MB3790 概述
Battery Backup IC 电池备份IC
MB3790 数据手册
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PDF下载FUJITSU SEMICONDUCTOR
DATA SHEET
DS04-27502-3E
ASSP For Power Supply Applications
Bi-CMOS
Battery Backup IC
MB3790
■ DESCRIPTION
The MB3790 is designed to control power supplies to SRAM, logic IC, or other circuit devices and protects them
against momentary power failures by using backup batteries. In addition to its function to supply the power to
these devices, it has a function to switch the source of power to the primary or secondary backup battery when
the power supply voltage drops below a predetermined level. Also, it outputs a reset signal when the power supply
turns on or off or when a fault occurs in the power supply.
Ideally designed as a single-chip IC for power supply control, the MB3790 consumes only a minimal current and
comes in a thin-type package. Therefore, it is best suited for power supply control in memory cards and similar
other devices.
■ FEATURES
• Input circuit current consumption when non-loaded: 50 µA [typ]
• Output drive current: 200 mA [max]
• Resistance between input and output: 0.5 ohms [typ]
• Input power-down detection level: 4.2 V ± 2.5 %
• On-chip power-on reset circuit
• Primary battery voltage-down detection levels: 2.65 V, 2.37 V
(Continued)
■ PACKAGES
Plastic SOP, 16 pin
Plastic SSOP*, 20 pin
(FPT-16P-M06)
(FPT-20P-M04)
* : Since the SSOP is an extremely thin package, use a partial heating method when mounting the device.
MB3790
(Continued)
• On-chip secondary battery recharging function
• Output current during battery backup: VBAT1: 500 µA [max], VBAT2: 50 µA [max]
• Leakage current: 0.5 µA [max]
■ PIN ASSIGNMENTS
(TOP VIEW)
(TOP VIEW)
N.C.
V BAT1
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CONTROL
N.C.
N.C.
V BAT1
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
CONTROL
N.C.
V OUT
V IN
V OUT
V IN
V OUT
V IN
V OUT
V IN
V BAT2
V SENSE
CT
V BAT2
V SENSE
N.C.
ALARM1
ALARM2
GND
N.C.
RESET
RESET
N.C.
N.C.
ALARM1
ALARM2
GND
CT
RESET
RESET
(FPT-16P-M06)
(FPT-20P-M04)
2
MB3790
■ BLOCK DIAGRAM
R ON
=0.5Ω
V IN
V OUT
100Ω
CONTROL
SBD
V IN
590KΩ
2.65V
2.37V
Reference
voltage power
supply circuit
+
ALARM1
1.24V
-
500Ω
V IN
+
+
-
3 µA
S
R
Q
ALARM2
RESET
V SENSE
-
V OUT
Vth:3V
240KΩ
V OUT
RESET
Vth:1.5V
GND
CT
V BAT2
V BAT1
3
MB3790
■ PIN DESCRIPTION
Pin number
Symbol
I/O
Name and function
16P
1
20P
1
N.C.
VBATI
VOUT
—
I
Non connection
2
2
This pin connects to the primary battery.
3, 4
3, 4
O
These pins supply the output voltage. (Range of output current value
IOUT ≤ 200 mA)
5
5
VBAT2
I/O
This pin connects to the secondary battery. When the power supply
voltage is greater than or equal to the detection level (i.e., VINH), the
secondary battery is recharged using the constant-voltage method of
charging.
—
6
6, 7
8
N.C.
—
O
Non connection
ALARM1
This is an open-collector output pin for a primary battery alarm
signal. When the power supply voltage is greater than or equal to
VINH, it monitors the primary battery voltage. If the power supply
voltage is less than VINL, it does not monitor the primary battery
voltage. If VBAT1 is less than or equal to 2.65 V, its output voltage is
forced to a Low level.
7
9
ALARM2
O
This is an open-collector output pin for a primary battery alarm
signal. When the power supply voltage is greater than or equal to
VINH, it monitors the primary battery voltage. If the power supply
voltage is less than VINL, it does not monitor the primary battery
voltage. If VBAT1 is less than or equal to 2.37 V, its output voltage is
forced to a Low level.
