TBR05L080BF [FUTUREWAFER]
Trench MOS Barrier Schottky Rectifier;
| 型号： | TBR05L080BF |
| 厂家： | 
FutureWafer Tech Co.,Ltd |
| 描述： | Trench MOS Barrier Schottky Rectifier |
| 文件： | 总18页 (文件大小：2263K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TBR05L080A/AF/B/BF/C/HT
Trench MOS Barrier Schottky Rectifier
1. Synopsis
1-1. General Description
This TBR05L080 Series are Trench MOS Barrier Schottky Rectifier
(TBR) Provides Fast Switching Performance in a Compact
Thermally Efficient Package. Its Low Profile Makes it a Good
Option For Flat Panel Display and Other Applications With
Limited Vertical Clearance. The Device Offers Low Leakage
Over Temperature Making it a Good Match For Applications
Requiring Low Quiescent Current.
SMAJ
1-2. Feature List
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Trench MOS Barrier Schottky Technology
Low Forward Voltage Drop
80-Volts Reverse
SMAF
High Frequency Operation
1-3. Applications
SMCJ
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Switch Mode Power Supply
Power Factor Correction
Solar Inverter
Uninterruptible Power Supply
High Efficiency DC/DC Converters
Motor Drivers
SMBJ
1-4. Benefits
TO277B
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Essentially No Switching Losses
Higher Efficiency
Reduction Of Heat Sink Requirements
Parallel Devices Without Thermal Runaway
SMBF
Higher System Reliability Due To Lower Operating Temperatures
1-5. Mechanical Characteristics
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Molded JEDEC Package:
- SMAJ / SMAF
Cathode
Anode
- SMBJ / SMBF
- SMCJ
- TO277B
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Packing: Tape and Reel
Flammability rating UL 94V-0
Halogen Free
JEDEC MSL Classification: Level 1
Document Number: F22037W
05-OCT-2021 V 2.1
www.futurewafer.com.tw
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Trench MOS Barrier Schottky Rectifier
2. Contents
1. Synopsis.......................................................................................................................................................................................................1
1-1. General Description........................................................................................................................................................................1
1-2. Feature List......................................................................................................................................................................................1
1-3. Applications.....................................................................................................................................................................................1
1-4. Benefits ............................................................................................................................................................................................1
1-5. Mechanical Characteristics ...........................................................................................................................................................1
2. Contents .......................................................................................................................................................................................................2
3. Electrical Property......................................................................................................................................................................................3
3-1. Absolute Maximum Ratings ..........................................................................................................................................................3
3-2. Electrical Characteristics ...............................................................................................................................................................3
3-3. Thermal Characteristics.................................................................................................................................................................3
3-4. Ratings and Characteristics Curve...............................................................................................................................................4
4. Soldering Parameters................................................................................................................................................................................5
5. Package Information..................................................................................................................................................................................6
5-1. Dimension-SMAJ............................................................................................................................................................................6
5-2. PCB Pad Layout Recommendation-SMAJ .................................................................................................................................6
5-3. Dimension-SMAF ...........................................................................................................................................................................7
5-4. PCB Pad Layout Recommendation-SMAF.................................................................................................................................7
5-5. Dimension-SMBJ............................................................................................................................................................................8
5-6. PCB Pad Layout Recommendation-SMBJ .................................................................................................................................8
5-7. Dimension-SMBF ...........................................................................................................................................................................9
5-8. PCB Pad Layout Recommendation-SMBF.................................................................................................................................9
5-9. Dimension-SMCJ..........................................................................................................................................................................10
5-10. PCB Pad Layout Recommendation-SMCJ.............................................................................................................................10
5-11. Dimension-TO277B....................................................................................................................................................................11
5-12. PCB Pad Layout Recommendation-TO277B.........................................................................................................................11
6. Packing .......................................................................................................................................................................................................12
6-1. Taping and Reel Specification-SMAJ & SMAF ........................................................................................................................12
6-2. Embossed Carrier Tape Specification-SMAJ & SMAF ...........................................................................................................12
6-3. Taping and Reel Specification-SMBJ & SMBF ........................................................................................................................13
6-4. Embossed Carrier Tape Specification-SMBJ & SMBF ...........................................................................................................13
6-5. Taping and Reel Specification-SMCJ........................................................................................................................................14
6-6. Embossed Carrier Tape Specification-SMCJ...........................................................................................................................14
6-7. Taping and Reel Specification-TO277B....................................................................................................................................15
6-8. Embossed Carrier Tape Specification-TO277B.......................................................................................................................15
6-9. Surface Mount Reel Specification-SMAJ & SMAF & SMBJ & SMBF & TO277B................................................................16
6-10. Tape Leader and Trailer Specification-SMAJ & SMAF & SMBJ & SMBF & TO277B ......................................................16
6-11. Surface Mount Reel Specification-SMCJ................................................................................................................................17
6-12. Tape Leader and Trailer Specification-SMCJ ........................................................................................................................17
7. Ordering Information...............................................................................................................................................................................18
8. Version........................................................................................................................................................................................................18
8-1. History ............................................................................................................................................................................................18
8-2. Company Profile ...........................................................................................................................................................................18
Document Number: F22037W
05-OCT-2021 V 2.1
www.futurewafer.com.tw
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TBR05L080A/AF/B/BF/C/HT
Trench MOS Barrier Schottky Rectifier
3. Electrical Property
3-1. Absolute Maximum Ratings
Notes: (1) Measured on 8.3ms signal half sine wave or equivalent square wave, duty cycle=4 per minute maximum.
