FAR-C3SB-11000-K01-T [FUJITSU]
Series - Fundamental Quartz Crystal, 11MHz Nom;
| 型号： | FAR-C3SB-11000-K01-T |
| 厂家： | 
FUJITSU |
| 描述： | Series - Fundamental Quartz Crystal, 11MHz Nom |
| 文件： | 总11页 (文件大小：305K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
FUJITSU SEMICONDUCTOR
DATA SHEET
DS07-20101-7E
Resonator
Piezoelectric Resonator
FAR Family (C1, C3, C4 series)
■ DESCRIPTION
Fujitsu resonators (C1, C3, C4 series) feature originally developed single crystals with a high electromechanical
coupling coefficient (LiTaO3: lithium tantalate, LiNbO3: lithium niobate), the result is compact packaging. Three
series are available: the C3 and C4 series with built-in capacitors for high integration, for exclusive use in
microcomputer clocks; and the C1 series for high precision. All series include the CHIP type device for surface-
mount and the SIP type device for general PC boards.
■ FEATURES
•
Surface-mount technology can be applied to the CHIP type to increase packaging density. The SIP type is
only half the height of conventional quartz crystal resonators, and can be easily mounted on general PC boards.
The C3 and C4 series have been developed for exclusive use in microcomputer clocks. They have built-in
capacitors, and the number of components has been reduced to one-third of that of conventional circuits.
Both the SIP and CHIP types can be shipped in taped packages for automatic mounting.
The resonators have superior shock and vibration resistance, preventing damage during automatic insertion
process.
•
•
•
■ PACKAGE
FAR Family (C1, C3, C4 series)
■ STANDARD CHARACTERISTICS
Series
C1 series
C3 series
C4 series
Parameter
Material
Lithium Tantalate (LiTaO3)
3.58 to 16 MHz
Lithium Niobate (LiNbO3)
3 to 16 MHz
Frequency
Standard frequency
See “■ Standard frequency.”
±0.05% (G)
±0.1% (J)
±0.3% (K)
±0.5% (M)
±0.1% (J)
±0.3% (K)
±0.5% (M)
±0.5% (M)
±0.3% (K)
±1% (L)
Initial frequency
tolerance
Temperature
characteristics
(–20 to 60°C)
±0.02%
—
±0.05%
±0.5%
Capacity of built-in
capacitor
20±8 pF (standard)*
Aging stability
Within ±0.1%
–30 to 85°C
–40 to 100°C
Operating temperature
Storage temperature
(Resonant frequency and serial
resonant resistance)
(Oscillation frequency)
R:
3 MHz to 10 MHz max.
IC; 1/6MB84069B x 2
10 MHz to 16 MHz
IC; MC74HC04
1 MΩ
Resonator
30 pF
R
R
VCC; 5 VDC
R; Resonator
C1, C2: Loading capacitors
(built-in)
75 Ω
OSC
75 Ω
LM
C1 C2
Standard measuring
circuit
FAR
(Serial resonant resistance)
R: Resonator
R
C1 C2
75 Ω
LM
75 Ω
OSC
*: The capacity of the built-in capacitor is 20±8 pF by standard.
10±4 pF and 30±8 pF types are also available. However, the characteristics of 10±4 pF and 30±8 pF types are specified by
Fujitsu, considering matching data with applied IC (mainly microcomputer).
2
FAR Family (C1, C3, C4 series)
■ STANDARD FREQUENCY
C1/C3 series
C4 series
Standard
frequency (kHz)
Package
size
Resonant
resistance
Package
size
Resonant
resistance
3,580
4,000
4,194
4,915
A
A
A
A
A
A
A
A
300 Ω max.
150 Ω max.
(00)
(01)
6,000
6,144
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
7,373
8,000
10,000
11,000
11,059
12,000
14,746
16.000
150 Ω max.
75 Ω max.
(01)
(02)
•
Package sizes and resonant resistance
There are two package sizes according to frequency:
Frequency
3 to 5.99 MHz
6 to 16 MHz
Package size
A
B
For resonant resistance, standard values are specified according to frequency:
Standard resonant resistance
Frequency
C1/C3 series
C4 series
300 Ω max.
3 to 3.57 MHz
3.58 to 5.99 MHz
6 to 16 MHz
—
(00)
300 Ω max.
150 Ω max.
(00)
(01)
150 Ω max.
75 Ω max.