8
9
10
11
GND
—
O
This pin connects to the ground (0 V).
RESET
This pin outputs a reset signal. When the power supply voltage is
less than or equal to VINL, it outputs a High level.
If the power supply voltage of SRAM is less than the designated
range, it directly controls the CE or CS of SRAM to disable writes and
thereby protect the data in memory.
10
11
12
13
RESET
CT
O
This pin outputs an inverted signal of RESET.
—
This pin is used to set the reset pulse width.
Insert a capacitor between this pin and GND to set the pulse width.
—
14, 15
16
N.C.
—
I
Non connection
12
VSENSE
This pin accepts comparator input for detecting the power supply
voltage level. For details, refer to APPLICATION in this data sheet.
13, 14 17, 18
VIN
N.C.
I
—
I
These pins accept the input voltage for the device.
Non connection
15
16
19
20
CONTROL
This pin is used for output control. For details, refer to APPLICATION
in this data sheet.
4
MB3790
■ FUNCTIONAL DESCRIPTION
1. Battery Backup Function
• When the power supply voltage exceeds the voltage detection level (i.e., VINH), the device outputs a current of
up to 200 mA from the VIN power supply to the load circuit via the VOUT pin.
• When the power supply voltage is less than or equal to VINL, the device switches the source of power for VOUT
from VIN to the primary or secondary battery for backup purposes.
2. Power Supply Voltage Level Detect Function
When the power supply voltage drops below VINL, the voltage level detection comparator is actuated to perform the
following (note that the detection voltage level has the hysteresis characteristics listed in ELECTRICAL CHARAC-
TERISTICS in this data sheet):
• The comparator first outputs the RESET signal (High level).
• It switches the source of power for the load circuit to the primary or secondary battery.
The power supply voltage detection level can be adjusted by fitting an external resistor to the VSENSE pin. When
adjusting the detection level, be sure to set it to 4.0 V or higher by considering the power supply voltage for the
internal circuit operation.
In addition, the detection set time can be extended by connecting a capacitator. For this method of adjustment, refer
to APPLICATION in this data sheet.
3. Reference Voltage Circuit
This is a temperature-compensated reference voltage circuit of a band gap type so that it outputs a trimming-
adjusted exact reference voltage.
The reference voltage power supply is used to set the reference voltage/constant current values of the detection
circuit, as well as the secondary battery recharging voltage.
4. Power-on Reset Function
By charging the capacitator connected to the CT pin with constant current (approx. 3 µA), this function determines
the reset pulse width. The calculation formula for this is given below:
Reset pulse width tPO (sec) CT (F) × 106
(When CT = 1000 pF, tPO 1 ms [typ])
5. Primary Battery Voltage Detection Function
If the primary battery voltage drops below the detection level when the power supply voltage is greater than or equal
to VINL, the device outputs an alarm signal (Low level) from the CMOS output pin, ALARM1 or ALARM2.
Note that the voltage level detection comparator has the hysteresis characteristics listed in ELECTRICAL CHAR-
ACTERISTICS in this data sheet.
• When the primary battery voltage is 2.65 V [typ] or less:
The ALARM1 output pin is forced to a Low level to issue an alarm indicating that it’s time to replace the primary
battery.
• When the primary battery voltage is 2.37 V [typ] or less:
The ALARM2 output pin is forced to a low level to issue an alarm indicating that the primary battery voltage
is less than the voltage necessary to retain the SRAM data (approx. 2.0 V)
6. Secondary Battery Recharging Function
When the power supply voltage is greater than or equal to VINL, the device recharges the secondary battery using
the constant-voltage method of charging. Note that the typical value of the device's internal recharging resistor is
500 ohms.
