GS256418GB-250IVT [GSI]
Cache SRAM, 16MX18, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, FPBGA-119;型号: | GS256418GB-250IVT |
厂家: | GSI TECHNOLOGY |
描述: | Cache SRAM, 16MX18, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, FPBGA-119 静态存储器 内存集成电路 |
文件: | 总32页 (文件大小:581K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Advanced Information
GS8256418/36(GB/GD)-xxxV
119- & 165-Bump BGA
Commercial Temp
Industrial Temp
333 MHz–200 MHz
16M x 18, 8M x 36
288Mb DCD Sync Burst SRAMs
1.8 V or 2.5 V V
DD
1.8 V or 2.5 V I/O
either linear or interleave order with the Linear Burst Order (LBO)
input. The Burst function need not be used. New addresses can be
loaded on every cycle with no degradation of chip performance.
Features
• FT pin for user-configurable flow through or pipeline operation
• Single/Dual Cycle Deselect selectable
• IEEE 1149.1 JTAG-compatible Boundary Scan
• ZQ mode pin for user-selectable high/low output drive
• 1.8 V +10%/–10% core power supply
• 2.5 V +10%/–10% core power supply
• 1.8 V or 2.5 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
• ZZ pin for automatic power-down
• RoHS-compliant 119-bump and 165-bump BGA packages
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by the
user via the FT mode . Holding the FT mode pin low places the
RAM in Flow Through mode, causing output data to bypass the
Data Output Register. Holding FT high places the RAM in
Pipeline mode, activating the rising-edge-triggered Data Output
Register.
DCD Pipelined Reads
The GS8256418/36-xxxV is a DCD (Dual Cycle Deselect)
pipelined synchronous SRAM. DCD SRAMs pipeline disable
commands to the same degree as read commands. DCD RAMs
hold the deselect command for one full cycle and then begin
turning off their outputs just after the second rising edge of clock.
Functional Description
Applications
The GS8256418/36-xxxV is a 301,989,888-bit high performance
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write control
inputs.
synchronous SRAM with a 2-bit burst address counter. Although
of a type originally developed for Level 2 Cache applications
supporting high performance CPUs, the device now finds
application in synchronous SRAM applications, ranging from
DSP main store to networking chip set support.
Controls
FLXDrive™
Addresses, data I/Os, chip enable (E1), address burst control
The ZQ pin allows selection between high drive strength (ZQ low)
inputs (ADSP, ADSC, ADV), and write control inputs (Bx, BW,
GW) are synchronous and are controlled by a positive-edge-
triggered clock input (CK). Output enable (G) and power down
control (ZZ) are asynchronous inputs. Burst cycles can be initiated
with either ADSP or ADSC inputs. In Burst mode, subsequent
burst addresses are generated internally and are controlled by
ADV. The burst address counter may be configured to count in
for multi-drop bus applications and normal drive strength (ZQ
floating or high) point-to-point applications. See the Output Driver
Characteristics chart for details.
