREQSEL1
RESET_N
CLE
8
AD5
XXX
XXX
XXX
X
9
AD6
10
11
12
13
14
15
16
AD7
AD8
ALE/ADV_N
DACK
FT3
13H
L
AD9
AD10
AD11
VCC(I/O)
AD12
DREQ
VCC(I/O)
A7
YYW
W-B
A6
Figure 3-2 Pin Configuration LQFP64 (top-down view)
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Document No.: FT_000589
FT313H USB2.0 HS Host Controller Datasheet Version 1.2
Clearance No.: FTDI# 318
3.3 Pin Out – 64pin TQFP
48
1
2
AGND
AD0
PSW_N
47
AGND
46
3
AD1
VOUT(1V2)
45
X2
4
AD2
44
5
AD3
X1/CLKIN
43
6
FTD
I
VCC(I/O)
AD4
AGND
42
41
40
39
38
37
36
35
34
33
7
FREQSEL2
FREQSEL1
RESET_N
CLE
8
AD5
XXX
XXX
XXX
X
9
AD6
10
11
12
13
14
15
16
AD7
AD8
ALE/ADV_N
DACK
FT3
13H
P
AD9
AD10
AD11
VCC(I/O)
AD12
DREQ
VCC(I/O)
A7
YYW
W-B
A6
Figure 3-3 Pin Configuration TQFP64 (top-down view)
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Document No.: FT_000589
FT313H USB2.0 HS Host Controller Datasheet Version 1.2
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3.4 Pin Description
Pin No.
Name
Type
Description
1
AGND
AD0
P
Analog Ground
Bit 0 of the address and data bus
2
3
I/O
I/O
I/O
I/O
P
Bidirectional pad; push-pull, three-state output. 3.3V
tolerant
Bit 1 of the address and data bus
AD1
AD2
Bidirectional pad; push-pull, three-state output. 3.3V
tolerant
Bit 2 of the address and data bus
4
Bidirectional pad; push-pull, three-state output. 3.3V
tolerant
Bit 3 of the address and data bus
5
AD3
Bidirectional pad; push-pull, three-state output. 3.3V
tolerant
I/O supply voltage; connect a 0.1uF decoupling
capacitor
6
VCC(I/O)
AD4
1.8V, 2.5V or 3.3V
Bit 4 of the address and data bus
7
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Bidirectional pad; push-pull, three-state output. 3.3V
tolerant
Bit 5 of the address and data bus
8
AD5
Bidirectional pad; push-pull, three-state output. 3.3V
tolerant
Bit 6 of the address and data bus
9
AD6
Bidirectional pad; push-pull, three-state output. 3.3V
tolerant
Bit 7 of the address and data bus
10
11
12
13
AD7
Bidirectional pad; push-pull, three-state output. 3.3V
tolerant
Bit 8 of the address and data bus
AD8
Bidirectional pad; push-pull, three-state output. 3.3V
tolerant
Bit 9 of the address and data bus
AD9
Bidirectional pad; push-pull, three-state output. 3.3V
tolerant
Bit 10 of the address and data bus
AD10
Bidirectional pad; push-pull, three-state output. 3.3V
tolerant
Bit 11 of the address and data bus
14
15
AD11
I/O
P
Bidirectional pad; push-pull, three-state output. 3.3V
tolerant
I/O supply voltage; connect a 0.1uF decoupling
capacitor
VCC(I/O)
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FT313H USB2.0 HS Host Controller Datasheet Version 1.2
Clearance No.: FTDI# 318
Pin No.
Name
Type
Description
1.8V, 2.5V or 3.3V
Bit 12 of the address and data bus
16
17
18
19
AD12
AD13
AD14
AD15
I/O
I/O
I/O
I/O
Bidirectional pad; push-pull, three-state output. 3.3V
tolerant
Bit 13 of the address and data bus
Bidirectional pad; push-pull, three-state output. 3.3V
tolerant
Bit 14 of the address and data bus
Bidirectional pad; push-pull, three-state output. 3.3V
tolerant
Bit 15 of the address and data bus
Bidirectional pad; push-pull, three-state output. 3.3V
tolerant
Core power 1.2V input; for normal operation, this
pin must be connected to pin 46. Connect a 0.1uF
decoupling capacitor
20
21
VCC(1V2)
P
I
Chip select;
CS_N/CE_N
Input ; 3.3V tolerant
Read enable, or read latch; when not in use,
connect to VCC(I/O)
RD_N
22
I
/RE_N/OE_N
Input; 3.3V tolerant
WR_N
Write enable; when not in use, connect to VCC(I/O)
Input; 3.3V tolerant
23
24
I
/WE_N
Interrupt output
INT
O
Push-pull output; 3.3V tolerant
I/O supply voltage; connect a 0.1uF decoupling
capacitor
25
26
VCC(I/O)
P
I
1.8V, 2.5V or 3.3V
Bit 0 of the address bus; when not in use, connect to
GND
A0
A1
A2
A3
Input; 3.3V tolerant
Bit 1 of the address bus; when not in use, connect to
GND
27
28
29
I
I
I
Input; 3.3V tolerant
Bit 2 of the address bus; when not in use, connect to
GND
Input; 3.3V tolerant
Bit 3 of the address bus; when not in use, connect to
GND
Input; 3.3V tolerant
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Document No.: FT_000589
FT313H USB2.0 HS Host Controller Datasheet Version 1.2
Clearance No.: FTDI# 318
Pin No.
Name
Type
Description
Bit 4 of the address bus; when not in use, connect to
GND
30
A4
I
Input; 3.3V tolerant
Bit 5 of the address bus; when not in use, connect to
GND
31
32
33
A5
VCC (1V2)
A6
I
P
I
Input; 3.3V tolerant
Core power 1.2V input; for normal operation, this
pin must be connected to pin 46. Connect a 0.1uF
decoupling capacitor.
Bit 6 of the address bus; when not in use, connect to
GND
Input; 3.3V tolerant
Bit 7 of the address bus; when not in use, connect to
GND
34
35
A7
I
Input; 3.3V tolerant
I/O supply voltage; connect a 0.1uF decoupling
capacitor
VCC(I/O)
P
1.8V, 2.5V or 3.3V
DMA request;
36
37
38
DREQ
DACK
O
I
Push-pull output; 3.3V tolerant
DMA acknowledge; Internal pull-down.
Input; 3.3V tolerant
Address latch enable
Input; 3.3V tolerant
ALE/ADV_N
I
Command latch enable
Input; 3.3V tolerant
39
40
41
CLE
I
I
I
RESET_N
FREQSEL1
Chip reset; Internal pull-up. Input; 3.3V tolerant
Input clock frequency selection pin1
Input; 3.3V tolerant
Input clock frequency selection pin2
Input; 3.3V tolerant
42
FREQSEL2
I
43
44
AGND
P
Analog Ground
Crystal oscillator or clock input; 3.3V peak input
allowed
X1/CLKIN
AI
Crystal oscillator output; leave open if an external
clock is applied on pin X1/CLKIN
45
46
X2
AO
AO
VOUT(1V2)
Internal 1.2V regulator output; connect 4.7uF and
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FT313H USB2.0 HS Host Controller Datasheet Version 1.2
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Pin No.
Name
Type
Description
0.1uF decoupling capacitors to this pin.
47
48
AGND
P
Analog Ground
Port power switch; when not in use, connect to
VCC(3V3) through a 10kΩ resistor
PSW_N
OD
Open drain output; 5V tolerant
Over current input; when not in use, connect to
VCC(3V3) through a 10KΩ resistor
49
50
OC_N
RREF
I
Input; 5V tolerant
Port reference resistor connection
AI
Connect 12 kΩ±1% resistor between RREF and GND
51
52
53
54
55
56
NC
DM
No connect
AI/O
Port DM; connect to the D- pin of the USB connector
NC
No connect
DP
AI/O
P
Port DP; connect to the D+ pin of the USB connector
AGND
NC
Analog Ground
No connect
Supply 3.3V voltage; Connect 10uF and 0.1uF
decoupling capacitors
57
VCC(3V3)
P
P
58
59
60
NC
AGND
NC
No connect
Analog Ground
No connect
VBUS discharge.
5V tolerant
61
62
63
64
VBUS
CPE0
OD
I
I
I
Bit 0 to select charging port emulation type
Enable test mode. Internal pull-down.
For normal operation leave floating.
TESTEN
CPE1
Bit 1 to select charging port emulation type
Table 3-1 FT313H pin description
Notes:
P
: Power or ground
: Input
I/O
AI
: Bi-direction Input and Output
: Analog Input
I
O
OD
: Output
AO
: Analog Output
: Open drain output
AI/O : Analog Input / Output
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FT313H USB2.0 HS Host Controller Datasheet Version 1.2
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4 Function Description
The FT313H is a USB2.0 compatible EHCI single port host controller which is mainly composed
of the following:
Microcontroller bus interface
SRAM bus interface mode
NOR bus interface mode
General multiplex bus interface mode
Interface mode lock
DMA controller
EHCI host controller
System clock
Power management
BCD mode
The functions for each block are briefly described in the following subsections.
4.1 Microcontroller Bus Interface
The FT313H has a fast advance general purpose interface to communicate with most types of
microcontrollers and microprocessors. This microcontroller interface is configured using pins
ALE/ADV_N and CLE to accommodate most types of interfaces. The bus interface supports 8-
bit and 16-bit, which can be configured using bit DATA_BUS_WIDTH. Three bus interface types
are selected using inputs ALE/ADV_N and CLE during power up, the RD_N /RE_N/OE_N and
CS_N/CE_N pins, or the RESET_N pin. Table 4.1 provides detail of bus configuration for each
mode. Table 4.2 shows pinout information of each bus interface.
Bus Mode
ALE/ADV_N
CLE
DATA_BUS
_WIDTH
Signal Description
A[7:0]: 8-bit address bus
AD[7:0]: 8-bit data bus
SRAM 8-bit
HIGH
HIGH
1
Write (WR_N), read (RD_N), chip
select (CS_N): control signals for
normal SRAM mode
DACK: DMA acknowledge input
DREQ: DMA request output
A[7:0]: 8-bit address bus
AD[15:0]: 16-bit data bus
SRAM 16-bit
HIGH
HIGH
0
Write (WR_N), read (RD_N), chip
select (CS_N): control signals for
normal SRAM mode
DACK: DMA acknowledge input
DREQ: DMA request output
AD[7:0]: 8-bit data bus
NOR 8-bit
HIGH
HIGH
LOW
LOW
LOW
HIGH
1
0
1
ADV_N, write enable, output enable,
chip select: control signals
AD[15:0]: 16-bit data bus
NOR 16-bit
ADV_N, write enable, output enable,
chip select: control signals
AD[7:0]: 8-bit data bus
ALE, write(WR_N), read(RD_N), chip
General
Multiplex 8-bit
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Bus Mode
ALE/ADV_N
CLE
DATA_BUS
_WIDTH
Signal Description
select: control signals
DACK: DMA acknowledge input
DREQ: DMA request output
AD[15:0]: 16-bit data bus
General
Multiplex 16-bit
LOW
HIGH
0
ALE, write(WR_N), read(RD_N), chip
select: control signals
DACK: DMA acknowledge input
DREQ: DMA request output
Table 4-1 Bus Configuration modes
SRAM mode
NOR mode
General
Multiplex
mode
Type
Description
AD[15:0]
A[7:0]
-
AD[15:0]
-
AD[15:0]
I/O
Data or address bus
Address bus
-
I
I
I
I
ADV_N
CS_N
OE_N
ALE
Address or command valid
Chip select
CS_N
CS_N
Read control
RD_N/RE_N
RD_N/RE_N
WR_N/WE_N
INT
WE_N
WR_N/WE_N
INT
I
Write control
INT
O
O
I
Interrupt request
DMA request
DREQ
-
-
DREQ
DACK
DACK
DMA acknowledge
Table 4-2 Pin information of the bus interface
4.2 SRAM bus interface mode
The bus interface will be in SRAM 16-bit mode if pins ALE/ADV_N and CLE are HIGH, when:
The CS_N/CE_N pin goes LOW, and the RD_N /RE_N/OE_N pin goes LOW.