5
MB3790
■ DESCRIPTION OF OPERATION
1. Operation When the Input Voltage Goes On or Off
DV IN
V IN
V INH
V INL
(1)
(2)
(3)
(4)
(2)
(3)
(4)
V IN-DV1
V OUT
V BAT1-DVB1
t PO
t PO
V IN-DV1
RESET
V BAT1-DVB1
High level
Low level
High level
Low level
High level
RESET
V IN-DV1
Low level
High level
Low level
High level
Low level
(1) Power-on
While the power supply voltage is less than VINH (4.3 V typ), the protected devices such as SRAM or a microprocessor
are in the standby mode with the power supplied by the battery.
When the power supply voltage rises to a level greater than or equal to VINH, the PMOS transistor between the input/
output pins turns on and the power for such devices is supplied from the VIN pin. At the same time, the primary
battery voltage detection and the secondary battery recharging operations are actuated.
(2) Standby mode
When the power supply voltage rises to a level greater than or equal to VINH, the RESET pin outputs a High level
for the set duration of time and the devices such as SRAM or a microprocessor are held in the standby mode. Note
that the set duration of time can be adjusted by changing the capacitance of the CT pin.
The RESET pin outputs an inverted signal of the RESET pin.
(3) Active mode
The reset signal is cleared and the devices such as SRAM or a microprocessor are placed in the operating mode.
6
MB3790
(4) Momentary power failure or voltage dip
When the power supply voltage drops less than or equal to VINL. (4.2 V typ) as the power supply goes down or its
voltage dips momentarily, the RESET pin outputs a High level and the RESET pin outputs a low level. The devices
such as SRAM or a microprocessor are thereby placed in the standby mode and powered from the battery. When
in this mode, the primary battery voltage detection and the secondary battery recharging operations are stopped.
Note: To guarantee backup operation in case of momentary power failure, make sure the 5 V-to-0 V fall time on VIN
is 50 µs or more by using, for example, a capacitator.
2. Alarm Operation
DV BAT1
DV BAT2
V BATH1
V BATL1
V BAT1
V BATH2
V BATL2
ALARM1
(1)
(1)
ALARM2
(2)
(2)
If the primary battery voltage decreases while the power supply voltage (VIN) is greater than or equal to VINH (4.3 V
typ), alarm signals are output as described below. At this time, if the VBAT1 pin is released open, the output from the
alarm pin becomes indeterminate.
(1) Primary battery replacement alarm (alarm-1 output)
If the primary battery voltage drops to VBAT1 (2.65 V typ), the ALARM1 pin is forced to a Low level to issue an alarm
indicating that it’s time to replace the primary battery.
(2) Primary battery minimum voltage alarm (alarm-2 output)
If the primary battery voltage further drops to VBAT2 (2.37 V typ), the ALARM2 pin is forced to a Low level to issue
an alarm indicating that the primary battery power has dropped below the voltage necessary to retain the SRAM
data (approx. 2.0 V).
7
MB3790
■ ABSOLUTE MAXIMUM RATINGS
(Ta = +25°C)
Parameter
Input voltage
Symbol
VIN
Conditions
Rating
–0.3 to 6
Unit
V
Battery voltage
VBAT
–0.3 to 6
V
Reset output Voltage
Alarm output Voltage
VRESET
VALARM
– 0.3 to VOUT + 0.3 (≤ 6)
V
—
V
– 0.3 to VIN + 0.3 (≤ 6)
Output current
IOUT
IOH
IOL
mA
mA
mA
mW
mW
°C
250
6
Output high current
Output low current
Source current
Sink current
6
SSOP
SOP
450*
Power dissipation
PD
Ta ≤ +25°C
540*
Storage temperature
Tstg
—
–55 to +125
* : When mounted on a 4 cm-square double-side epoxy board.
WARNING: Permanent device damage may occur if the above ABSOLUTE MAXIMUM RATINGS are exceeded.
Functional operation should be restricted to the conditions as detailed in the operational sections of
this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
■ RECOMMENDED OPERATING CONDITIONS
Value
Parameter
Symbol
Conditions
Unit
Min.
