G960T63UF [GMT]

Regulator;
G960T63UF
型号: G960T63UF
厂家: GLOBAL MIXED-MODE TECHNOLOGY INC    GLOBAL MIXED-MODE TECHNOLOGY INC
描述:

Regulator

文件: 总9页 (文件大小:225K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Global Mixed-mode Technology Inc.  
3.3V 1A Low Dropout Regulator  
General Description  
G960  
Features  
„
„
„
„
„
„
Dropout voltage typically 0.8V @ IO = 1A  
Output current in excess of 1A  
The G960 positive 3.3V voltage regulator features  
the ability to source 1A of output current with a  
dropout voltage of typically 0.8V over the entire op-  
erating temperature range. A low quiescent current  
is provided over the entire current output current  
range. The typical quiescent current is 0.6mA. Fur-  
thermore, the quiescent current is smaller when the  
regulator is in the dropout mode (VIN < 3.3V).  
Output voltage accuracy ±2%  
Quiescent current, typically 600µA  
Internal short circuit current limit  
Internal over temperature protection  
Applications  
Familiar regulator features such as over tem-  
perature and over current protection circuits are  
provided to prevent it from being damaged by  
abnormal operating conditions.  
„
„
„
„
„
„
„
CD-R/W  
ADSL  
Cable Modem  
Set-Top-Box  
LAN switch/Hub  
Router  
DVD-R/W  
Ordering Information  
ORDER  
NUMBER  
G960T33T  
G960T35T  
G960T36T  
G960T43U  
G960T45U  
G960T53U  
G960T63U  
G960T65U  
ORDER NUMBER  
TEMP.  
RANGE  
PIN OPTION  
PACKAGE  
MARKING  
(Pb free)  
G960T33Tf  
G960T35Tf  
G960T36Tf  
G960T43Uf  
G960T45Uf  
G960T53Uf  
G960T63Uf  
G960T65Uf  
1
2
3
VIN  
960T33  
960T35  
960T36  
960T43  
960T45  
960T53  
960T63  
960T65  
TO-220  
TO-220  
TO-220  
TO-252  
TO-252  
TO-263  
SOT-223  
SOT-223  
GND  
VIN  
VIN  
GND  
VIN  
GND  
GND  
VIN  
VOUT  
GND  
VOUT  
VOUT  
GND  
VOUT  
VOUT  
GND  
-40°C~85°C  
-40°C~85°C  
-40°C~85°C  
-40°C~85°C  
-40°C~85°C  
-40°C~85°C  
-40°C~85°C  
-40°C~85°C  
VOUT  
GND  
VIN  
VOUT  
VIN  
VIN  
VOUT  
Order Number Identification  
GXXX XX  
X
X
Packing Type  
Pin Option  
Package Type  
Part Number  
PACKAGE TYPE  
T3 : TO-220  
PIN OPTION  
PACKING  
U : Tape & Reel Direction  
T : Tube  
1
2
3
T4 : TO-252  
1 : VOUT  
2 : VOUT  
3 : GND  
4 : GND  
5 : VIN  
GND  
VIN  
VIN  
T5 : TO-263  
GND  
VIN  
T6 : SOT-223  
VOUT  
VIN  
VOUT  
VOUT  
GND  
GND  
VOUT  
6 : VIN  
Package Type  
Typical Application  
[Note 4] : Type of COUT  
IO  
VIN  
VOUT  
G960  
Top View  
Top View  
Top View  
C1  
0.47µF  
COUT  
10µF  
IQ  
3
1
2
1
2
3
1
2
3
TO-252263  
SOT-223  
TO-220  
TEL: 886-3-5788833  
http://www.gmt.com.tw  
Ver: 2.7  
Apr 18, 2006  
1
Global Mixed-mode Technology Inc.  
G960  
Absolute Maximum Ratings  
(Note 1)  
Operating Conditions (Note 1)  
Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . 4V~7V  
Temperature Range. . . . . . . . . . . . .-40°C TA 85°C  
Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8V  
Power Dissipation Internally Limited  
(Note 2)  
Maximum Junction Temperature . . . . . . . . . . . . . .150°C  
Storage Temperature Range . . . .-65°C TJ +150°C  
Reflow Temperature (soldering, 10sec) . . . . . .260°C  
Thermal Resistance Junction to Ambient, (θJA)  
SOT-223. . . . . . . . . . . . . . . . . . . . . . . . . . . .148°C/W  
TO-220. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76°C/W  
