G926BF1U_技术文档

Global Mixed-mode Technology Inc.

G926

Dual 500mA LDO Regulator

General Description

Features

The G926A is a dual low dropout regulator with VOUT1

2.5V/500mA and VOUT2 3.3V/500mA, G926B is with

VOUT1 1.8V/500mA and VOUT2 3.3V/500mA, G926C

is with VOUT1 3.3V/500mA and VOUT2 2.5V/ 500mA

and G926D is with VOUT1 3.3V/500mA and VOUT2

1.8V/500mA. The dropout voltage is typically 1V with

500mA load. A low quiescent current is typical 200µA.

Wide Input Voltage Range: 4.3V~6.5V

I_O= 500mA, V_OUT1and V_OUT2Dropout Voltage

Typically 1V

Output Current in Excess of 500mA

Output Voltage Accuracy ±2%

Quiescent Current, Typically 200µA

Internal Short Circuit Current Limit

Internal Over Temperature Protection

Familiar regulator features such as over temperature and

current limit protection circuits are provided to prevent it

from being damaged by abnormal operating conditions.

Applications

The G926 comes in a SOP-8 and SOP-8 (FD) with

power-pad package.

CD/DVD-ROM, CD/RW

Wireless LAN Card/Keyboard/Mouse

Battery-Powered Equipment

XDSL Router

Ordering Information

ORDER

TEMP.

RANGE

PACKAGE

(Pb free)

SOP-8

MARKING

VOUT1

VOUT2

NUMBER

G926AP1U

G926BP1U

G926CP1U

G926DP1U

G926AF1U

G926BF1U

G926CF1U

G926DF1U

Note: P1: SOP-8

G926A

G926B

2.5V

1.8V

3.3V

2.5V

1.8V

3.3V

2.5V

1.8V

3.3V

2.5V

1.8V

-40°C~ +85°C

SOP-8

G926C

SOP-8

G926D

SOP-8

G926A

SOP-8 (FD)

G926B

G926C

G926D

F1: SOP-8 (FD)

U: Tape & Reel

Pin Configuration

Typical Application Circuit

G926

V_IN

V_OUT1

VOUT1

VIN

8

1

2

3

4

GND

VOUT1

VIN

8

7

6

5

1

2

3

4

NC

GND

NC

VOUT1

VIN

10µF

7

G926

VIN

6

5

VIN

VOUT2

GND

V_OUT2

10µF

VOUT2

NC

SOP-8

SOP-8 (FD)

TEL: 886-3-5788833

http://www.gmt.com.tw

Ver: 0.3 Preliminary

Oct 19, 2006

1

Global Mixed-mode Technology Inc.

G926

Absolute Maximum Ratings

(Note 1)

Operating Conditions (Note 1)

Input Voltage. . . . . . . . . . . . . . . . . . . . . . . .4.3V ~ 6.5V

Temperature Range. . . . . . . . . . . . . .-40°C ≤ T_A≤85°C

Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V

Power Dissipation Internally Limited

(Note2)

Maximum Junction Temperature . . . . . . . . . . . .150°C

Storage Temperature Range . . . .-65°C ≤ T_J≤+150°C

Reflow Temperature (soldering, 10sec) . . . . . . 260°C

Thermal Resistance Junction to Ambient

SOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .162°C/W

SOP-8(FD) . . . . . . . . . . . . . . . . . . . . . . . . . . .75°C/W

Thermal Resistance Junction to Case

SOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31°C/W

SOP-8(FD) . . . . . . . . . . . . . . . . . . . . . . . . . . . .5°C/W

Electrical Characteristics

V_IN=5V, I_O= 500mA, C_IN=1µF, C_OUT=1µF. All specifications apply for T_A= T_J= 25°C. [Note 3]

PARAMETER

Input Voltage

SYMBOL

CONDITION

MIN

4.3

TYP

---

MAX

6.5

UNIT

V_IN

V

G926A

G926B

G926C

G926D

G926A

G926B

G926C

G926D

2.450

1.764

3.234

2.450

1.764

---

2.5

1.8

3.3

2.5

1.8

0.3

0.5

200

53

2.550

1.836

3.366

2.550

1.836

1

I_O= 50mA

Output Voltage1

Output Voltage 2

V_OUT1

V

10mA < I_O< 500mA

I_O= 50mA

V_OUT2

Line Regulation

Load Regulation

Quiescent Current

V_line

V_load

I_Q

4V < V_IN< 6.5V, I_O= 10mA

10mA < I_O< 500mA

V_IN= 5V

%

---

1

---

500

---

µA

dB

fi=120Hz, V_P-P= 1V, V_O= 3.3V

fi=120Hz, V_P-P= 1V, V_O= 2.5V

fi=120Hz, V_P-P= 1V, V_O= 1.8V

I_O=500mA

---

Ripple Rejection

PSRR

---

53

---

53

---

Dropout Voltage

V_D

---

1

1.2

V

VOUT1

---

650

800

150

25

---

Short Circuit Current

I_short

mA

VOUT2

---

VOUT1

550

---

Current Limit

I_lim

mA

VOUT2

---

Over Temperature Threshold

Over Temperature Hysterisis

T_OT

T_hys

---

°C

---

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are condi-

tions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and

test conditions see the Electrical Characteristics.