—
Typ.
5.0
3.0
—
Max.
5.5
Input voltage
VIN
V
V
Battery voltage
Output current
VBAT
—
—
3.3
IOUT
0
200
mA
Supply from the
primary battery
IO(BAT1)
—
—
500
Output current during
battery backup
µA
°C
Supply from the
secondary battery
IO(BAT2)
Top
—
—
—
50
Operating temperature
—
–30
+70
8
MB3790
■ ELECTRICAL CHARACTERISTICS
• DC characteristics
(Recommended operating conditions unless otherwise noted.)
(VIN = +5 V, Ta = +25°C)
Value
Unit
Parameter
Symbol
IIN1
Conditions
Min.
—
Typ.
Max.
100
10
All sections Input current
IOUT = 0 mA
50
µA
mV
mV
µs
DV1
DV2
tro
IOUT = 1 mA
—
0.5
100
2.0
Backup
Power
Supply
Input/output voltage
difference
IOUT = 200 mA
CO = 0.01 µF, C T = 0
—
300
10
Section
Output delay time
—
4.10
4.05
4.20
4.15
50
4.20
4.20
4.30
4.30
100
4.30
4.35
4.40
4.45
150
V
V
VIN
VINL
Ta = – 30°C to + 70°C
VIN
Input low voltage detection
V
VINH
Ta = – 30°C to + 70°C
VINH – VINL
V
Input low voltage hysteresis
width
DVIN
mV
Power
Supply
Monitoring
Section
VOHR
VOLR
VOHR
IOHR = 1 mA
IOLR = 5 mA
IOHR = 0.2 mA
4.5
—
4.8
0.2
2.6
—
0.4
—
V
V
V
Reset output voltage
Reset output voltage
during backup V IN = 0 V
VBAT1 = 3 V
2.2
VOLR
IOLR = 3 mA
—
0.2
0.4
V
Reset pulse width
tPO
tPI
0.5
5.0
—
1.0
—
2.0
—
ms
µs
µs
µs
µs
CT = 1000 pF
Input pulse width
Reset output rise time
Reset output fall time
Reset output delay time
trR
2.0
0.2
2.0
3.0
1.0
10
CT = 1000 pF
CL = 100 pF
tfR
—
tpdR
VIN slew rate < 0.1 V/µs
—
(Continued)
9
MB3790
(Continued)
(VIN = +5 V, Ta = +25°C)
Value
Unit
Parameter
Symbol
Conditions
Min.
2.55
2.52
2.59
2.56
20
Typ.
2.65
2.65
2.69
2.69
40
Max.
2.75
2.78
2.79
2.82
60
V
V
VBAT
VBATL1
Ta = – 30°C to +70°C
Low voltage detection 1
V
VBAT
VBATH1
DVBAT1
VBATL2
Ta = – 30°C to +70°C
VBATH1 – VBATL1
V
Low voltage detection-1
hysteresis width
mV
2.27
2.24
2.31
2.28
20
2.37
2.37
2.41
2.41
40
2.47
2.50
2.51
2.54
60
V
V
VBAT
Ta = – 30°C to +70°C
Low voltage detection 2
V
VBAT
VBATH2
Battery-1
Monitoring
Section
Ta = – 30°C to +70°C
VBATH2 – VBATL2
V
Low voltage detection-2
hysteresis width
DVBAT2
DVBAT
mV
Low voltage detection
difference
VBATL1 – VBATL2
0.26
0.28
0.30
V
IBATA
IBATB
VBAT = 3 V, VIN = 0 V
VBAT = 3 V, VIN = 5 V
IBAT1 = 100 µA
–100
–100
—
—
—
500
500
0.35
nA
nA
V
Battery-1 input current
Battery-1 output voltage
difference
during backup, CTL = GND
0.30
DVB1
IBAT1 = 10 µA
—
0.10
0.15
V
VOHA
VOLA
trA
IOHA = 4 mA
IOLA = 5 mA
4.5
—
—
—
—
4.8
0.2
2.0
0.2
2.0
—
0.4
3.0
1.0
10
V
V
Alarm output voltage
Alarm output rise time
Alarm output fall time
Alarm output delay time
µs
µs
