UMFT201XA-02 [FTDI]

UMFT230XA USB to Basic UART Development Module;
UMFT201XA-02
型号: UMFT201XA-02
厂家: FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD.    FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD.
描述:

UMFT230XA USB to Basic UART Development Module

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UMFT230XA Datasheet  
Version 1.4  
Document Reference No.: FT_000519 Clearance No.: FTDI#269  
Future Technology  
Devices International  
Datasheet  
UMFT230XA USB to Basic  
UART Development Module  
UMFT230XA is a USB to Basic UART DIP module with a 0.3” row pitch.  
1.1 Features  
1 Introduction  
The UMFT230XA is a development module for  
FTDI’s FT230XQ, one of the devices from FTDI’s  
range of USB interface bridging integrated circuit  
devices. FT230X is a USB to UART interface with  
a battery charger detection feature, which can  
allow batteries to be charged with a higher  
current from a dedicated charger port (without  
the FT230X being enumerated). In addition,  
asynchronous and synchronous bit bang interface  
modes are available. The internally generated  
clock (6MHz, 12MHz and 24MHz) can be brought  
out of the on one of the CBUS pin to be used to  
drive a microprocessor or external logic.  
The UMFT230XA is fitted with a FT230XQ; all the  
features of the FT230X can be utilized with the  
UMFT230XA. For a full list of the FT230X’s features  
please see the FT230X datasheet which can be found  
by clicking here.  
In addition to the features listed in the FT230X  
datasheet, the UMFT230XA has the following features:  
Small PCB assembly module designed to fit a  
standard 7.62mm (0.3”) wide 16 pin DIP socket.  
Pins are on a 2.54mm (0.1”) pitch.  
On board USB ‘mini-B’ socket allows module to be  
connected to a PC via a standard A to mini-B USB  
cable.  
The UMFT230XA is a module which is designed to  
plug into a standard 0.3” wide 16 pin DIP socket.  
All components used, including the FT230XQ are  
Pb-free (RoHS compliant).  
Functionally configurable using solder links. The  
default solder links setup enables the module to  
function without peripheral wires or application  
board. Other configurations enable external power  
supply options and variation of logic reference  
levels.  
Neither the whole nor any part of the information contained in, or the product described in this manual, may be adapted or re produced  
in any material or electronic form without the prior written consent of the copyright holder. This product and its documentation are  
supplied on an as-is basis and no warranty as to their suitability for any particular purpose is either made or implied. Future Technology  
Devices International Ltd will not accept any claim for damages howsoever arising as a result of use or failure of this product. Your  
statutory rights are not affected. This product or any variant of it is not intended for use in any medical appliance, device or system in  
which the failure of the product might reasonably be expected to result in personal injury. This document provides preliminary  
information that may be subject to change without notice. No freedom to use patents or other intellectual property rights is implied by  
the publication of this document. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park,  
Glasgow,G41 1HH,United Kingdom.Scotland Registered Number: SC136640  
Copyright © Future Technology Devices International Limited  
 
 
UMFT230XA Datasheet  
Version 1.4  
Document Reference No.: FT_000519 Clearance No.: FTDI#269  
Table of Contents  
1 Introduction ................................................................. 1  
1.1 Features ................................................................................ 1  
2 Driver Support.............................................................. 3  
3 Ordering Information & TID .......................................... 4  
4 UMFT230XA Signals and Configurations......................... 5  
4.1 UMFT230XA Pin Out ............................................................... 5  
4.2 Signal Descriptions ................................................................ 6  
4.3 CBUS Signal Options............................................................... 7  
5 Module Configurations .................................................. 8  
5.1 Solder Link Configuration Options........................................... 8  
5.2 Solder Link Modifications........................................................ 8  
5.3 Bus Power Configuration........................................................ 9  
5.4 Self Powered Configuration ...................................................10  
5.5 USB Bus Powered with Power Switching Configuration...........11  
5.6 Variable IO Voltage Supply....................................................12  
5.7 3.3V Voltage Supply ..............................................................13  
5.8 Configuring the MTP ROM......................................................14  
5.9 Module Dimensions ...............................................................14  
5.10 IC Package Markings.............................................................15  
6 UMFT230XA Module Circuit Schematic ......................... 16  
7 Internal MTPROM Configuration .................................. 17  
8 Contact Information.................................................... 18  
Appendix A References ................................................. 19  
Document References ...................................................................19  
Acronyms and Abbreviations .........................................................19  
Appendix B List of Figures and Tables............................ 20  
List of Figures...............................................................................20  
List of Tables ................................................................................20  
Appendix C Revision History.......................................... 21  
Copyright © Future Technology Devices International Limited  
2
UMFT230XA Datasheet  
Version 1.4  
Document Reference No.: FT_000519 Clearance No.: FTDI#269  
2 Driver Support  
Royalty-Free VIRTUAL COM PORT (VCP)  
DRIVERS for:  
Royalty-Free D2XX Direct Drivers (USB Drivers  
+ DLL S/W Interface):  
Windows 10 32, 64 bit  
Windows 8 and 8.1 32,64-bit  
Windows 7 32,64-bit  
Windows Vista  
Windows 10 32, 64 bit  
Windows 8 and 8.1 32,64-bit  
Windows 7 32,64-bit  
Windows Vista  
Windows XP 32,64-bit  
Windows XP Embedded  
Windows CE.NET 4.2 , 5.0 and 6.0  
MAC OS OS-X  
Windows XP 32,64-bit  
Windows XP Embedded.  
