BAT54H [FUTUREWAFER]
Surface Mount Schottky Barrier Diode;
| 型号： | BAT54H |
| 厂家： | 
FutureWafer Tech Co.,Ltd |
| 描述： | Surface Mount Schottky Barrier Diode |
| 文件： | 总15页 (文件大小：1841K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BAT54 Family
Surface Mount Schottky Barrier Diode
1. Synopsis
1-1. General Description
These Schottky Barrier Diodes are Designed for High Speed
Switching Applications, Circuit Protection, And Voltage
Clamping. Extremely Low Forward Voltage Reduces
Conduction Loss. Miniature Surface Mount Package is
Excellent For Handheld And Portable Applications Where
Space is Limited.
BAT54
SOT23
BAT54T
SOD123
1-2. Feature List
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Low Turn-on Voltage
Extremely Fast Switching Speed
PN Junction Guard Ring for Transient and ESD Protection
Totally Lead-Free & Fully RoHS Compliant
Halogen and Antimony Free. “Green” Device
BAT54H
SOD323
BAT54CW
SOT323
1-3. Mechanical Characteristics
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Molded JEDEC Package:
- SOT23
/
/
/
/
- SOT323
- SOT363
- SOD323
- SOD523FL
- SOD123
- SOD323FL
- DFN1006-2L
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Packing: Tape and Reel
Flammability rating UL 94V-0
Halogen Free
BAT54WS
SOD323FL
BAT54BRW
SOT363
JEDEC MSL Classification: Level 1
BAT54L
BAT54K
DFN1006-2L
SOD523FL
1-3. Device Characteristics
www.futurewafer.com.tw
FQE-001-04
Document No.: F41806F
07-DEC-2021 V 2.1
1/15
BAT54 Family
Surface Mount Schottky Barrier Diode
2. Contents
1. Synopsis................................................................................................................................................................1
1-1. General Description ..................................................................................................................................1
1-2. Feature List ................................................................................................................................................1
1-3. Mechanical Characteristics......................................................................................................................1
2. Contents ................................................................................................................................................................2
3. Electrical Property ..............................................................................................................................................3
3-1. Electrical Characteristics..........................................................................................................................3
3-2. Thermal Characteristics ...........................................................................................................................3
3-3. Ratings and Characteristics Curve (TA=25°C Unless Otherwise Noted)-Fig 1~2 .................................................3
3-3. Ratings and Characteristics Curve (TA=25°C Unless Otherwise Noted)-Fig 3~7 .................................................4
4. Soldering Parameters ........................................................................................................................................5
5. Package Information ..........................................................................................................................................6
5-1. Dimension-SOT23.....................................................................................................................................6
5-2. PCB Pad Layout Recommendation-SOT23..........................................................................................6
5-3. Dimension-SOT323 ..................................................................................................................................7
5-4. PCB Pad Layout Recommendation-SOT323 .......................................................................................7
5-5. Dimension-SOT363 ..................................................................................................................................8
5-6. PCB Pad Layout Recommendation-SOT363 .......................................................................................8
5-7. Dimension-SOD123..................................................................................................................................9
5-8. PCB Pad Layout Recommendation-SOD123.......................................................................................9
5-9. Dimension-SOD323................................................................................................................................10
5-10. PCB Pad Layout Recommendation-SOD323...................................................................................10
5-11. Dimension-SOD323FL.........................................................................................................................11
5-12. PCB Pad Layout Recommendation-SOD323FL..............................................................................11