µs
CL = 100 pF
tfA
tpdA
50 mV overdrive
ICHG = –10 µA
VCHG = 2.0 V
Battery-2 recharging
voltage
VCHG
2.80
1.0
3.00
2.0
3.20
—
V
Battery-2
Monitoring
Section
Battery-2 recharging current ICHG
Battery-2 output voltage
mA
difference
DVB2
IBAT2 = 10 µA
—
0.10
0.15
V
during backup
10
MB3790
■ TIMING CHART
1. Rise/Fall Times on Reset and Alarm Pins: tr/tf
90%
90%
RESET
RESET
ALARM1
ALARM2
10%
10%
t r
t f
2. Reset Pulse Width: tPO; Input Pulse Width: tPI; Reset Output Delay Time: tpdR
t PI
5V
V IN
V INH
V INL
4V
t PO
t pdR
t pdR
V IH-DV1
RESET
V BAT1-DVB2
11
MB3790
3. Alarm Output delay time: tpdA
50mV
V BATL1, V BATL2
V BAT1
50mV
t pdA
ALARM1
ALARM2
4. VOUT Output Delay Time: tro
5V
V IN
98%
V OUT
t ro
12
MB3790
■ TYPICAL CHARACTERISTIC CURVES
1. VOH characteristics of RESET pin
2. VOL characteristics of RESET pin
0.5
3.0
V IN = OPEN
V BAT1 =+3V
V IN =+5V
V BAT1 =+3V
2.8
0.4
0.3
2.6
2.4
2.2
2.0
0.2
0.1
0
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
0.0
1.0
2.0
3.0
4.0
5.0
Current I (mA)
Current I (mA)
3. VOH characteristics of RESET pin
5.0
4. VOL characteristics of RESET pin
0.5
V IN = OPEN
V BAT1 =+3V
4.8
4.6
4.4
0.4
0.3
0.2
0.1
0
V IN =+5V
V BAT1 =+3V
4.2
4.0
0.0
-0.4
-0.8
-1.2
-1.6
-2.0
0.0
1.0
2.0
3.0
4.0
5.0
Current I (mA)
Current I (mA)
5. VOH characteristics of ALM pin
5.0
6. VOL characteristics of ALM pin
0.5
V IN =+5V
V BAT1 =+2V
4.8
4.6
4.4
0.4
0.3
0.2
0.1
0
V IN =+5V
V BAT1 =+3V
4.2
4.0
0.0
-1.0
-2.0
-3.0
-4.0
-5.0
0.0
1.0
2.0
3.0
4.0
5.0
Current I (mA)
Current I (mA)
(Continued)
13
MB3790
(Continued)
7. Temperature characteristics of input current
8. Temperature characteristics of battery power
detection voltage
70
60
50
2.9
V
IN =+5V
2.8
2.7
V
V
BATH1
BATL1
40
30
20
2.6
2.5
2.4
V
V
BATH2
BATL2
10
0
2.3
2.2
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
7. Temperature characteristics of power-down
detection voltage
4.6
4.5
4.4
V
V
INH
INL
4.3
4.2
4.1
4.0
3.9
-40
-20
0
20
40
60
80
Ambient temperature Ta (°C)
14
MB3790
■ APPLICATION
1. Method of Using the CONTROL Pin
It is possible to control the operation of analog switch 1 by entering a High or Low level to the CONTROL pin while
being powered bythe battery. The Table below shows how the analog switch operates when its operation iscontrolled
from the CONTROL pin.
When using the primary and the secondary batteries in combination as in the case of memory cards, be sure to
set the CONTROL pin High to prevent the primary battery from being recharged by the secondary battery current
flowing from analog switch 1.
