MB88346L_06 [FUJITSU]

D/A Converter for Digital Tuning (12-channel, 8-bit, on-chip OP amp, low-voltage); D / A转换器,用于数字调谐( 12通道, 8位,片上运算放大器,低电压)
MB88346L_06
型号: MB88346L_06
厂家: FUJITSU    FUJITSU
描述:

D/A Converter for Digital Tuning (12-channel, 8-bit, on-chip OP amp, low-voltage)
D / A转换器,用于数字调谐( 12通道, 8位,片上运算放大器,低电压)

转换器 运算放大器
文件: 总20页 (文件大小:187K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
FUJITSU MICROELECTRONICS  
DATA SHEET  
DS04-13511-3Ea  
Linear IC Converter  
CMOS  
D/A Converter for Digital Tuning  
(12-channel, 8-bit, on-chip OP amp, low-voltage)  
MB88346L  
DESCRIPTION  
The Fujitsu Microelectronics MB88346L is a 12-channel 8-bit D/A converter capable of low-voltage operation that  
has amplifiers built into each of the 12 analog output lines to deliver heavy-current drive capability.  
The use of serial data input means that only three control lines are required, and enables cascade connection of  
multiple MB88346L chips.  
The MB88346L is suitable for applications such as electronic volume controls and replacing trimmer potentiom-  
eters in tuning systems. In addition, the MB88346L is both function-compatible and pin-compatible the currently  
used MB88346B, making it easy to reduce the voltage level of a system by simply replacing the MB88346B with  
the MB88346L.  
FEATURES  
• Low voltage operation (VCC/VDD : 2.7 V to 3.6 V)  
• Ultra-low power consumption (0.5 mW/ch at VCC = 3 V)  
• Ultra-compact space-saving package lineup (SSOP-20)  
• Contains 12-channel R-2R type 8-bit D/A converter  
• On-chip analog output amps (sink current max. 1.0 mA, source current max. 1.0 mA)  
• Analog output range from 0 to VCC  
Two separate power supply/ground lines for MCU interface block/operational amplifier output buffer block and  
D/A converter block  
• Serial data input : maximum operating speed 2.5 MHz  
(maximum operating speed in cascade connection is 1.5 MHz)  
• CMOS process  
• Package lineup includes DIP 20-pin, SSOP 20-pin  
Copyright©2000-2008 FUJITSU MICROELECTRONICS LIMITED All rights reserved  
2006.12  
MB88346L  
PIN ASSIGNMENT  
(Top view)  
VSS  
AO3  
AO4  
AO5  
AO6  
AO7  
AO8  
AO9  
AO10  
VDD  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
GND  
AO2  
AO1  
DI  
CLK  
LD  
DO  
AO12  
AO11  
VCC  
(DIP-20P-M02)  
(FPT-20P-M03)  
2
MB88346L  
PIN DESCRIPTION  
Pin No.  
Symbol  
I/O  
Function  
Serial address/data input to the internal 12-bit shift register : The ad-  
dress/data format is that upper 4 bits (D11 to D8) indicate an address  
and lower 8 bits (D7 to D0) indicate data. The D11 (MSB) is the first-  
in bit and D0 (LSB) is the last-in bit.  
17  
DI  
I
14  
16  
DO  
O
I
Outputs MSB bit data from 12-bit shift register.  
Shift clock input to the internal 12-bit shift register : At the rising edge  
of CLK data on the DI pin is shifted into the LSB of the shift register  
and contents of the shift register are shifted right (to the MSB) .  
CLK  
Load strobe input for a 12-bit address/data : A high level on the LD pin  
latches a 4-bit address (upper 4 bits : D11 to D8) of the internal 12-bit  
shift register into the internal address decoder, and writes 8-bit data  
(lower 8 bits : D7 to D0) of the shift register into an internal data latch  
selected by the latched address.  
15  
LD  
I
18  
19  
2
3
4
5
6
7
8
AO1  
AO2  
AO3  
AO4  
AO5  
AO6  
AO7  
AO8  
AO9  
AO10  
AO11  
AO12  
O
8-bit D/A output pins with OP amps.  
9
12  
13  
11  
20  
10  
1
VCC  
GND  
VDD  
MCU interface and OP amp power supply pin.  
MCU interface and OP amp ground pin.  
D/A converter power supply pin.  
VSS  
D/A converter ground pin.  