Windows CE.NET 4.2, 5.0 and 6.0  
MAC OS OS-X  
Linux 3.0 and greater  
Android  
Linux 3.0 and greater  
Android  
The drivers listed above are all available to download for free from www.ftdichip.com. Various 3rd Party  
Drivers are also available for various other operating systems - visit www.ftdichip.com for details.  
Copyright © Future Technology Devices International Limited  
3
UMFT230XA Datasheet  
Version 1.4  
Document Reference No.: FT_000519 Clearance No.: FTDI#269  
3 Ordering Information & TID  
Module Code  
Utilised  
IC Code  
TID  
Description  
UMFT201XA-01  
UMFT201XA-02  
UMFT220XA-01  
UMFT220XA-02  
UMFT221XA-01  
UMFT221XA-02  
UMFT230XA-01  
UMFT230XA-02  
UMFT231XA-01  
FT201XQ 40001460 USB to I2C evaluation module , Pin length: 5.6mm.  
FT201XQ 40001460 USB to I2C evaluation module , Pin length: 4.6mm.  
FT220XQ 40001461 USB to 4-bit SPI/FT1248 evaluationmodule, Pin length: 5.6mm.  
FT220XQ 40001461 USB to 4-bit SPI/FT1248 evaluationmodule, Pin length: 4.6mm.  
FT221XQ 40001462 USB to 8-bit SPI/FT1248 evaluationmodule, Pin length: 5.6mm.  
FT221XQ 40001462 USB to 8-bit SPI/FT1248 evaluationmodule, Pin length: 4.6mm.  
FT230XQ 40001463 USB to Basic UART evaluationmodule, Pin length: 5.6mm.  
FT230XQ 40001463 USB to Basic UART evaluationmodule, Pin length: 4.6mm.  
FT231XQ 40001464 USB to Full-Handshake UART evaluationmodule, Pin length:  
5.6mm.  
UMFT231XA-02  
FT231XQ 40001464 USB to Full-Handshake UART evaluationmodule, Pin length:  
4.6mm.  
UMFT240XA-01  
UMFT240XA-02  
FT240XQ 40001466 USB to 8-bit 245 FIFO evaluationmodule, Pinlength: 5.6mm.  
FT240XQ 40001466 USB to 8-bit 245 FIFO evaluationmodule, Pinlength: 4.6mm.  
TID is the test identification code. Note that this TID is for revision D silicon.  
Copyright © Future Technology Devices International Limited  
4
UMFT230XA Datasheet  
Version 1.4  
Document Reference No.: FT_000519 Clearance No.: FTDI#269  
4 UMFT230XASignalsandConfigurations  
4.1 UMFT230XA Pin Out  
GND J1-1  
3V3OUT  
VCCIO  
J2-1 SLD  
VBUS  
VCC  
RESET#  
CTS#  
CBUS3  
CBUS2  
RTS#  
CBUS1  
RXD  
CBUS0  
TXD J1-8  
J2-8 GND  
Figure 4.1 Module Pin Out  
Figure 4.1 illustrates the signals available on the DIL pins. The LHS shows the pinout when the module is  
viewed from the bottom. The RHS shows what signals are available (on the pins below) when viewed  
from the top. The pins do not go completely through the PCB.  
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UMFT230XA Datasheet  
Version 1.4  
Document Reference No.: FT_000519 Clearance No.: FTDI#269  
4.2 Signal Descriptions  
Pin  
Name  
Type  
Description  
No.  
J1-1,  
J2-8  
GND  
PWR  
Module GroundSupply Pins  
3.3V output from integratedLDO regulator. This pin is decoupled with a 100nF  
capacitor to ground on the PCB module. The prime purpose of this pin is to provide  
the 3.3V supply that can be used internally. For powersupply configuration details  
see section 5.  