TO-252. . . . . . . . . . . . . . . . . . . . . . . . . . . . .124°C/W  
TO-263. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76°C/W  
Thermal Resistance Junction to Case, (θJC)  
SOT-223. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22°C/W  
TO-252. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7°C/W  
TO-263. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6°C/W  
Electrical Characteristics  
VIN =5V, IO = 1A, CIN = 1µF, COUT =10µF, All specifications apply for TA = TJ = 25°C. [Note 3]  
PARAMETER  
Output Voltage  
CONDITION  
MIN  
3.234  
---  
---  
---  
0.3  
---  
---  
---  
---  
TYP  
3.3  
20  
MAX UNIT  
50mA < IO <1A  
4V < VIN < 7V, IO = 10mA  
50mA < IO < 1A  
3.366  
30  
50  
---  
1.5  
---  
V
mV  
mV  
mΩ  
mA  
dB  
V
Line Regulation  
Load Regulation  
Output Impedance  
Quiescent Current  
Ripple Rejection  
30  
200mA DC and 100mA AC, fo = 120Hz  
100  
0.6  
42  
0.8  
200  
1.6  
150  
VIN = 5V  
fi = 120Hz, 1VP-P, Io = 100mA  
IO = 1A  
---  
Dropout Voltage  
IO = 100mA  
---  
---  
mV  
A
Short Circuit Current  
Over Temperature  
VIN=7.05V, IO=1.1A, duration time=40msec with G960T45 package  
---  
---  
°C  
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are  
conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications  
and test conditions see the Electrical Characteristics.  
The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, θJA, and  
ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / θJA. If this dis-  
sipation is exceeded, the die temperature will rise above 15C and IC will go into thermal shutdown. For the G960 in the  
SOT-223 package, θJA is 148°C/W; in the TO-252 package, θJA is 124°C/W; in the TO-263 package, θJA is 76°C/W, and in  
the TO-220 package, θJA is 76°C/W (No heat sink).  
Note 1:  
Note2:  
Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.  
The type of output capacitor should be tantalum or aluminum.  
Note3:  
Note4:  
Definitions  
Dropout Voltage  
Load Regulation  
The input/output Voltage differential at which the  
regulator output no longer maintains regulation  
against further reductions in input voltage. Measured  
when the output drops 100mV below its nominal  
value, dropout voltage is affected by junction tem-  
perature, load current and minimum input supply re-  
quirements.  
The change in output voltage for a change in load  
current at constant chip temperature. The measure-  
ment is made under conditions of low dissipation or  
by using pulse techniques such that average chip  
temperature is not significantly affected.  
Maximum Power Dissipation  
The maximum total device dissipation for which the  
regulator will operate within specifications.  
Line Regulation  
The change in output voltage for a change in input  
voltage. The measurement is made under conditions  
of low dissipation or by using pulse techniques such  
that average chip temperature is not significantly af-  
fected.  
Quiescent Bias Current  
Current which is used to operate the regulator chip  
and is not delivered to the load.  
TEL: 886-3-5788833  
http://www.gmt.com.tw  
Ver: 2.7  
Apr 18, 2006  
2
Global Mixed-mode Technology Inc.  
G960  
Typical Performance Characteristics  
(VIN=5V, CIN=1µF, COUT =10µF, TA=25°C, unless otherwise noted.)  
Line Transient  
Load Transient  
Ch1: Vout (offset=3.30V)  