3
MB88346L  
BLOCK DIAGRAM  
DI  
12-bit shift register  
DO  
LD  
CLK  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7 D8  
D9  
D10  
D11  
Address decoder  
8
1
2
3
4
12  
12  
D0  
D7  
D0  
D7  
1
12  
8-bit latch  
8-bit latch  
8-bit  
8-bit  
R-2R  
R-2R  
D/A converter  
D/A converter  
+
+
VCC  
GND  
AO1  
AO12  
VDD VSS  
4
MB88346L  
DATA CONFIGURATION  
The MB88346L has a 12-bit shift register for controlling the chip. The data passed to the 12-bit shift register  
needs to be supplied in the following format.  
The data structure consists of a total of 12 bits, four for address selection and eight for D/A data output.  
1. Shift Register Control Data Configuration  
First  
MSB  
Last  
LSB  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
D8  
D9  
D10  
D11  
D/A data output  
Address selection  
2. D/A Converter Control Signals  
D0  
D1  
D2  
D3  
D4  
D5  
0
D6  
D7  
D/A data output  
0
0
0
0
0
0
0
0
0
0
0
=: VSS  
1
0
0
0
0
0
=: VLB + VSS  
0
1
0
0
0
0
=: VLB × 2 + VSS  
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
=: VLB × 254 + VSS  
=: VDD  
VLB = (VDD VSS) /255  
5
MB88346L  
3. Address Selection Signals  
D8  
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
D9  
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
D10  
0
D11  
0
Address selection  
Don’t Care  
0
1
AO1 selection  
AO2 selection  
AO3 selection  
AO4 selection  
AO5 selection  
AO6 selection  
AO7 selection  
AO8 selection  
AO9 selection  
AO10 selection  
AO11 selection  
AO12 selection  
Don’t Care  
1
0
1
1
0
0
0
1
1
0
1
1
0
0
0
1
1
0
1
1
0
0
0
1
1
0
Don’t Care  
1
1
Don’t Care  
6
MB88346L  
OPERATING DESCRIPTION  
1. Timing Chart for Data Condition Setup  
MSB  
LSB  
D0  
DI  
D11  
D10  
D9  
D8  
D2  
D1  
CLK  
LD  
D/A data output  
2. Analog Output Voltage Range  
R-2R ladder output  
VDD  
OP amp output  
VCC  
VAOH (V CC)  
D/A output range (linear range)  
VAOL (GND)  
VSS  
GND  
VCC = VDD  
GND = VSS  
7
MB88346L  
ABSOLUTE MAXIMUM RATINGS  
Rating  
Parameter  
Symbol  
Condition  
Unit  
Min  
0.3  
0.3  
0.3  
0.3  
Max  
+ 7.0  
+ 7.0  
VCC  
VDD*  
VIN  
V
V
Power supply voltage  
GND used as reference,  
Ta = + 25 °C  
Input voltage  
VCC + 0.3  
VCC + 0.3  
250  
V
Output voltage  
VOUT  
PD  
V
Power consumption  
Operating temperature  
Storage temperature  
mW  
°C  
°C  
Ta  
20  
55  
+ 85  
Tstg  
+ 150  
* : VCC VDD  
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,  
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.  
RECOMMENDED OPERATING CONDITIONS  
Value  
Parameter  
Power supply voltage 1  
Power supply voltage 2  
Symbol  
Condition  
Unit  
Min  
2.7  
Typ  
0
Max  
3.6  
VCC  
GND  
VDD  
VSS  
IAL  
V
V
2.0  
GND  
VCC  
V
VDD VSS 2.0 V  
VCC 2.0  
1.0  
V
Analog output source current  
Analog output sink current  
Oscillator limiting output capacity  
Digital data value range  
VCC = 3.0 V  
mA  
mA  
µF  
°C  
IAH  
VCC = 3.0 V  
1.0  
CAL  
0.1  
#00  
20  
#FF  
+ 85  
Operating temperature  
Ta  
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the  
semiconductor device. All of the device’s electrical characteristics are warranted when the device is  
operated within these ranges.  
Always use semiconductor devices within their recommended operating condition ranges. Operation  
outside these ranges may adversely affect reliability and could result in device failure.  
No warranty is made with respect to uses, operating conditions, or combinations not represented on  
the data sheet. Users considering application outside the listed conditions are advised to contact their  
representatives beforehand.  