Power  
Input/  
Output  
J1-2  
3V3OUT  
Power  
Input  
+1.8V to +3.3V supply to the UARTInterface and CBUS I/O pins. Forpower supply  
configuration details see section 5.  
J1-3  
J1-4  
VCCIO  
FT230X active low reset line. Configuredwith an on board pull-upand recommended  
filter capacitor.  
RESET#  
Input  
J1-5  
J1-6  
J1-7  
J1-8  
J2-1  
CTS#  
RTS#  
RXD  
Input  
Output  
Input  
Output  
GND  
Clear To SendControl Input / Handshake Signal.  
Request to Send Control Output / Handshake Signal.  
ReceivingAsynchronous Data Input.  
TXD  
Transmit Asynchronous Data Output.  
SLD  
USB Cable Shield. Connected to GND via a 0ohmresistor.  
5V Power output fromthe USB bus. For a low powerUSB buspowered design, up to  
100mA can be sourced from the 5V supply and appliedto the USB bus. A maximum  
of 500mA can be sourced from the USB bus in a high power USB bus powered design.  
Currents up to 1A can be sourced froma dedicated charger andapplied to the USB  
bus.  
Power  
J2-2  
VBUS  
Output  
Power  
Input  
J2-3  
J2-4  
J2-5  
J2-6  
J2-7  
VCC  
5V power input for FT230X. For power supply configuration details see section 5.  
Configurable CBUS I/O Pin. Function of this pin is configured in the device internal  
MTP ROM. . See CBUS Signal Options, Table 4.2.  
CBUS3  
CBUS2  
CBUS1  
CBUS0  
I/O  
I/O  
I/O  
I/O  
Configurable CBUS I/O Pin. Function of this pin is configured in the device internal  
MTP ROM.. See CBUS SignalOptions, Table 4.2.  
Configurable CBUS I/O Pin. Function of this pin is configured in the device internal  
MTP ROM.. See CBUS SignalOptions, Table 4.2.  
Configurable CBUS I/O Pin. Function of this pin is configured in the device internal  
MTP ROM. See CBUS Signal Options, Table 4.2.  
Table 4.1 Module Pin Out Description  
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UMFT230XA Datasheet  
Version 1.4  
Document Reference No.: FT_000519 Clearance No.: FTDI#269  
4.3 CBUS Signal Options  
The following options can be configured on the CBUS I/O pins. These options are all configured in the  
internal MTP ROM using the utility software FT_PROG, which can be downloaded from the  
www.ftdichip.com. The default configuration is described in DS_UMFT231XA.  
CBUS Signal  
Option  
Available On  
CBUS Pin  
Description  
Tristate  
TXDEN  
CBUS0-CBUS3  
CBUS0-CBUS3  
CBUS0-CBUS3  
CBUS0-CBUS3  
IO Pad is tristated  
Enable transmit data for RS485  
Output a constant 1  
DRIVE_1  
DRIVE_0  
Output a constant 0  
Output is low after the device has beenconfigured by USB,then high during  
USB suspendmode. This output can be used to control powerto external logic  
P-Channel logic level MOSFET switch.  
NOTE: This function is driven by an open-drain to ground with no internal  
pull-up; this is specially designed to aid battery chargingapplications.  
UMFT230XA connectsan on-board 47K pull-up to each CBUS andDBUS pin.  
PWREN#  
CBUS0-CBUS3  
Transmit data LED drive open drain pulseslow whentransmitting data via  
USB.  
TXLED#  
RXLED#  
CBUS0-CBUS3  
CBUS0-CBUS3  
CBUS0-CBUS3  
Receive data LED drive opendrain pulseslow whenreceivingdata via USB.  
LED drive open drain pulses lowwhen transmitting or receiving data via  
USB.  
TX&RXLED#  
Goes low during USB suspend mode. Typically used to power down an  
external logic to RS232level converter IC in USB to RS232 converterdesigns.  
CancelSLEEP# optionfor when connected to a dedicated chargerport, this  
can be selectedwhen configuring the MTP ROM. When this option is enabled  
SLEEP# is drivenhigh when FT230X is connectedto a Dedicated Charger Port.  