Ch2: Vin (offset=5.0V)  
Iout=100mA  
Ch1: Vout (offset=3.30V)  
Ch2: Iout (780mA/div)  
Output Voltage vs. Load Current  
Dropout Voltage vs. Load Current  
3.380  
3.360  
3.340  
3.320  
3.300  
3.280  
3.260  
1200  
1000  
800  
600  
400  
200  
0
0
100  
200  
300  
400  
500  
600  
700  
800  
900  
1000  
0
100  
200  
300  
400  
500  
600  
700  
800  
900  
1000  
Load Current (mA)  
Load Current (mA)  
Ground Current vs. Load Current  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0
100  
200  
300  
400  
500  
600  
700  
800  
900  
1000  
Load Current (mA)  
TEL: 886-3-5788833  
http://www.gmt.com.tw  
Ver: 2.7  
Apr 18, 2006  
3
Global Mixed-mode Technology Inc.  
G960  
Typical Performance Characteristics (continued)  
SOT-223 Max. Power Dissipation vs.  
SOT-223 Power Dissipation vs.  
PCB Top Copper Area  
TAMB (still air)  
T
AMB = 25°C ; Still Air  
( Different PCB Top Copper Area )  
Unit:in2  
3
2.5  
2
3
2.5  
2
A=0.5  
A=1.0  
A=1.5  
A=2.0  
A=2.5  
A=3.0  
A=3.5  
A=4.0  
A=4.5  
A=5.0  
1.5  
1
1.5  
1
0.5  
0
0.5  
0
0.5  
1.5  
2.5  
3.5  
4.5  
25  
35  
45  
55  
65  
75  
85  
PCB Top Copper Area (in2)  
TAMB (°C)  
TO-252 Max. Power Dissipation vs.  
TAMB (still air)  
TO-252 Power Dissipation vs.  
PCB Top Copper Area  
T
AMB = 25°C ; Still Air  
( Different PCB Top Copper Area )  
Unit:in2  
4
3.5  
3
4
3.5  
3
A=0.5  
A=1.0  
A=1.5  
A=2.0  
A=2.5  
A=3.0  
A=3.5  
A=4.0  
A=4.5  
A=5.0  
2.5  
2
2.5  
2
1.5  
1
1.5  
1
0.5  
0
0.5  
0
25  
35  
45  
55  
65  
75  
85  
0.5  
1.5  
2.5  
3.5  
4.5  
PCB Top Copper Area (in2)  
TAMB (°C)  
TO-263 Power Dissipation vs.  
PCB Top Copper Area  
TO-263 Max. Power Dissipation vs.  
TAMB (still air)  
T
AMB = 25°C ; Still Air  
Unit:in2  
( Different PCB Top Copper Area )  
4
3.5  
3
4
3.5  
A=0.5  
A=1.0  
A=1.5  
A=2.0  
A=2.5  
A=3.0  
A=3.5  
A=4.0  
A=4.5  
A=5.0  
3
2.5  
2
2.5  
2
1.5  
1
1.5  
1
0.5  
0
0.5  
0
25  
35  
45  
55  
65  
75  
85  
0.5  
1.5  
2.5  
3.5  
4.5  
PCB Top Copper Area (in2)  
TAMB (°C)  
TEL: 886-3-5788833  
http://www.gmt.com.tw  
Ver: 2.7  
Apr 18, 2006  
4
Global Mixed-mode Technology Inc.  
G960  
Typical Performance Characteristics  
Heatsink Package Dimension  
(continued)  
TO-220 Max. Power Dissipation vs.  
TO-220  
Temperature  
5
4.5  
4
3.5  
3
Heatsink  
2.5  
2
1.5  
1
Without heatsink  
0.5  
0
-45  
-15  
15  
45  
75  
105  
Temparature (°C)  
Recommended Minimum Footprint  
TO-252  
SOT-223  
TO-263  
TEL: 886-3-5788833  
http://www.gmt.com.tw  
Ver: 2.7  
Apr 18, 2006  
5
Global Mixed-mode Technology Inc.  
G960  
Package Information  
E
A
E1  
E1  
DIA  
F
d
D
D1  
I
L
e
C
A1  
b
b1  
e1  
TO-220 (T3) Package  
MILLIMETER  
INCH  
SYMBOL  
MIN  
MAX  
4.826  
2.72  
MIN  
MAX  
0.190  
0.107  
0.037  
0.055  
0.018  
0.145  
0.356  
0.113  
0.410  
0.206  
0.156  
0.110  
0.210  
0.055  
0.565  
0.16  
A
A1  
b
4.318  
2.46  
0.170  
0.097  
0.027  
0.045  
0.012  
0.135  
0.336  
0.103  
0.390  
0.195  
0.146  
0.090  
0.190  
0.045  
0.535  
0.140  
0.69  
0.94  
b1  
C
1.143  
0.304  
3.429  
8.53  
1.397  
0.460  
3.683  
9.04  
D
D1  
d
2.62  
2.87  
E
9.906  
4.953  
3.708  
2.29  
10.40  
5.22  
E1  
DIA  
e
3.962  
2.79  
e1  
F
4.83  
5.33  
1.143  
1.397  
14.351  
4.06  
L
13.589  
3.56  
I
TEL: 886-3-5788833  
