FLD3F12JL 概述
1,310nm MQW-DFB Return Path Laser 1,310nm MQW - DFB回传通道激光 激光二极管
FLD3F12JL 规格参数
生命周期: | Active | Reach Compliance Code: | compliant |
风险等级: | 5.61 | 最大正向电流: | 0.15 A |
最大正向电压: | 1.5 V | 安装特点: | THROUGH HOLE MOUNT |
最高工作温度: | 85 °C | 最低工作温度: | -25 °C |
光电设备类型: | LASER DIODE | 峰值波长: | 1310 nm |
半导体材料: | GaAs | 子类别: | Laser Diodes |
表面贴装: | NO | Base Number Matches: | 1 |
FLD3F12JL 数据手册
通过下载FLD3F12JL数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载1,310nm MQW-DFB
Return Path Laser
FLD3F12JL
FEATURES
BENEFITS
• Multiple Quantum Well (MQW) DFB Laser • 4 Channels video/data
Loading
• Wide operating temperature without TEC
Characteristics
• Low Distortion
• Built-in optical isolator
• 5dB Link Loss
• Coaxial module with vertical flange
APPLICATIONS
This DFB laser module is intended for application in return
(reverse) path analog video/data.
DESCRIPTION
The FLD3F12JL is a DFB laser diode for return path analog video/data applications. It has a 2.0 to
4.0mW optical power range*. It is specified with 4 channels signal loading and has excellent CSO and
CTB performance. It is packaged in a small coaxial coolerless type module with built-in isolator and
monitor photodiode. This device has a wide operating temperature of -25 to +85°C without Thermo-
Electric Cooler (TEC).
ABSOLUTE MAXIMUM RATINGS (T =25°C)
c
Parameter
Symbol
Ratings
Unit
Optical Output Power
Pf
8.0
150
2
mW
mA
V
max
Forward Current (LD)
If
max
Reverse Voltage (LD)
Vr
max
Photodiode Reverse Voltage
Photodiode Forward Current
VDR
20
2
V
max
max
mA
IDF
T
Soldering Temperature
(t<10sec., d>2.5mm)
260
°C
solder
Storage Temperature
T
-40 to +90
-25 to +85
85
°C
°C
%
stg
Operating Case Temperature
Storage Humidity (Note 1)
T
X
op
stg
Operating Humidity (Note 1)
X
85
%
op
Note 1: Storage or operating within 500 hours maximum.
Edition 1.0
December 1999
1
1,310nm MQW-DFB
Return Path Laser
FLD3F12JL
OPTICAL AND ELECTRICAL CHARACTERISTICS (T =-25 to +85°C, unless otherwise specified)
c
Limits
Typ.
Parameter
Fiber Output Power
Threshold Current
Forward Voltage
Unit
mW
mA
Symbol
Test Conditions
Min.
Max.
P
f
CW, I =I
F op
2.0
-
4.0
I
2
-
-
60
1.5
th
CW
V
F
CW, I =I
F op
1.2
V
Slope Efficiency
S
CW, I =I
F op
40
-
250
200
1.4
µW/mA
µW/mA
-
Slope Efficiency at Tc=25°C
S
CW, I =I , Tc=25°C
60
120
25
F op
Slope Efficiency Ratio
Peak Wavelength
RTS
S(Tc)/S25
0.5
1,290
30
-
-
-
λ
1,330
-
nm
CW, I =I
F op
p
SSR
CSO
SideMode Suppression Ratio
Composite Second Order
CW, I =I
F op
dB
Note (1)
-
-
-55
dBc
Composite Triple Beat
Relative Intensity Noise
CTB
RIN
Note (1)
Note (2)
-
-
-
-
-60
dBc
-150
dB/Hz
Frequency Flatness
Monitor Current
-
Note (3)
-0.5
0.05
-
-
-
+0.5
2.0
dB
mA
nA
CW, I =Iop, VDR=5V
F
Im
ID
VDR=5V
Note (4)
1
500
Monitor Dark Current
TE
-1.0
-
+1.0
dB
Tracking Error
Note (1): I =I , OMI=7%/ch, 4ch(f=7.25MHz to 25.25MHz)
op
F
Note (2): CW, I =I , f=5MHz to 300MHz
F
op
Note (3): I =I , f=5MHz to 300MHz
F
op
Note (4): CW, Im-APC(I =I @Tc=+25°C), Tc=-25°C to +85°C