8
MB88346L  
ELECTRICAL CHARACTERISTICS  
1. DC Characteristics  
(1) Digital Block  
(VDD, VCC = 2.7 V to 3.6 V (VCC VDD) , GND = VSS = 0 V, Ta = −20 °C to +85 °C)  
Value  
Parameter  
Symbol  
Pin  
Condition  
Unit  
Min  
Typ  
Max  
Power supply voltage  
Power supply current 1  
VCC  
ICC  
2.7  
3.0  
3.6  
V
VCC  
Stationary (CLK signal  
stopped) , no load  
1.2  
3.0  
mA  
Input leak current  
IILK  
VIL  
VIN = 0 to VCC  
10  
+ 10  
0.2 VCC  
µA  
V
CLK, DI,  
LD  
L level input voltage  
H level input voltage  
L level output voltage  
H level output voltage  
VIH  
VOL  
VOH  
0.8 VCC  
V
IOL = 2.5 mA  
IOH = − 400 µA  
0.4  
V
DO  
VCC 0.4  
V
(2) Analog Block 1  
(VDD, VCC = 2.7 V to 3.6 V (VCC VDD) , GND = VS = 0 V, Ta = –20 °C to +85 °C)  
Value  
Parameter  
Power consumption  
Analog voltage  
Symbol  
Pin  
Condition  
Unit  
Min  
Typ  
Max  
Maximum setting value  
from #00 to #FF  
IDD  
VDD  
0.6  
1.5  
mA  
VDD  
VSS  
VDD  
VSS  
2.0  
GND  
8
VCC  
VCC 2.0  
V
V
VDD – VSS 2.0  
Resolution  
Res  
Rem  
LE  
bit  
Monotonic increase  
Nonlinearity error  
Differential linearity error  
8
bit  
AO1 to AO12  
VDD VCC 0.1 V,  
VSS 0.1 V, no load  
1.5  
1.0  
+ 1.5  
+ 1.0  
LSB  
LSB  
DLE  
Nonlinearity error : Deviation (error) in input/output curves with respect to an ideal straight line connecting  
output voltage at “00” and output voltage at “FF.”  
Differential linearity error : Deviation (error) in amplification with respect to theoretical increase in amplification  
per 1-bit increase in digital value.  
Ideal straight line  
VAOH  
Non linearity error  
VAOL  
Note : The value of VAOH and VDD, and  
the value of VAOL and VSS are not  
necessarily equivalent.  
Digital setting  
#00  
#FF  
9
MB88346L  
(3) Analog Block 2  
Parameter  
(VDD, VCC = 2.7 V to 3.6 V (VCC VDD) , GND = VSS = 0 V, Ta = −20 °C to +85 °C)  
Value  
Symbol  
Pin  
Condition  
Unit  
Min  
Typ  
Max  
VDD = VCC = 3.0 V,  
VSS = GND = 0.0 V,  
IAL = 0 µA  
Output minimum  
voltage 1  
VAOL1  
VSS  
VSS + 0.1  
V
Digital data = #00  
VDD = VCC = 3.0 V,  
VSS = GND = 0.0 V,  
IAL = 500 µA  
Output minimum  
voltage 2  
VAOL2  
VAOL3  
VAOL4  
VAOL5  
VAOH1  
VAOH2  
VAOH3  
VAOH4  
VAOH5  
VSS 0.2  
VSS  
VSS + 0.2  
VSS + 0.2  
VSS + 0.3  
VSS + 0.3  
VDD  
V
V
V
V
V
V
V
V
V
Digital data = #00  
VDD = VCC = 3.0 V,  
VSS = GND = 0.0 V,  
IAH = 500 µA  
Output minimum  
voltage 3  
VSS  
Digital data = #00  
VDD = VCC = 3.0 V,  
VSS = GND = 0.0 V,  
IAL = 1.0 mA  
Output minimum  
voltage 4  
VSS 0.3  
VSS  
Digital data = #00  
VDD = VCC = 3.0 V,  
VSS = GND = 0.0 V,  
IAH = 1.0 mA  
Output minimum  
voltage 5  
VSS  
Digital data = #00  
AO1 to AO12  
VDD = VCC = 3.0 V,  
VSS = GND = 0.0 V,  
IAL = 0 µA  
Output maximum  
voltage 1  
VDD 0.1  
VDD 0.2  
VDD 0.2  
VDD 0.3  
VDD 0.3  
Digital data = #FF  
VDD = VCC = 3.0 V,  
VSS = GND = 0.0 V,  
IAL = 500 µA  
Output maximum  
voltage 2  
VDD  
