EDC4UV6482-60JG-S [FUJITSU]

EDO DRAM Module, 4MX64, 60ns, CMOS, PDMA168;
EDC4UV6482-60JG-S
型号: EDC4UV6482-60JG-S
厂家: FUJITSU    FUJITSU
描述:

EDO DRAM Module, 4MX64, 60ns, CMOS, PDMA168

动态存储器 光电二极管 内存集成电路
文件: 总8页 (文件大小:139K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
September 1996  
Revision 1.0  
DATA SHEET  
EDC4UV6482-(60/70)(J/T)G-S  
32MByte (4M x 64) CMOS EDO DRAM Module - 3.3V  
General Description  
The EDC4UV6482-(60/70)(J/T)G-S is a high performance, EDO (Extended Data Out) 32-megabyte dynamic RAM module orga-  
nized as 4M words by 64 bits, in a 168-pins, dual-in-line (DIMM) memory modules.  
The module utilizes sixteen, Fujitsu MB81V17805A-(60/70) (PJ/FN) CMOS 2Mx8 EDO dynamic RAMs in a surface mount package  
on an epoxy laminate substrate. Each device is accompanied by a decoupling capacitor for improved noise immunity.  
Control lines provided are such that byte control is possible. Serial PD on the module is provided by using 128 byte serial EEPROM.  
Features  
• High Density: 32MByte  
• Fast Access Time of 60/70 ns (max.)  
• Low Power: 3.5/3.2 W (max.) - Active (60/70 ns)  
115mW (max.) - Standby (LVTTL)  
57mW (max.)  
- Standby (CMOS)  
• LVTTL-compatible inputs and outputs  
• Separate power and ground planes to improve noise immunity  
• Single power supply of 3.3V±0.3V  
• Height: 1.00 inch  
ABSOLUTE MAXIMUM RATINGS  
Item  
Symbol  
Ratings  
-0.5 to +4.6  
16  
Unit  
V
Voltage on any pin relative to V  
V
P
SS  
T
Power Dissipation  
W
T
T
Operating Temperature  
Storage Temperate  
0 to +70  
-55 to +125  
50  
°C  
°C  
mA  
opr  
T
stg  
OS  
I
Short Circuit Output Current  
RECOMMENDED DC OPERATING CONDITIONS  
(TA = 0 to +70 °C)  
Symbol  
Parameter  
Supply Voltage  
Min  
Typ  
Max  
3.6  
0
Unit  
V
V
V
V
3.0  
0
3.3  
V
V
V
V
CC  
SS  
IH  
Ground  
0
-
V
+0.3  
Input High voltage  
Input Low voltage  
2.0  
-0.3  
CC  
-
0.8  
IL  
Fujitsu Microelectronics, Inc.  
1
September 1996  
Revision 1.0  
EDC4UV6482-(60/70)(J/T)G-S  
Functional Diagram  
CAS7*  
CAS6*  
CAS5*  
CAS4*  
CAS3*  
CAS2*  
CAS1*  
CAS0*  
2M x 8  
EDO  
DRAM  
2M x 8  
EDO  
DRAM  
2M x 8  
EDO  
DRAM  
2M x 8  
EDO  
DRAM  
2M x 8  
EDO  
DRAM  
2M x 8  
EDO  
DRAM  
2M x 8  
EDO  
DRAM  
2M x 8  
EDO  
DRAM  
OE0*  
OE2*  
WE2*  
WE0*  
RAS0*  
RAS2*  
2M x 8  
EDO  
2M x 8  
EDO  
2M x 8  
EDO  
2M x 8  
EDO  
2M x 8  
EDO  
2M x 8  
EDO  
2M x 8  
EDO  
2M x 8  
EDO  
DRAM  
DRAM  
DRAM  
DRAM  
DRAM  
DRAM  
DRAM  
DRAM  
RAS1*  
RAS3*  
DQ0~DQ63  
SA0  
SA1  
SA2  
SCL  
SDA  
V
V
SS  
Serial  
EEPROM  
Device  
CC  
Decoupling capacitors  
to all devices  
(All specifications of the device are subject to change without notice.)  
Notes:  
1. “*” signifies active low signal.  
2. Addresses A0 ~ A10 are connected to all DRAMs.  
Fujitsu Microelectronics, Inc.  
2
September 1996  
Revision 2.0  
EDC4UV6482-(60/70)(J/T)G-S  
Pin Name  
A0~A10  
Addresses  
Data Inputs/Outputs  
Write Enable  
Row Address Strobes  
Serial Data Input/Output  
Output Enable  
CAS0*~CAS7*  
SA0~SA2  
SCL  
VCC  
VSS  
Column Address Strobes  
Decode Inputs  
Serial Clock  
Power Supply  
Ground  
DQ0~DQ63  
WE0*, WE2*  
RAS0*~RAS3*  
SDA  
OE0*, OE2*  
NC  
No Connection  
Pin No.  