SLEEP#  
CBUS0-CBUS3  
CLK24MHz  
CLK12MHz  
CLK6MHz  
CBUS0-CBUS3  
CBUS0-CBUS3  
CBUS0-CBUS3  
24 MHz Clock output.**  
12 MHz Clock output.**  
6 MHz Clock output.**  
CBUS bit bang mode option. Allows up to 4 of the CBUS pinsto be used as  
general purpose I/O. Configuredindividually for CBUS0, CBUS1, CBUS2 and  
CBUS3 in the internal MTP ROM. A separate application note, AN232R-01,  
available from FTDI website (www.ftdichip.com) describesin more detail how  
to use CBUS bit bangmode.  
GPIO  
CBUS0-CBUS3  
Battery Charge Detect indicates whenthe device is connected to a dedicated  
battery chargerhost. Active high output. NOTE: Requiresa 10K pull-down to  
remove power up toggling.  
BCD_Charger  
CBUS0-CBUS3  
CBUS0-CBUS3  
Active low BCD Charger, driven by an open drain to ground with no internal  
pull-up (4.7K on boardpull-up present).  
BCD_Charger#  
BitBang_WR#  
BitBang_RD#  
VBUS Sense  
Time Stamp  
CBUS0-CBUS3  
CBUS0-CBUS3  
CBUS0-CBUS3  
CBUS0-CBUS3  
CBUS0-CBUS3  
Synchronousand asynchronousbit bang mode WR#strobe output.  
Synchronousand asynchronousbit bang mode RD# strobe output.  
Input to detect when VBUS is present.  
Toggle signal which changes state each time a USB SOF is received  
Keep_Awake#  
Active Low input, prevents the chip from going into suspend.  
Table 4.2 CBUS Signal Options  
**When in USB suspendmode the outputs clocks are also suspended.  
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UMFT230XA Datasheet  
Version 1.4  
Document Reference No.: FT_000519 Clearance No.: FTDI#269  
5 Module Configurations  
5.1 Solder Link Configuration Options  
Solder  
Setting  
Status  
Description  
Link No.  
Connects internal 3.3V regulator to VCCIO. This restricts signal drive to only 3.3V  
level signals.  
JP1  
Shorted  
Default  
Non-  
Disconnects internal 3.3V regulator connectionto VCCIO.This mode allowsfor the  
supply of 1.8V-3.3V powerfroman external powersupply, thus allows the  
Default processing of signals with logiclevelsbetween 1.8V and 3.3V. VCCIO canbe  
adjusted to match the interface requirements of external circuitry.  
JP1  
Opened  
Table 5.1 Solder Links JP1 Pin Description  
Solder  
Setting  
Status  
Description  
Link No.  
JP2  
JP2  
Shorted  
Opened  
Default Connects VBUS to VCC. Thismode is known as “BUS-Powered” mode.  
Non- Disconnects VBUS to VCC. Thisallows the supply of powerforman external power  
Default supply. This mode is known as “Self-Powered” mode.  
Table 5.2 Solder Links JP2 Pin Description  
Note: There should never be more than one power output supplied to the same net. Failure to properly  
remove solder from JP1 and JP2 can cause a direct short between two different power supplies (when a  
self-powered set-up is applied and the USB bus is connected) resulting in damage to the UMFT230XA  
module and the target circuit.  
5.2 Solder Link Modifications  
The UMFT230XA has two solder links fixed to the top side of the PCB. These solder link can be adjusted  
by removing the solder linking the two PADs to produce an open or by placing a solder bridge to produce  
a short.  
By default the UMFT230XA has both solder links shorting their pads. To allow for enhanced flexibility of  
this module remove both solder links and wire the header pins accordingto the power setup required.  
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UMFT230XA Datasheet  
Version 1.4  
Document Reference No.: FT_000519 Clearance No.: FTDI#269  
5.3 Bus Power Configuration  
GND  
Alternative  
Alternative  
connection  
connection  
VCCIO  
VCC  
Current Flow  
3V3OUT  
VBUS  
GND  
Self-Sourced  
3V3 TTL Mode  
Bus Powered  
Mode  
Solder Link JP1 - Closed  
Solder Link JP2 - Closed  
Viewing pins thourgh the board  
from the top.  
Figure 5.1 Bus Powered Configuration  
A bus powered configuration draws its power from the USB host/hub. The UMFT230XA is configured by  
default to be in bus poweredmode.  
Figure 5.1illustrates the UMFT230XA module in a typical USB bus powered design configuration. By  
default solder bridge connections link VCCIO to 3V3OUT, and VCC to VBUS. (Note that Figure 5.1 is for  
illustration only and that the pins do not actually go all the way throughthe PCB  
For a bus power configuration power is supplied from the USB VBUS:  
+5V VBUS power is sourced fromthe USB bus and is connected to the FT230X power input (VCC)  
+3.3V power is sourced from the FT230X’s voltage regulator output and is connected to the FT230X IO  
port’s power input (VCCIO).  