(01)
(02)
Note: For resonant resistance other than the standard values, they are specified by Fujitsu considering matching data with
applied IC (mainly micro computer).
■ NOTES ON USE
•
•
Handle carefully.
Solder under the following conditions.
CHIP type: 5 seconds max. at 230°C (PCB)
SIP type: 10 seconds max. at 260°C
Do not apply extreme heat to the resonator. Recommended preheating for the CHIP type is 150°C for one
minute.
•
•
•
•
Avoid extreme fluctuations in temperature during use.
There is no specific direction in resonator mounting.
Additional information is available separately, if required, for designing microcomputer oscillation circuits.
CHIP type is for reflow solder, not for flow solder.
3
FAR Family (C1, C3, C4 series)
■ PART NUMBERING SYSTEM
FAR
(1) (2) (3)
(4)
(5) (6) (7)
(8)
(1) Series
Series
C1
Single crystal
LiTaO3
Capacitor
—
C3
LiTaO3
With built-in capacitors
With built-in capacitors
C4
LiNbO3
(2) Package type
Specification
Type
CHIP
SIP
C
S
(3) Package size
See Table 1 in “■ Dimensions.”
Specification
Size
Large
Small
A
B
(4) Frequency (kHz)
Frequency Designation Frequency Designation Frequency Designation Frequency Designation
3,580 kHz
4,000 kHz
4,194 kHz
4,195 kHz
03580
04000
04194
04915
6,000 kHz
6,144 kHz
7,373 kHz
8,000 kHz
06000
06144
07373
08000
10,000 kHz
11,000 kHz
11,059 kHz
12,000 kHz
10000
11000
11059
12000
14,746 kHz
16,000 kHz
14746
16000
(5) Initial tolerance of frequency
See “■ Standard Frequency.”
Specification
Tolerance
C1 series
available
available
available
avaialble
—
C3 series
C4 series
G
J
±0.05%
±0.1%
±0.3%
±0.5%
±1%
—
—
available
available
available
—
—
K
M
L
available
available
available
4
FAR Family (C1, C3, C4 series)
(6) Capacity of built-in capacitor
Specification
Capacitance
20±8 pF
0
1
10±4 pF
2
30±8 pF
Note: For C1 series, only “0” is available.
(7) Resonant resistance
Specification
Resonant resistance
300 Ω max.
0
1
2
150 Ω max.
75 Ω max.
(8) User-specific Special Symbols
Specification
Name
Description
No specification, no taping specification
No specification, with taping specification
Serial number for custom design
—
A to Z
(9)Taping specification
• SIP type
Specification
Description
Reel pack
–T
–U
Ammo pack
• CHIP type
Specification
–R
Description
16 mm carrier pack
5
FAR Family (C1, C3, C4 series)
■ MARKING
(CHIP type)
(SIP type)
Fujitsu’s parts abbreviation
Frequency (kHz)
Fujitsu’s parts abbreviation
Frequency (kHz)
4000
T
1200
T
k
m
F
F
k
m
Lot No. (Date of manufacture,
conforms to EIAJ)
Lot No. (Date of manufacture,
conforms to EIAJ)
Initial frequency tolerance
Characteristics:
Initial frequency tolerance
Characteristics:
T: LiTaO3 N: LiNbO3
T: LiTaO3 N: LiNbO3
The stamp color varies with the capacity of the capacitor.
Capacitance
10 pF
Marking clolr
Yellow
20 pF
White
30 pF
Gray
Data code (EIAJ standard) is specified as follows in a four-year cycle.
Year
Month Symbol Year
Month Symbol Year
Month Symbol Year
Month Symbol
1
2
A
B
C
D
E
F
1
2
N
P
Q
R
E
T
1
2
a
b
1
2
n
3
3
3
3
4
4
4
d
e
f
4
r
1977
1981
1985
1989
1993
1978
1982
1986
1990
1994
1979
1983
1987
1991
1995
1980
1984
1988
1992
1996
5
5
5
5
6
6
6
6
t
7
G
H
J
7
U
V
W
X
Y
Z
7
7
u
8
8
8
8
9
9
9
j
9
10
11
12
K
L
10
11
12
10
11
12
10
11
12
M
6
FAR Family (C1, C3, C4 series)
■ PIN ASSIGNMENT
• C1 series
SIP type
CHIP type
1
2
1
2
(Equivalent circuit)
2
1
• C3 and C4 series
SIP type
CHIP type
2
3
1
1
2
3
(Equivalent circuit)
3
1
2
7
FAR Family (C1, C3, C4 series)
■ DIMENSIONS
Table 1 Package size
Unit: mm (in.)