5-13. Dimension-SOD523FL.........................................................................................................................12
5-14. PCB Pad Layout Recommendation-SOD523FL..............................................................................12
5-15. Dimension-DFN1006-2L ......................................................................................................................13
5-16. PCB Pad Layout Recommendation-DFN1006-2L ...........................................................................13
6. Ordering Information........................................................................................................................................14
7. Version.................................................................................................................................................................15
7-1. History.......................................................................................................................................................15
7-2. Company Profile......................................................................................................................................15
www.futurewafer.com.tw
FQE-001-04
Document No.: F41806F
07-DEC-2021 V 2.1
2/15
BAT54 Family
Surface Mount Schottky Barrier Diode
3. Electrical Property
3-1. Electrical Characteristics
3-2. Thermal Characteristics
3-3. Ratings and Characteristics Curve (TA=25°C Unless Otherwise Noted)-Fig 1~2
Fig 1. Power Derating Curve
Fig 2. Typical Instantaneous Forward Characteristics
T A = 125°C
T A = 85°C
T A = 25°C
Average Temperature, T A (°C)
Instantaneous Forward Voltage, V F (V)
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FQE-001-04
Document No.: F41806F
07-DEC-2021 V 2.1
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BAT54 Family
Surface Mount Schottky Barrier Diode
3-3. Ratings and Characteristics Curve (TA=25°C Unless Otherwise Noted)-Fig 3~7
Fig 3. Typical Reverse Current Characteristics
Fig 4. Total Capacitance vs. V R
T A = 125°C
T A = 85°C
T A = 25°C
Reverse Voltage, V R (V)
Reverse Voltage, V R (V)
Fig 5. Average Forward Power Dissipation
vs. Average Forward Current
Fig 6. Reverse Leakage Current
vs. Junction Temperature
V R = 3V
δ=1.0
δ=0.5
δ=0.2
δ=0.1
δ=0.05
Forward Current, I F (A)
Average Temperature, T A (°C)
Fig 7. Relative Variation of Thermal Impedance
Junction to Ambient vs. Pulse Duration
SOT23 / SOD123 / DFN1006-2L
SOD523FL
SOT323 / SOT363 / SOD323 / 323FL
Pulse Duration, t p (S)
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FQE-001-04
Document No.: F41806F
07-DEC-2021 V 2.1
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BAT54 Family
Surface Mount Schottky Barrier Diode
4. Soldering Parameters
www.futurewafer.com.tw
Document No.: F41806F
07-DEC-2021 V 2.1
FQE-001-04
5/15
BAT54 Family
Surface Mount Schottky Barrier Diode
5. Package Information
5-1. Dimension-SOT23
Unit:mm
5-2. PCB Pad Layout Recommendation-SOT23
www.futurewafer.com.tw
Document No.: F41806F
07-DEC-2021 V 2.1
FQE-001-04
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BAT54 Family
Surface Mount Schottky Barrier Diode
5-3. Dimension-SOT323
Unit:mm
5-4. PCB Pad Layout Recommendation-SOT323
Unit:mm
www.futurewafer.com.tw
FQE-001-04
Document No.: F41806F
07-DEC-2021 V 2.1
7/15
BAT54 Family
Surface Mount Schottky Barrier Diode
5-5. Dimension-SOT363
Unit:mm
5-6. PCB Pad Layout Recommendation-SOT363
Unit:mm
www.futurewafer.com.tw
FQE-001-04
Document No.: F41806F
07-DEC-2021 V 2.1
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BAT54 Family
Surface Mount Schottky Barrier Diode
5-7. Dimension-SOD123
Unit:mm
5-8. PCB Pad Layout Recommendation-SOD123
Unit: mm(inch)
www.futurewafer.com.tw
FQE-001-04
Document No.: F41806F
07-DEC-2021 V 2.1
9/15
BAT54 Family
Surface Mount Schottky Barrier Diode
5-9. Dimension-SOD323
5-10. PCB Pad Layout Recommendation-SOD323
www.futurewafer.com.tw
FQE-001-04
Document No.: F41806F
07-DEC-2021 V 2.1
10/15
BAT54 Family
Surface Mount Schottky Barrier Diode
5-11. Dimension-SOD323FL
Unit:mm
5-12. PCB Pad Layout Recommendation-SOD323FL
Unit:mm
www.futurewafer.com.tw
FQE-001-04
Document No.: F41806F
07-DEC-2021 V 2.1
11/15
BAT54 Family
Surface Mount Schottky Barrier Diode
5-13. Dimension-SOD523FL
Unit:mm
5-14. PCB Pad Layout Recommendation-SOD523FL
Unit:mm
www.futurewafer.com.tw
FQE-001-04
Document No.: F41806F
07-DEC-2021 V 2.1
12/15
BAT54 Family
Surface Mount Schottky Barrier Diode
5-15. Dimension-DFN1006-2L
5-16. PCB Pad Layout Recommendation-DFN1006-2L
www.futurewafer.com.tw
FQE-001-04
Document No.: F41806F
07-DEC-2021 V 2.1
13/15
BAT54 Family
Surface Mount Schottky Barrier Diode
6. Ordering Information
www.futurewafer.com.tw
Document No.: F41806F
07-DEC-2021 V 2.1
FQE-001-04
14/15
BAT54 Family
Surface Mount Schottky Barrier Diode
7. Version
7-1. History
7-2. Company Profile
Futurewafer Tech Co., Ltd. 台灣未來芯科技股份有限公司
TEL: +886-3-3350161 / FAX: +886-3-3350172
cherry@futurewafer.com.tw
No. 286-11F, Sec. 3, Sanmin Rd., Taoyuan Dist., Taoyuan City 330, Taiwan
www.futurewafer.com.tw
Document No.: F41806F
07-DEC-2021 V 2.1
FQE-001-04
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