Pin Designation  
Pin No.  
43  
Pin Designation  
Pin No.  
85  
Pin Designation  
Pin No.  
127  
Pin Designation  
V
V
V
V
SS  
1
2
3
4
5
6
SS  
SS  
SS  
DQ0  
DQ1  
DQ2  
DQ3  
44  
OE2*  
86  
DQ32  
DQ33  
DQ34  
DQ35  
128  
NC  
45  
RAS2*  
CAS2*  
CAS3*  
WE2*  
87  
129  
RAS3*  
CAS6*  
CAS7*  
NC  
46  
88  
130  
47  
89  
131  
V
V
48  
90  
132  
CC  
CC  
V
V
7
8
DQ4  
DQ5  
DQ6  
DQ7  
DQ8  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
91  
92  
DQ36  
DQ37  
DQ38  
DQ39  
DQ40  
133  
134  
135  
136  
137  
138  
139  
140  
141  
142  
143  
CC  
CC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
9
93  
10  
11  
12  
13  
14  
15  
16  
17  
94  
95  
V
V
V
V
96  
SS  
SS  
SS  
SS  
DQ9  
DQ16  
DQ17  
DQ18  
DQ19  
97  
DQ41  
DQ42  
DQ43  
DQ44  
DQ45  
DQ48  
DQ49  
DQ50  
DQ51  
DQ10  
DQ11  
DQ12  
DQ13  
98  
99  
100  
101  
V
V
CC  
CC  
V
V
18  
19  
20  
21  
22  
60  
61  
62  
63  
64  
DQ20  
NC  
102  
103  
104  
105  
106  
144  
145  
146  
147  
148  
DQ52  
NC  
CC  
CC  
DQ14  
DQ15  
NC  
DQ46  
DQ47  
NC  
NC  
NC  
NC  
NC  
V
V
NC  
NC  
SS  
SS  
V
V
23  
24  
25  
26  
27  
28  
29  
30  
31  
65  
66  
67  
68  
69  
70  
71  
72  
73  
DQ21  
DQ22  
DQ23  
107  
108  
109  
110  
111  
112  
113  
114  
115  
149  
150  
151  
152  
153  
154  
155  
156  
157  
DQ53  
DQ54  
DQ55  
SS  
SS  
NC  
NC  
NC  
NC  
V
V
V
V
CC  
SS  
CC  
SS  
WE0*  
CAS0*  
CAS1*  
RAS0*  
OE0*  
DQ24  
DQ25  
DQ26  
DQ27  
NC  
DQ56  
DQ57  
DQ58  
DQ59  
CAS4*  
CAS5*  
RAS1*  
NC  
V
V
CC  
CC  
V
V
32  
33  
34  
35  
36  
37  
38  
39  
40  
74  
75  
76  
77  
78  
79  
80  
81  
82  
DQ28  
DQ29  
DQ30  
DQ31  
116  
117  
118  
119  
120  
121  
122  
123  
124  
158  
159  
160  
161  
162  
163  
164  
165  
166  
DQ60  
DQ61  
DQ62  
DQ63  
SS  
SS  
A0  
A2  
A4  
A6  
A8  
A10  
NC  
A1  
A3  
A5  
A7  
A9  
NC  
NC  
V
V
SS  
SS  
NC  
NC  
NC  
SDA  
NC  
NC  
SA0  
SA1  
V
V
CC  
CC  
V
41  
42  
83  
84  
SCL  
125  
126  
NC  
NC  
167  
168  
SA2  
CC  
V
V
NC  
CC  
CC  
Fujitsu Microelectronics, Inc.  
3
September 1996  
Revision 1.0  
EDC4UV6482-(60/70)(J/T)G-S  
DC CHARACTERISTICS  
(VCC = 3.3V±0.3V, VSS = 0V, TA = 0 to +70 °C)  
60  
70  
Parameter  
Symbol  
Test Condition  
Unit  
Note  
Min.  
Max.  
Min.  
Max.  
I
RAS*, CAS* cycling; t = min.  
Operating Current  
-
976  
-
896  
mA  
1, 2  
CC1  
RC  
LVTTL Interface  
RAS*, CAS* V  
-
-
32  
16  
-
-
32  
16  
mA  
mA  
IH  
D
= HIgh-Z  
out  
I
Standby current  
CC2  
CMOS Interface  
RAS*, CAS* V - 0.2V  
cc  
D
= HIgh-Z  
out  
CAS* V ; RAS*, Address  
RAS* -only Refresh  
Current  
IH  
I
-
-
976  
976  
-
-
896  
896  
mA  
mA  
2
CC3  
cycling @ t = min.  
