G950T66UF [GMT]
Regulator;
| 型号： | G950T66UF |
| 厂家： | 
GLOBAL MIXED-MODE TECHNOLOGY INC |
| 描述： | Regulator |
| 文件： | 总10页 (文件大小：291K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Global Mixed-mode Technology Inc.
G950
2.5V 1A Regulator
Features
General Description
The G950 positive 2.5V voltage regulator features
the ability to source 1A of output current. The typical
quiescent current is 0.6mA.
Output current in excess of 1A
Output voltage accuracy +3%/-1%
Quiescent current, typically 600µA
Internal short circuit current limit
Internal over temperature protection
Familiar regulator features such as over tem-
perature and over current protection circuits are
provided to prevent it from being damaged by
abnormal operating conditions.
Applications
PC motherboard
ADSL/Cable Modem
Set-Top-Box
LAN switch/Hub
Router
Ordering Information
ORDER
NUMBER
G950T43U
G950T45U
G950T55U
G950T63U
G950T64U
G950T65U
G950T66U
TEMP.
RANGE
PIN OPTION
PACKAGE
ORDER NUMBER
1
2
3
VIN
(Pb free)
G950T43Uf
G950T45Uf
G950T55Uf
G950T63Uf
G950T64Uf
G950T65Uf
G950T66Uf
TO-252
TO-252
TO-263
SOT-223
SOT-223
SOT-223
SOT-223
GND
VIN
VIN
GND
GND
VIN
VOUT
GND
GND
VOUT
VIN
-40°C~85°C
-40°C~85°C
-40°C~85°C
-40°C~85°C
-40°C~85°C
-40°C~85°C
-40°C~85°C
VOUT
VOUT
VIN
VOUT
VOUT
GND
GND
VOUT
VIN
* For other package types and pin options, please contact us at sales@gmt.com.tw
Order Number Identification
GXXX XX
X
X
Packing Type
Pin Option
Package Type
Part Number
PACKAGE TYPE
PIN OPTION
PACKING
U : Tape & Reel
T4 : TO-252
T5 : TO-263
T6 : SOT-223
1
2
GND
VIN
3
VIN
1 : VOUT
2 : VOUT
GND
VIN
VOUT
VOUT
GND
3 : GND
4 : GND
5 : VIN
VOUT
VIN
GND
VOUT
6 : VIN
Package Type
Typical Application
[Note 4]: Type of COUT
IO
VIN
VOUT
G950
Top View
Top View
C1
1µF
COUT
10µF
IQ
1
3
2
1
3
2
TO-252、263
SOT-223
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 2.4
Apr 10, 2007
1
Global Mixed-mode Technology Inc.
G950
Absolute Maximum Ratings (Note 1)
Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Power Dissipation Internally Limited (Note 2)
Operating Conditions (Note 1)
Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . 3.3V~6V
Temperature Range. . . . . . . .. . . . . . -40°C ≤ TA ≤85°C
Maximum Junction Temperature . . . . . . . . . . . . . 150°C
Storage Temperature Range. . . .-65°C ≤ TJ ≤+150°C
Reflow Temperature (soldering, 10sec) . . . . . .260 °C
Thermal Resistance Junction to Ambient, (θJA)
TO-252. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124°C/W
TO-263. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
SOT-223. . . . . . . . . . . . . . . . . . . . . . . . . . . .148°C/W
Thermal Resistance Junction to Case, (θJc)
TO-252. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7°C/W
TO-263. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6°C/W
SOT-223. . . . . . . . . . . . . . . . . . . . . . . . . . . ..22°C/W
Note (1): See Recommended Minimum Footprint.
Electrical Characteristics
VIN =5V, IO = 1A, CIN = 1µF, COUT =10µF, All specifications apply for TA = TJ = 25°C. [Note 3]
PARAMETER
CONDITIONS
VIN = 5V, 10mA < IO < 1A
MIN
TYP
MAX
UNITS
Output Voltage
2.475
2.50
2.575
V
VIN = 3.3V, 10mA < IO < 500mA
3.3V < VIN < 6V, IO = 10mA
VIN = 5V, 10mA < IO < 1A
Line Regulation
Load Regulation
---
---
---
---
0.3
---
---
---
---
---
---
3
30
50
---
---
1.5
---
---
---
---
---
---
mV
mV
mV
mΩ
mA
dB
V
35
V
IN = 3.3V, 10mA < IO < 500mA
25
Output Impedance
Quiescent Current
Ripple Rejection
200mA DC and 100mA AC, fo = 120Hz
80
VIN = 5V
0.6
46
fi = 120Hz,Vripple =2VP-P, Io = 100mA
IO = 1A
1.15
420
200
1.6
150
Dropout Voltage
IO = 500mA
IO = 100mA
mV
mV
A
Short Circuit Current
Over Temperature
°C
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are
conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications
and test conditions see the Electrical Characteristics.
Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, θJA,
and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / θJA. If
this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the
G950 in SOT-223 package, θJA is 148°C/W; in TO-263 package, θJA is 76°C/W, and in the TO-252 package, θJA is
124°C/W.
Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Note4: The type of output capacitor should be tantalum or aluminum.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 2.4
Apr 10, 2007
2
Global Mixed-mode Technology Inc.
G950
Definitions
Dropout Voltage
Load Regulation
The input/output Voltage differential at which the
regulator output no longer maintains regulation
against further reductions in input voltage. Measured
when the output drops 100mV below its nominal
value. Dropout voltage is affected by junction tem-
perature, load current and minimum input supply re-
quirements.
The change in output voltage for a change in load
current at constant chip temperature. The measure-
ment is made under conditions of low dissipation or
by using pulse techniques such that average chip
temperature is not significantly affected.
Maximum Power Dissipation
The maximum total device dissipation for which the
regulator will operate within specifications.
Line Regulation
The change in output voltage for a change in input
voltage. The measurement is made under conditions
of low dissipation or by using pulse techniques such
that average chip temperature is not significantly af-
fected.
Quiescent Bias Current
Current which is used to operate the regulator chip
and is not delivered to the load.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 2.4
Apr 10, 2007
3
Global Mixed-mode Technology Inc.
G950
Typical Performance Characteristics
(VIN= +5V, CIN=1µF, COUT=10µF, TA=25°C, unless otherwise noted.)
Load Transient
Line Transient
Ch1: Vin (offset=5.0V)
Ch2: Vout (offset=2.50V)
Ch1: Iout (1A/div)
Ch2: Vout (offset=2.50V)
CIN = 1 F
µ
Iout=100mA
Output Voltage vs. Load Current
Dropout Voltage vs. Load Current
2.600
2.580
2.560
2.540
2.520
2.500
2.480
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
0
100 200 300 400 500 600 700 800 900 1000
0
100 200 300 400 500 600 700 800 900 1000
Load Current (mA)
Load Current (mA)
Ground Current vs. Load Current
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
0
100 200 300 400 500 600 700 800 900 1000
Load Current (mA)
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 2.4
Apr 10, 2007
4
Global Mixed-mode Technology Inc.
G950
Typical Performance Characteristics
(VIN= +3.3V, CIN=1µF, COUT=10µF, TA=25°C, unless otherwise noted.)
Line Transient
Load Transient
Ch1: Iout (400mA/div)
Ch2: Vout is AC coupled
Ch1: Vin (offset=3.3V)
Ch2: Vout (offset=2.50V)
CIN = 1 F
µ
Iout=100mA
Output Voltage vs. Load Current
Dropout Voltage vs. Load Current
2.550
2.545
2.540
2.535
2.530
2.525
2.520
2.515
2.510
2.505
2.500
500
450
400
350
300
250
200
150
100
50
0
0
50 100 150 200 250 300 350 400 450 500 550 600
0
50 100 150 200 250 300 350 400 450 500 550 600
Load Current (mA)
Load Current (mA)
Ground Current vs. Load Current
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
0
100
200
300
400
500
600
Load Current (mA)
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 2.4
Apr 10, 2007
5
Global Mixed-mode Technology Inc.
G950
Typical Performance Characteristics (continued)
TO-252 Max. Power Dissipation
vs. PCB Top Copper Area
TO-252 Max. Power Dissipation
vs. TAMB (still air)
TAMB = 25 C ; Still Air
°
( Different PCB Top Copper Area )
Unit:in2
A=0.5
4
3.5
3
4
3.5
3
A=1.0
A=1.5
A=2.0
A=2.5
A=3.0
A=3.5
A=4.0
A=4.5
A=5.0
2.5
2
2.5
2
1.5
1
1.5
1
0.5
0
0.5
0
0.5
1.5
2.5
3.5
4.5
25
45
65
85
PCB Top Copper Area (in2)
°
TAMB ( C)
TO-263 Max. Power Dissipation
vs. TAMB (still air)
TO-263 Max. Power Dissipation
vs. PCB Top Copper Area
TAMB = 25 C ; Still Air
( Different PCB Top Copper Area )
°
Unit:in2
4
3.5
3
4
3.5
3
A=0.5
A=1.0
A=1.5
A=2.0
A=2.5
A=3.0
A=3.5
A=4.0
A=4.5
A=5.0
2.5
2
2.5
2
1.5
1
1.5
1
0.5
0
0.5
0
0.5
1.5
2.5
3.5
4.5
25
45
65
85
PCB Top Copper Area (in2)
TAMB ( C)
°
SOT-223 Max. Power Dissipation
vs. PCB Top Copper Area
SOT-223 Max. Power Dissipation
vs. TAMB (still air)
TAMB = 25 C ; Still Air
°
( Different PCB Top Copper Area)
3
2.5
2
Unit:in2
3
2.5
2
A=0.5
A=1.0
A=1.5
A=2.0
A=2.5
A=3.0
A=3.5
A=4.0
A=4.5
A=5.0
1.5
1
1.5
1
0.5
0
0.5
0
0.5
1.5
2.5
3.5
4.5
25
45
65
85
PCB Top Copper Area (in2)
TAMB ( C)
°
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 2.4
Apr 10, 2007
6
Global Mixed-mode Technology Inc.