The maximum power dissipation is a function of the maximum junction temperature, T_Jmax; total thermal resistance, θ_JA,

and ambient temperature T_A. The maximum allowable power dissipation at any ambient temperature is T_jmax-T_A/ θ_JA. If this

dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the G926 in

SOP-8 package, θ_JAis 162°C/W. For in SOP-8 (FD) with power-pad package, θ_JAis 75°C/W.

Note 1:

Note2:

Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.

The type of output capacitor should be tantalum, aluminum or ceramic.

Note3:

Note4:

TEL: 886-3-5788833

http://www.gmt.com.tw

Ver: 0.3 Preliminary

Oct 19, 2006

2

Global Mixed-mode Technology Inc.

Pin Description

G926

NAME

I/O

FUNCTION

SOP-8

SOP-8(FD)

O

VOUT1 output voltage 2.5V in G926A, 1.8V in G926B or 3.3V in G926C and

G926D, and source up to 500mA.

1

2,3

4

1

2,3

4

VOUT1

VIN

I

Input voltage

O

VOUT2 output voltage 3.3V in G926A and G926B, 2.5V in G926C or 1.8V in

G926D, and source up to 500mA.

VOUT2

5,6,8

7

NC

I

No Connection

5,6,7,8

GND

Ground also function as heat-sink.

Definitions

Dropout Voltage

Load Regulation

The input/output Voltage differential at which the regu-

lator output no longer maintains regulation against

further reductions in input voltage. Measured when the

output drops 100mV below its nominal value, dropout

voltage is affected by junction temperature, load cur-

rent and minimum input supply requirements.

The change in output voltage for a change in load

current at constant chip temperature. The measure-

ment is made under conditions of low dissipation or by

using pulse techniques such that average chip tem-

perature is not significantly affected.

Maximum Power Dissipation

Line Regulation

The maximum total device dissipation for which the

regulator will operate within specifications.

The change in output voltage for a change in input volt-

age. The measurement is made under conditions of low

dissipation or by using pulse techniques such that av-

erage chip temperature is not significantly affected.

Quiescent Bias Current

Current which is used to operate the regulator chip

and is not delivered to the load.

TEL: 886-3-5788833

http://www.gmt.com.tw

Ver: 0.3 Preliminary

Oct 19, 2006

3

Global Mixed-mode Technology Inc.

G926

Typical Performance Characteristics

(V_IN=5V, C_IN=1µF, C_OUT=1µF, T_A=25°C, unless otherwise noted.)

Line Transient Response

Load Transient Response

Short Circuit Current

Ripple Rejection

60

I_L=10mA

I_L=100mA

50

40

30

20

10

0

I_L=500mA

C =10 F;

µ

IN

C_OUT=10 F

µ

10

100

1000

10000

100000

Frequency (Hz)

TEL: 886-3-5788833

http://www.gmt.com.tw

Ver: 0.3 Preliminary

Oct 19, 2006

4

Global Mixed-mode Technology Inc.

G926

Typical Performance Characteristics (continued)

Overcurrent Protection Characteristics

Start-up

Output Voltage vs. V_IN

Output Voltage vs. I_L

1.809

1.807

1.805

1.803

1.801

1.799

1.797

1.795

3.312

3.31

1.802

1.801

1.800

1.799

1.798

1.797

1.796

1.795

1.794

1.793

1.792

3.31

3.30

3.29

3.28

V_IN=4.0V;V_O1

T =25 C ; I =10mA

°

A

L

3.308

3.306

3.304

3.302

3.3

V_IN=5.0V;V_O2

V_O1

V_IN=4.0V;V_O2

V_IN=3.3V;V_O1

3.298

3.296

3.294

V_O2

0

100

200

300

400

500

2.5

3

3.5

4

4.5

5

5.5

6

V_IN(V)

I_L(mA)

TEL: 886-3-5788833

http://www.gmt.com.tw

Ver: 0.3 Preliminary

Oct 19, 2006

5

Global Mixed-mode Technology Inc.