Interfacing the UMFT230XA module to a microcontroller (MCU), or other logic devices for bus powered  
configuration is done the same way as a self powered configuration (see Section 3), except that it is  
possible for the MCU or external device to take its power supply from the USB bus (either the 5V from  
the USB pin, or 3.3V from the 3V3OUT pin).  
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UMFT230XA Datasheet  
Version 1.4  
Document Reference No.: FT_000519 Clearance No.: FTDI#269  
5.4 Self Powered Configuration  
Vcc = 1.8V 3.3V  
Vcc = 5V  
VIO  
TXD  
RXD  
TXD  
RTS#  
CTS#  
RXD  
RTS#  
CTS#  
MCU  
VCCIO  
VCC  
3V3OUT  
VBUS  
GND  
Self Power  
Mode  
Solder Link JP2 - Open  
Variable TTL  
Mode  
Solder Link JP1 - Open  
Viewing pins thourgh the board  
from the top.  
Figure 5.2 Self-Powered Configuration  
A self-powered configuration operates on the principle of drawing power from an external power supply,  
as oppose to drawing power from the USB host. In this configuration no current is drawn from the USB  
bus.  
Figure 5.2 illustrates the UMFT230XA in a typical USB self-powered configuration. In this case the solder  
links connection of JP1 is removed, which allows 5V power to be supplied to the module VCC pins from an  
external source. VCCIO can to be powered from 3V3OUT or the VCC of an external source. (Note that  
Figure 5.2 is for illustration only and that the pins do not actually go all the way through the PCB)  
For a self-powered configuration it is necessary to prevent current from flowing back to the USB data  
lines when the connected USB host or hub has powered down. To carry out this function the UMFT230XA  
uses an on-board voltage divider network connected to the USB power bus and RESET# pin. This  
operates on the principle that when no power is supplied to the VBUS line, the FT230X will automatically  
be held in reset by a weak pull-down, when power is applied the voltage divider will apply a weak 3.3V  
pull-up. Driving a level to the RESET# pin of the UMFT230XA will override the effect of this voltage  
divider. When the FT230X is in reset the USB DP signal pull-up resistor connected to the data lines is  
disconnected andno current can flow down the USB lines.  
An example of interfacing the FT230X with a Microcontrollers UART interface is also illustrated in Figure  
5.2. This example shows the wire configuration of the transfer and handshake lines. This example also  
illustrates that a voltage other than 3.3V can be supplied to the FT230X’s IO port, this feature is  
described further and for bus poweredmode in Section 5.6.  
Alternatively both the FT230X’s IO port and MCU can be powered from the 3V3OUT pin; this approach is  
described in Section 5.5.  
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UMFT230XA Datasheet  
Version 1.4  
Document Reference No.: FT_000519 Clearance No.: FTDI#269  
5.5 USB Bus Powered with Power Switching Configuration  
5V  
P-Channel Power  
MOSFET  
s
d
VCC  
TXD  
RXD  
0.1uF  
0.1uF  
10K  
g
Soft  
Start  
Circuit  
TXD  
RTS#  
CTS#  
CBUSx  
PWREN#  
RXD  
RTS#  
CTS#  
1K  
MCU  
VCCIO  
VCC  
3V3OUT  
VBUS  
GND  
Bus Powered  
Mode  
Solder Link JP2 - Closed  
Self-Sorced  
3.3V TTL Mode  
Solder Link JP1 - Closed  
Viewing pins thourgh the board  
from the top.  
Figure 5.3 Bus Powered with Power Switching Configuration  
USB bus powered mode is introduced in Section 5.3. This section describes how to use this mode with a  
power switch.  
USB bus powered circuits are required by USB compliance standards to consume less than 2.5mA (and  
less than 100mA when not enumerated and not suspended) when connected to a host or hub when in  
USB suspend mode. The PWREN# CBUS function can be used to remove power from external circuitry  
whenever the FT230X is not enumerated. (Note: It is impossible to be in suspended mode when  
enumerated.) (Note that Figure 5.3 is for illustration only and that the pins do not actually go all the way  
through the PCB)  
To implement a power switch using PWREN#, configure a P-Channel Power MOSFET to have a soft start  
by fitting a 10K pull-up, a 1K series resistor anda 100nF cap as shown in Figure 5.3. The time constant  
Connecting the source of the P-Channel MOSFET to 3V3OUT instead of VBUS can allow external logic to  
source 3.3V power from the FT230X without breaking USB compliancy. In this setup it is important that  
the VCCIO is not sourced from the drain of this MOSFET, this is because the power used to drive the gate  
of this transistor is sourced from VCCIO. VCCIO should be connected directly to 3V3OUT for this setup to  
function effectively. It is also important that the external logic must and IO core of the FT230X must not  
draw more that 50mA, this is because the current limit of the internal 3.3V regulator is 50mA.  