• Control Conditions of CONTROL Pin
ON/OFF State of analog switch*2
Control conditions
Operating state
Standby/active state
Backup state
Input voltage (VIN) CONTROL pin*1
Analog switch 1
Analog switch 2
VIN > VINL
VINL > VIN
VINL > VIN
High/Low
OFF
OFF
ON
OFF
ON
High (= VOUT)
Low (= GND)
ON
*1: If the CONTROL pin is released open, the logic state of the CMOS circuit may become instable letting current
flow into the circuit. Therefore, the CONTROL pin must always have a High or Low level input.
*2: The ON-resistance of the analog switch is approximately 10 K ohms.
Analog Switch connection Diagram
V OUT
SBD
Analog Switch 1
Analog Switch 2
V BAT1
V BAT2
Connection to the
primary battery
Connection to the
secondary battery
15
MB3790
3. Outputting Reset Signal Forcibly
The reset signal can be output forcibly by bringing the VSENSE pin of the MB3790 to a Low level (< 1.24). The reset
signal is held on until the capacitator CT is charged up after the VSENSE pin is released open.
Forced Reset Method 1
V IN
V IN
CT
47KΩ
VSENSE
CT
SW
GND
SW: Turned on (VRESET = High)
Forced Reset Method 2
V IN
V IN
CT
47KΩ
VSENSE
CT
10KΩ
Control signal
input pin
Q1
GND
10KΩ
When the voltage enough to turn on Q1 (≥ approx. 1.2 V) gives to the Control signal input pin,
VRESET is equal to High level.
[Reset Pulse Width Calculation Formula]
Reset Pulse Width tPO (sec) = CT (F) ×106 (where CT = capacitance)
Example: When CT = 1000 pF, tPO = 1 ms (Typ)
16
MB3790
4. Adjusting the Supply Voltage Detection Level Set time
The MB3790 outputs a reset signal when the power supply momentarily goes down or its voltage sags for 5 µs or
more. The set time before this reset signal is output can be extended by connecting a capacitor to the VSENSE pin.
Adjusting the Supply Voltage Detection Level Set Time
V IN
V IN
5V
4V
VSENSE
t PI
C
GND
5. Compatibility with JEIDA Memory Card Guideline Ver. 4
The MB3790 has its ALM1 and ALM2 pin specifications matched to the BVD2 and BVD1 pin specifications of the
JEIDA Memory Card Guideline Ver. 4. Therefore, the ALM1 and ALM2 pins can be connected directly to the BVD2
and BVD1 pins.
• Alarm Pin Detection Voltage Levels
Pin Name
ALM1
VBAT1 ≤ 2.37 V
Low level
2.37 V < VBAT1 ≤ 2.65V
Low level
2.65 V ≤ VBAT1
High level
Connected Pin
BVD2
ALM2
Low level
High level
High level
BVD1
VBAT1: Primary battery voltage
17
MB3790
■ STANDARD DEVICE CONFIGURATION
V IN
V BAT1
CONTROL
*2
*2
V IN
V IN
V OUT
*1
V OUT
C 1
V BAT2
L
O
G
I
S
R
A
*1
ALARM1
C 2
ALARM1
CT
RESET
RESET
M
C
ALARM2
ALARM2
GND
CT
GND
*1 For C1 and C2, use capacitors of 0.022 µF or more.
*2 For VIN and VOUT, connect these two pins to the mating pins, respectively.