Digital data = #FF  
VDD = VCC = 3.0 V,  
VSS = GND = 0.0 V,  
IAH = 500 µA  
Output maximum  
voltage 3  
VDD  
VDD + 0.2  
Digital data = #FF  
VDD = VCC = 3.0 V,  
VSS = GND = 0.0 V,  
IAL = 1.0 mA  
Output maximum  
voltage 4  
VDD  
Digital data = #FF  
VDD = VCC = 3.0 V,  
VSS = GND = 0.0 V,  
IAH = 1.0 mA  
Output maximum  
voltage 5  
VDD  
VDD + 0.3  
Digital data = #FF  
10  
MB88346L  
2. AC Characteristics  
Parameter  
(VDD, VCC = 2.7 V to 3.6 V (VCC VDD) , GND = VSS = 0 V, Ta = − 20 °C to +85 °C)  
Value  
Symbol  
Condition  
Unit  
Min  
200  
200  
Max  
Clock L level pulse width  
Clock H level pulse width  
tCKL  
tCKH  
ns  
ns  
Clock rise time  
Clock fall time  
tCr  
tCf  
200  
ns  
Data setup time  
tDCH  
tCHD  
tCHL  
tLDC  
tLDH  
tDO  
30  
60  
ns  
ns  
ns  
ns  
ns  
ns  
µs  
Data hold time  
Load setup time  
200  
100  
100  
70  
Load hold time  
Load H level pulse width  
Data output delay time  
D/A output settling time  
Refer to “• Load condition 1”  
Refer to “• Load condition 2”  
600  
300  
tLDD  
• Load condition 1  
• Load condition 2  
Measurement point  
Measurement point  
CAL = 50 pF  
CL = 20 pF  
to 100 pF  
R AL = 10 k  
11  
MB88346L  
• Input/output timing  
tCr  
tCKH  
tCf  
CLK  
tCKL  
tLDC  
DI  
tLDH  
tDCH  
tCHD  
tCHL  
LD  
tLDD  
90 %  
10 %  
D/A output  
DO  
tDO  
Note: Decision levels: 80 % and 20 % of VCC  
VAO vs. IAO CHARACTERISTICS : EXAMPLE  
Ta = +25°C  
3.0 V  
3.0 V  
Source current  
Sink current  
MB88346L  
VDD  
VCC  
AO1  
to  
DI  
Pattern input  
CLK  
LD  
AO12  
GND  
V
VSS  
(Continued)  
12  
MB88346L  
(Continued)  
#FF setting  
[mV]  
3,000  
2,980  
2,960  
2,940  
2,920  
2,900  
2,880  
2,860  
2,840  
2,820  
2,800  
1.0  
0.8  
0.6  
0.4  
0.2  
0.2  
0.4  
0.6  
0.8  
1.0 [mA]  
0.0  
Sink current  
Source current  
#80 setting  
[mV]  
1,600  
1,580  
1,560  
1,540  
1,520  
1,500  
1,480  
1,460  
1,440  
1,420  
1,400  
1.0  
0.8  
0.6  
0.4  
0.2  
0.2  
0.4  
0.6  
0.8  
1.0 [mA]  
0.0  
Sink current  
Source current  
[mV]  
200  
180  
160  
140  
120  
100  
80  
#00 setting  
60  
40  
20  
0
1.0  
0.8  
0.6  
0.4  
0.2  
0.2  
0.4  
0.6  
0.8  
1.0 [mA]  
0.0  
Sink current  
Source current  
13  
MB88346L  
ORDERING INFORMATION  
Part number  
Package  
Remarks  
20-pin plastic DIP  
(DIP-20P-M02)  
MB88346LP  
20-pin plastic SSOP  
(FPT-20P-M03)  
MB88346LPFV  
14  
MB88346L  
PACKAGE DIMENSIONS  
20-pin plastic DIP  
Lead pitch  
Row spacing  
Sealing method  
2.54mm(100mil)  
7.62mm(300mil)  
Plastic mold  
(DIP-20P-M02)  
20-pin plastic DIP  
(DIP-20P-M02)  
+0.20  
–0.30  
24.64  
.970 +..001028  
INDEX-1  
6.20±0.25  
(.244±.010)  
INDEX-2  
0.51(.020)MIN  
4.36(.172)MAX  
3.00(.118)MIN  
0.25±0.05  
(.010±.002)  
0.46±0.08  
(.018±.003)  
+0.30  
–0  
+0.30  
15°MAX  
0.86  
1.27  
–0  
7.62(.300)  
TYP  
.034 +0.012  
.050 +0.012  
1.27(.050)  
MAX  
2.54(.100)  
TYP  
Dimensions in mm (inches).  