•
Then, if the DATA_BUS_WIDTH bit is set, the bus interface will be in SRAM 8-bit mode.
In SRAM mode, A[7:0] is the 8-bit address bus and AD[15:0] is the separate 16-bit data bus.
The FT313H pins RD_N /RE_N/OE_N and WR_N/WE_N are the read and write strobes. The
SRAM bus interface supports both 8-bit and 16-bit bus width that can be configured by setting
or clearing bit DATA_BUS_WIDTH. The DMA transfer is also applicable to this interface.
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4.3 NOR bus interface mode
The bus interface will be in NOR 16-bit mode, if pin ALE/ADV_N is HIGH and pin CLE is LOW,
when:
•
The CS_N/CE_N pin goes LOW, and the RD_N /RE_N/OE_N pin goes LOW.
Then, if the DATA_BUS_WIDTH bit is set, the bus interface will be in NOR 8-bit mode.
The NOR Flash interface access consists of two phases: address and data.
The address is valid when CS_N/CE_N and ADV_N are LOW, and the address is latched at the
rising edge of ADV_N. For a read operation, WE_N must be HIGH. OE_N is the data output
control. When active, the addressed register or the buffer data is driven to the I/O bus. The
read operation is completed when CS_N/CE_N is de-asserted. For a write operation, OE_N
must be HIGH. The WE_N assertion can start when ADV_N is de-asserted. WE_N is the data
input strobe signal. When de-asserted, data will be written to the addressed register or the
buffer. The write operation is completed when CS_N/CE_N is de-asserted.
4.4 General multiplex bus interface mode
The bus interface will be in general multiplex 16-bit mode, if pin ALE/ADV_N is LOW and pin
CLE is HIGH, when:
•
The CS_N/CE_N pin goes LOW, and the RD_N /RE_N/OE_N pin goes LOW.
Then, if the DATA_BUS_WIDTH bit is set, the bus interface will be in general multiplex 8-bit
mode. The general multiplex bus interface supports most advance application processors.
The general multiplex interface access consists of two phases: address and data.
The address is valid when ALE/ADV_N goes HIGH, and the address is latched at the falling
edge of ALE/ADV_N. For a read operation, WR_N/WE_N must be HIGH. RD_N /RE_N/OE_N is
the data output control. When active, the addressed register or the buffer data is driven to the
I/O bus. The read operation is completed when CS_N/CE_N is de-asserted. For a write
operation, RD_N /RE_N/OE_N must be HIGH. The WR_N/WE_N assertion can start when
ALE/ADV_N is de-asserted. WR_N/WE_N is the data input strobe signal. When de-asserted,
data will be written to the addressed register or the buffer. The write operation is completed
when CS_N/CE_N is de-asserted. The DMA transfer is also applicable to this interface.
4.5 Interface mode lock
The bus interface can be locked in any of the modes, SRAM, NOR, or general multiplex, using
bit 3 of the HW Mode Control register. To lock the interface in a particular mode:
1. Read bits 7 and 6 of the SW Reset register.
2. Set bit 3 of the HW Mode Control register to logic 1.
3. Read bits 7 and 6 of the SW Reset register to ensure that the interface is locked in the
desired mode.
Note: the default is 16-bit SRAM mode.
4.6 DMA controller
The DMA controller of the FT313H is used to transfer data between the system memory and
local buffers. It shares data bus AD[15:0] and control signals WR_N/WE_N, RD_N
/RE_N/OE_N, and CS_N/CE_N. The logic is dependent on the bus interface mode setting.
DREQ signal is from the FT313H to indicate the start of DMA transfer. DACK signal is used to
differentiate if data transferred is for the DMA or PIO access. When DACK is asserted, it
indicates that it is still in DMA mode. When DACK is de-asserted, it indicates that PIO is to be
accessed. ALE/ADV_N and CLE are ignored in a DMA access cycle. Correct data will be
captured only on the rising edge of WR_N/WE_N and RD_N /RE_N/OE_N.
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The DMA controller of the FT313H has only one DMA channel. Therefore, only one DMA read or
DMA write may take place at a time. Assign the DMA transfer length in the Data Session
Length register for each DMA transfer. If the transfer length is larger than the burst counter,
the DREQ signal will de-assert at the end of each burst transfer. DREQ will re-assert at the
beginning of the each burst.
When DMA is transferring data from/to local buffer, if it wants to access local buffer content by
PIO mode, can use auxiliary memory access registers AUX_MEMADDR and AUX_DATAPORT to
read/write data from/to local buffer with single cycle.
For a 16-bit DMA transfer, the minimum burst length is 2 bytes. This means that the burst
length is only one DMA cycle. Therefore, DREQ and DACK will assert and de-assert at each
DMA cycle.
The FT313H will be asserted DMA EOT interrupt to indicate that the DMA transfer has either
successfully completed or terminated.
4.7 EHCI host controller
The FT313H is a one-port EHCI-compatible host controller which supports all the USB 2.0
compliant Low-speed, Full-speed, and High-speed devices and split/preamble transactions for
the HS/FS hub.
The EHCI host controller supports two categories of the transfer types, the periodic and
asynchronous transfer types. The periodic transfer type includes the isochronous and interrupt
transfers, while the asynchronous transfer type includes the control and bulk transfers.
The EHCI host controller has schedule interface that provides to the separate schedules for
each category of the transfer type. The periodic schedule is based on a time-oriented frame list
that represents a slide window of time of the host controller work items. All the ISO and INT
transfers are serviced via the periodic schedule. The asynchronous schedule is a simple circular
list of the schedule work items that provides a round robin service opportunity for all the
asynchronous transfers.
The EHCI host controller contains the Isochronous Transfer Descriptor (iTD), Queue Head (qH)
and Queue Element Transfer Descriptor (qTD), and Split Transaction Isochronous Transfer
Descriptor (siTD) data structure interface to support the isochronous/interrupt/control/bulk
transfers and split transaction.
The EHCI host controller internal buffer memory is 24KB. START_ADDR_MEM register is
allocated from 0x0000 to 0x5FFF.
4.8 System clock
4.8.1 Phase Locked Loop (PLL) clock multiplier
The internal PLL supports 12MHz, 19.2MHz, or 24MHz input, which can be crystal or a clock
already existing in system. The frequency selection can be done using the FREQSEL1 and
FREQSEL2 pins. Table 4.3 provides clock frequency selection.
FREQSEL1
FREQSEL2
Clock Frequency
12MHz
0
1
0
0
0
1
19.2MHz
24MHz
Table 4-3 Clock frequency select
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4.9 Power management
4.9.1 Power up and reset sequence
When VCC(I/O) and VCC(3V3) are on, an internal regulator will power on with VCC(3V3) on.
An internal POR pulse will be generated during the regulator power on, so that internal circuits
are in reset state until the regulator power is stable.
4.9.2 Power supply
Power supplies are defined in Table 4.4.
Symbol
VCC(I/O)
VCC(3V3)
Typical
1.8V, or 2.5V, or 3.3V Supply for digital I/O pad
3.3V Supply for chip
Description
Table 4-4 Power supply
4.9.3 ATX reference voltage
The ATX circuit provides a stable internal voltage reference (+1.2V) to bias the analog
circuitry. This circuit requires an accurate external reference resistor. Connect 12kΩ±1%
resistor between pins RREF and GND.
4.9.4 Power modes
Power management configuration defined in Table 4.5.
For each bit description, see CONFIG register.
OSC_EN
PLL_EN
HC_CLK_EN
Description
Operation mode
Suspend mode
1
0
1
0
1
0
Table 4-5 power management configuration
4.9.4.1 Operation mode
All power supplies are present. Host controller is active.
4.9.4.2 Suspend mode
All power supplies are present. Host controller goes to USB suspend.
The steps for the host suspend are as follows:
1. Clear the RS bit of the USBCMD register to stop the host controller from executing
schedule.
2. Set the PO_SUSP bit of the PORTSC register to force the host controller to go into
suspend.
3. Disable OSC_EN, PLL_EN and HC_CLK_EN bits of the CONFIG register to save power.
4. Clear the U_SUSP_U bit of the EOTTIME register to put the chip into suspend mode.
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4.9.4.3 Wake up
The regulator will be in normal operating mode and the clock/oscillator/PLL will be enabled
when either of these conditions is triggered:
1. Dummy read access with a LOW pulse on pins CS_N/CE_N and RD_N /RE_N/OE_N.
2. USB device connects or disconnects.
3. Remote wake up from external USB device.
4. Over current condition is triggered on OC_N if enabled by register.
After wake up automatically set corresponding bit of the CONFIG register, must set the
U_SUSP_U bit of the EOTTIME register to wake up the chip.
4.10 BCD mode
The FT313H is an EHCI-compatible host controller with BCD block function, which follows the
Battery Charging Specification Revision 1.2(BC1.2) by USB-IF. The block function that
emulates USB host port as either Charging Downstream Port (CDP) or Dedicated Charging Port
(DCP) which provides higher current source than Standard Downstream Port (SDP).
The BCD logic block will decode the mode of operation and choose by following setting:
1. BCD function is default enable by CONFIG register bit[5] setting.
2. BCD mode selection is default controlled by external pins configuration. Set CONFIG
register bit[15] to take over BCD mode setting by software.
3. Same configuration by CONFIG register bit[14:13] to set BCD mode if software takes
over control.
CPE1
CPE0
Mode
BCD_EN
Description
0
0
SDP
1
Standard downstream port, VBUS current
limit ≤ 500mA
0
1
DCP
1
Dedicated charging port, USB host no
functional on this port, VBUS current limit ≤
1.5A
1
X
1
X
CDP
X
1
0
Charging downstream port alternative
configuration, VBUS current limit ≤ 1.5A
BCD function disable
Table 4-6 BCD mode configuration
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5 Host controller specific registers
5.1 Overview of registers
Table 5.1 shows the definitions of the FT313H host controller specific registers.
