SBR3L100BF [FUTUREWAFER]
Surface Mount Schottky Barrier Rectifier;
| 型号： | SBR3L100BF |
| 厂家： | 
FutureWafer Tech Co.,Ltd |
| 描述： | Surface Mount Schottky Barrier Rectifier |
| 文件： | 总16页 (文件大小：2083K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SBR3L100 Family
Surface Mount Schottky Barrier Rectifier
1. Synopsis
1-1. General Description
These Devices Employ The Schottky Barrier Principle in a
Metal−to−Silicon Power Rectifier. Features Epitaxial
Construction With Oxide Passivation and Metal Overlay
Contact. Ideally Suited For Low Voltage, High Frequency
Switching Power Supplies; Free Wheeling Diodes and
Polarity Protection Diodes.
SOD123FL
1-2. Feature List
SOD123HE
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High Surge Current Capability
Low Power Loss, High Efficiency
Low Forward Voltage
Ultra Low Leakage Current
Soft, Fast Switching Capability
High Operating Junction Temperature
SMAJ
SMAF
1-3. Applications
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For Use In Low Voltage High Frequency
Inverters, Freewheeling, DC/DC Converters,
and Polarity Protection Applications.
1-4. Benefits
SMBJ
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Essentially No Switching Losses
Higher Efficiency
Reduction Of Heat Sink Requirements
Parallel Devices Without Thermal Runaway
Higher System Reliability Due To Lower Operating Temperatures
1-5. Mechanical Characteristics
SMBF
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Molded JEDEC Package:
- SOD123FL / SOD123HE
- SMAJ / SMAF
Cathode
Anode
- SMBJ / SMBF
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Packing: Tape and Reel
Flammability rating UL 94V-0
Halogen Free
JEDEC MSL Classification: Level 1
www.futurewafer.com.tw
FQE-001-04
Document No.: F41810S
13-DEC-2021 V 2.1
1/16
SBR3L100 Family
Surface Mount Schottky Barrier Rectifier
2. Contents
1. Synopsis.......................................................................................................................................................................................................1
1-1. General Description........................................................................................................................................................................1
1-2. Feature List......................................................................................................................................................................................1
1-3. Applications.....................................................................................................................................................................................1
1-4. Benefits ............................................................................................................................................................................................1
1-5. Mechanical Characteristics ...........................................................................................................................................................1
2. Contents .......................................................................................................................................................................................................2
3. Electrical Property......................................................................................................................................................................................3
3-1. Device Characteristics ...................................................................................................................................................................3
3-2. Ratings and Characteristics Curve (TA=25°C unless otherwise noted)......................................................................................................4
4. Soldering Parameters................................................................................................................................................................................5
5. Package Information..................................................................................................................................................................................6
5-1. Dimension-SOD123FL...................................................................................................................................................................6
5-2. PCB Pad Layout Recommendation-SOD123FL ........................................................................................................................6
5-3. Dimension-SOD123HE..................................................................................................................................................................7
5-4. PCB Pad Layout Recommendation-SOD123HE .......................................................................................................................7
5-5. Dimension-SMAJ............................................................................................................................................................................8
5-6. PCB Pad Layout Recommendation-SMAJ .................................................................................................................................8
5-7. Dimension-SMAF ...........................................................................................................................................................................9
5-8. PCB Pad Layout Recommendation-SMAF.................................................................................................................................9
5-9. Dimension-SMBJ..........................................................................................................................................................................10
5-10. PCB Pad Layout Recommendation-SMBJ .............................................................................................................................10
5-11. Dimension-SMBF .......................................................................................................................................................................11
5-12. PCB Pad Layout Recommendation-SMBF.............................................................................................................................11
6. Packing .......................................................................................................................................................................................................12
