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HMSEMI
MOXA
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High Density Vertical PCB Mount and Solder C
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Surface Mount Multilayer Ceramic Chip Capacitors for High Temperatures 175 °C / 200 °C
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UJA1167ATK
Mini high-speed CAN system basis chip with Standby/Sleep modes & watchdog
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HYNIX
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MS9593-105
BRACKET, ANGLE, 90°, CRES UNS S32100, .190 X .250 BOLT
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FX11LA-100P10-SV21
0.5mm Pitch Connectors with Ground Plate for 2mm Board-to-Board Connections
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Space-saving Plug-in Signal Conditioners F-UNIT
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CHERRY
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SFP56 -to-SFP56 (zSFP) Passive Cable Assembly, 56 Gbps, 26 AWG, 2.0m Length
MOLEX
CINCON
M8TS-266-R/SK
Dual Output Super-mini Signal Conditioners Pico-M Series
MSYSTEM
HMSEMI
MSYSTEM
MURATA
WALSIN
MURATA
FESTO
NANYA
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FVS-FB-L/K
Space-saving Plug-in Signal Conditioners F-UNIT
MSYSTEM
EI1202PPOSL-1
Proximity Sensors Inductive Stainless Steel Housing Types EI, DC, M12, M18, M30
CARLOGAVAZZI
NANYA
AT25QL641
64-Mbit, 1.7V Minimum SPI Serial Flash Memory with Dual I/O, Quad I/O and QPI Support
DIALOG
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KYOCERA AVX
AMPHENOL
SAMTEC
WALSIN
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MSYSTEM
GLENAIR
ITT
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ABRACON
MOLEX
VICOR
KEMET
MTRONPTI
TI
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CTS
SCHURTER
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MURATA
TE
TOREX
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BOURNS
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RCD
BEL
NXP
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TDK
KOA
INFINEON
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EUROQUARTZ
MAXIM
LITTELFUSE
VCC
RENESAS
CDE
IDT
AVAGO
HONEYWELL
ONSEMI
FH
NICHICON
APITECH
ROHM
EPCOS
AGILENT
GRAYHILL
ADI
Carling Technologies
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