C
Note: The values in parentheses are reference values.  
1994 FUJITSU LIMITED D20003S-3C-4  
Please confirm the latest Package dimension by following URL.  
http://edevice.fujitsu.com/package/en-search/  
(Continued)  
15  
MB88346L  
(Continued)  
20-pin plastic SSOP  
Lead pitch  
0.65 mm  
4.40 × 6.50 mm  
Gullwing  
Package width  
package length  
×
Lead shape  
Sealing method  
Mounting height  
Weight  
Plastic mold  
1.45 mmMAX  
0.09g  
Code  
(Reference)  
P-SSOP20-4.4×6.5-0.65  
(FPT-20P-M03)  
20-pin plastic SSOP  
(FPT-20P-M03)  
Note 1) *1 : Resin protrusion. (Each side : +0.15 (.006) Max).  
Note 2) *2 : These dimensions do not include resin protrusion.  
Note 3) Pins width and pins thickness include plating thickness.  
Note 4) Pins width do not include tie bar cutting remainder.  
16.50±0.10(.256±.004)  
*
0.17±0.03  
(.007±.001)  
20  
11  
2
*
4.40±0.10 6.40±0.20  
(.173±.004) (.252±.008)  
INDEX  
Details of "A" part  
1.25 +00..1200  
(Mounting height)  
.049 +..000048  
1
10  
LEAD No.  
"A"  
0.65(.026)  
0.24±0.08  
(.009±.003)  
M
0.13(.005)  
0~8˚  
0.10±0.10  
(Stand off)  
0.50±0.20  
(.004±.004)  
(.020±.008)  
0.25(.010)  
0.60±0.15  
(.024±.006)  
0.10(.004)  
Dimensions in mm (inches).  
Note: The values in parentheses are reference values.  
C
2003 FUJITSU LIMITED F20012S-c-4-6  
Please confirm the latest Package dimension by following URL.  
http://edevice.fujitsu.com/package/en-search/  
16  
MB88346L  
MEMO  
17  
MB88346L  
MEMO  
18  
MB88346L  
MEMO  
19  
FUJITSU MICROELECTRONICS LIMITED  
Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku,  
Tokyo 163-0722, Japan  
Tel: +81-3-5322-3347 Fax: +81-3-5322-3387  
http://jp.fujitsu.com/fml/en/  
For further information please contact:  
North and South America  
Asia Pacific  
FUJITSU MICROELECTRONICS AMERICA, INC.  
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Sunnyvale, CA 94085-5401, U.S.A.  
Tel: +1-408-737-5600 Fax: +1-408-737-5999  
http://www.fma.fujitsu.com/  
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151 Lorong Chuan, #05-08 New Tech Park,  
Singapore 556741  
Tel: +65-6281-0770 Fax: +65-6281-0220  
http://www.fujitsu.com/sg/services/micro/semiconductor/  
Europe  
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Rm.3102, Bund Center, No.222 Yan An Road(E),  
Shanghai 200002, China  
FUJITSU MICROELECTRONICS EUROPE GmbH  
Pittlerstrasse 47, 63225 Langen,  
Germany  
Tel: +86-21-6335-1560 Fax: +86-21-6335-1605  
http://cn.fujitsu.com/fmc/  
Tel: +49-6103-690-0 Fax: +49-6103-690-122  
http://emea.fujitsu.com/microelectronics/  
FUJITSU MICROELECTRONICS PACIFIC ASIA LTD.  
10/F., World Commerce Centre, 11 Canton Road  
Tsimshatsui, Kowloon  
Korea  
FUJITSU MICROELECTRONICS KOREA LTD.  
206 KOSMO TOWER, 1002 Daechi-Dong,  
Kangnam-Gu,Seoul 135-280  
Korea  
Hong Kong  
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Edited Strategic Business Development Dept.  

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