Address
Register
Reset value
Description
EHCI operational register
00h
04h
08h
10h
14h
18h
1Ch
24h
28h
30h
HCCAPLENGTH
HCSPARAMS
HCCPARAMS
USBCMD
0100 0010h
0000 0001h
0000 0006h
0008 0B00h
0000 1000h
0000 0000h
0000 0000h
0000 0000h
0000 0000h
0000 0000h
Capability register
Structural parameter register
Capability parameter register
USB command register
USBSTS
USB status register
USBINTR
USB interrupt enable register
Frame index register
FRINDEX
PERIODICLISTADDR
ASYNCLISTADDR
POSTSC
Periodic frame list base address register
Current asynchronous list address register
Port status and control register
Configuration register
34h
EOFTIME
0000 0041h
EOF time and asynchronous schedule sleep timer
register
80h
84h
88h
8Ch
90h
92h
94h
96h
98h
9Ah
9Ch
CHIPID
0313 0001h
0000 0000h
0000 001Fh
0000 0000h
0000h
Chip ID register
HWMODE
HW mode control register
Edge interrupt control register
SW reset register
EDGEINTC
SWRESET
MEMADDR
DATAPORT
DATASESSION
CONFIG
Memory address register
Data port register
0000h
0000h
Data session length register
Configuration register
Auxiliary memory address register
Auxiliary data port register
Sleep timer register
1FA0h
AUX_MEMADDR
AUX_DATAPORT
SLEEPTIMER
0000h
0000h
0400h
Interrupt register
A0h HCINTSTS
0000h
Host controller interrupt status register
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Address
Register
Reset value
Description
A4h
HCINTEN
0000h
Host controller interrupt enable register
USB testing register
50h
70h
74h
TESTMODE
0000 0000h
0000 0000h
0000 0000h
Test mode register
TESTPMSET1
Test parameter setting 1 register
Test parameter setting 2 register
TESTPMSET2
Table 5-1 Overview of host controller specific registers
5.2 EHCI operational registers
5.2.1 HCCAPLENGTH register (address = 00h)
This register is used as an offset to add to register base to find the beginning of the operational register
space. The high two bytes contain a BCD encoding of the EHCI revision number supported by this host
controller. The most signification byte of this register represents a major revision and the least
signification byte is the minor revision.
Bit
Name
Type
Default value
Description
Host Controller Interface Version Number
[31:16]
HCIVERSION
RO
16’h0100
This register is a 2-byte register containing a
BCD encoding of the EHCI revision number
supported by the host controller.
[15:8]
[7:0]
Reserved
RO
RO
8’h0
-
Capability Register Length
CAPLENGTH
8’h10
This register is used as an offset added to
register base to find out the beginning of the
Operational Register Space.
Table 5-2 Capability register
5.2.2 HCSPARAMS register (address = 04h)
This is a set of fields that are structural parameter: number of downstream ports, etc.
Bit
Name
Type
RO
Default value
28’h0
Description
[31:4]
[3:0]
Reserved
N_PORTS
-
Number of Ports
RO
4’h1
This field specifies the number of the physical
downstream ports implemented on the host
controller.
Table 5-3 Structural parameter register
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5.2.3 HCCPARAMS register (address = 08h)
This is multiple mode control (time base bit functionality) and addressing capability.
Bit
Name
Reserved
ASPC
Type
RO
Default value
29’h0
Description
[31:3]
2
-
Asynchronous Schedule Park Capability
RO
1’b1
The host controller supports the park feature for
high-speed queue heads in the Asynchronous
Schedule. This feature can be disabled or
enabled and set to a specific level by using the
Asynchronous Schedule Park Mode Enable and
Asynchronous Schedule Park Mode Count fields
in the USBCMD register.
Programmable Frame List Flag
1
0
PFLF
RO
RO
1’b1
1’b0
When this bit is set to 1b, the system software
can specify and use a smaller frame list and
configure the host controller via Frame List Size
field of the USBCMD register. This requirement
ensures that the frame list is always physically
contiguous.
Reserved
-
Table 5-4 Capability parameter register
5.2.4 USBCMD register (address = 10h)
The command register indicates the command to be executed by the serial bus host controller. Writing to
the register causes a command to be executed.
Bit
Name
Type
RO
Default value
8’h0
Description
[31:24]
[23:16]
Reserved
INT_THRC
-
Interrupt Threshold Control
R/W
8’h08
This field is used by the system software to
select the maximum rate at which the host
controller will issue the interrupts. The only
valid values are described as below:
Value Max Interrupt Interval for the high-speed
00h Reserved
01h No limited interval
02h
04h
08h
10h
20h
40h
2 micro-frames
4 micro-frames
8 micro-frames (Default, equals to 1 ms)
16 micro-frames (2 ms)
32 micro-frames (4 ms)
64 micro-frames (8 ms)
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Bit
Name
Type
Default value
Description
Note1: This is further gated by MIN_WIDTH bits
of EDGEINTC register if edge trigger interrupt is
used.
Note2: In the full-speed mode, these registers
are reserved.
[15:12]
11
Reserved
RO
4’b0
-
Asynchronous Schedule Park Mode Enable
ASYN_PK_EN
R/W
1’b1
Software uses this register to enable or disable
the Park mode. When this register is set to ‘1’,
the Park mode is enabled.
10
Reserved
RO
1’b0
-
Asynchronous Schedule Park Mode Count
[9:8]
ASYN_PK_CNT R/W
2’b11
This field contains a count for the number of
successive transactions that the host controller
is allowed to execute from a high-speed queue
head on the asynchronous schedule.
7
6
Reserved
RO
1’b0
1’b0
-
Interrupt on Asynchronous Advance
Doorbell
INT_OAAD
R/W
This bit is used as a doorbell by software to ring
the host controller to issue an interrupt at the
next advance of the asynchronous schedule.
Asynchronous Schedule Enable
5
ASCH_EN
R/W
1’b0
This bit controls whether the host controller
skips the processing of asynchronous schedule.
0: Do not process the asynchronous schedule
1: Use the ASYNCLISTADDR register to access
the asynchronous schedule
Periodic Schedule Enable
4
PSCH_EN
R/W
1’b0
This bit controls whether the host controller
skips the processing of the periodic schedule.
0: Do not process the periodic schedule
1: Use the PERIODICKISTBASE register to
access the periodic schedule
Frame List Size
[3:2]
FRL_SIZE
HC_RESET
R/W
R/W
2’b00
This field specifies the size of the frame list.
00: 1024 elements (4096 bytes; default value)
01: 512 elements (2048 bytes)
10: 256 elements (1024 bytes)
11: Reserved
Host Controller Reset
1
1’b0
This control bit is used by the software to reset
the host controller.
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Bit
Name
Type
Default value
Description
Run/Stop
0
RS
R/W
1’b0
When this bit is set to 1b, the host controller
proceeds with the execution of schedule.
0: Stop
1: Run
Table 5-5 USB command register
5.2.5 USBSTS register (address = 14h)
This register indicates pending interrupts and various states of the Host Controller. The status resulting
from a transaction on the serial bus is not indicated in this register. Software sets a bit to 0 in this
register by writing a 1 to it.
Bit
Name
Type
RO
Default value
16’h0
Description
[31:16]
15
Reserved
ASCH_STS
-
Asynchronous Schedule Status
RO
1’b0
This bit reports the actual status of the
asynchronous schedule.
Periodic Schedule Status
14
13
12
PSCH_STS
Reclamation
HCHalted
RO
RO
RO
1’b0
1’b0
1’b1
This bit reports the actual status of the periodic
schedule.
Reclamation
This is a read-only status bit, and used to detect
an empty of the asynchronous schedule.
Host Controller Halted
This bit is a zero whenever the Run/Stop bit is
set to ‘1.’ The host controller sets this bit to ‘1’
after it has stopped the executing as a result of
the Run/Stop bit being set to 0b.
[11:6]
5
Reserved
INT_OAA
RO
6’b0
-
Interrupt on Asynchronous Advance
R/WC
1’b0
This status bit indicates the assertion of interrupt
on Async Advance Doorbell.
Host System Error
4
3
2
H_SYSERR
FRL_ROL
R/WC
R/WC
R/WC
1’b0
1’b0
1’b0
The Host Controller sets this bit to ‘1’ when a
serious error occurred during a host system
access involving the host controller module.
Frame List Rollover
The host controller sets this bit to ’1’ when the
Frame List Index rolls over from its maximum
value to zero.
Port Change Detect
PO_CHG_DET
The host controller sets this bit to ’1’ when any
port has a change bit transition from ‘0’ to ‘1.’
In addition, this bit is loaded with the OR of all of
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Bit
Name
Type
Default value
Description
the PORTSC change bits.
USB Error Interrupt
1
USBERR_INT
R/WC
1’b0
The host controller sets this bit to ‘1’ when the
completion of a USB transaction results in an
error condition.
USB Interrupt
0
USB_INT
R/WC
1’b0
The host controller sets this bit to ‘1’ upon the
completion of a USB transaction.
Table 5-6 USB status register
5.2.6 USBINTR register (address = 18h)
This register enables and disables reporting of the corresponding interrupt to the software. When a bit is
set and the corresponding interrupt is active, an interrupt is generated to the host. Interrupt sources that
are disabled in this register still appear in the USBSTS to allow the software to poll for events.
Bit
Name
Type
RO
Default value
26’h0
Description
[31:6]
5
Reserved
INT_OAA_EN
-
Interrupt on Async Advance Enable
R/W
1’b0
When this bit is set to ‘1,’ and the Interrupt on
Async Advance bit in the USBSTS register is
set to ‘1’ also, the host controller will issue an
interrupt at the next interrupt threshold.
Host System Error Enable
4
H_SYSERR_EN
FRL_ROL_EN
R/W
R/W
1’b0
When this bit is set to ‘1,’ and the Host
System Error Status bit in the USBSTS register
is set to ‘1’ also, the host controller will issue
an interrupt.
Frame List Rollover Enable
3
2
1
1’b0
1’b0
1’b0
When this bit is set to ‘1,’ and the Frame List
Rollover bit in the USBSTS register is set to ‘1’
also, the host controller will issue an interrupt.
Port Change Interrupt Enable
PO_CHG_DET_EN R/W
When this bit is set to ‘1,’ and the Port Change
Detect bit in the USBSTS register is set to ‘1’
also, the host controller will issue an interrupt.
USB Error Interrupt Enable
USBERR_INT_EN
USB_INT_EN
R/W
R/W
When this bit is set to ‘1,’ and the USBERRINT
bit in the USBSTS register is set to ‘1’ also, the
host controller will issue an interrupt at the
next interrupt threshold.
USB Interrupt Enable
0
1’b0
When this bit is set to ‘1,’ and the USBINT bit
in the USBSTS register is a set to ‘1’ also, the
host controller will issue an interrupt at the
next interrupt threshold. If set interrupt
threshold to 01h, means that when interrupt
event occurred, the INT signal will be toggled
at once.
Table 5-7 USB interrupt enable register
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5.2.7 FRINDEX register (address = 1Ch)
This register is used by the host controller to index into the periodic frame. The register updates very 125
microseconds (one each micro-frame).
Bit
Name
Type
RO
Default value
28’h0
Description
[31:14]
[13:0]
Reserved
FRINDEX
-
Frame Index
R/W
14’b0
This register is used by the host controller to
index the frame into the Periodic Frame List. It
updates every 125 microseconds. This register
cannot be written unless the host controller is
at the halted state.
Bits[N:3] are used for Frame List current
index. This means that each location of the
frame list is accessed 8 times before moving
to the next index.
