MB84VZ128A [FUJITSU]
Memory IC;型号: | MB84VZ128A |
厂家: | FUJITSU |
描述: | Memory IC |
文件: | 总4页 (文件大小:92K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MB84VZ128A
New products
Stacked MCP Mounted with
128M-bit (×16) Page Mode
NOR-type Dual Operation Flash
Memories (2 chips), 16M-bit (×16)
TM
Mobile FCRAM , and
4M-bit (×16) SRAM
MB84VZ128A
This is an MCP with a 256M-bit ROM and 20M-bit RAM.
The combined density, 276M-bit, is the world's largest density for mobile purposes.
The Flash Memory has the Page Mode capable of high-speed read-out at 25ns.
Product Description
terminals grow more sophisticated, so grows the demand for
mobile terminal memory with increased density, low power
Mobile terminal functions have advanced remarkably in
recent years. Beyond the simple call functions, today's users
have their choice of a dizzying array of functions, including
Java applications, music playback and distribution, GPS,
and shoot/transmit/receive functions with digital images.
Some of the mobile terminals now on the market incorporate
almost every function that today's technologies allow them
to perform. These terminals are even being used to store and
browse web contents without the help of personal computers.
And the development of these terminals is expected to be
just as radical in the future as it has been up to now. Motion
image distribution and other applications requiring higher
bit rates and higher-speed processing functions are growing
more commonplace, and newer mobile devices are being
designed to meet the hardware requirements. As mobile
Photo 1 External View
2002 No.2
FIND Vol.20
69
MB84VZ128A
New products
consumption, high speed, miniaturization, and consolidation of
multiple memory types within single memory package.
FUJITSU has been providing highly advanced stacked MCP
memories optimal for storage of application data. The Flash
Memory has the page access mode, and its page access time
achieves 25ns, effectively tripling the access speeds of today's
conventional products (a conventional 64M-bit flash memory
has a random access time of 70ns). The additional 16M-bit
FCRAM mounted in the package is optimal for the storage of
temporary memory for large application or data rewrites, and
the 4M-bit SRAM can be used as a work memory for Base
Band working consistently. With these advantages, the
MB84VZ128A dramatically improves mobile terminal
performance and is optimal for the newer functions in the
mobiles terminals of the next generation.
(Multi Chip Package) products to meet the market demand.
_
_
_
FUJITSU has now developed the remarkable MB84VZ128A
―
the world's very first stacked MCP mounted with two 128M-bit
page mode NOR-type flash memories, a low-power-
consumption 16M-bit Mobile FCRAM*1 for mobile
applications, and a 4M-bit SRAM as supplemental memory for
mobile terminals. This new package provides an impressive non-
volatile memory domain of 256M-bit the largest MCP density
―
in the world by mounting two 128M-bit NOR-type flash
―
Figure 1 Pin Assignments
(Top view)
Stamped Surface
M18
A18
B18
N.C.
B17
N.C.
B16
L18
N.C.
L17
N.C.
A17
N.C.
A16
N.C.
M17
N.C.
L16
N.C.
M16
N.C.
A15
N.C.
B15
N.C.
L15
N.C.
M15
N.C.
A14
N.C.
B14
N.C.
L14
N.C.
M14
N.C.
M13
C14
D14
E14
N.C.
E13
A21
E12
J14
N.C.
J13
F14
N.C.
F13
G14
N.C.
G13
H14
N.C.
H13
K14
N.C.
K13
N.C.
K12
N.C.
A13
N.C.
B13
N.C.
C13
N.C.
D13
N.C.
L13
N.C.
N.C.
B12
N.C.
B11
N.C.
B10
N.C.
B9
N.C.
C12
A15
D12
A12
D11
A22
F12
A16
G12
N.C.
H12
VSS
J12
N.C.
L12
N.C.
A11
C11
A8
A13
E11
A14
F11
N.C. DQ15 DQ7 DQ14 N.C.
G11
DQ6 DQ13 DQ12 DQ5
G10 H10
J10
H11
J11
K11
L11
N.C.
L10
N.C.
L9
A19
D10
A9
A10
F10
C10
WE
C9
E10
K10
CE2r A20
D9
E9
N.C. CE2s DQ4 VCCr N.C.
F9
G9 H9 J9
K9
CEf_2 ACC RESET_1 RY/BY_1 CE1s VCCs DQ3 VCCf_1 DQ11 VCCf_2
C8
RY/BY_2 LB
B8
E8
A18
E7
F8
A17
F7
G8
DQ1
G7
H8
J8
L8
D8
UB
D7
K8
DQ9 DQ10 DQ2 VSS
C7
A7
C6
H7
OE
H6
B7
VSS
B6
J7
DQ0
J6
K7
L7
A6
A5
A4
VSS
G6
DQ8 RESET_2
E6
M6
A6
N.C.
