BAS40WD [FUTUREWAFER]
Surface Mount Switching Diode;
| 型号： | BAS40WD |
| 厂家： | 
FutureWafer Tech Co.,Ltd |
| 描述： | Surface Mount Switching Diode |
| 文件： | 总11页 (文件大小：1684K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BAS40WD Series
Surface Mount Switching Diode
1. Synopsis
1-1. Feature List
●
●
●
●
●
●
●
For General Purpose Switching Applications
Fast Switching Speed
Totally Lead-Free & Fully RoHS Compliant
Halogen and Antimony Free. “Green” Device
High Breakdown Voltage
SOD323
Low Capacitance
Low Leakage Current
1-2. Applications
●
Ultra High-Speed Switching
●
Voltage Clamping
1-3. Mechanical Characteristics
SOD323FL
●
Molded JEDEC Package:
- SOD323 / SOD323FL / SOD523FL
Packing: Tape and Reel
●
●
●
●
Flammability rating UL 94V-0
Halogen Free
JEDEC MSL Classification: Level 1
SOD523FL
1-4. Absolute Maximum Ratings
Parameter
Symbol
V RRM
V RWM
V R
Condition
Values
Units
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Reverse Voltage
T J = 25°C
40
V
Non-repetitive Peak Reverse Voltage
V RM
I F
200
750
Average Forward Current
-
mA
Repetitive Peak Forward Current
I FRM
I FSM
P D
t p ≤ 1 s; δ ≤ 0.5
Non-repetitive Peak Forward Surge Current
t p ≤ 10 ms
Power Dissipation
-
-
200
500
mW
Thermal Resistance, Junction-Ambient (Air)
R ƟJA
°C/W
Operating Temperature Range
Storage Temperature Range
T J
-
-
-55 ~ +150
°C
T STG
Document No.: F21837W
www.futurewafer.com.tw
1
30-DEC-2021 V 2.0
FQE-001-04
BAS40WD Series
Surface Mount Switching Diode
2. Contents
1. Synopsis........................................................................................................................................................1
1-1. Feature List................................................................................................................................................1
1-2. Applications ...............................................................................................................................................1
1-3. Mechanical Characteristics .......................................................................................................................1
1-4. Absolute Maximum Ratings.......................................................................................................................1
2. Contents ........................................................................................................................................................2
3. Electrical Property........................................................................................................................................3
3-1. Electrical Characteristics...........................................................................................................................3
3-2. Ratings and Characteristics Curve............................................................................................................3
4. Soldering Parameters ..................................................................................................................................4
5. Package Information ....................................................................................................................................5
5-1. Dimension-SOD323 ..................................................................................................................................5
5-2. PCB Pad Layout Recommendation-SOD323 ...........................................................................................5
5-3. Dimension-SOD323FL ..............................................................................................................................6
5-4. PCB Pad Layout Recommendation-SOD323FL .......................................................................................6
5-5. Dimension-SOD523FL ..............................................................................................................................7
5-6. PCB Pad Layout Recommendation-SOD523FL .......................................................................................7
6. Packing..........................................................................................................................................................8
6-1. Taping and Reel Specification-SOD323 & SOD323FL.............................................................................8
6-2. Embossed Carrier Tape Specification-SOD323 & SOD323FL.................................................................8
6-3. Taping and Reel Specification-SOD523FL ...............................................................................................9
6-4. Embossed Carrier Tape Specification-SOD523FL ...................................................................................9
6-5. Surface Mount Reel Specification...........................................................................................................10
6-6. Tape Leader and Trailer Specification ....................................................................................................10
7. Ordering Information..................................................................................................................................11
8. Version.........................................................................................................................................................11
8-1. History .....................................................................................................................................................11
8-2. Company Profile......................................................................................................................................11
Document No.: F21837W
www.futurewafer.com.tw
2
30-DEC-2021 V 2.0
FQE-001-04
BAS40WD Series
Surface Mount Switching Diode
3. Electrical Property
3-1. Electrical Characteristics
Parameter
Symbol
Condition
I R = 10uA
I F = 1mA
Min.
Typ.
Max.
-
Units
Reverse Breakdown Voltage
Forward Voltage
V BR
V F
40
-
-
-
-
-
V
0.38
1.0
5.0
I F = 200mA
-
Reverse Recovery Time
t rr
I F = I T = 10mA,
-
nS
I rr = 1mA, R L = 100Ω
Reverse Leakage Current
Junction Capacitance
I R
V R = 30V, T J = 25°C
-
-
20
100
5.0
nA
pF
C I/O
Pin Capacitance to GND.
4.0
V dc = 0V, f = 1MHZ
3-2. Ratings and Characteristics Curve (TA=25°C unless otherwise noted)
Fig 1. Typical Forward Characteristics
Fig 2. Reverse Current
T A = 125°C
T A = 75°C
T A = 25°C
Forward Voltage, V F (V)
Reverse Voltage, V R (V)
Fig 3. Typical Junction Capacitance
Fig 4. Power Derating Curve
Reverse Voltage, V R (V)
Case Temperature, T C (°C)
Document No.: F21837W
www.futurewafer.com.tw
3
30-DEC-2021 V 2.0
FQE-001-04
BAS40WD Series
Surface Mount Switching Diode
4. Soldering Parameters
Document No.: F21837W
www.futurewafer.com.tw
4
30-DEC-2021 V 2.0
FQE-001-04
BAS40WD Series
Surface Mount Switching Diode
5. Package Information
5-1. Dimension-SOD323
SOD323
Dim
Millimeters
Min.