Core and Interface Voltages
The GS8256418/36-xxxV operates on a 1.8 V or 2.5 V power
supply. All input are 31.8 V or 2.5 V compatible. Separate output
Parameter Synopsis
-333
2.5
3.0
-250
-200
Unit
tKQ
2.5
4.0
3.0
5.0
ns
ns
tCycle
Pipeline
3-1-1-1
Curr (x18)
Curr (x36)
TBD
TBD
TBD
TBD
TBD
TBD
mA
mA
tKQ
tCycle
4.5
4.5
5.5
5.5
6.5
6.5
ns
ns
Flow Through
2-1-1-1
Curr (x18)
Curr (x36)
TBD
TBD
TBD
TBD
TBD
TBD
mA
mA
Rev: 1.01 8/2016
1/32
© 2015, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Advanced Information
GS8256418/36(GB/GD)-xxxV
119-Bump BGA—x36 Common I/O—Top View
1
2
A
3
A
A
A
4
5
A
A
A
6
A
7
V
V
DDQ
A
B
C
D
E
F
ADSP
ADSC
A
B
C
D
E
F
DDQ
A
A
A
NC
NC
V
A
A
A
DD
V
V
DQC
DQC
DQPC
DQC
DQC
DQC
DQC
ZQ
E1
DQPB
DQB
DQB
DQB
DQB
DQB
DQB
SS
SS
SS
SS
SS
SS
V
V
V
V
V
V
DDQ
G
DDQ
G
H
J
DQC2
BC
ADV
GW
BB
DQB
G
H
J
V
V
SS
DQC
DQB
SS
V
V
V
V
V
NC
NC
DDQ
DD
DD
DD
DDQ
DQA
DQA
V
V
K
L
DQD
DQD
DQD
DQD
DQD
DQD
DQPD
A
CK
NU
BW
A1
DQA
DQA
DQA
DQA
DQPA
A
K
L
SS
SS
BD
BA
V
V
V
V
DDQ
M
N
P
R
T
M
N
P
R
T
DDQ
SS
SS
V
V
DQD
DQD
NC
DQA
SS
SS
V
V
A0
DQA
NC
ZZ
SS
SS
V
LBO
A
FT
A
DD
NC
A
A
TCK
2
A
V
V
DDQ
U
TMS
TDI
TDO
NC
U
DDQ
7 x 17 Bump BGA—14 x 22 mm Body—1.27 mm Bump Pitch
Rev: 1.01 8/2016
2/32
© 2015, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Advanced Information
GS8256418/36(GB/GD)-xxxV
119-Bump BGA—x18 Common I/O—Top View
1
2
A
3
A
A
A
4
5
A
A
A
6
A
7
V
V
DDQ
A
B
C
D
E
F
ADSP
ADSC
A
B
C
D
E
F
DDQ
A
A
A
NC
NC
V
A
A
A
DD
V
V
DQB
NC
NC
DQB
NC
DQB
NC
ZQ
E1
DQPA
NC
DQA
NC
DQA
NC
SS
SS
SS
SS
SS
SS
V
V
V
V
DQA
V
V
DDQ
G
DDQ
G
H
J
NC
BB
ADV
GW
NC
DQA
G
H
J
V
V
DQB
NC
SS
SS
V
V
V
V
V
NC
NC
DDQ
DD
DD
DD
DDQ
DQA
NC
V
V
K
L
NC
DQB
NC
CK
NU
BW
A1
NC
DQA
NC
DQA
NC
A
K
L
SS
SS
DQB
NC
BA
V
V
V
V
DDQ
M
N
P
R
T
DQB
NC
M
N
P
R
T
DDQ
SS
SS
V
V
DQB
NC
SS
SS
V
V
NC
NC
A
DQPB
A
A0
DQA
NC
ZZ
SS
SS
V
LBO
A
FT
A
DD
A
A
TCK
2
A
V
V
DDQ
U
TMS
TDI
TDO
NC
U
DDQ
7 x 17 Bump BGA—14 x 22 mm Body—1.27 mm Bump Pitch
Rev: 1.01 8/2016
3/32
© 2015, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Advanced Information
GS8256418/36(GB/GD)-xxxV
119-Bump BGA Pin Description
Symbol
A0, A1
An
Type
Description
I
I
Address field LSBs and Address Counter Preset Inputs
Address Inputs
DQA
DQB
DQC
DQD
I/O
Data Input and Output pins
BA, BB, BC, BD
I
—
I
Byte Write Enable for DQA, DQB, DQC, DQD I/Os; active low
No Connect
NC
CK
Clock Input Signal; active high
BW
I
Byte Write—Writes all enabled bytes; active low
Global Write Enable—Writes all bytes; active low
Chip Enable; active low
GW
I