a
Type
L
L1
W
H
Two terminal Three terminal
11.0 ± 0.2
4.3 ± 0.2
6.3 ± 0.2
A
B
A
B
—
(0.433 ± 0.008)
(0.169 ± 0.008) (0.248 ± 0.008)
SIP type
9.0 ± 0.2
(0.354 ± 0.008)
4.3 ± 0.2
(0.169 ± 0.008) (0.209 ± 0.008)
5.3 ± 0.2
—
5.08 ± 0.2
2.54 ± 0.2
(0.200 ± 0.008) (0.100 ± 0.008)
10.0 ± 0.5
9.4 ± 0.2
4.5 ± 0.5 2.5 ± 0.3
(0.394 ± 0.020) (0.370 ± 0.008) (0.177 ± 0.020) (0.098 ± 0.012)
CHIP type
8.0 ± 0.5
7.4 ± 0.2
3.2 ± 0.5
2.5 ± 0.3
(0.315 ± 0.020) (0.291 ± 0.008) (0.126 ± 0.020) (0.098 ± 0.012)
SIP type
L
W
L
W
H
H
0.35 ± 0.1
(0.014 ± 0.004)
0.35 ± 0.1
(0.014 ± 0.004)
0.5 ± 0.2
(0.020 ± 0.008)
0.5 ± 0.2
(0.020 ± 0.008)
a
a
a
3.4 ± 0.2
(0.134 ± 0.008)
3.4 ± 0.2
(0.134 ± 0.008)
C1 series
C3 and C4 series
CHIP type
L1
L1
L1
H
H
H
L
L
L
1.5
(0.059)
1.5
(0.059)
1.5
(0.059)
W
W
W
0.45
(0.018) (0.037)
0.95
0.45
(0.018) (0.037)
0.95
a
a
a
a
a
C1 series
C3 series
C4 series
8
FAR Family (C1, C3, C4 series)
■ TAPING FORM AND DIMENSIONS
•
SIP type
Unit: mm (in.)
6.35 ± 1.3
(0.250 ± 0.051)
12.7 ± 1.0
(0.500 ± 0.394)
3.81 ± 0.7
(0.150 ± 0.028)
3.0 max. (0.118)
9.0 ± 2
(0.354 ± 0.079)
18.0 ± 0.5
(0.709 ± 0.020)
+1.0
18.0
–0.5
12.5 min.
(0.492)
+0.040
(0.709
)
–0.020
φ4.0 ± 0.3 (0.157 ± 0.012)
12.7 ± 0.3
(0.500 ± 0.012)
Pack quantity (pcs)
Package size A Package size B
Designation
Pack form
T
Reel pack
1000
1500
1000
1500
U
Ammo pack
Note: 1. In reel packs, the tolerance of the cumulative feed hole pitch (20 pitches) is ±1.3 (0.051) or less.
2. In ammo packs, there must be perforations every 25 pitches.
•
CHIP type
Unit: mm (in.)
4 ± 0.1
2 ± 0.1
(0.157 ± 0.004) (0.079 ± 0.004)
1.5 ± 0.1
(0.059 ± 0.004)
7.65 ± 0.1
(0.301 ± 0.004)
Package
size
W
W ± 0.1
(0.004)
4.9
10.4
A
B
16 ± 0.2
(0.193) (0.409)
(0.630 ± 0.008)
3.6
8.4
(0.142) (0.331)
3.0 ± 0.1
(0.118 ± 0.004)
6.85 (0.270)
±0.1 (0.004)
8 ± 0.15
(0.315 ± 0.006)
Reel form
2.0 (0.080)
• Pack quantity
φ13.0
Pack
Package size
(0.512)
quantity
A
B
3,000 pcs
3,400 pcs
φ75 (2.953)
1.0
φ21.0
(0.039)
(0.827)
2.0 (0.079)
φ330 ± 2.0
(12.992 ± 0.079)
18.0 (0.709)
9
FAR Family (C1, C3, C4 series)
■ APPLICATION EXAMPLES
•
C1 series
22 pF to 47 pF
R
680 Ω
1.8 kΩ
TTL oscillation circuit
(serial resonation circuit)
220 Ω
Output
IC
IC
R: Resonator
IC: MB74LS04
•
C3, C4 series
MB8850
MB8850H series
1
2
1
3
R
2
R: Resonator
■ RELIABILITY
Parameter
Test conditions
Requirements
Frequency fluctuation:
within ±0.1%
Shock
MIL-STD-883B, 2002, condtion C (3000G)
MIL-STD-202E, 201A (1.5 mm <0.059> at 10 Hz Frequency fluctuation:
Vibration
to 55 Hz for 2 hours)
within ±0.1%
5 times drop from 1 m (39.370 in.) height to
wooden board.