■ ORDERING INFORMATION
Part number
MB3790PF
Package
Remarks
16 pin, Plastic SOP
(FPT-16P-M06)
MB3790PFT
20 pin, Plastic SSOP
(FPT-20P-M04)
18
MB3790
■ PACKAGE DIMENSIONS
16-pin, Plastic SOP
(FPT-16P-M06)
2.25(.089)MAX
10.15+–00..2205 .400 +–..000180
0.05(.002)MIN
(STAND OFF)
INDEX
6.80–+00..2400
5.30±0.30
7.80±0.40
.268–+..000186
(.209±.012) (.307±.016)
"B"
1.27(.050)
TYP
0.45±0.10
(.018±.004)
0.15+–00..0025
.006–+..000012
0.50±0.20
(.020±.008)
M
Ø0.13(.005)
Details of "A" part
Details of "B" part
0.40(.016)
0.20(.008)
0.15(.006)
0.20(.008)
"A"
0.10(.004)
0.18(.007)MAX
0.68(.027)MAX
0.18(.007)MAX
0.68(.027)MAX
8.89(.350)REF
Dimensions in mm (inches)
C
1994 FUJITSU LIMITED F16015S-2C-4
(Continued)
19
MB3790
(Continued)
20-pin, Plastic SSOP
(CASE No.: FPT-20P-M04)
*6.50±0.10
(.256±.004)
1.10±0.10
(.043±.004)
0.10(.004)
4.40±0.10 6.40±0.20
*
5.40(.213)NOM
INDEX
(.173±.004) (.252±.008)
"A"
0.65±0.12
(.0256±.0047)
0.22–+00..0150
.009–+..000024
0.15–+00..0025
.006–+..000012
Details of "A" part
0.10±0.10
(.004±.004)
(STAND OFF)
0.50±0.20
(.020±.008)
5.85(.230)REF
0°~10°
Dimensions in mm (inches)
C
1994 FUJITSU LIMITED F20014S-1C-4
Since the SSOP (FPT-20P-M04) is built in an extremely thin structure, use a partial heating method when mounting
the device.
20
FUJITSU LIMITED
For further information please contact:
Japan
FUJITSU LIMITED
Corporate Global Business Support Division
Electronic Devices
KAWASAKI PLANT, 4-1-1, Kamikodanaka
Nakahara-ku, Kawasaki-shi
Kanagawa 211-88, Japan
Tel: (044) 754-3763
All Rights Reserved.
The contents of this document are subject to change without
notice. Customers are advised to consult with FUJITSU sales
representatives before ordering.
Fax: (044) 754-3329
The information and circuit diagrams in this document presented
as examples of semiconductor device applications, and are not
intended to be incorporated in devices for actual use. Also,
FUJITSU is unable to assume responsibility for infringement of
any patent rights or other rights of third parties arising from the
use of this information or circuit diagrams.
North and South America
FUJITSU MICROELECTRONICS, INC.
Semiconductor Division
3545 North First Street
San Jose, CA 95134-1804, U.S.A.
Tel: (408) 922-9000
FUJITSU semiconductor devices are intended for use in
standard applications (computers, office automation and other
office equipment, industrial, communications, and measurement
equipment, personal or household devices, etc.).
CAUTION:
Customers considering the use of our products in special
applications where failure or abnormal operation may directly
affect human lives or cause physical injury or property damage,
or where extremely high levels of reliability are demanded (such
as aerospace systems, atomic energy controls, sea floor
repeaters, vehicle operating controls, medical devices for life
support, etc.) are requested to consult with FUJITSU sales
representatives before such use. The company will not be
responsible for damages arising from such use without prior
approval.
Fax: (408) 432-9044/9045
Europe
FUJITSU MIKROELEKTRONIK GmbH
Am Siebenstein 6-10
63303 Dreieich-Buchschlag
Germany
Tel: (06103) 690-0
Fax: (06103) 690-122
Asia Pacific
FUJITSU MICROELECTRONICS ASIA PTE. LIMITED
#05-08, 151 Lorong Chuan
New Tech Park
Singapore 556741
Tel: (65) 281-0770
Fax: (65) 281-0220
Any semiconductor devices have inherently a certain rate of
failure. You must protect against injury, damage or loss from
such failures by incorporating safety design measures into your
facility and equipment such as redundancy, fire protection, and
prevention of over-current levels and other abnormal operating
conditions.
If any products described in this document represent goods or
technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Control Law of Japan, the
prior authorization by Japanese government should be required
for export of those products from Japan.
F9703
FUJITSU LIMITED Printed in Japan
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