USBCMD[Frame List Size] Number Elements N
00b
01b
10b
11b
(1024)
(512)
(256)
12
11
10
Reserved
Table 5-8 Frame index register
5.2.8 PERIODICLISTADDR register (address = 24h)
This 32-bit register contains the beginning address of the periodic frame list in the system memory.
Bit
Name
Type
Default value
Description
Periodic Frame List Base Address
[31:12]
PERI_BASEADR
R/W
20’h0
This 32-bit register contains the beginning
address of the
Periodic Frame List in the system memory.
These bits correspond to the memory address
signals[31:12].
[11:0]
Reserved
RO
12’b0
-
Table 5-9 Periodic frame list base address register
5.2.9 ASYNCLISTADDR register (address = 28h)
This 32-bit register contains the address of the next asynchronous queue head to be executed.
Bit
Name
Type
Default value
Description
Current Asynchronous List Address
[31:5]
ASYNC_LADR
R/W
27’h0
This 32-bit register contains the address of the
next asynchronous queue head to be
executed. These bits correspond to the
memory address signals [31:5].
[4:0]
Reserved
RO
5’b0
-
Table 5-10 Current asynchronous list address register
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5.2.10
POSTSC register (address = 30h)
The port status and control register is in the power well. It is only reset by hardware when the power is
initially applied or in response to a host controller reset. The initial conditions of a port are:
No peripheral connected
Port disable
The software must not attempt to change the state of the port until the power is stable on the port. The
host is required to have power stable to the port within 20 milliseconds of the zero to one transition.
When a peripheral device is attached, the port state transitions to the connected state and system
software will process this as with any status change notification.
Bit
Name
Type
Default value
15’h0
Description
[31:17]
16
Reserved
RO
-
Test Force Enable
TST_FORCEEN R/W
1’b0
When this signal is written as ‘1,’ the
downstream facing port will be enabled in the
high-speed mode. Then the Run/Stop bit must
be transitioned to one in order to enable the
transmission of the SOFs out of the port under
test. This enables testing of the disconnect
detection.
[15:12]
[11:10]
Reserved
LINE_STS
RO
RO
4’b0
-
Line Status
2’b00
These bits reflect the current logical levels of the
D+ and D- signal lines.
Bits[11:10] USB state
00b
10b
01b
11b
SE0
J-state
K-state
Undefined
9
8
Reserved
RO
1’b0
1’b0
-
Port Reset
PO_RESET
R/W
1 = Port is in the reset state.
0 = Port is not in the reset state.
When the software writes a ‘1’ to this bit, the
bus reset sequence as defined in the USB
specification will start.
Software writes a ‘0’ to this bit to terminate the
bus reset sequence. Software must keep this bit
at a ‘1’ long enough to ensure the reset
sequence.
Note: Reset signal which shall be followed by the
USB2.0 chapter 7.1.7.5 Reset Signal
requirement. If detected HS device, the software
shall wait more than 200us for port reset
clearing. Before setting this bit, RUN/STOP bit
should be set to ‘0.’
Port Suspend
7
PO_SUSP
R/W
1’b0
1 = Port is in the suspend state
0 = Port is not in the suspend state.
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Bit
Name
Type
Default value
Description
The Port Enable Bit and Suspend Bit of this
register define the port state as follows:
Bits[Port Enable, Suspend] Port State
0X
10
11
Disable
Enable
Suspend
At the suspend state, the downstream
propagation of the data is blocked on this port,
except for the port reset. While at the suspend
state, the port is sensitive to resume detection.
Writing a ‘0’ to this bit is ignored by the host
controller. The host controller will
unconditionally set this bit to a ‘0’ when:
The software sets Force Port Resume bit to a ‘0’
(From a one)
The software sets Port Reset bit to a ‘1’ (From a
‘0’)
Note: Before setting this bit, RUN/STOP bit
should be set to 0.
Force Port Resume
6
F_PO_RESM
R/W
1’b0
1 = Resume detected/driven on port.
0 = No resume detected/driven on port.
Software sets this bit to a ‘1’ to resume signal.
The host controller sets this bit to a ‘1’ if a J-to-K
transition is detected while the port is in the
suspend state. When this bit transits to a ‘1’ for
the detection of a J-to-K transition, the Port
Change Detect bit in USBSTS register is also set
to a ‘1’.
[5:4]
3
Reserved
RO
2’b00
-
Port Enable/Disable Change
PO_EN_CHG
R/WC
1’b0
1 = Port enable/disable status has changed.
0 = No change
Port Enable/Disable
2
PO_EN
R/W
1’b0
1 = Enable
0 = Disable
Ports can only be enabled by the host controller
as a part of the reset and enable. Software
cannot enable a port by writing a one to this
field.
Connect Status Change
1
0
CONN_CHG
CONN_STS
R/WC
1’b0
1’b0
1 = Change current connect status
0 = No change.
This bit indicates a change has occurred in the
current connect status of the port.
Current Connect Status
RO
1 = Device is presented on the port.
0 = No device is presented.
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Bit
Name
Type
Default value
Description
This value reflects the current state of the port,
and may not correspond directly to cause the
Connect Status Change bit to be set.
Table 5-11 Port status and control register
5.3 Configuration registers
5.3.1 EOTTIME register (address = 34h)
Bit
Name
Type
Default
value
Description
[31:7]
6
Reserved
RO
25’h0
-
Transceiver Suspend Mode
U_SUSP_N
R/W
1’b1
Active low
Places the transceiver in the suspend mode that draws
the minimal power from the power supplies. This is
part of the power management.
EOF 2 Timing Points
[5:4]
EOF2_TIME
R/W
2’b00
Control EOF2 timing point before next SOF.
High-Speed EOF2 Time
00b 2 clocks (30 MHz) = 66 ns
01b 4 clocks (30 MHz) = 133 ns
10b 8 clocks (30 MHz) = 266 ns
11b 16 clocks (30 MHz) = 533 ns
Full-Speed EOF2 Time
00b 20 clocks (30 MHz)=8 clocks (12 MHz) = 666 ns
01b 40 clocks (30 MHz)=16 clocks (12 MHz) = 1.333 µs
10b 80 clocks (30 MHz) = 32 clocks (12 MHz) = 2.66 µs
11b 160 clocks (30 MHz) = 64 clocks (12 MHz) = 5.3 µs
Low-Speed EOF2 Time
00b 40 clocks (30 MHz) = 16 clocks (12 MHz) = 1.33 µs
01b 80 clocks (30 MHz) = 32 clocks (12 MHz) = 2.66 µs
10b 160 clocks (30 MHz) = 64 clocks (12 MHz) = 5.33 µs
11b 320 clocks (30 MHz) = 128 clocks (12 MHz) = 10.66 µs
EOF 1 Timing Points
[3:2]
EOF1_TIME
R/W
2’b00
Controls the EOF1 timing point before next SOF.
This value should be adjusted according to the
maximum packet size.
High-Speed EOF1 Time
00b 540 clocks (30 MHz) = 18 µs
01b 360 clocks (30 MHz) = 12 µs
10b 180 clocks (30 MHz) = 6 µs
11b 720 clocks (30 MHz) = 24 µs
Full-Speed EOF1 Time
00b 1600 clocks (30 MHz) = 640 clocks (12 MHz) = 53.3 µs
01b 1400 clocks (30 MHz) = 560 clocks (12 MHz) = 46.6 µs
10b 1200 clocks (30 MHz) = 480 clocks (12 MHz) = 40 µs
11b 21000 clocks (30 MHz) = 8400 clocks (12 MHz)=700 µs
Low-Speed EOF1 Time
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Bit
Name
Type
Default
value
Description
00b 3750 clocks (30 MHz) = 1500 clocks (12 MHz) = 125 µs
01b 3500 clocks (30 MHz) = 1400 clocks (12 MHz) = 116 µs
10b 3250 clocks (30 MHz) = 1300 clocks (12 MHz) = 108 µs
11b 4000 clocks (30 MHz) = 1600 clocks (12 MHz) = 133 µs
Asynchronous Schedule Sleep Timer
[1:0]
ASYN_SCH_SLPT
R/W
2’b01
Controls the Asynchronous Schedule sleep timer.
00b
01b
10b
11b
5 µs
10 µs
15 µs
20 µs
Table 5-12 EOF time and asynchronous schedule sleep timer register
5.3.2 CHIPID register (address = 80h)
This chip ID register contains the chip identification and hardware version numbers.
Bit
Name
Type
Default value
Description
Chip ID
[31:0]
CHIP_ID
RO
32’h03130001
Table 5-13 Chip ID register
5.3.3 HWMODE register (address = 84h)
Bit
Name
Type
Default value
Description
[15: 8]
Reserved
RO
8’b0
-
Host Speed Type
Indicate the speed type of attached
device
[7: 6]
HOST_SPD_TYP
RO
2’b00
2’b10:
2’b00:
2’b01:
HS
FS
LS
2’b11:
Reserved
5
4
3
DACK_POL
DREQ_POL
INTF_LOCK
R/W
R/W
R/W
1’b0
1’b0
1’b0
DACK Polarity
0: active LOW
1: active HIGH
DREQ Polarity
0: active LOW
1: active HIGH
Interface Lock
0: Unlock the bus interface
1: Lock the bus interface
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Bit
Name
INTR_POL
Type
R/W
Default value
Description
Interrupt Polarity
2
1
1’b0
0: active LOW
1: active HIGH
INTR_LEVEL
R/W
1’b0
1’b0
Interrupt Level
0: level trigger
1: Edge trigged. The pulse width
depends on the NO_OF_CLK bits in
the EDGEINTC register.
0
GLOBAL_INTR_EN R/W
Globe interrupt enable
0: INT assertion disabled. INT will
never be asserted, regardless of
other settings or INT events.
1: INT assertion enabled. INT will be
asserted according to the HCINTEN
register, and event setting and
occurrence.
Table 5-14 HW mode register
5.3.4 EDGEINTC register (address = 88h)
Bit
Name
Type
Default value
Description
[31:24]
MIN_WIDTH
R/W
8’b0
Minimum Interval
Indicates the minimum interval between two
edge interrupts in uSOFs (1 uSOF = 125us).
This is not valid for level interrupts. A count
of zero means that an interrupt occurs as
when an event occurs.
[23:16]
[15: 0]
Reserved
RO
8’b0
-
NO_OF_CLK
R/W
16’b1F
Number of clocks
Number of clocks that an Edge Interrupt
must be kept asserted on the interface. The
default INT pulse width is approximately
500ns. (N+1)*60MHz system clock.
Table 5-15 Edge interrupt control register
5.3.5 SWRESET register (address = 8Ch)
Bit
Name
Type
RO
Default value
8’b0
Description
-
[15: 8]
[7: 6]
Reserved
INTF_MODE
RO
2’b00
Interface mode
00b: Reserved
01b: Generic
Multiplex mode
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Bit
Name
Type
Default value
Description
10b: NOR mode
11b: SRAM mode
Write to these bits
have no effect.
5
4
Reserved
RO
1’b0
1’b0
-
DATA_BUS_WIDTH
R/W
Data bus width
0: Defines a 16-
bit data bus width.
1: Sets a 8-bit
data bus width.