Frequency fluctuation:
within ±0.1%
Drop
Sealing
Immersion in water at 85°C
No bubbles observed
Frequency fluctuation:
within ±0.1%
Heat resistance
MIL-STD-202E, 210A condition B (260°C • 5 sec.)
MIL-STD-883B, 1010, condition A (–35 to 85°C,
10 cycle)
Frequency fluctuation:
within ±0.1%
Temperature cycling
MIL-STD-883B, 1008, condition B 1000 h (100°C • Frequency fluctuation:
High-temperature loading test
High-temperature humidity test
1000 hours)
within ±0.1%
MIL-STD-202E, 103A, condition B (96 hours at
60°C, 90% to 95% RH, 12 VDC)
Frequency fluctuation:
within ±0.1%
10
FAR Family (C1, C3, C4 series)
FUJITSU LIMITED
All Rights Reserved.
For further information please contact:
Japan
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales
representatives before ordering.
FUJITSU MEDIA DEVICES LIMITED
Marketing and Technical Support Dept.
SHINYOKOHAMA SQUARE BLDG
2-3-12,Shin-yokohama,
Kouhoku-ku, Yokohama-shi,
Kanagawa 222-0033, Japan
Tel: +81-45-471-0067
The information and circuit diagrams in this document are
presented as examples of semiconductor device applications, and
are not intended to be incorporated in devices for actual use. Also,
FUJITSU is unable to assume responsibility for infringement of
any patent rights or other rights of third parties arising from the use
of this information or circuit diagrams.
Fax: +81-45-471-0069
http://www.fujitsu.co.jp/hypertext/fmd/English/index.html
North and South America
The contents of this document may not be reproduced or copied
without the permission of FUJITSU LIMITED.
FUJITSU MICROELECTRONICS, INC.
3545 North First Street,
San Jose, CA 95134-1804, U.S.A.
Tel: +1-408-922-9000
FUJITSU semiconductor devices are intended for use in standard
applications (computers, office automation and other office
equipments, industrial, communications, and measurement
equipments, personal or household devices, etc.).
Fax: +1-408-922-9179
Customer Response Center
Mon. - Fri.: 7 am - 5 pm (PST)
Tel: +1-800-866-8608
CAUTION:
Fax: +1-408-922-9179
Customers considering the use of our products in special
applications where failure or abnormal operation may directly
affect human lives or cause physical injury or property damage, or
where extremely high levels of reliability are demanded (such as
aerospace systems, atomic energy controls, sea floor repeaters,
vehicle operating controls, medical devices for life support, etc.)
are requested to consult with FUJITSU sales representatives before
such use. The company will not be responsible for damages arising
from such use without prior approval.
http://www.fujitsumicro.com/
Europe
FUJITSU MICROELECTRONICS EUROPE GmbH
Am Siebenstein 6-10,
D-63303 Dreieich-Buchschlag,
Germany
Tel: +49-6103-690-0
Fax: +49-6103-690-122
http://www.fujitsu-fme.com/
Any semiconductor devices have inherently a certain rate of failure.
You must protect against injury, damage or loss from such failures
by incorporating safety design measures into your facility and
equipment such as redundancy, fire protection, and prevention of
over-current levels and other abnormal operating conditions.
Asia Pacific
FUJITSU MICROELECTRONICS ASIA PTE. LTD.
#05-08, 151 Lorong Chuan,
New Tech Park,
Singapore 556741
Tel: +65-281-0770
If any products described in this document represent goods or
technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Control Law of Japan, the
prior authorization by Japanese government should be required for
export of those products from Japan.
Fax: +65-281-0220
http://www.fmap.com.sg/
F9703
FUJITSU LIMITED Printed in Japan
相关型号：
©2020 ICPDF网 联系我们和版权申明