G950
Recommend Minimum Footprint
SOT-223
TO-252
TO-263
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 2.4
Apr 10, 2007
7
Global Mixed-mode Technology Inc.
G950
Package Information
D
A
D1
C1
B
V
E
A1
L
b1
L3
L1
L2
b
e
e1
C
TO-252 (T4) Package
MILLIMETERS
INCHES
SYMBOL
MIN.
2.190
0.000
0.880
0.500
0.700
0.430
0.430
6.350
5.200
5.400
MAX.
2.400
0.127
1.650
0.880
0.900
0.580
0.580
6.730
5.460
6.220
MIN.
0.086
0.000
0.035
0.020
0.028
0.017
0.017
0.250
0.205
0.213
MAX.
0.094
0.005
0.065
0.035
0.035
0.023
0.023
0.265
0.215
0.245
A
A1
B
b
b1
C
C1
D
D1
E
e
2.300 TYP
0.091 TYP
e1
L
4.500
8.830
2.550
1.400
0.350
3.800
4.700
10.77
2.900
1.780
1.020
4.320
0.177
0.348
0.100
0.055
0.014
0.150
0.185
0.424
0.114
0.070
0.040
0.170
L1
L2
L3
V
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 2.4
Apr 10, 2007
8
Global Mixed-mode Technology Inc.
G950
A
D
c1
B
E
V
L3
b1
L
A1
L1
b
L2
e
e1
c
TO-263 (T5) Package
MILLIMETER
INCH
SYMBOL
MIN
4.470
0.000
1.170
0.710
1.170
0.310
1.170
10.010
8.500
MAX
4.670
0.150
1.370
0.910
1.370
0.530
1.370
10.310
8.900
MIN
0.176
0.000
0.046
0.028
0.046
0.012
0.046
0.394
0.335
MAX
0.184
0.006
0.054
0.036
0.054
0.021
0.054
0.406
0.350
A
A1
B
b
b1
c
c1
D
E
e
2.540 TYP
5.600 REF
0.100 TYP
0.220 REF
e1
L
4.980
15.050
5.080
2.340
1.300
5.180
15.450
5.480
2.740
1.700
0.196
0.593
0.200
0.092
0.051
0.204
0.608
0.216
0.108
0.067
L1
L2
L3
V
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 2.4
Apr 10, 2007
9
Global Mixed-mode Technology Inc.
G950
A
D
α
B1
C
13°(4X)
H
E
L
L2
e
e1
13°(4X)
A1
B
SOT-223 (T6) Package
MILLIMETERS
INCHES
SYMBOLS
MIN
1.55
0.02
0.60
2.90
0.24
6.30
3.30
MAX
1.80
0.12
0.80
3.10
0.32
6.70
3.70
MIN
0.061
0.0008
0.024
0.114
0.009
0.248
0.130
MAX
0.071
0.0047
0.031
0.122
0.013
0.264
0.146
A
A1
B
B1
C
D
E
e
2.30 BSC
4.60 BSC
0.090 BSC
0.181 BSC
e1
H
6.70
7.30
0.264
0.287
L
0.90 MIN
0.06 BSC
0.036 MIN
L2
α
0.0024 BSC
0°
10°
0°
10°
Taping Specification
PACKAGE
Q’TY/REEL
TO-252
TO-263
SOT-223
2,500 ea
800 ea
Feed Direction
TO-252 Package Orientation
Feed Direction
SOT-223 Package Orientation
2,500 ea
Feed Direction
TO-263 Package Orientation
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 2.4
Apr 10, 2007
10
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