G926

Typical Performance Characteristics (continued)

Quiescent Current vs. V_IN

Dropout Voltage vs. I_L

250

200

150

100

50

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

T_A=25°C

V_O1

T_A=25°C

V_O2

0

2.5

3

3.5

4

V

4.5

_IN(V)

5

5.5

6

0

100

200 300

I_L(mA)

400

500

G926 Max. Power Dissipation

vs. PCB Top Copper Area

Output Voltage vs. Temperature

3.324

3.314

3.304

3.294

3.284

3.274

3.264

3.254

3.244

3.234

2.5

2

1.809

1.807

1.805

1.803

1.801

1.799

1.797

1.795

V_IN=5V;V_O2

1.5

1

V_IN=4V;V_O1

0.5

0

I_L=10mA

-25 -15 -5

5

15 25 35 45 55 65 75 85

0

1

2

3

4

5

PCB Top Copper Area (in²)

Temperature (°C)

G926 Max. Power Dissipation

vs. T_AMB(still air)

Recommended Minimum Footprint

SOP-8/SOP-8 (FD)

Unit:in²

2.5

2

A=0.1

A=0.2

A=0.3

A=0.4

A=0.5

A=1.0

A=1.5

A=2.0

A=2.5

A=3.0

A=3.5

A=4.0

A=4.5

A=5.0

SOP-8 Package

1.5

1

0.5

0

25

35

45

55

65

75

85

T_AMB(°C)

TEL: 886-3-5788833

http://www.gmt.com.tw

Ver: 0.3 Preliminary

Oct 19, 2006

6

Global Mixed-mode Technology Inc.

Package Information

G926

C

H

E

L

D

θ

7 °(4X)

A2

A1

A

y

e

B

SOP-8 Package

Note:

1. Package body sizes exclude mold flash and gate burrs

2. Dimension L is measured in gage plane

3. Tolerance 0.10mm unless otherwise specified

4. Controlling dimension is millimeter converted inch dimensions are not necessarily exact.

5. Followed from JEDEC MS-012

DIMENSION IN MM

DIMENSION IN INCH

SYMBOL

MIN.

1.35

0.10

-----

NOM.

1.60

-----

1.45

-----

1.27

-----

MAX.

1.75

0.25

-----

MIN.

0.053

0.004

-----

NOM.

0.063

-----

MAX.

0.069

0.010

-----

A

A1

A2

B

0.057

-----

0.33

0.19

4.80

3.80

-----

0.51

0.25

5.00

4.00

-----

0.013

0.007

0.189

0.150

-----

0.020

0.010

0.197

0.157

-----

C

D

E

-----

e

0.050

-----

H

L

5.80

0.40

-----

6.20

1.27

0.10

8°

0.228

0.016

-----

0.244

0.050

0.004

8°

-----

y

θ

-----

0°

-----

TEL: 886-3-5788833

http://www.gmt.com.tw

Ver: 0.3 Preliminary

Oct 19, 2006

7

Global Mixed-mode Technology Inc.

G926

D1

0.008TYP

E1

E

H

L

D

θ

0.015x45º

A2

A1

A

SEATING PLANE

0.004MAX.

e

B

SOP-8 (FD) Package

Note:

1. JEDEC Outline: MS-012 AA/E.P. Version: N/A

2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions and gate burrs shall not ex-

ceed .15mm (.006in) per side.

3. Dimensions “E” does not include inter-lead flash, or protrusions inter-lead flash and protrusions shall not exceed .25mm

(.010in) per side.

DIMENSION IN MM

DIMENSION IN INCH

MIN

SYMBOL

MIN

1.35

0.00

-----

MAX

1.75

0.13

1.50

MAX

0.069

0.005

0.059

A

A1

A2

B

0.053

0.000

-----

0.41TYP

1.27TYP

0.016TYP

0.05TYP

D

4.80

3.81

4.98

3.99

0.189

0.150

0.196

0.157

E

e

H

5.80

0.41

0°

6.20

1.27

8°

0.228

0.016

0°

0.244

0.050

8°

L

θ

D1

E1

-----

2.29

-----

0.090

-----

Taping Specification

PACKAGE

Q’TY/REEL

2,500 ea

SOP-8

SOP-8 (FD)

2,500 ea

Feed Direction

Typical SOP Package Orientation

GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.

TEL: 886-3-5788833

http://www.gmt.com.tw

Ver: 0.3 Preliminary

Oct 19, 2006

8


型号：	G926BF1U
厂家：	GLOBAL MIXED-MODE TECHNOLOGY INC
描述：	Dual 500mA LDO Regulator 双500毫安LDO稳压器稳压器电源电路
文件：	总8页 (文件大小：335K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

G926BF1U [GMT]

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