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UMFT230XA Datasheet  
Version 1.4  
Document Reference No.: FT_000519 Clearance No.: FTDI#269  
5.6 Variable IO Voltage Supply  
Vcc = 1.8V 3.3V  
TXD  
RXD  
TXD  
RTS#  
CTS#  
RXD  
RTS#  
CTS#  
MCU  
VCCIO  
VCC  
3V3OUT  
VBUS  
GND  
Solder Link JP1 - Open  
Solder Link JP2 - Closed  
Viewing pins thourgh the board  
from the top.  
Figure 5.4 USB Bus Powered 3.3V Logic Drive  
The FT230X can process signals at CMOS/TTL logic levels in the range of 1.8V to 3.3V. This section  
describes how to utilise this feature.  
Figure 5.4 shows a configuration where the FT230X is interfaced to a device with IOs operating in the  
range of 1.8V 3.3V. The IO ports of this module need to be powered with a voltage level that is equal  
to the level of the signals it is processing. Since the FT230X’s embedded voltage regulator only outputs  
3V3 the IO ports will need to be powered from another power source when operating at voltage levels  
other than 3.3V. (Note that Figure 5.4 is for illustration only and that the pins do not actually go all the  
way through the PCB)  
By default, a short is present between 3V3OUT (embedded voltage regulator) and VCCIO (IO port’s  
power input) by solder links JP1. If an external power supply is used to power the IO ports this solder  
links needs to be open. This can be done by removing the solder linking the two pads of the solder links.  
The configuration described in this section can be implemented in either bus-powered mode or self-  
powered mode.  
Note 1: The CBUS and DBUS pins are 5V tolerant; however these signals cannot drive signals at 5V  
TTL/CMOS. VCCIO is not 5V tolerant; applying 5V to VCCIO will damage the chip.  
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UMFT230XA Datasheet  
Version 1.4  
Document Reference No.: FT_000519 Clearance No.: FTDI#269  
Note 2: If power is applied to VCCIO and no power is applied to VCC all Ios will be at an unknown state,  
this however will not damage the chip. The FT230X also has protective circuitry to prevent the chip being  
damaged by a voltage discrepancy betweenVCCIO and the level of the signal being processed.  
Note 3: When using VCCIO less than 3V3 on a chip from FTDI’s X-chip range, it is recommended to uses  
pull up resistors (47K) to VCCIO on the data lines, all of the UMFT2xxXA devices include an on-board  
pull-up for these lines.  
5.7 3.3V Voltage Supply  
Vcc = 3.3V  
Vcc = 3.3V  
TXD  
TXD  
RXD  
RTS#  
CTS#  
RXD  
RTS#  
CTS#  
MCU  
VCCIO  
VCC  
3V3OUT  
VBUS  
GND  
Solder Links JP2 - Open  
Solder Links JP1 - Closed  
Viewing pins thourgh the board  
from the top.  
Figure 5.5 USB Self Powered 3.3V Logic Drive  
The FT230X can be powered from a single 3.3V supply. This feature is an alternative to having the  
FT230X poweredat 5V in standard self-powered configuration.  
The 3.3V Self Powered configuration is illustrated in Figure 5.5. Note that the 3.3V input is connected to  
VCC, VCCIO and 3V3OUT. (Note that Figure 5.5 is for illustration only and that the pins do not actually go  
all the way through the PCB)  
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5.8 Configuring the MTP ROM  
The FT230X contains an embedded MTP ROM. This can be used to configure the functions of each CBUS  
pin, the current drive on each signal pin, current limit for the USB bus and the other descriptors of the  
device. For details on using the MTP ROM/EEPROM programming utility FT_PROG, please see the  
FT_PROG User Guide and FT201X datasheet.  
When programming the MTP ROM please note:  
i) One of the CBUS Pins can be configured as PWREN# in the internal MTP ROM. This can be used to  
switch the power supply to the external circuitry.  
ii) The Max Bus Power setting of the MTP ROM should specify the maximum current to be drawn from  
the USB host/hub when enumerated. For high-powered USB devices the current limit when  
enumerated is between 100mA and 500mA, for low-powered USB devices the current limit is  
100mA.  