3
2
Reserved
RO
1’b0
1’b0
-
RESET_ATX
R/W
Reset USB
transceiver
0: No reset
1: Enable reset
When the software
writes a ‘1’ to this
bit, the USB PHY
reset sequence will
start. Automatic
clear zero.
1
RESET_HC
R/W
1’b0
Reset host
controller
0: No reset
1: Enable reset
When the software
writes a ‘1’ to this
bit, the Host
Controller reset
sequence will
start. Automatic
clear zero.
0
RESET_ALL
R/W
1’b0
Reset all system
0: No reset
1: Enable reset
When the software
writes a ‘1’ to this
bit, the whole
system reset
sequence will
start. Automatic
clear zero.
Table 5-16 SW reset register
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5.3.6 MEMADDR register (address = 90h)
Bit
Name
Type
Default value
Description
[15: 0]
START_ADDR_MEM R/W
16’b0
Start address for memory read / write
Internal 24K RAM memory address from
0x0000 to 0x5FFF.
Used by PIO and DMA.
Table 5-17 Memory address register
5.3.7 DATAPORT register (address = 92h)
Bit
Name
Type
Default value
Description
Data port
[15: 0]
DATA_PORT
R/W
16’b0
Read / write data from / to memory must go
through this port.
Used by PIO and DMA.
Table 5-18 Data port register
5.3.8 DATASESSION register (address = 94h)
Bit
Name
Type
Default value
Description
15
MEM_RW
R/W
1’b0
Memory read or write
0: Write data into memory
1: Read data from memory
Used by PIO and DMA
[14: 0]
DATA_LEN
R/W
15’b0
Data length for memory read or write
Preset the data length for memory read/write.
The max data length is 24K.
Used by PIO and DMA
Table 5-19 Data session length register
5.3.9 CONFIG register (address = 96h)
Bit
Name
Type
Default value
Description
15
BCD_MODE_CTRL
R/W
1’b0
BCD Mode override control
0: External CPE0 and CPE1 pins configuration
take effect.
1: BCD_MODE [1:0] register bits take effect
[14:13]
BCD_MODE[1:0]
R/W
2’b00
BCD Mode setting
00: SDP
Standard downstream port, VBUS
current limit ≥ 500mA.
01: DCP
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Bit
Name
Type
Default value
Description
Dedicated charging port. USB host not
functional on this port, VBUS current limit ≤
1.5A.
10: Reserved
11: CDP
Charging downstream port, VBUS
current limit ≤ 1.5A.
12
11
Reserved
OSC_EN
-
1’b1
-
R/W
1’b1
Oscillator enable
0: Oscillator is not active
1: Oscillator is active
10
PLL_EN
R/W
1’b1
Internal PLL enable
0: PLL is disable
1: PLL is enable
9
8
Reserved
-
1’b1
1’b1
-
HC_CLK_EN
R/W
Host controller clock enable
0: clocks are disabled
1: clocks are enabled
7
VBUS_OFF
R/W
1’b1
VBUS power switch
This bit controls the voltage on the VBUS
on/off (default is “1”) by switch external
power switcher.
0: VBUS on, PSW_N signal is active LOW.
1: VBUS off, PSW_N signal is not active.
6
5
PORT_OC_EN
BCD_EN
R/W
R/W
1’b0
1’b1
Port overcurrent enable
0: disable over current detection
1: enable over current detection
BCD module enable
0: disable BCD module
1: enable BCD module
4
Reserved
RO
1’b0
-
[3: 2]
BURST_LEN
R/W
2’b00
DMA burst length
00: Single DMA burst
01: 4-cycle DMA burst
10: 8-cycle DMA burst
11: 16-cycle DMA burst
1
ENABLE_DMA
R/W
1’b0
Enable DMA
0: terminate DMA
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Bit
Name
Type
Default value
Description
1: enable DMA
0
DMA_ABORT
R/W
1'b0
DMA abort
0: DMA continuous running
1: DMA abort implement
Table 5-20 DMA configuration register
5.3.10
AUX_MEMADDR register (address = 98h)
Bit
Name
Type
Default
value
Description
[15: 0]
AUX_START_ADDR_MEM R/W
16’b0
Auxiliary start address of memory
read / write
When memory is occurred by DMA, use
auxiliary start address for PIO memory
access.
Table 5-21 AUX Memory address register
5.3.11
Bit
AUX_DATAPORT register (address = 9Ah)
Name
Type
Default value
Description
[15: 0]
AUX_DATA_PORT
R/W
16’b0
Auxiliary data port
When memory is occurred by DMA, use
auxiliary data port for PIO memory access.
Table 5-22 AUX data port register
5.3.12
SLEEPTIMER register (address = 9Ch)
Bit
Name
Type
Default value
Description
[15: 0]
SLEEP_TIMER
R/W
16’b0400
Sleep timer
When host controller detected USB bus has no
activity, the sleep timer will be started. When
timer reduce to zero, the BUSINACTIVE
interrupt will be generated, if the respective
enable bit in the HCINTEN register is set.
Default sleep timer is approximately 10ms.
Table 5-23 Sleep timer register
5.4 Interrupt registers
5.4.1 HCINTSTS register (address = A0h)
Bit
Name
Type
RO
Default value Description
[15: 8]
7
Reserved
WAKEUPINT
10’b0
-
R/WC
1’b0
Wake up interrupt on device connect or
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Bit
Name
Type
Default value Description
disconnect
Indicates that wake up event is triggered.
The INT line will be asserted if the
respective enable bit in the HCINTEN
register is set.
0: No wake up event has occurred on the
port when device connects or disconnects.
1: Wake up event has occurred on the port
when device connects or disconnects.
6
OCINT
R/WC
1’b0
Overcurrent interrupt
Indicates that overcurrent event is
triggered. The INT line will be asserted if
the respective enable bit in the HCINTEN
register is set.
0: No overcurrent event has occurred.
1: Overcurrent event has occurred.
5
CLKREADY
R/WC
1’b0
Clock ready
Indicates that internal clock signals are
running stable. The INT line will be asserted
if the respective enable bit in the HCINTEN
register is set.
0: No clock ready event has occurred.
1: Clock ready event has occurred.
4
3
BUSINACTIVE
R/WC
R/WC
1’b0
1’b0
USB Bus inactive interrupt
Indicates that USB bus is inactive. The INT
line will be asserted if the respective enable
bit in the HCINTEN register is set.
0: USB bus is active.
1: USB bus is inactive.
REMOTEWKINT
Remote Wake up interrupt
Indicates INT was generated when the host
controller remote wakeup. The INT line will
be asserted if the respective enable bit in
the HCINTEN register is set.
0: No remote wake up.
1: Remote wake up event occurred.
2
1
DMAEOTINT
R/WC
R/WC
1’b0
1’b0
DMA EOT interrupt
Indicates the DMA transfer completion. The
INT line will be asserted if the respective
enable bit in the HCINTEN register is set.
0: No DMA transfer is completed.
1: DMA transfer is completed.
SOFINT
SOF interrupt
The INT line will be asserted if the
respective bit enable is set.
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Bit
Name
Type
Default value Description
0: No SOF event has occurred.
1: SOF event has occurred.
0
MSOFINT
R/WC
1’b0
uSOF interrupt
The INT line will be asserted if the
respective enable bit in the HCINTEN
register is set.
0: No uSOF event has occurred.
1: uSOF event has occurred.
Table 5-24 HC interrupt status register
5.4.2 HCINTEN register (address = A4h)
Bit
Name
Type
RO
Default value
10’b0
Description
-
[15: 8]
7
Reserved
WAKEUPINT_EN
R/W
1’b0
Wake up interrupt enable on device
connect or disconnect
Control the INT generation when the device
connects or disconnects as wake up events.
0: No INT will be generated when device
connects or disconnects as wake up events.
1: INT will be asserted when device connects
or disconnects as wake up events.
6
OCINT_EN
R/W
1’b0
Overcurrent interrupt enable
Control the INT generation when the
overcurrent event triggers
0: No INT will be generated after overcurrent
event is triggered.
1: INT will be asserted after overcurrent event
is triggered.
5
4
CLKREADY_EN
R/W
R/W
1’b0
1’b0
Clock ready enable
Control the INT generation when the internal
clock signals are running stable
0: No INT will be generated after clock runs
stable.
1: INT will be asserted after clock runs stable.
USB Bus inactive enable
BUSINACTIVE_EN
Control the INT generation when the USB bus
is inactive
0: No INT will be generated when the USB bus
is inactive.
1: INT will be asserted when the USB bus is
inactive.
3
R/W
1’b0
Remote wake up interrupt enable
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Bit
Name
Type
Default value
Description
REMOTEWKINT
_EN
Control the INT generation when the host
controller supports remote wake up
0: No INT will be generated when remote
wake up occurred.
1: INT will be asserted when remote wake up
occurred.
2
DMAEOTINT_EN
R/W
1’b0
DMA EOT interrupt enable
Control assertion of INT on the DMA transfer
completion
0: No INT will be generated when a DMA
transfer is completed.
1: INT will be asserted when a DMA transfer is
completed.
1
0
SOFINT_EN
R/W
R/W
1’b0
1’b0
SOF interrupt enable
Control the INT generation at every SOF
occurrence
0: No INT will be generated on SOF.
1: INT will be asserted at every SOF.
MSOFINT_EN
uSOF interrupt enable
Control the INT generation at every uSOF
occurrence
0: No INT will be generated on uSOF.
1: INT will be asserted at every uSOF.
Table 5-25 HC interrupt status register
5.5 USB testing registers
5.5.1 TESTMODE register (address = 50h)
This register allows the firmware to set the DP and DM pins to predetermined states for testing purposes.
Once force one test mode on host, must use test device on port connection.
Note: Only one bit can be set to logic 1 at a time. After writing to this register, need add 150ns delay
before writing this register again. The registers 70h and 74h both have same operation.
Bit
Name
Type
RO
Default value
27’b0
Description
[31:5]
4
Reserved
TST_LOOPBK
-
R/W
1’b0
Turn on the loop back mode. When this bit is
set to ‘1’, the host controller will enter the loop
back mode.
3
2
Reserved
TST_PKT
RO
1’b0
1’b0
-
R/W
TEST_PACKET
After entering the high speed and writing 1’b1
to this bit, users should command the DMA by
the test parameter setting registers (0x70h
and 0x74h) to move the packet data defined
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Bit
Name
Type
Default value
Description
in the USB2.0 specification from the memory
to FIFO. Then, send the packet to the
transceiver.
TEST_K
1
0
TST_KSTA
TST_JSTA
R/W
R/W
1’b0
1’b0
Upon writing a ‘1,’ the D+/D- are set to the
high-speed K state.
TEST_J
Upon writing a ‘1,’ the D+/D- are set to the
high-speed J state.
Table 5-26 Test mode register
5.5.2 TESTPMSET1 register (address = 70h)
This parameter setting register is only used by test packet mode.
Bit
Name
Type
RO
Default value
7’b0
Description
-
[31:25]
[24: 8]
Reserved
DMA_LEN
R/W
11’h000
DMA Length
The total bytes of the DMA controller will
move. The maximum length is 1024 – 1 Bytes.
