SSF3324 [GOOD-ARK]

30V N-Channel MOSFET;
SSF3324
型号: SSF3324
厂家: GOOD-ARK ELECTRONICS    GOOD-ARK ELECTRONICS
描述:

30V N-Channel MOSFET

文件: 总8页 (文件大小:1331K)
中文:  中文翻译
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SSF3324  
30V N-Channel MOSFET  
Main Product Characteristics  
VDSS 30V  
RDS(on) 26.5mohm(typ.)  
ID 5.8A  
MarkingandPin  
Assignment  
SOT23  
SchematicDiagram  
Features and Benefits  
AdvancedtrenchMOSFETprocess technology  
Special designed for PWM, load switching and  
generalpurposeapplications  
Ultralowon-resistancewithlowgatecharge  
Fastswitching andreversebodyrecovery  
150operating temperature  
Leadfreeproduct  
Description  
It utilizes the latest trench processing techniques to achieve the high cell density and reduces the  
on-resistance with high repetitive avalanche rating. These features combine to make this design an extremely  
efficient andreliable devicefor useinpower switching application and awidevarietyof other applications.  
Absolute Max Rating  
Symbol  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Parameter  
Max.  
5.8 ①  
4.2 ①  
23  
Units  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current ②  
A
PD @TC = 25°C  
VDS  
Power Dissipation  
1.4  
W
V
Drain-Source Voltage  
30  
VGS  
Gate-to-Source Voltage  
± 12  
V
TJ TSTG  
Operating Junction and Storage Temperature Range  
-55 to + 150  
°C  
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Page 1 of 8  
Rev.1.1  
SSF3324  
30V N-Channel MOSFET  
Thermal Resistance  
Symbol  
Characteristics  
Typ.  
Max.  
Units  
RθJA  
Junction-to-ambient (t ≤ 10s) ③  
90  
/W  
Electrical Characteristics @TA=25unless otherwise specified  
Symbol Parameter  
Min.  
30  
0.7  
Typ.  
Max.  
Units  
Conditions  
V(BR)DSS Drain-to-Source breakdown voltage  
V
VGS = 0V, ID = 250μA  
VGS=4.5V,ID = 2A  
TJ = 125℃  
26.5  
43.7  
31.1  
50.2  
44.9  
62.1  
35  
RDS(on)  
RDS(on)  
RDS(on)  
VGS(th)  
IDSS  
Static Drain-to-Source on-resistance  
Static Drain-to-Source on-resistance  
Static Drain-to-Source on-resistance  
Gate threshold voltage  
mΩ  
mΩ  
mΩ  
V
40  
VGS=2.5V,ID=1.5A  
TJ = 125℃  
50  
VGS=1.8V,ID=1A  
TJ = 125℃  
1.4  
VDS = VGS, ID = 250μA  
TJ = 125℃  
0.63  
1
VDS = 24V,VGS = 0V  
TJ = 125°C  
Drain-to-Source leakage current  
Gate-to-Source forward leakage  
μA  
nA  
50  
100  
-100  
VGS =12V  
IGSS  
VGS = -12V  
Qg  
Total gate charge  
Gate-to-Source charge  
Gate-to-Drain("Miller") charge  
Turn-on delay time  
Rise time  
ID = 5.8A,  
10  
2
nC  
ns  
VDS=15V,  
Qgs  
Qgd  
td(on)  
tr  
VGS = 4.5V  
3
3
VGS=10V, VDS =15V,  
5
RGEN=3Ω,  
td(off)  
tf  
Turn-Off delay time  
Fall time  
26  
4
Ciss  
Coss  
Crss  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
VGS = 0V,  
VDS =15V,  
ƒ = 1MHz  
1245  
85  
70  
pF  
Source-Drain Ratings and Characteristics  
Symbol  
Parameter  
Min.  
Typ.  
Max.  
Units  
Conditions  
Continuous Source Current  
(Body Diode)  
MOSFET symbol  
showing the  
IS  
5.8 ①  
A
integral reverse  
p-n junction diode.  
IS=1A, VGS=0V  
Pulsed Source Current  
(Body Diode)  
ISM  
VSD  
23  
A
V
Diode Forward Voltage  
0.72  
1.2  
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Page 2 of 8  
Rev.1.1  
SSF3324  
30V N-Channel MOSFET  
Test Circuits and Waveforms  
aveforms:  
Notes:  
Calculated continuous current based on maximum allowable junction temperature.  
Repetitive rating; pulse width limited by max junction temperature.  
The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a  
still air environment with TA =25°C  
These curves are based on the junction-to-case thermal impedence which is measured with the  
device mounted to a large heatsink, assuming a maximum junction temperature of TJ(MAX)=150°C.  
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Page 3 of 8  
Rev.1.1  
SSF3324  
30V N-Channel MOSFET  
Typical Electrical and Thermal Characteristics  
Figure 1: Typical Output Characteristics  
Figure 2. Typical Transfer Characteristics  
Figure 3. Gate to source cut-off voltage  
Figure 4: Drain-to-Source Breakdown Voltage vs.  
Temperature  
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Page 4 of 8  
Rev.1.1  
SSF3324  
30V N-Channel MOSFET  
Typical Electrical and Thermal Characteristics  
Figure 5. Normalized On-Resistance Vs. Case  
Temperature  
Figure 6. Maximum Drain Current Vs. Case  
Temperature  
Figure 7. Typical Capacitance Vs. Drain-to-Source  
Voltage  
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Page 5 of 8  
Rev.1.1  
SSF3324  
30V N-Channel MOSFET  
Figure8. Normalized Maximum Transient Thermal Impedance  
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Page 6 of 8  
Rev.1.1  
SSF3324  
30V N-Channel MOSFET  
Mechanical Data  
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Page 7 of 8  
Rev.1.1  
SSF3324  
30V N-Channel MOSFET  
Ordering and Marking Information  
Device Marking: 3324  
Package (Available)  
SOT23  
Operating Temperature Range  
C : -55 to 150 ºC  
Devices per Unit  
Package Units/ Tubes/Inner Units/Inner Inner  
Type Tube Box Box  
Units/Carton  
Boxes/Carton Box  
Box  
SOT23 3000  
10  
30000  
4
120000  
Reliability Test Program  
Test Item  
High  
Conditions  
Tj=125to 150@  
Duration Sample Size  
168 hours  
500 hours  
1000 hours  
3 lots x 77 devices  
Temperature  
Reverse  
80% of Max  
VDSS/VCES/VR  
Bias(HTRB)  
High  
Tj=150@ 100% of  
168 hours  
500 hours  
1000 hours  
3 lots x 77 devices  
Temperature  
Gate  
Max VGSS  
Bias(HTGB)  
www.goodark.com  
Page 8 of 8  
Rev.1.1  

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