FESD05HD [FUTUREWAFER]
High Power Small Package ESD Protection;
| 型号： | FESD05HD |
| 厂家： | 
FutureWafer Tech Co.,Ltd |
| 描述： | High Power Small Package ESD Protection |
| 文件： | 总4页 (文件大小：767K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
FESD05HD
High Power Small Package ESD Protection
Applications
● Lan equipment
● Video
● DVI
● High Speed Data Line
● Ethernet
● USB 2.0 Power and Data line Protection
Feature
● With TVS Diode
● ESD Protection:Level 4
● Low clamping voltage
● 150Watts peak pulse power per line(tp=8/20uS)
● Ultra low capacitance:40pf max.(I/O to GND.)
DFN1006
IEC Compatibility
● EN61000-4
● 61000-4-2(ESD):LEVEL 4,Air:15kv,contact:8kv
● 61000-4-4(EFT):40A-5/50ns
● 61000-4-5(Surge):12A-8/20us
Mechanical Characteristics
● Molded JEDEC DFN1006 package
● Packging:Tape and Reel
● Flammability rating UL 94V-0
● Halogen Free
Device Characteristics
Maximum Ratings@25 unless otherwise specified
Parameter
Symbol
PPP
Value
170
Units
Watts
°C
Peak pulse power (tp=8/20us) (fig. 3)
Operating Temperature
TJ
-55~150
Storage Temperature
TSTG
-55~150
°C
E1508F11D-STD-FW-001
Futurewafer Technology co., Ltd.,
FESD05HD
High Power Small Package ESD Protection
Electrical Characteristics
Parameter
Symbol
Condition
Pin 2-1/Pin 1-2
IZ=1mA,Pin 1-2/pin 2-1
@VRWM
min
max
5
Units
V
Reverse Stand-off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
VRWM
VBR
5.6
9.4
0.9
V
IR(max)
uA
IPP=1A tp=8/20us
IPP=12A tp=8/20us
tp=8/20us
9
Clamping Voltage
VC
V
14
12
Peak Pulse Current
IPP
A
Pin capacitance to GND.
Vdc=0V,f=1MHZ
Junction Capacitance
C I/O
30
40
pf
Rating and characteristic curve
Figure 1
Figure 2
Power Derating Curve
100
75
50
25
0
0
25
50
75
100
125
150
175
t-Time-µs
Tj (°C)
Figure 3
Figure 4
Non-repetitive Peak pulse power V.S pulse time
Peak Pulse Current vs. Clamping Voltage
170W,8/20uS
Pulse Duration –tp(us)
IPP(A)-Peak Pulse Current
E1508F11D-STD-FW-001
Futurewafer Technology co., Ltd.,
FESD05HD
High Power Small Package ESD Protection
I-V Characteristics for a unidirectional Protection Device
Ordering information
Marking codes
Part No.
FESD05HD
Quantity
Marking
FU
10,000pcs
MILLIMETER
NOM
SYMBOL
MIN
0.95
0.55
0.40
MAX
1.05
0.65
0.50
A
B
C
1.00
0.60
0.45
C1
D
e
0.05
0.55
0.45
0.20
0.50
0.65 BSC
0.25
E
0.30
單位: mm
E1508F11D-STD-FW-001
Futurewafer Technology co., Ltd.,
FESD05HD
High Power Small Package ESD Protection
Pad Layout
Futurewafer Technology co.,Ltd 台灣未來芯航電股份有限公司
Tel ：+886-3-3573583/Tel ：+886-3-3574065
Futurewafer.com.tw
桃園市桃園區中正路 987 巷 50 弄 2 號
E1508F11D-STD-FW-001
Futurewafer Technology co., Ltd.,
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