[7: 2]
1
Reserved
RO
6’b0
1’b0
-
DMA Type
DMA_TYPE
R/W
The transfer type of data moving
0: FIFO to Memory
1: Memory to FIFO
DMA Start
0
DMA_START
R/W
1’b0
This bit informs the DMA controller to initiate
the DMA transfer.
Table 5-27 Test mode parameter setting 1 register
5.5.3 TESTPMSET2 register (address = 74h)
This parameter setting register is only used by test packet mode.
Bit
Name
Type
Default value
Description
[31:0]
DMA_MADDR
R/W
32’b0
DMA Memory Address
The starting address of memory to request the
DMA transfer.
Table 5-28 Test parameter setting 2 register
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6 Devices Characteristics and Ratings
6.1 Absolute Maximum Ratings
The absolute maximum ratings for the FT313H device are as follows. These are in accordance with the
Absolute Maximum Rating System (IEC 60134). Exceeding these may cause permanent damage to the
device.
Parameter
Value
Unit
Storage Temperature
-65°C to 150°C
168 Hours
Degrees C
Floor Life (Out of Bag) At Factory Ambient
(30°C / 60% Relative Humidity)
Hours
(IPC/JEDEC J-STD-033A MSL Level 3
Compliant)*
Ambient Temperature (Power Applied)
VCC Supply Voltage
-40°C to 85°C
0 to +5
Degrees C
V
V
V
V
V
VCC(I/O) Supply Voltage
0 to +5
DC Input Voltage – USBDP and USBDM
DC Input Voltage – OC_N (5V tolerant)
DC Input Voltage – All Other Inputs
-0.5 to +5
-0.5 to +5.5
-0.5 to +5
Table 6-1 Absolute Maximum Ratings
* If devices are stored out of the packaging beyond this time limit the devices should be baked before
use. The devices should be ramped up to a temperature of +125°C and baked for up to 17 hours.
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6.2 DC Characteristics
DC Characteristics (Ambient Temperature = -40°C to +85°C)
Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
1.62
2.25
2.97
1.8
2.5
3.3
1.98
2.75
3.63
V
V
V
VCCIO operating
supply voltage
VCC(I/O)
Normal Operation
Normal Operation
VCC operating supply
voltage
VCC(3V3)
Icc1
2.97
-
3.3
20
3.63
-
V
Idle current
mA
Idle
Normal Operation
Icc2
Operating current
-
35
-
mA
High speed data
transfer
Icc3
USB suspend
-
200
1.2
-
uA
V
USB suspend
VCC(1V2)
Core supply voltage
1.08
1.32
Normal Operation
Internal 1.2V
regulator voltage
VOUT(1V2)
-
1.2
-
V
Normal Operation
Table 6-2 Operating Voltage and Current
Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
Voh
Vol
Vih
Vil
Output Voltage High
Output Voltage Low
Input High Voltage
Input Low Voltage
2.4
-
3.3
-
V
V
V
V
Ioh=8mA
-
-
-
0.4
-
Iol=8mA
2.0
-
-
-
0.8
Schmitt Hysteresis
Voltage
Vth
0.3
0.45
0.5
V
-
Ipu
Rpu
Ipd
Rpd
Iin
Input pull-up current
25
120K
25
42
78K
42
60
60K
60
uA
ohm
uA
Vin = 0V
Vin = 0V
Input pull-up
resistance equivalent
Input pull-down
current
Input pull-down
Vin = VCC(I/O)
Vin = VCC(I/O)
120K
-10
78K
±1
60K
10
ohm
uA
resistance equivalent
Vin = VCC(I/O) or
0
Input leakage current
Tri-state output
leakage current
Ioz
-10
±1
10
uA
-
Table 6-3 Digital I/O Pin Characteristics (VCC(I/O) = +3.3V, Standard Drive Level)
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Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
VCC(I/O)
-0.4
Voh
Output Voltage High
2.5
-
V
Ioh=6mA
Vol
Vih
Vil
Output Voltage Low
Input High Voltage
Input Low Voltage
-
-
-
-
0.4
-
V
V
V
Iol=6mA
0.7VCC(I/O)
-
-
0.3VCC(I/O)
-
Schmitt Hysteresis
Voltage
Vth
0.28
0.39
0.5
V
-
Ipu
Rpu
Ipd
Rpd
Iin
Input pull-up current
14
160K
14
23
108K
23
35
78K
35
uA
ohm
uA
Vin = 0
Vin = 0
Input pull-up
resistance equivalent
Input pull-down
current
Input pull-down
Vin = VCC(I/O)
Vin = VCC(I/O)
160K
-10
108K
±1
78K
10
ohm
uA
resistance equivalent
Vin = VCC(I/O) or
0
Input leakage current
Tri-state output
leakage current
Ioz
-10
±1
10
uA
-
Table 6-4 Digital I/O Pin Characteristics (VCC(I/O) = +2.5V, Standard Drive Level)
Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
VCC(I/O)
-0.4
Voh
Output Voltage High
1.8
-
V
Ioh=3.6mA
Vol
Vih
Vil
Output Voltage Low
Input High Voltage
Input Low Voltage
-
-
-
-
0.4
-
V
V
V
Iol=3.6mA
0.7VCC(I/O)
-
-
0.3VCC(I/O)
-
Schmitt Hysteresis
Voltage
Vth
0.25
0.35
0.5
V
-
Ipu
Rpu
Ipd
Rpd
Iin
Input pull-up current
6
10
180K
10
15
130K
15
uA
ohm
uA
Vin = 0
Vin = 0
Input pull-up
resistance equivalent
270K
6
Input pull-down
current
Input pull-down
Vin = VCC(I/O)
Vin = VCC(I/O)
270K
-10
-10
180K
±1
130K
10
ohm
uA
resistance equivalent
Vin = VCC(I/O) or
0
Input leakage current
Tri-state output
leakage current
Ioz
±1
10
uA
-
Table 6-5 Digital I/O Pin Characteristics (VCC(I/O) = +1.8V, Standard Drive Level)
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Parameter
Vhscm
Description
Minimum
Typical
Maximum
Units
Conditions
Input level for high speed
Voltage of high speed
data signal in the
common mode
-50
-
500
mV
-
Squelch is
detected
-
-
-
-
-
100
-
mV
mV
mV
mV
High speed squelch
detection threshold
Vhssq
Squelch is not
detected
150
625
-
Disconnection is
detected
-
High speed
disconnection
detection threshold
Vhsdsc
Disconnection is
not detected
525
Output level for high speed
High speed idle output
voltage (Differential)
Vhsoi
Vhsol
-10
-10
-
-
10
10
mV
mV
-
-
High speed low level
output voltage
(Differential)
High speed high level
output voltage
Vhsoh
-360
-
400
mV
-
(Differential)
Chirp-J output voltage
(Differential)
Vchirpj
Vchirpk
700
-
-
1100
-500
mV
mV
-
-
Chirp-K output
voltage (Differential)
-900
Input level for full speed and low speed
Differential input
voltage sensitivity
Vdi
Vcm
Vse
0.2
0.8
0.8
-
-
-
-
V
V
V
|Vdp-Vdm|
Differential common
mode voltage
2.5
2.0
-
-
Single ended receiver
threshold
Output level for full speed and low speed
Low level output
voltage
Vol
0
-
0.3
3.6
V
V
-
-
High level output
voltage
Voh
2.8
-
Resistance
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Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
Equivalent
resistance used as
an internal chip
Driver output
impedance
Rdrv
40.5
45
49.5
ohm
Table 6-6 USB I/O Pin (USBDP, USBDM) Characteristics
Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
Voh
Vol
Vih
Vil
Output Voltage High
Output Voltage Low
Input High Voltage
Input Low Voltage
2.4
-
-
-
-
-
-
V
V
V
V
Ioh=2mA~16mA
Iol=2mA~16mA
LVTTL
0.4
-
2.0
-
0.8
LVTTL
Output pull up voltage
for 5V tolerant I/Os
VCC(3V3)-
0.9
Vopu*
-
-
V
Ipu = 1uA
Vin = VCC(3V3) or
0
-
-
-
±1
±1
2.3
-
-
-
uA
uA
pF
Iin
Input leakage current
Input capacitor
Vin = 5V or 0
VCC(3V3) with 5V
tolerant I/O
Cin
Table 6-7 5V Tolerant Pin (PSW_N, OC_N, VBUS) Characteristics
Note*: This parameter is to indicate that the pull up resistor for the 5V tolerant I/Os cannot reach
VCC(3V3) DC level even without DC loading current.
6.3 AC Characteristics
AC Characteristics (Ambient Temperature = -40°C to +85°C)
System clock dynamic characteristics:
Parameter
Crystal oscillator
Clock frequency
External clock input
Value
Unit
Minimum
Typical
Maximum
-
-
-
12.00
19.20
24.00
-
-
-
MHz
external clock
jitter
-
-
500
55
ps
%
clock duty cycle
45
50
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Input voltage on
pin X1/CLKIN
-
3.3
-
V
Recommended accuracy of the clock frequency is 50ppm for the crystal.
