GSX-213/PP3MF38.4MHZ [GOLLEDGE]
Parallel - Fundamental Quartz Crystal, 38.4MHz Nom, ROHS COMPLIANT, ULTRA MINIATURE, CERAMIC PACKAGE-4;型号: | GSX-213/PP3MF38.4MHZ |
厂家: | GOLLEDGE ELECTRONICS LTD |
描述: | Parallel - Fundamental Quartz Crystal, 38.4MHz Nom, ROHS COMPLIANT, ULTRA MINIATURE, CERAMIC PACKAGE-4 驱动 晶体 谐振器 |
文件: | 总2页 (文件大小:137K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SMꢀCrystal for NFC, Smartcard etc
GSX-213
Specifications
Product
GSX-213
Option
Codes
Parameters
Frequency range: 26.0 ~ 60.0MHz
Calibration tolerance:
±10ppm
±15ppm
±30ppm
1
P
3
Other values (±7.5 ~ꢀ±100ppm)
specify
Temperature stability:
±10ppm
±15ppm
±20ppm
±30ppm
1
P
2
3
1.65
±0.07
Other values (±5.0 ~ꢀ±100ppm)
specify
1.25
±0.07
Operating temperature range:
-10 to +60°C
1
2
3
+0.03
-20 to +70°C
0.32
-0.02
-30 to +80°C
Other values
SOLDER PAD LAYOUT
specify
0.40
Storage temperature range:
-40 to +85°C
0.20
1
4
2
3
0.60
0.60
0.30
(typ)
Circuit condition:
5pF
8pF
9pF
R
M
N
A
S
0.50
(typ)
0.70 0.70
10pF
Series resonant
Other values
PAD CONNECTION
specify
1
2
3
4
Crystal
Ground & lid
Crystal
Oscillation mode:
Fundamental
F
Equivalent series resistance:
200Ω max @ 26.0MHz
Not connected
150Ω max @ 37.4MHz
100Ω max @ 38.4MHz
100Ω max @ 40.0MHz
Features
Ageing:
±1ppm max first year
Ultra-miniature for maximum space saving
Ideal for NFC, Smartcard, wireless & mobile
Metal lid can be grounded to minimise EMI
Seam sealed for excellent long-term stability
Test drive level:
100μW max
Soldering condition:
260°C, 10 sec x2 max
Standard. Optional - Please specify required code(s) when ordering
Ordering Information
Part No, or product name + option codes +ꢀfrequency
eg: GSX-213/111NF 26.0MHz 10/10/10/9-F
GSX-213/1P3AF 40.0MHz 10/15/30/10-F
Option code X (eg GSX-213/X) denotes a custom specification.
±10ppm temperature stability may not be available over -30+80°C.
Check with our sales office before ordering.
Tel: +44 1460 256 100
Fax: +44 1460 256 101
E-mail: sales@golledge.com
Web: www.golledge.com
12 Jun 2012
Product Information
GSX-213
Construction
Ceramic body with gold-plated pads
Metal lid, seam sealed
Composition
This product is lead-free, and is fully compliant with
the RoHS directive 2002/95/EC
Pb
RoHS
2002/95/EC
LeadFree
Packaging & Handling
Soldering Profile
Production quantities supplied on T&R, 3k pcs per reel.
Small quantities may be supplied on tape (no reel), or in bulk.
10s max
°C
260
Marking
Marking type:ꢀLaser
DCꢀ= Date code
FREQUENCY
T DC
200
100
0
Tape &ꢀReel Specification
5°C/s max
5°C/s max
2.0 2.0
1.75
1.0Ø 1.5Ø
0.2
±0.02
Heat
Slow
cooldown
Preheat
> 200°C
140~160°C
3.5
5°
8.0
±0.3
±0.05
1.85
Time
50~60s max
60~90s max
Maximum solder resistance:ꢀ260°C x 10 secs x 2.
0.45
FEED
1.45
+0.6
-0.4
8.4
1.5
±0.3
120°
20.5Ø
2.50
13Ø
±0.2
178Ø
60Ø
±1.0
±1.0
Not to scale. Dimensional tolerances ±0.1mm unless otherwise stated.
Tel: +44 1460 256 100
Fax: +44 1460 256 101
E-mail: sales@golledge.com
Web: www.golledge.com
21Sep2011
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