5.9 Module Dimensions  
2.54  
28.32  
2.4  
7.6  
30.1  
2.2  
L
-01 L = 5.6mm -02 L = 4.6mm  
Figure 5.6 UMFT230XA Module Dimensions  
All dimensions are given in millimetres.  
The UMFT230XA module exclusively uses lead free components, and is fully compliant with European  
Union directive 2002/95/EC.  
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UMFT230XA Datasheet  
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5.10 IC Package Markings  
1
12  
FTDI  
XXXXXXXXXX  
FT230XQ  
YYWW-D  
5
8
The date code format is YYXX where XX = 2 digit week number, YY = 2 digit year number. This is  
followed by the revision letter.  
The code XXXXXXX is the manufacturing LOT code.  
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UMFT230XA Datasheet  
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UMFT230XAModule Circuit Schematic  
Figure 6.1 Module Circuit Schematic  
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UMFT230XA Datasheet  
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Document Reference No.: FT_000519 Clearance No.: FTDI#269  
7 Internal MTPROM Configuration  
Following a power-on reset or a USB reset the FT230X will scan its internal MTP ROM and read the USB  
configuration descriptors stored there. The default values programmed into the internal MTP ROM in the  
FT230XQ used on the UMFT230XA are shown in Table 8.1.  
Parameter  
USB VendorID (VID)  
USB Product UD (PID)  
Serial Number Enabled?  
Value  
0403h  
6015h  
Yes  
Notes  
FTDI default VID (hex)  
FTDI default PID (hex)  
A unique serial number is generatedand programmed into  
the, TP ROM during final test of the module.  
Serial Number  
See Note  
Disabled  
Enabling this option will make the device pull down on the  
UART interface lines whenthe power is shut off (PWREN#  
is high).  
Pull down I/O Pins in USB  
Suspend  
ManufacturerName  
Product Description  
Max Bus PowerCurrent  
Power Source  
FTDI  
UMFT230XA  
90mA  
Bus Powered  
FT230X  
Device Type  
Returns USB 2.0 device descriptionto the host. Note: The  
device is a USB 2.0 Full Speed device (12Mb/s)as opposed  
to a USB 2.0 High Speeddevice (480Mb/s).  
USB Version  
0200  
Taking RI# low will wake up the USB host controllerfrom  
suspend.  
Remote Wake Up  
High Current I/Os  
Load VCP Driver  
Enabled  
Disabled  
Enabled  
Enables the high drive level onthe UARTand CBUS I/O  
pins.  
Makes the device load the CVP driver interface forthe  
device.  
CBUS0  
GPIO  
GPIO  
CBUS1  
CBUS2  
GPIO  
CBUS3  
GPIO  
Invert UART  
Disabled  
Signal on this pin becomesTXD# if enable.  
Table 7.1 Default Internal MTP ROM Configuration  
The internal MTP ROM in the FT230X can be programmed over USB using the utility program FT_PROG.  
FT_PROG can be downloaded from the www.ftdichip.com. Users who do not have their own USB vendor  
ID but who would like to use a unique Product ID in their design can apply to FTDI for a free block of  
unique PIDs. Contact FTDI Support (support1@ftdichip.com) for this service, also see TN_100 and  
TN_101.  
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8 Contact Information  
Head Office Glasgow, UK  
Branch Office Tigard, Oregon, USA  
Future Technology DevicesInternational Limited  
Unit 1, 2 Seaward Place, Centurion Business Park  
Glasgow G41 1HH  
Future Technology DevicesInternational Limited (USA)  
7130 SW Fir Loop  
Tigard, OR 97223-8160  
USA  
United Kingdom  
Tel: +44 (0) 141 429 2777  
Fax: +44 (0) 141 429 2758  
Tel: +1 (503) 547 0988  
Fax: +1 (503) 547 0987  
sales1@ftdichip.com  
support1@ftdichip.com  
admin1@ftdichip.com  
us.sales@ftdichip.com  
us.support@ftdichip.com  
us.admin@ftdichip.com  
E-mail (Sales)  
E-mail (Support)  
E-mail (GeneralEnquiries)  
E-mail (Sales)  
E-mail (Support)  
E-mail (GeneralEnquiries)  
Branch Office Taipei, Taiwan  
Branch Office Shanghai, China  
Future Technology DevicesInternational Limited (Taiwan) Future Technology DevicesInternational Limited (China)  
2F, No. 516, Sec. 1, NeiHu Road  
Taipei 114  
Taiwan , R.O.C.  