Table 6-8 System clock characteristics
Analog I/O pins (DP/DM) dynamic characteristics:
Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
Driver characteristic for high speed
High speed differential
rise time
Thsr
Thsf
500
500
-
-
-
-
ps
ps
-
-
High speed differential
fall time
Driver characteristic for full speed
Cl=50pF
Tfr
Tff
Rise time of DP/DM
Fall time of DP/DM
4
4
-
-
20
20
ns
ns
10%~90% of |Voh–Vol|
Cl=50pF
10%~90% of |Voh–Vol|
The first transition
exclude from the
idle mode
Differential rise/fall
time matching
Tfrma
90
-
110
%
Driver characteristic for low speed
Cl=200pF~600pF
Tlr
Tlf
Rise time of DP/DM
Fall time of DP/DM
75
75
-
-
300
300
ns
ns
10%~90% of |Voh–Vol|
Cl=200pF~600pF
10%~90% of |Voh–Vol|
The first transition
exclude from the
idle mode
Differential rise/fall
time matching
Tlrma
80
-
125
%
Table 6-9 Analog I/O pins characteristics
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6.4 Timing
6.4.1 PIO timing
SRAM PIO timing characteristics (Ambient Temperature = -40°C to +85°C)
VCC(I/O)=1.8V VCC(I/O)=2.5V
VCC(I/O)=3.3V
Parameter
Description
Unit
Min
Max
Min
Max
Min
Max
CS_N setup time
before WR_N / RD_N
low
Tcs
0
-
0
-
0
-
ns
ns
ns
ns
ns
CS_N hold time after
WR_N / RD_N high
Tch
Tcp
0
-
-
-
0
-
-
-
0
-
-
-
CS_N pulse width for
read
40
40
40
40
40
40
CS_N pulse width for
write
address setup time
before WR_N / RD_N
low
Tasrw
0
0
-
-
0
0
-
-
0
0
-
-
Address Hold Time
after WR_N/RD_N
LOW
ns
ns
Tahrw
Tap
Address Latch Pulse
Width
Twc
Twp
Write Cycle Time
WR_N Pulse Width
80
40
-
-
79
40
-
-
78.5
40
-
-
ns
ns
ns
RD_N High to Output
Hi-Z
Tdh
4
0
6
8
9
-
-
-
4
0
6
7
7
-
-
-
4
0
6
6
6
-
-
-
WR_N High to Input
Hi-Z
ns
ns
ns
DATA Setup Time
before DATA Latch
Tdadvh
Toe
RD_N Low to DATA
Output Enable
Trp
Trc
RD_N Pulse Width
Read Cycle Time
40
80
-
-
40
-
-
40
79
-
-
ns
ns
79.5
Table 6-10 SRAM PIO timing
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Toe
Tdadvh
Tdh
Data
Tahrw
AD[15:0]
A[7:0]
Tasrw
Address
ALE/ADV_N
CLE
Trp
RD_N/RE_N/
OE_N
Tch
Tcs
CS_N/CE_N
WR_N/WE_N
Tcp
Trc
Figure 6-1 Read in SRAM mode
Tdadvh
Tdh
Data
Tahrw
Address
AD[15:0]
A[7:0]
Tasrw
ALE/ADV_N
CLE
Twp
WR_N/WE_N
Tch
Tcs
CS_N/CE_N
Tcp
Twc
RD_N/RE_N/
OE_N
Figure 6-2 Write in SRAM mode
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NOR PIO timing characteristics (Ambient Temperature = -40°C to +85°C)
VCC(I/O)=1.8V
VCC(I/O)=2.5V
VCC(I/O)=3.3V
Parameter
Description
Unit
Min
0
Max
Min
0
Max
Min
0
Max
CS_N hold time after
WR_N / RD_N high
ns
ns
ns
ns
ns
Tch
Tcsadval
Tah
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
CS_N setup time
before Address Latch
6.5
0
6.5
0
6
Address Hold Time
after Address Latch
0
Address Setup Time
before Address Latch
Tas
6
6
5
Address Latch Pulse
Width
Tap
10
10
10
Twc
Twp
Write Cycle Time
WR_N Pulse Width
80
40
-
-
78.5
40
-
-
78.5
40
-
-
ns
ns
ns
RD_N High to Output
Hi-Z
Tdh
4
0
6
8
5
8
-
-
-
-
4
0
5
6
5
7
-
-
-
-
4
0
5
5
5
7
-
-
-
-
WR_N High to Input
Hi-Z
ns
ns
ns
ns
DATA Setup Time
before DATA Latch
Tdadvh
Toe
RD_N Low to DATA
Output Enable
Ready to
WR_N/RD_N Low
Tbds
Trp
Trc
RD_N Pulse Width
Read Cycle Time
40
80
-
-
40
79
-
-
40
79
-
-
ns
ns
Table 6-11 NOR PIO timing
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Tah
Tas
Toe
Tdh
Address
Data
AD[15:0]
Tbds
Tap
ALE/ADV_N
CLE
RD_N/RE_N/
OE_N
Trp
Tcsadval
Tch
CS_N/CE_N
WR_N/WE_N
Trc
Figure 6-3 Read in NOR mode
Tah
Tas
Tdadvh
Data
Tdh
Address
AD[15:0]
Tbds
Tap
ALE/ADV_N
CLE
RD_N/DS_N/
RE_N/OE_N
Tcsadval
Tch
CS_N/CE_N
Twc
WR_N/RW_N/
WE_N
Twp
Figure 6-4 Write in NOR mode
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General Multiplex PIO timing characteristics (Ambient Temperature = -40°C to +85°C)
VCC(I/O)=1.8V
VCC(I/O)=2.5V
VCC(I/O)=3.3V
Parameter
Description
Unit
Min
0
Max
Min
0
Max
Min
0
Max
CS_N hold time after
WR_N / RD_N high
ns
ns
ns
ns
ns
Tch
Tcsadval
Tah
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
CS_N setup time
before Address Latch
7.5
0
6.5
0
6.5
0
Address Hold Time
after Address Latch
Address Setup Time
before Address Latch
Tas
7
6
6
Address Latch Pulse
Width
Tap
10
10
10
Twc
Twp
Write Cycle Time
WR_N Pulse Width
80
40
-
-
78.5
40
-
-
78.5
40
-
-
ns
ns
ns
RD_N High to Output
Hi-Z
Tdh
4
0
9
-
-
-
-
4
0
5
6
5
6.5
3.5
0
6
-
-
-
-
WR_N High to Input
Hi-Z
ns
ns
ns
ns
-
-
-
-
DATA Setup Time
before DATA Latch
Tdadvh
Toe
6.5
8
5
RD_N Low to DATA
Output Enable
5
Ready to
WR_N/RD_N Low
Tbds
5
5
Trp
Trc
RD_N Pulse Width
Read Cycle Time
40
80
-
-
40
79
-
-
40
79
-
-
ns
ns
Table 6-12 General Multiplex PIO timing
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Tah
Tas
Toe
Tdh
Address
Data
AD[15:0]
Tbds
Tap
ALE/ADV_N
CLE
RD_N/RE_N/
OE_N
Trp
Tcsadval
Tch
CS_N/CE_N
WR_N/WE_N
Trc
Figure 6-5 Read in General Multiplex mode
Tah
Tas
Tdadvh
Data
Tdh
Address
AD[15:0]
Tbds
Tap
ALE/ADV_N
CLE
RD_N/RE_N/
OE_N
Tcsadval
Tch
CS_N/CE_N
WR_N/WE_N
Twp
Twc
Figure 6-6 Write in General Multiplex mode
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6.4.2 DMA timing
DMA timing characteristics (Ambient Temperature = -40°C to +85°C)
Parameter
Tsudreqdack
Tddackdreq
Thdreqdack
Description
Min
Max
Unit
DREQ Set-up Time before DACK
Assertion
-
0
ns
ns
DACK De-assertion to Next DREQ
Assertion Time
18
-
DREQ Hold Time after Last Strobe
Assertion
-
35
ns
Trwp
Toe
RD_N/WR_N Pulse Width
40
8
-
-
ns
ns
ns
Data Valid Time after RD_N Assertion
Read Data Hold Time after RD_N De-
asserts
4
9
Trdh
Write Data Hold Time after WR_N De-
assertion
0
6
-
-
-
-
-
ns
ns
ns
ns
ns
Twdh
Write Data Set-up Time before WR_N
De-assertion
Tdadvh
DACK Set-up Time before
RD_N/WR_N Assertion
0
Tsudackrw
DACK De-assertion after RD_N/WR_N
De-assertion
0
Trwdack
Tcyc
DMA Read/Write Cycle Time
80
Table 6-13 DMA timing
DREQ
Tsudreqdack
Thdreqdack
Trwp
Tcyc
DACK
Tsudackrw
Tddackdreq
RD_N/
WR_N
Trwdack
Toe
Trdh
DATA[15:0]
(read)
Tdadvh
Twdh
DATA[15:0]
(write)
DATA1
DATA2
DATAn
Figure 6-7 DMA read and write
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7 Application Examples
FT313H can be configured to communicate with a microcontroller uses 16-bit/8-bit SRAM asynchronous
bus interface, NOR interface, and General Multiplex interface. An example schematic is show in Figure
7.1.
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Figure 7-1 FT313H Chip Schematic
7.1 Examples of Bus Interface connection
7.1.1 16-Bit SRAM asynchronous bus interface
FT313H
Microcontroller
CS_N
CS_E/CS_N
OE_N/RE_N/RD_N
RD_N
WE_N/WR_N
AD<15:0>
A<7:0>
INT
WR_N
AD<15:0>
A<7:0>
INT
DACK
DACK
DREQ
DREQ
If DMA transfers are not used the DACK and DREQ signals may be left floating or the DACK signal may be
terminated with external 10k ohm pull-down resistor.
If the microcontroller has no AD<0> pin for 16-bit wide devices, the unused AD<0> signal with must be
terminated with an external 10k ohm pull-down resistor.
7.1.2 8-Bit SRAM asynchronous bus interface
FT313H
Microcontroller
CS_N
CS_E/CS_N
OE_N/RE_N/RD_N
RD_N
WE_N/WR_N
AD<7:0>
A<7:0>
INT
WR_N
AD<7:0>
A<7:0>
INT
DACK
DACK
DREQ
DREQ
8-Bit SRAM bus interface doesn’t use high AD<15:8> data bus, must terminate AD<15:8> signals with
external 10k ohm pull-down resistors.
If DMA transfers are not used the DACK and DREQ signals may be left floating or the DACK signal may be
terminated with external 10k ohm pull-down resistor.
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7.1.3 16-Bit NOR asynchronous bus interface
FT313H
Microcontroller
CS_N
CS_E/CS_N
OE_N/RE_N/RD_N
OE_N
WE_N/WR_N
AD<15:0>
A<7:0>
WE_N
AD<15:0>
INT
INT
ADV_N
ADV_N/ALE
16-Bit NOR uses AD<15:0> signals as address and data bus. Unused A<7:0> address must be
terminated with external 10k ohm pull-down resistor.
If the microcontroller has no AD<0> pin for 16-bit wide devices, the unused AD<0> signal with must be
terminated with an external 10k ohm pull-down resistor.
7.1.4 8-Bit NOR asynchronous bus interface
FT313H
Microcontroller
CS_N
CS_E/CS_N
OE_N/RE_N/RD_N
OE_N
WE_N/WR_N
AD<7:0>
A<7:0>
WE_N
AD<7:0>
INT
INT
ADV_N
ADV_N/ALE
8-Bit NOR uses AD<7:0> signals as address and data bus. The unused high data bus AD<15:8> and
A<7:0> address bus must be terminated with external 10k ohm pull-down resistors.
7.1.5 16-Bit General Multiplex asynchronous bus interface
FT313H
Microcontroller
CS_N
CS_E/CS_N
OE_N/RE_N/RD_N
RE_N
WE_N/WR_N
AD<15:0>
A<7:0>
WE_N
AD<15:0>
INT
INT
ADV_N/ALE
DACK
ALE
DACK
DREQ
DREQ
16-Bit General Multiplex uses AD<15:0> signals as address and data bus. Unused A<7:0> address must
be terminated with external 10k ohm pull-down resistor.
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If the microcontroller has no AD<0> pin for 16-bit wide devices, the unused AD<0> signal with must be
terminated with an external 10k ohm pull-down resistor.
If DMA transfers are not used the DACK and DREQ signals may be left floating or the DACK signal may be
terminated with external 10k ohm pull-down resistor.
7.1.6 8-Bit General Multiplex asynchronous bus interface
FT313H
Microcontroller
CS_N
CS_E/CS_N
OE_N/RE_N/RD_N
RE_N
WE_N/WR_N
AD<7:0>
A<7:0>
WE_N
AD<7:0>
INT
INT
ADV_N/ALE
DACK
ALE
DACK
DREQ
DREQ
8-Bit General Multiplex uses AD<7:0> signals as address and data bus. The unused high data bus
AD<15:8> and A<7:0> address bus must be terminated with external 10k ohm pull-down resistors.
If DMA transfers are not used the DACK and DREQ signals may be left floating or the DACK signal may be
terminated with external 10k ohm pull-down resistor.
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Document No.: FT_000589
FT313H USB2.0 HS Host Controller Datasheet Version 1.2
Clearance No.: FTDI# 318
8 Package Parameters
The FT313H is available in three different packages. The FT313HQ is the QFN-64 package, the FT313HL is
the LQFP-64 package and the FT313HP is the TQFP-64 package. The solder reflow profile for all packages
is described in following sections.