F
op
Edition 1.0
December 1999
2
1,310nm MQW-DFB
Return Path Laser
FLD3F12JL
Fig. 1 Forward Current vs Output Power
Fig. 2 Forward Voltage vs Forward Current
Tc=+25°C
80
4
-25°C
60
3
+25°C
40
20
2
Tc=+85°C
1
0
0
0
20
40
60
80
100
0
0.5
1.0
1.5
2.0
Forward Current, If (mA)
Forward Voltage, Vf (V)
Fig. 4 Temperature Dependence of Slope Efficiency
Fig. 3 Temperature Dependence of Threshold Current
100
250
200
150
100
50
10
1
-20
0
20
40
60
80
-20
0
20
40
60
80
Case Temperature, Tc (°C)
Case Temperature, Tc (°C)
Edition 1.0
December 1999
3
1,310nm MQW-DFB
Return Path Laser
FLD3F12JL
Fig. 5 Tracking Characteristics
Im = constant (@Tc=25°C)
2
-1
0
-1
-2
-25
0
25
40
60
80 85
Case Temperature, Tc (°C)
Fig. 6 CSO vs. Output Power
-50
-55
OMI = 7%/ch, 4ch
Tc=+85°C
+25°C
-60
-65
-70
-25°C
2
3
4
Optical Output Power, Pf (mW)
Fig. 7 CTB vs. Output Power
-60
-65
OMI = 7%/ch, 4ch
Tc=-25°C
-70
-75
+85°C
+25°C
-80
2
3
4
Optical Output Power, Pf (mW)
Edition 1.0
December 1999
4
1,310nm MQW-DFB
Return Path Laser
FLD3F12JL
Notes
Edition 1.0
December 1999
5
1,310nm MQW-DFB
Return Path Laser
FLD3F12JL
“JL” PACKAGE
UNIT: mm
lead rotation 10°
4-C1
0.3
2
3
4-Ø0.45 0.1
4
1
6.7 0.2
10 MIN.
2.5 0.1
7.4 0.2
800 MIN.
32 MAX.
LD
PD
1
2
4
CASE
3
For further information please contact:
FUJITSU COMPOUND SEMICONDUCTOR, INC.
CAUTION
Americas & R.O.W.
2355 Zanker Rd.
Fujitsu Compound Semiconductor Products contain gallium arsenide
(GaAs) which can be hazardous to the human body and the environment.
For safety, observe the following procedures:
San Jose, CA 95131-1138, U.S.A.
Phone: (408) 232-9500
FAX: (408) 428-9111
www.fcsi.fujitsu.com
• Do not put this product into the mouth.
• Do not alter the form of this product into a gas, powder, or liquid
through burning, crushing, or chemical processing as these by-products
are dangerous to the human body if inhaled, ingested, or swallowed.
FME, QDD
Fujitsu Microelectronics Europe GmbH
Quantum Devices Division
Network House
• Observe government laws and company regulations when discarding this
product. This product must be discarded in accordance with methods
specified by applicable hazardous waste procedures.
Norreys Drive
Maidenhead, Berkshire SL6 4FJ
United Kingdom
TEL: +44 (0) 1628 504800
FAX: +44 (0) 1628 504888
FUJITSU QUANTUM DEVICES LIMITED
Global Business Division
Global Sales Support Department
Shinjuku Daiichiseimei Building, 2-7-1 Nishishinjuku,
Shinjuku-ku, Tokyo, 163-0721, Japan
TEL: +81-3-5322-3356
FUJITSU QUANTUM DEVICES
SINGAPORE PTE LTD.
Hong Kong Branch
FAX: +81-3-5322-3398
Rm. 1101, Ocean Centre, 5 Canton Rd. Tsim Sha Tsui,
Kowloon, Hong Kong
TEL: +852-23770226
FAX: +852-23763269
Fujitsu Limited reserves the right to change products and specifications without notice.
The information does not convey any license under rights of Fujitsu Limited or others.
© 2000 FUJITSU COMPOUND SEMICONDUCTOR, INC.
Printed in U.S.A. FCSI0200M200
6
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