3-2. Electrical Characteristics
3-3. Thermal Characteristics
Document Number: F22037W
05-OCT-2021 V 2.1
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Trench MOS Barrier Schottky Rectifier
3-4. Ratings and Characteristics Curve
Fig 1. Maximum Forward Current Derating Curve
Fig 2. Typical Instantaneous Forward Characteristics
TM = 125°C
TJ=150°C
TJ=125°C
TA = 25°C
TJ=100°C
TJ=25°C
TM measured at cathode
terminal mount typical values
TM - Mount Temperature (°C)
Instantaneous Forward Voltage, VF (V)
Fig 4. Typical Junction Capacitance
Fig 3. Typical Reverse Current Characteristics
TJ = 25 °C
f = 1.0 MHz
TJ=150°C
Vsig = 50 mVp-p
TJ=125°C
TJ=100°C
TJ=25°C
Percent of Rated Peak Reverse Voltage, VR (%)
Fig 5. Forward Power Loss Characteristics
Reverse Voltage, VR (V)
Fig 6. Typical Transient Thermal Impedance
Junction To Ambient
D=0.8
D=0.5
D=0.3
D=0.2
D=1.0
D=0.1
Average Forward Current (A)
t - Pulse Duration (s)
Document Number: F22037W
05-OCT-2021 V 2.1
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Trench MOS Barrier Schottky Rectifier
4. Soldering Parameters
Document Number: F22037W
05-OCT-2021 V 2.1
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Trench MOS Barrier Schottky Rectifier
5. Package Information
5-1. Dimension-SMAJ
Unit:mm
5-2. PCB Pad Layout Recommendation-SMAJ
Unit:mm
Document Number: F22037W
05-OCT-2021 V 2.1
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Trench MOS Barrier Schottky Rectifier
5-3. Dimension-SMAF
Unit:mm
5-4. PCB Pad Layout Recommendation-SMAF
Unit:mm
Document Number: F22037W
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Trench MOS Barrier Schottky Rectifier
5-5. Dimension-SMBJ
Unit:mm
5-6. PCB Pad Layout Recommendation-SMBJ
Unit:mm
Document Number: F22037W
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Trench MOS Barrier Schottky Rectifier
5-7. Dimension-SMBF
Unit:mm
5-8. PCB Pad Layout Recommendation-SMBF
Unit:mm
Document Number: F22037W
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Trench MOS Barrier Schottky Rectifier
5-9. Dimension-SMCJ
Unit:mm
5-10. PCB Pad Layout Recommendation-SMCJ
Unit:mm
Document Number: F22037W
05-OCT-2021 V 2.1
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TBR05L080A/AF/B/BF/C/HT
Trench MOS Barrier Schottky Rectifier
5-11. Dimension-TO277B
Unit:mm
5-12. PCB Pad Layout Recommendation-TO277B
Unit:mm
Document Number: F22037W
www.futurewafer.com.tw
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Trench MOS Barrier Schottky Rectifier
6. Packing
6-1. Taping and Reel Specification-SMAJ & SMAF
Taping Width
Tape Orientation
12mm
Direction Of Feed
6-2. Embossed Carrier Tape Specification-SMAJ & SMAF
Unit:mm
Document Number: F22037W
www.futurewafer.com.tw
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Trench MOS Barrier Schottky Rectifier
6-3. Taping and Reel Specification-SMBJ & SMBF
Taping Width
Tape Orientation
12mm
Direction Of Feed
6-4. Embossed Carrier Tape Specification-SMBJ & SMBF
Unit:mm
Document Number: F22037W
www.futurewafer.com.tw
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Trench MOS Barrier Schottky Rectifier
6-5. Taping and Reel Specification-SMCJ
Taping Width
Tape Orientation
16mm
Direction Of Feed
6-6. Embossed Carrier Tape Specification-SMCJ
Unit:mm
Document Number: F22037W
05-OCT-2021 V 2.1
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Trench MOS Barrier Schottky Rectifier
6-7. Taping and Reel Specification-TO277B
Direction Of Feed
6-8. Embossed Carrier Tape Specification-TO277B
Document Number: F22037W
www.futurewafer.com.tw
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Trench MOS Barrier Schottky Rectifier
6-9. Surface Mount Reel Specification-SMAJ & SMAF & SMBJ & SMBF & TO277B
Unit:mm
6-10. Tape Leader and Trailer Specification-SMAJ & SMAF & SMBJ & SMBF & TO277B
Document Number: F22037W
05-OCT-2021 V 2.1
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Trench MOS Barrier Schottky Rectifier
6-11. Surface Mount Reel Specification-SMCJ
Unit:mm
6-12. Tape Leader and Trailer Specification-SMCJ
Document Number: F22037W
www.futurewafer.com.tw
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TBR05L080A/AF/B/BF/C/HT
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7. Ordering Information
8. Version
8-1. History
8-2. Company Profile
Futurewafer Technology Co.,Ltd 台灣未來芯科技股份有限公司
TEL: +886-3-3350161 / FAX: +886-3-3350172
cherry@futurewafer.com.tw
No. 286-11F, Sec. 3, Sanmin Rd., Taoyuan Dist., Taoyuan City 330, Taiwan
Document Number: F22037W
05-OCT-2021 V 2.1
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