http://www.gmt.com.tw  
Ver: 2.7  
Apr 18, 2006  
6
Global Mixed-mode Technology Inc.  
G960  
A
E
A1  
c1  
b2  
L2  
Seating  
Plane  
D
H
L1  
L3  
L
c
b1  
b
e
e1  
E1  
BACK VIEW Z-Z  
TO-252 (T4) Package  
MILLIMETERS  
INCHES  
SYMBOL  
MIN.  
2.19  
0.89  
0.64  
0.76  
5.21  
0.46  
0.46  
5.97  
6.35  
MAX.  
2.38  
1.14  
0.88  
1.14  
5.46  
0.58  
0.58  
6.22  
6.73  
MIN.  
0.086  
0.035  
0.025  
0.030  
0.205  
0.018  
0.018  
0.235  
0.250  
MAX.  
0.094  
0.045  
0.035  
0.045  
0.215  
0.023  
0.023  
0.244  
0.265  
A
A1  
b
b1  
b2  
c
c1  
D
E
E1  
e
MIN 4.32  
2.28 BSC  
4.57 BSC  
MIN 0.170  
0.090 BSC  
0.180 BSC  
e1  
H
9.40  
0.51  
0.64  
0.88  
1.15  
10.42  
-----  
0.370  
0.020  
0.025  
0.035  
0.045  
0.410  
-----  
L
L1  
L2  
L3  
1.02  
1.27  
1.52  
0.040  
0.050  
0.060  
TEL: 886-3-5788833  
http://www.gmt.com.tw  
Ver: 2.7  
Apr 18, 2006  
7
Global Mixed-mode Technology Inc.  
G960  
A
E
A1  
L3  
D
H
C
L1  
L
e
L2  
A2  
e1  
b
b1  
TO-263 (T5) Package  
MILLIMETER  
INCH  
SYMBOL  
MIN  
4.30  
1.22  
2.45  
0.69  
1.22  
0.36  
8.64  
9.70  
2.29  
4.83  
14.60  
4.70  
1.20  
2.24  
MAX  
4.70  
1.32  
2.69  
0.94  
1.40  
0.56  
9.652  
10.54  
2.79  
5.33  
15.78  
5.84  
1.778  
2.84  
MIN  
0.169  
0.048  
0.104  
0.027  
0.048  
0.014  
0.340  
0.382  
0.090  
0.190  
0.575  
0.185  
0.047  
0.088  
MAX  
0.185  
0.055  
0.106  
0.037  
0.055  
0.022  
0.380  
0.415  
0.110  
0.210  
0.625  
0.230  
0.070  
0.111  
A
A1  
A2  
b
b1  
C
D
E
e
e1  
H
L
L1  
L2  
L3  
1.40MAX  
0.055MAX  
TEL: 886-3-5788833  
http://www.gmt.com.tw  
Ver: 2.7  
Apr 18, 2006  
8
Global Mixed-mode Technology Inc.  
G960  
A
D
α
B1  
C
13°(4X)  
H
E
L
L2  
e
e1  
13°(4X)  
A1  
B
SOT-223 (T6) Package  
MILLIMETER  
INCH  
SYMBOL  
MIN  
MAX  
1.80  
0.12  
0.80  
3.10  
0.32  
6.70  
3.70  
MIN  
0.061  
0.0008  
0.024  
0.114  
0.009  
0.248  
0.130  
MAX  
0.071  
0.0047  
0.031  
0.122  
0.013  
0.264  
0.146  
A
A1  
B
1.55  
0.02  
0.60  
2.90  
0.24  
6.30  
3.30  
B1  
C
D
E
e
2.30 BSC  
4.60 BSC  
0.090 BSC  
0.181 BSC  
e1  
H
6.70  
7.30  
0.264  
0.287  
L
0.90 MIN  
0.06 BSC  
0.036 MIN  
L2  
α
0.0024 BSC  
0°  
10°  
0°  
10°  
Taping Specification  
PACKAGE  
TO-220  
QTY/REEL  
-----  
QTY/TUBE  
50 ea  
-----  
TO-252  
2,500 ea  
800 ea  
Feed Direction  
TO-252 Package Orientation  
Feed Direction  
SOT-223 Package Orientation  
TO-263  
-----  
SOT-223  
2,500 ea  
-----  
Feed Direction  
TO-263 Package Orientation  
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.  
TEL: 886-3-5788833  
http://www.gmt.com.tw  
Ver: 2.7  
Apr 18, 2006  
9

相关型号:

G961

1A Low Dropout Regulator with Enable
GMT

G961-15ADJTEU

1A Low Dropout Regulator with Enable
GMT

G961-15ADJTEUF

1A Low Dropout Regulator with Enable
GMT

G961-18ADJTEU

1A Low Dropout Regulator with Enable
GMT

G961-18ADJTEUF

1A Low Dropout Regulator with Enable
GMT

G961-25ADJTEU

1A Low Dropout Regulator with Enable
GMT

G961-25ADJTEUF

1A Low Dropout Regulator with Enable
GMT

G9611

Low-Dropout, 300mA Linear Regulator with Reset
GMT

G9611AP1T

Low-Dropout, 300mA Linear Regulator with Reset
GMT

G9611AP1U

Low-Dropout, 300mA Linear Regulator with Reset
GMT

G9611BP1T

Low-Dropout, 300mA Linear Regulator with Reset
GMT

G9611BP1U

Low-Dropout, 300mA Linear Regulator with Reset
GMT