RC  
RAS*, CAS* cycling @  
CAS*-before-RAS*  
Refresh Current  
I
CC4  
t
= min.  
RC  
RAS* V ; CAS*, Address  
Hyper Page Mode  
Current  
IL  
I
-
976  
160  
20  
-
896  
160  
20  
mA  
µA  
µA  
1, 3  
CC5  
cycling @ t = min.  
PC  
I
0V Vin V + 0.3V  
Input Leakage Current  
Output Leakage Current  
-160  
-20  
-160  
-20  
LI  
CC  
0V Vout V  
CC  
I
LO  
D
= Disable  
out  
V
High I = -2mA  
Output High Voltage  
Output Low Voltage  
2.4  
0
-
2.4  
0
-
V
V
OH  
out  
V
Low I = 2 mA  
0.4  
0.4  
OL  
out  
Notes:  
1. Values depend on output load condition when the device is selected. Maximum Values are specified at the output open condition.  
2. Address can be changed once or less while RAS* = V .  
IL  
3. Address can be changed once or less while CAS* = V  
.
IH  
CAPACITANCE  
(TA =+25°C, VCC = 3.3V±0.3V)  
Parameter  
Symbol  
Max.  
85  
Unit  
pF  
Note  
C
Input Capacitance (Address)  
1
1
I1  
C
Input Capacitance (RAS*)  
33  
pF  
I2  
C
Input Capacitance (CAS0*~CAS7*)  
Input Capacitance (OE*, WE*)  
Input/Output Capacitance (DQ0~DQ63)  
20  
pF  
1
I3  
C
61  
pF  
1
I4  
C
20  
pF  
1, 2  
I/O  
Notes:  
1. Capacitance is measured with Boonton Meter or effective capacitance method.  
2. CAS* - V to disable D  
.
out  
IH  
Fujitsu Microelectronics, Inc.  
4
September 1996  
Revision 2.0  
EDC4UV6482-(60/70)(J/T)G-S  
AC CHARACTERISTICS  
(TA = 0 to +70°C, VCC = 3.3V±0.3V, VSS = 0V)  
60  
70  
Parameter  
Symbol  
Unit  
Notes  
Min  
110  
-
Max  
Min  
130  
-
Max  
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
Random read/write cycle time  
Access time from RAS*  
-
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ms  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
RC  
60  
70  
3, 4  
3, 4, 5  
3, 10  
2
RAC  
CAC  
AA  
Access time from CAS*  
-
15  
-
20  
Access time from column address  
Transition time (rise and fall)  
RAS* precharge time  
-
30  
-
35  
2
50  
2
50  
T
40  
60  
15  
45  
10  
20  
15  
5
-
50  
70  
20  
50  
15  
20  
15  
5
-
RP  
RAS* pulse width  
10000  
10000  
RAS  
RSH  
CSH  
CAS  
RCD  
RAD  
CRP  
ASR  
RAH  
ASC  
CAH  
RAL  
RCS  
RCH  
RRH  
WCH  
WP  
RAS* hold time  
-
-
CAS* hold time  
-
-
CAS* pulse width  
10000  
10000  
RAS* to CAS* delay time  
RAS* to column address delay time  
CAS* to RAS* precharge time  
Row address set-up time  
45  
50  
4
30  
35  
10  
-
-
0
-
0
-
Row address hold time  
10  
0
-
10  
0
-
Column address set-up time  
Column address hold time  
Column address to RAS* lead time  
Read command set-up time  
Read command hold time to CAS*  
Read command hold time to RAS*  
Write command hold time  
Write command pulse width  
Write command to RAS* lead time  
Write command to CAS* lead time  
Data-in set-up time  
-
-
10  
30  
5
-
15  
35  
5
-
-
-
-
-
0
-
0
-
8
0
-
0
-
10  
10  
15  
10  
0
-
15  
15  
20  
15  
0
-
-
-
-
-
RWL  
CWL  
DS  
-
-
-
-
9
9
Data-in hold time  
10  
-
-
15  
-
-
DH  
Refresh period (2048 cycles)  
Write command set-up time  
CAS* set-up time (CBR refresh)  
CAS* hold time (CBR refresh)  
RAS* precharge to CAS* hold time  
Access time from CAS* precharge  
Hyper page mode cycle time  
CAS* precharge time (Hyper page)  
RAS* pulse width (Hyper page)  
32  
32  
REF  
WCS  
CSR  
CHR  
RPC  
CPA  
HPC  
CP  
0
-
0
-
7
1
1
10  
10  
5
-
10  
15  
5
-
-
-
-
-
-
35  
-
40  
3, 11  
12  
25  
10  
60  
-
30  
10  
70  
-
-
-
100000  
100000  
RASP  
Fujitsu Microelectronics, Inc.  