A5
D6
F6
K6
L6
N.C.
N.C.
C5
A3
A2
E5
A1
A0
CEf_1 CE1r
N.C. N.C.
N.C.
M5
F5
G5
J5
K5
L5
D5
H5
N.C.
A4
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
L4
N.C.
M4
B4
N.C.
A3
N.C.
B3
N.C.
L3
N.C.
M3
N.C.
A2
N.C.
B2
N.C.
L2
N.C.
M2
N.C.
A1
N.C.
B1
N.C. N.C..
M1
L1
N.C.
N.C.
N.C.
N.C.
70
FIND Vol.20
No.2 2002
MB84VZ128A
New products
Product Features
A common assignment for stacked MCPs has been adopted
for signal pin assignments (also compatible with conventional
4-chip MCP).
■ Product Configuration
●
128M-bit NOR-type page read mode dual operation flash
memory (×16) ×2 chips
16M-bit mobile FCRAM (×16)
4M-bit SRAM (×16)
■ Access Time
Page Read Access: 25ns (NOR-type flash memory, 8 Word
●
●
●
Page)
●
Random Read Access: 85ns (NOR-type flash memory)
Random Read Access: 85ns (mobile FCRAM)
Random Read Access: 70ns (SRAM)
●
■ Package
Package: FBGA -139 ball
*2
●
●
(Signal ball, 96; reinforcement ball, 43)
Size: 15mm×11mm×1.4 (t) mm
●
■ Operation Power Supply Voltage: Vcc=2.7V to 3.1V
Figure 2 Block Diagram
Vccf_1 Vss
A22 to A0
A22 to A0
RY/BY_1
DQ15 to
DQ0
128M-bit
Page Mode
Flash Memory 1
/CEf_1
/OE
/WE
DQ15 to DQ0
ACC
/RESET_1
Vccf_2 Vss
A22 to
A0
RY/BY_2
DQ15 to
DQ0
128M-bit
Page Mode
Flash Memory 2
/CEf_2
/RESET_2
Vccr Vss
A19 to
A0
DQ15 to
DQ0
/CE1r
CE2r
16M-bit
Mobile FCRAM
/UB
/LB
Vccs Vss
A17 to
A0
DQ15 to
DQ0
/CE1s
CE2s
4M-bit SRAM
2002 No.2
FIND Vol.20
71
MB84VZ128A
New products
■ Low Power Consumption
Standby Current:
Future Development
●
5μA at maximum (NOR-type flash memory / 1 chip
70μA at maximum (mobile FCRAM),
7μA at maximum (SRAM)
This article has introduced the stacked MCP mounted
with two 128M-bit page mode NOR-type flash memories, a
16M-bit mobile FCRAM, and a 4M-bit SRAM as a memory
solution for the coming generation of mobile devices. As a
total memory solution supplier, FUJITSU will continue to
develop and provide advanced MCP products that will
●
Read-out Operation:
60mA at maximum (NOR-type flash memory at initial
stage of page read)
20mA at maximum (mobile FCRAM)
40mA at maximum (SRAM)
Write/Erase Operation:
35mA at maximum (NOR-type flash memory)
Number of Erase/Write Times:
100 thousand times (NOR-type flash memory)
match the evermore demanding needs of the market.
✱
●
●
NOTES
1: Mobile FCRAM: A large density, low-power pseudo SRAM
which consists of an FCRAM core with an asynchronous
SRAM interface.
*
*
*
2: FBGA (Fine-pitch Ball Grid Array): A type of surface-mounting
_
_
_
_
Fig. 1 shows the pin assignments, Fig. 2 the block diagram,
and Fig. 3 the package external dimension diagram.
package.
FCRAM (Fast Cycle RAM) is a registered trademark of FUJITSU
_
_
_
LIMITED.
Figure 3 Package External Dimension Diagram
139-φ0.40+-00..0105
M
0.08
S AB
11.00±0.10
0.20 S B
B
+0.15
1.25 -0.1(0 SEATED HEIGHT)
0.4
REF
0.8
REF
18
17
16
15
14
13
12
11
10
9
0.8
REF
A
15.00±0.10
8
7
0.4
REF
6
5
4
0.10(.004)S
3
2
1
M L
K J H G F E D C B A
0.10±0.05
INDEX-MARK AREA
(STAND OFF)
0.20
S
A
S
FBGA-139,BGA-139P-M01
0.08
S
72
FIND Vol.20
No.2 2002
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