6-1. Taping and Reel Specification-SOD123FL & SOD123HE......................................................................................................12
6-2. Embossed Carrier Tape Specification-SOD123FL & SOD123HE.........................................................................................12
6-3. Surface Mount Reel Specification-SOD123FL & SOD123HE................................................................................................13
6-4. Tape Leader and Trailer Specification-SOD123FL & SOD123HE........................................................................................13
6-5. Taping and Reel Specification-SMAJ & SMAF & SMBJ & SMBF .........................................................................................14
6-6. Embossed Carrier Tape Specification-SMAJ & SMAF & SMBJ & SMBF ............................................................................14
6-7. Surface Mount Reel Specification-SMAJ & SMAF & SMBJ & SMBF ...................................................................................15
6-8. Tape Leader and Trailer Specification-SMAJ & SMAF & SMBJ & SMBF............................................................................15
7. Ordering Information...............................................................................................................................................................................16
8. Version........................................................................................................................................................................................................16
8-1. History ............................................................................................................................................................................................16
8-2. Company Profile ...........................................................................................................................................................................16
www.futurewafer.com.tw
FQE-001-04
Document No.: F41810S
13-DEC-2021 V 2.1
2/16
SBR3L100 Family
Surface Mount Schottky Barrier Rectifier
3. Electrical Property
3-1. Device Characteristics
www.futurewafer.com.tw
Document No.: F41810S
13-DEC-2021 V 2.1
FQE-001-04
3/16
SBR3L100 Family
Surface Mount Schottky Barrier Rectifier
3-2. Ratings and Characteristics Curve (TA=25°C unless otherwise noted)
Fig 1. Maximum Forward Current Derating Curve
Fig 2. Typical Instantaneous Forward Characteristics
T J = 125°C
T J = 100°C
T J = 25°C
TM measured at cathode
terminal mount typical values
T M - Mount Temperature (°C)
Instantaneous Forward Voltage, V F (V)
Fig 4. Typical Junction Capacitance
Fig 3. Typical Reverse Current Characteristics
T J = 25 °C
f = 1.0 MHz
T J = 150°C
V sig = 50 mVp-p
T J = 125°C
T J = 100°C
T J = 25°C
Reverse Voltage, V R (V)
Reverse Voltage, V R (V)
Fig 5. Maximum Non-repetitive Forward Surge Current
Number of Cycles at 60Hz
Document No.: F41810S
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FQE-001-04
13-DEC-2021 V 2.1
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SBR3L100 Family
Surface Mount Schottky Barrier Rectifier
4. Soldering Parameters
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Document No.: F41810S
13-DEC-2021 V 2.1
FQE-001-04
5/16
SBR3L100 Family
Surface Mount Schottky Barrier Rectifier
5. Package Information
5-1. Dimension-SOD123FL
5-2. PCB Pad Layout Recommendation-SOD123FL
Unit: mm(inch)
www.futurewafer.com.tw
FQE-001-04
Document No.: F41810S
13-DEC-2021 V 2.1
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SBR3L100 Family
Surface Mount Schottky Barrier Rectifier
5-3. Dimension-SOD123HE
5-4. PCB Pad Layout Recommendation-SOD123HE
Unit: mm
www.futurewafer.com.tw
FQE-001-04
Document No.: F41810S
13-DEC-2021 V 2.1
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SBR3L100 Family
Surface Mount Schottky Barrier Rectifier
5-5. Dimension-SMAJ
Unit:mm
5-6. PCB Pad Layout Recommendation-SMAJ
Unit:mm
www.futurewafer.com.tw
FQE-001-04
Document No.: F41810S
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SBR3L100 Family
Surface Mount Schottky Barrier Rectifier
5-7. Dimension-SMAF
Unit:mm
5-8. PCB Pad Layout Recommendation-SMAF
Unit:mm
www.futurewafer.com.tw
FQE-001-04
Document No.: F41810S
13-DEC-2021 V 2.1
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SBR3L100 Family
Surface Mount Schottky Barrier Rectifier
5-9. Dimension-SMBJ
Unit:mm
5-10. PCB Pad Layout Recommendation-SMBJ
Unit:mm
www.futurewafer.com.tw
FQE-001-04
Document No.: F41810S
13-DEC-2021 V 2.1
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SBR3L100 Family
Surface Mount Schottky Barrier Rectifier
5-11. Dimension-SMBF
Unit:mm
5-12. PCB Pad Layout Recommendation-SMBF
Unit:mm
www.futurewafer.com.tw
FQE-001-04
Document No.: F41810S
13-DEC-2021 V 2.1
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SBR3L100 Family
Surface Mount Schottky Barrier Rectifier
6. Packing
6-1. Taping and Reel Specification-SOD123FL & SOD123HE
Taping Width
Tape Orientation
8mm
Direction Of Feed
6-2. Embossed Carrier Tape Specification-SOD123FL & SOD123HE
Unit:mm
www.futurewafer.com.tw
FQE-001-04
Document No.: F41810S
13-DEC-2021 V 2.1
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SBR3L100 Family
Surface Mount Schottky Barrier Rectifier
6-3. Surface Mount Reel Specification-SOD123FL & SOD123HE
Unit:mm
6-4. Tape Leader and Trailer Specification-SOD123FL & SOD123HE
www.futurewafer.com.tw
FQE-001-04
Document No.: F41810S
13-DEC-2021 V 2.1
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SBR3L100 Family
Surface Mount Schottky Barrier Rectifier
6-5. Taping and Reel Specification-SMAJ & SMAF & SMBJ & SMBF
Taping Width
Tape Orientation
12mm
Direction Of Feed
6-6. Embossed Carrier Tape Specification-SMAJ & SMAF & SMBJ & SMBF
Unit:mm
www.futurewafer.com.tw
FQE-001-04
Document No.: F41810S
13-DEC-2021 V 2.1
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SBR3L100 Family
Surface Mount Schottky Barrier Rectifier
6-7. Surface Mount Reel Specification-SMAJ & SMAF & SMBJ & SMBF
Unit:mm
6-8. Tape Leader and Trailer Specification-SMAJ & SMAF & SMBJ & SMBF
www.futurewafer.com.tw
FQE-001-04
Document No.: F41810S
13-DEC-2021 V 2.1
15/16
SBR3L100 Family
Surface Mount Schottky Barrier Rectifier
7. Ordering Information
8. Version
8-1. History
8-2. Company Profile
Futurewafer Tech Co., Ltd. 台灣未來芯科技股份有限公司
TEL: +886-3-3350161 / FAX: +886-3-3350172
cherry@futurewafer.com.tw
No. 286-11F, Sec. 3, Sanmin Rd., Taoyuan Dist., Taoyuan City 330, Taiwan
www.futurewafer.com.tw
Document No.: F41810S
13-DEC-2021 V 2.1
FQE-001-04
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