5
September 1996  
Revision 1.0  
EDC4UV6482-(60/70)(J/T)G-S  
Notes:  
1. An initial pulse of at least 200µs is required after power-up followed by a minimum of eight RAS* cycles before device operation  
is achieved.  
2.  
V
(min.) and V (max.) are reference levels for measuring timing of input signals. Transition times are measured between V  
IH IL IH  
(min.) and V (max.) and are assumed to be 5 ns for all inputs.  
IL  
3. Measure with a load equivalent to 2 TTL loads and 100pF.  
4. Operation within the t (max.) limit ensures that t (max.) limit can be met; t (max.) is specified as a reference point  
RCD  
RCD  
RAC  
only. If t  
is greater than the specified t  
(max) limit, then access time is controlled exclusively by t  
.
RCD  
RCD  
CAC  
5. Assumes that tRCD t  
(max.).  
RAD  
6. This parameter defines the time at which the output achieves open circuit condition and is not referenced to V or V  
.
OH  
OL  
7.  
t
is non restrictive operating parameter. It is included in the data sheet as an electrical characteristic only. If tWCS t  
(min.)  
WCS  
WCS  
the cycle is an early write cycle and the data out pin will remain at high impedance for the duration of the cycle.  
8. Either t or t must be satisfied for a read cycle.  
RCH  
RRH  
9. These parameters are referenced to the CAS* leading edge in early write cycles.  
10. Operation within the t (max.) limit ensures that t (max.) limit can be met. t (max.) is specified as a reference point only.  
RAD  
RAD  
RAC  
If t  
is greater than the specified t  
(max.) limit, then access time is controlled by t  
.
RAD  
RAD  
AA  
11. Access time is determined by the longer of t , t  
, or t  
.
AA CAC  
ACP  
12.  
t
defines RAS* pulse width in fast page mode cycles.  
RASC  
Physical Dimensions  
168-pin (84x2) DIMM  
5.250  
Note†  
5.171  
5.014  
0.158  
1
11  
40  
41  
84  
0.118  
2.150  
1.450  
0.450  
0.250  
0.250  
1.700  
2.507  
0.050  
±0.004  
4.550 (Ref.)  
5.014  
0.350  
Front View  
Notes:  
1. All dimensions are in inches.  
2. Pin 85 is behind pin 1 on the back side.  
3. Thickness =0.350 for SOJ DRAMs  
=0.170 for TSOP DRAMs  
Fujitsu Microelectronics, Inc.  
6
September 1996  
Revision 2.0  
EDC4UV6482-(60/70)(J/T)G-S  
All Rights Reserved.  
Circuit diagrams using fujitsu products are included to illustrate typical semiconductor applications.  
Information sufficient for construction purpose may not be shown.  
The information contained in this document has been carefully checked and is believed to be reliable.  
However, Fujitsu Microelectronics, Inc. assumes no responsibility for inaccuracies.  
The information conveyed in this document does not convey any license under the copyrights, patent  
rights or trademarks claimed and owned by Fujitsu Limited, its subsidiaries, or Fujitsu  
Microelectronics, Inc.  
Fujitsu Microelectronics, Inc. reserves the right to change products or specifications without notice.  
No part of the publication may be copied or reproduced in any form or by any means, or transferred  
to any third party without prior written consent of Fujitsu Microelectronics, Inc.  
7
September 1996  
Revision 1.0  
EDC4UV6482-(60/70)(J/T)G-S  
Visit our web site for the latest information:  
http://www.fujitsumicro.com  
Fujitsu Microelectronics, Inc.  
Customer Response Center:  
For semiconductor products, flat panel displays, and PC cards in the U.S., Canada and Mexico,  
please contact the Fujitsu Microelectronics Customer Response Center (CRC). The CRC  
provides a single point of contact for resolving customer issues and answering technical  
questions.  
Web:  
Tel:  
Click on Tech Support in the FMI home page, then submit our form  
Telephone: 1-800-866-8608 Monday through Friday, 7 to 5 PST  
Outside U.S., Canada & Mexico call: 010-1-408-922-9000 and ask  
for the Customer Response Center. (Note: Country Code may vary)  
Fax:  
(408) 922-9179  
E-Mail:  
fmicrc@fmi.fujitsu.com  
MP-DRAMM-DS-20388-9/96  
8

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