8.1 FT313H Package Markings
8.1.1 QFN-64
An example of the markings on the QFN package are shown in Figure 8-1. The FTDI part number is too
long for the 64 QFN package so in this case the last two digits are wrapped down onto the date code line.
64
1
Line 1 – FTDI Logo
Line 2 – Wafer Lot Number
XXXXXXXXXX
Line 3 – FTDI Part Number
FT313HQ
Line 4 – Date Code, Revision
YYWW-B
Figure 8-1 QFN Package Markings
Notes:
1. YYWW = Date Code, where YY is year and WW is week number
2. Marking alignment should be centre justified
3. Laser Marking should be used
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Document No.: FT_000589
FT313H USB2.0 HS Host Controller Datasheet Version 1.2
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8.1.2 LQFP-64
An example of the markings on the LQFP package are shown in Figure 8-2.
64
1
Line 1 – FTDI Logo
XXXXXXXXXX
FT313HL
Line 2 – Wafer Lot Number
Line 3 – FTDI Part Number
Line 4 – Date Code, Revision
YYWW-B
Figure 8-2 LQFP Package Markings
Notes:
1. YYWW = Date Code, where YY is year and WW is week number
2. Marking alignment should be centre justified
3. Laser Marking should be used
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Document No.: FT_000589
FT313H USB2.0 HS Host Controller Datasheet Version 1.2
Clearance No.: FTDI# 318
8.1.3 TQFP-64
An example of the markings on the TQFP package are shown in Error! Reference source not found..
64
1
Line 1 – FTDI Logo
Line 2 – Wafer Lot Number
XXXXXXXXXX
Line 3 – FTDI Part Number
FT313HP
Line 4 – Date Code, Revision
YYWW-B
Figure 8-3 TQFP Package Markings
Notes:
1. YYWW = Date Code, where YY is year and WW is week number
2. Marking alignment should be centre justified
3. Laser Marking should be used
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Document No.: FT_000589
FT313H USB2.0 HS Host Controller Datasheet Version 1.2
Clearance No.: FTDI# 318
8.2 QFN-64 Package Dimensions
Figure 8-4 QFN-64 Package Markings
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Document No.: FT_000589
FT313H USB2.0 HS Host Controller Datasheet Version 1.2
Clearance No.: FTDI# 318
8.3 LQFP-64 Package Dimensions
Figure 8-5 LQFP-64 Package Markings
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FT313H USB2.0 HS Host Controller Datasheet Version 1.2
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8.4 TQFP-64 Package Dimensions
Figure 8-6 TQFP-64 Package Markings
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FT313H USB2.0 HS Host Controller Datasheet Version 1.2
Clearance No.: FTDI# 318
8.5 Solder Reflow Profile
The FT313H is supplied in Pb free QFN-64, LQFP-64 and TQFP-64 packages. The recommended solder
reflow profile for all package options is shown in
.
tp
T
p
Critical Zone: when
T is in the range
Ramp Up
T to T
p
L
T
L
tL
T Max
S
Ramp
Down
T Min
S
tS
Preheat
25
T = 25º C to TP
Time, t (seconds)
Figure 8-7 FT313H Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 8-1. Values are shown for
both a completely Pb free solder process (i.e. the FT313H is used with Pb free solder), and for a non-Pb
free solder process (i.e. the FT313H is used with non-Pb free solder).
Profile Feature
Pb Free Solder Process
Non-Pb Free Solder Process
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
100°C
150°C
150°C
200°C
60 to 120 seconds
60 to 120 seconds
Time Maintained Above Critical Temperature
TL:
217°C
183°C
- Temperature (TL)
- Time (tL)
60 to 150 seconds
60 to 150 seconds
Peak Temperature (Tp)
260°C
240°C
Time within 5°C of actual Peak Temperature
(tp)
20 to 40 seconds
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
8 minutes Max.
6°C / second Max.
6 minutes Max.
Time for T= 25°C to Peak Temperature, Tp
Table 8-1 Reflow Profile Parameter Values
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Document No.: FT_000589
FT313H USB2.0 HS Host Controller Datasheet Version 1.2
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9 FTDI Chip Contact Information
Branch Office – Tigard, Oregon, USA
Head Office – Glasgow, UK
7130 SW Fir Loop
Tigard, OR 97223
USA
Tel: +1 (503) 547 0988
Fax: +1 (503) 547 0987
Unit 1, 2 Seaward Place, Centurion Business Park
Glasgow G41 1HH
United Kingdom
Tel: +44 (0) 141 429 2777
Fax: +44 (0) 141 429 2758
E-Mail (Sales)
E-Mail (Support)
E-Mail (General Enquiries)
us.sales@ftdichip.com
us.support@ftdichip.com
us.admin@ftdichip.com
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries) admin1@ftdichip.com
sales1@ftdichip.com
support1@ftdichip.com
Branch Office – Shanghai, China
Branch Office – Taipei, Taiwan
Room 1103, No. 666 West Huaihai Road,
Changning District
Shanghai, 200052
2F, No. 516, Sec. 1, NeiHu Road
Taipei 114
Taiwan, R.O.C.
Tel: +886 (0) 2 8797 1330
Fax: +886 (0) 2 8751 9737
China
Tel: +86 21 62351596
Fax: +86 21 62351595
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries)
cn.sales@ftdichip.com
cn.support@ftdichip.com
cn.admin@ftdichip.com
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries) tw.admin1@ftdichip.com
tw.sales1@ftdichip.com
tw.support1@ftdichip.com
Web Site
http://ftdichip.com
System and equipment manufacturers and designers are responsible to ensure that their systems, and any Future Technology
Devices International Ltd (FTDI) devices incorporated in their systems, meet all applicable safety, regulatory and system-level
performance requirements. All application-related information in this document (including application descriptions, suggested
FTDI devices and other materials) is provided for reference only. While FTDI has taken care to assure it is accurate, this
information is subject to customer confirmation, and FTDI disclaims all liability for system designs and for any applications
assistance provided by FTDI. Use of FTDI devices in life support and/or safety applications is entirely at the user’s risk, and the
user agrees to defend, indemnify and hold harmless FTDI from any and all damages, claims, suits or expense resulting from
such use. This document is subject to change without notice. No freedom to use patents or other intellectual property rights is
implied by the publication of this document. Neither the whole nor any part of the information contained in, or the product
described in this document, may be adapted or reproduced in any material or electronic form without the prior written consent
of the copyright holder. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park,
Glasgow G41 1HH, United Kingdom. Scotland Registered Company Number: SC136640
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Appendix A – References
Useful Application Notes
Appendix B - List of Figures and Tables
List of Figures
Figure 2-1 FT313H Block Diagram...................................................................................................3
Figure 3-1 Pin Configuration QFN64 (top-down view) ........................................................................7
Figure 3-2 Pin Configuration LQFP64 (top-down view) .......................................................................8
Figure 3-3 Pin Configuration TQFP64 (top-down view).......................................................................9
Figure 6-1 Read in SRAM mode .................................................................................................... 47
Figure 6-2 Write in SRAM mode.................................................................................................... 47
Figure 6-3 Read in NOR mode ...................................................................................................... 49
Figure 6-6 Write in General Multiplex mode.................................................................................... 51
Figure 6-7 DMA read and write..................................................................................................... 52
Figure 7-1 FT313H Chip Schematic ............................................................................................... 54
Figure 8-1 QFN Package Markings................................................................................................. 57
Figure 8-2 LQFP Package Markings................................................................................................ 58
Figure 8-3 TQFP Package Markings ............................................................................................... 59
Figure 8-4 QFN-64 Package Markings............................................................................................ 60
Figure 8-5 LQFP-64 Package Markings........................................................................................... 61
Figure 8-6 TQFP-64 Package Markings........................................................................................... 62
Figure 8-7 FT313H Solder Reflow Profile........................................................................................ 63
List of Tables
Table 1-1 FT313H Numbers............................................................................................................2
Table 3-1 FT313H pin description.................................................................................................. 13
Table 4-1 Bus Configuration modes............................................................................................... 15
Table 4-2 Pin information of the bus interface ................................................................................ 15
Table 4-3 Clock frequency select .................................................................................................. 17
Table 4-5 power management configuration................................................................................... 18
Table 5-1 Overview of host controller specific registers.................................................................... 21
Table 5-2 Capability register ........................................................................................................ 21
Table 5-3 Structural parameter register......................................................................................... 21
Table 5-5 USB command register.................................................................................................. 24
Table 5-6 USB status register....................................................................................................... 25
Table 5-9 Periodic frame list base address register.......................................................................... 26
Table 5-10 Current asynchronous list address register..................................................................... 26
Table 5-11 Port status and control register .................................................................................... 29
Table 5-12 EOF time and asynchronous schedule sleep timer register ............................................... 30
Table 5-14 HW mode register....................................................................................................... 31
Table 5-15 Edge interrupt control register...................................................................................... 31
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Table 5-16 SW reset register........................................................................................................ 32
Table 5-17 Memory address register ............................................................................................. 33
Table 5-18 Data port register....................................................................................................... 33
Table 5-19 Data session length register......................................................................................... 33
Table 5-20 DMA configuration register........................................................................................... 35
Table 5-21 AUX Memory address register ...................................................................................... 35
Table 5-22 AUX data port register................................................................................................. 35
Table 5-23 Sleep timer register .................................................................................................... 35
Table 5-24 HC interrupt status register.......................................................................................... 37
Table 5-25 HC interrupt status register.......................................................................................... 38
Table 5-26 Test mode register...................................................................................................... 39
Table 5-28 Test parameter setting 2 register.................................................................................. 39
Table 6-1 Absolute Maximum Ratings........................................................................................... 40
Table 6-2 Operating Voltage and Current....................................................................................... 41
Table 6-3 Digital I/O Pin Characteristics (VCC(I/O) = +3.3V, Standard Drive Level)............................ 41
Table 6-4 Digital I/O Pin Characteristics (VCC(I/O) = +2.5V, Standard Drive Level)............................ 42
Table 6-5 Digital I/O Pin Characteristics (VCC(I/O) = +1.8V, Standard Drive Level)............................ 42
Table 6-6 USB I/O Pin (USBDP, USBDM) Characteristics .................................................................. 44
Table 6-7 5V Tolerant Pin (PSW_N, OC_N, VBUS) Characteristics...................................................... 44
Table 6-8 System clock characteristics .......................................................................................... 45
Table 6-9 Analog I/O pins characteristics....................................................................................... 45
Table 6-11 NOR PIO timing.......................................................................................................... 48
Table 6-12 General Multiplex PIO timing........................................................................................ 50
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Document No.: FT_000589
FT313H USB2.0 HS Host Controller Datasheet Version 1.2
Clearance No.: FTDI# 318
Appendix C - Revision History
Document Title:
USB Host IC FT313H
FT_000589
Document Reference No.:
Clearance No.:
FTDI# 318
Product Page:
http://www.ftdichip.com/FTProducts.htm
DS_FT313H
Document Feedback:
Version 1.0
Version 1.1
Version 1.2
Initial Release
OCT 2012
NOV 2012
SEP 2013
Formatting tidy up
Add package markings
Copyright © 2013 Future Technology Devices International Limited
67
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