Max.
Body Length
Body Width
1.60
1.90
1.45
2.70
1.10
0.40
0.20
0.40
1.15
Lead Span Nominal 2.39
Height
0.80
0.25
0.10
0.20
Lead Width
Lead Height
Lead Length
5-2. PCB Pad Layout Recommendation-SOD323
Document No.: F21837W
www.futurewafer.com.tw
5
30-DEC-2021 V 2.0
FQE-001-04
BAS40WD Series
Surface Mount Switching Diode
5-3. Dimension-SOD323FL
SOD323FL
Dim.
A
Min.
0.80
0.25
0.10
1.15
1.60
2.30
0.7
0.8
-
Typ.
Max.
1.10
0.40
0.15
1.35
1.80
2.80
1.0
-
-
-
-
-
-
-
-
-
-
-
-
b
c
D
E
He
L1
L2
α1
α2
β1
β2
1.2
7°
-
3°
-
7°
-
3°
Unit:mm
5-4. PCB Pad Layout Recommendation-SOD323FL
Dimension
Values
2.0
G
X
1.4
X1
Y
3.0
0.5
Unit:mm
Document No.: F21837W
www.futurewafer.com.tw
6
30-DEC-2021 V 2.0
FQE-001-04
BAS40WD Series
Surface Mount Switching Diode
5-5. Dimension-SOD523FL
SOD523FL
Symbol
Min.
0.55
0.26
0.11
0.75
1.15
1.55
0.10
Max.
0.65
0.34
0.17
0.85
1.25
1.65
0.30
A
b
c
D
E
He
L
Unit: mm
5-6. PCB Pad Layout Recommendation-SOD523FL
SOD523FL
Dim
G
Values
0.80
X
0.60
X1
Y
2.00
0.70
Unit: mm
Document No.: F21837W
www.futurewafer.com.tw
7
30-DEC-2021 V 2.0
FQE-001-04
BAS40WD Series
Surface Mount Switching Diode
6. Packing
6-1. Taping and Reel Specification-SOD323 & SOD323FL
Taping Width
Tape Orientation
8mm
Direction Of Feed
6-2. Embossed Carrier Tape Specification-SOD323 & SOD323FL
Unit: mm
W
Dimension W
D
D1
E
F
P
P0
P2
t
Values
8
mm
1.5
±0.1
1.3
Max.
1.75
±0.1
3.5
±0.05
4
±0.1
4
±0.1
2
±0.1
0.23
±0.02
8 +0.3
/ -0.1
A0 /
B0 /
K0
Determined by Component Size. The Clearance Between the Component And The Cavity Must Comply
to The Rotational And Lateral Movement Requirement Provided in Figures in The “Maximum
Component Movement in Tape Pocket” Section.
Document No.: F21837W
www.futurewafer.com.tw
8
30-DEC-2021 V 2.0
FQE-001-04
BAS40WD Series
Surface Mount Switching Diode
6-3. Taping and Reel Specification-SOD523FL
Taping Width
Tape Orientation
8mm
Direction Of Feed
6-4. Embossed Carrier Tape Specification-SOD523FL
Unit: mm
Dimension W
D
D1
E
F
P
P0
P2
t
W
Values
8
mm
1.5
±0.1
0.6
Max.
1.75
±0.1
3.5
±0.05
2
±0.1
4
±0.1
2
±0.1
0.23
±0.02
8 +0.3
/ -0.1
A0 /
B0 /
K0
Determined by Component Size. The Clearance Between the Component And The Cavity Must Comply
to The Rotational And Lateral Movement Requirement Provided in Figures in The “Maximum
Component Movement in Tape Pocket” Section.
Document No.: F21837W
www.futurewafer.com.tw
9
30-DEC-2021 V 2.0
FQE-001-04
BAS40WD Series
Surface Mount Switching Diode
6-5. Surface Mount Reel Specification
Unit: mm
Dimension Tape Width Reel Size
Values 8 mm 7”
A
B
C
D
N
G
T
178
±2
2.0
+0.5/-0
13
20.5
55
±5
8.4
+1.5/-0.0
14.4
+0.5/-0.2 ±0.2
6-6. Tape Leader and Trailer Specification
Document No.: F21837W
www.futurewafer.com.tw
10
30-DEC-2021 V 2.0
FQE-001-04
BAS40WD Series
Surface Mount Switching Diode
7. Ordering Information
Part Number
Marking Code
Component Package Quantity
Packaging Option
BAS40WD
F43F
SOD323
3,000 PCS
Tape & Reel -
8mm tape / 7”reel
BAS40WDF
BAS40WDS
SOD323FL
SOD523FL
8,000 PCS
8. Version
8-1. History
Version
Date
File No.
Recording
Basis
A
07-Feb-2018
22-Apr-2019
30-Dec-2021
F21837W
New Create
Market
B
Update Company Info. System
Update Version System
2.0
8-2. Company Profile
Futurewafer Tech Co., Ltd. 台灣未來芯科技股份有限公司
TEL: +886-3-3350161 / FAX: +886-3-3350172
cherry@futurewafer.com.tw
No. 286-11F, Sec. 3, Sanmin Rd., Taoyuan Dist., Taoyuan City 330, Taiwan
Document No.: F21837W
www.futurewafer.com.tw
11
30-DEC-2021 V 2.0
FQE-001-04
相关型号：
©2020 ICPDF网 联系我们和版权申明