Room 1103, No. 666 West Huaihai Road,  
Shanghai, 200052  
China  
Tel: +886 (0) 2 8791 3570  
Fax: +886 (0) 2 8791 3576  
Tel: +86 21 62351596  
Fax: +86 21 62351595  
tw .sales1@ftdichip.com  
tw .support1@ftdichip.com  
tw .admin1@ftdichip.com  
cn.sales@ftdichip.com  
cn.support@ftdichip.com  
cn.admin@ftdichip.com  
E-mail (Sales)  
E-mail (Support)  
E-mail (GeneralEnquiries)  
E-mail (Sales)  
E-mail (Support)  
E-mail (GeneralEnquiries)  
Web Site  
http://ftdichip.com  
Distributor and Sales Representatives  
Please visit the SalesNetwork page of the FTDI Web site forthe contact details of ourdistributor(s) and sales  
representative(s) in yourcountry.  
System and equipment manufacturers and designers are responsible to ensure that their systems, and any Future Technology Devices  
International Ltd (FTDI) devices incorporated in their systems, meet all applicable safety, regulatory and syste m-level performance  
requirements.All application-related information in this document (including application descriptions, suggested FTDI devices and other  
materials) is provided for reference only. While FTDI has taken care to assure it is accurate, this information is subject to customer  
confirmation, and FTDI disclaims all liability for system designs and for any applications assistance provided by FTDI. Use o f FTDI  
devices in life support and/or safety applications is entirely at the users risk, and the user agrees to defend, indemnify and hold  
harmless FTDI from any and all damages, claims, suits or expense resulting from such use. This document is subject to change without  
notice. No freedom to use patents or other intellectual property rights is implied by the publication of this document. Neither the whole  
nor any part of the information contained in, or the product described in this document, may be adapted or reproduced in any material  
or electronic form without the prior written consent of the copyright holder. Future Technology Devices International Ltd, Unit 1, 2  
Seaward Place,Centurion Business Park,GlasgowG41 1HH,United Kingdom.Scotland Registered Company Number: SC136640  
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Appendix A References  
Document References  
DS_FT201x  
DS_FT220X  
DS_FT221X  
DS_FT230X  
DS_FT231X  
DS_FT240X  
DS_UMFT230XA  
AN232R-01  
AN_124 User Guide for FT Prog  
TN_100 USB VID-PID Guidelines  
TN_101 Guide to Debugging Customers Failed Driver Installation  
Acronyms and Abbreviations  
Terms  
DIP  
Description  
Dual In-line Package  
Dynamic Link Library  
Integrated Circuit  
Inter Integrated Circuit  
Operating System  
Printed Circuit Board  
Read Only Memory  
Universal Serial Bus  
Virtual COM Ports  
DLL  
IC  
I²C  
OS  
PCB  
ROM  
USB  
VCP  
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Appendix B List of Figures and Tables  
List of Figures  
Figure 4.1 Module Pin Out...................................................................................................................5  
Figure 5.1 Bus Powered Configuration..................................................................................................9  
Figure 5.2 Self-Powered Configuration...............................................................................................10  
Figure 5.3 Bus Powered with Power Switching Configuration ..............................................................11  
Figure 5.4 USB Bus Powered 3.3V Logic Drive....................................................................................12  
Figure 5.5 USB Self Powered 3.3V Logic Drive ...................................................................................13  
Figure 6.1 UMFT230XA Module Dimensions........................................................................................14  
Figure 8.1 Module Circuit Schematic..................................................................................................16  
List of Tables  
Table 4.1 Module Pin Out Description...................................................................................................6  
Table 4.2 CBUS Signal Options............................................................................................................7  
Table 5.1 Solder Links JP1 Pin Description ...........................................................................................8  
Table 5.2 Solder Links JP2 Pin Description ...........................................................................................8  
Table 9.1 Default Internal MTP ROM Configuration.............................................................................17  
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UMFT230XA Datasheet  
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Appendix C Revision History  
Document Title:  
UMFT230XA USB to Basic UART Development Module  
Document Reference No.:  
Clearance No.:  
FT_000519  
FTDI# 269  
Product Page:  
http://www.ftdichip.com/FT-X.htm  
Send Feedback  
Document Feedback:  
Revision  
Changes  
Date  
1.0  
Initial Release  
2012-02-09  
Added links, references to silicon revision, TID and  
logos  
1.0  
1.2  
2012-06-13  
2013-01-29  
Added a section for package marking and changed  
TIDs  
1.3  
1.4  
Added - 02 details  
201311-08  
Added ordering informationand support for Win 10  
2016-04-13  
Copyright © Future Technology Devices International Limited  
21  

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