E1
I
G
ADV
I
Output Enable; active low
I
Burst address counter advance enable; active low
Address Strobe (Processor, Cache Controller); active low
Sleep mode control; active high
ADSP, ADSC
ZZ
I
I
FT
I
Flow Through or Pipeline mode; active low
Linear Burst Order mode; active low
LBO
I
FLXDrive Output Impedance Control (Low = Low Impedance [High Drive], High = High Impedance [Low
Drive])
ZQ
I
I
I
Scan Test Mode Select
Scan Test Data In
TMS
TDI
O
I
Scan Test Data Out
Scan Test Clock
TDO
TCK
V
I
Core power supply
I/O and Core Ground
I/O and Core Ground
DD
V
I
SS
V
I
SS
V
I
Output driver power supply
No Connect
DDQ
NC
NU
—
—
Not Used
Rev: 1.01 8/2016
4/32
© 2015, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Advanced Information
GS8256418/36(GB/GD)-xxxV
165-Bump BGA—x18 Commom I/O—Top View
1
2
3
4
5
6
7
8
9
10
A
11
A
A
B
C
D
E
F
A
A
E1
BB
NC
NC
BW
ADSC
ADV
A
B
C
D
E
F
A
NC
A
NC
DQB
DQB
DQB
DQB
NC
NC
NC
NC
NC
NU
A
NC
NC
BA
CK
GW
G
ADSP
A
NC
NC
NC
NC
NC
ZQ
NC
DQPA
DQA
DQA
DQA
DQA
ZZ
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
DDQ
DDQ
DDQ
DDQ
DDQ
SS
DD
DD
DD
DD
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD
DD
DD
DD
DD
DD
DD
DD
DD
DDQ
DDQ
DDQ
DDQ
DDQ
NC
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
NC
NC
G
H
J
NC
G
H
J
FT
NC
NC
DQB
DQB
DQB
DQB
DQPB
NC
V
V
DQA
DQA
DQA
DQA
NC
A
NC
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
K
L
V
V
V
V
V
V
V
V
NC
K
L
NC
M
N
P
R
NC
M
N
P
R
V
NC
TDI
A
NC
V
NC
DDQ
SS
SS
DDQ
A
A
A
A1
A0
TDO
TCK
A
A
A
A
LBO
A
A
TMS
A
A
A
11 x 15 Bump BGA—13 mm x 15 mm Body—1.0 mm Bump Pitch
Rev: 1.01 8/2016
5/32
© 2015, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Advanced Information
GS8256418/36(GB/GD)-xxxV
165-Bump BGA—x36 Common I/O—Top View
1
2
3
4
5
6
7
8
9
10
A
11
A
B
C
D
E
F
A
A
E1
BC
BB
NC
BW
ADSC
ADV
NC
A
B
C
D
E
F
A
A
NC
BD
BA
CK
GW
G
ADSP
A
NC
DQPB
DQB
DQB
DQB
DQB
ZZ
DQPC
DQC
DQC
DQC
DQC
FT
NC
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
NC
DDQ
DDQ
DDQ
DDQ
DDQ
SS
DD
DD
DD
DD
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD
DD
DD
DD
DD
DD
DD
DD
DD
DDQ
DDQ
DDQ
DDQ
DDQ
DQC
DQC
DQC
DQC
NC
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
DQB
DQB
DQB
DQB
ZQ
G
H
J
G
H
J
NC
NC
DQD
DQD
DQD
DQD
DQPD
NC
DQD
DQD
DQD
DQD
NU
V
V
DQA
DQA
DQA
DQA
NC
DQA
DQA
DQA
DQA
DQPA
A
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
K
L
V
V
V
V
V
V
V
V
K
L
M
N
P
R
M
N
P
R
V
NC
TDI
A
NC
V
SS
DDQ
SS
DDQ
A
A
A
A
A1
A0
TDO
TCK
A
A
A
A
LBO
A
A
TMS
A
A
A
11 x 15 Bump BGA—13 mm x 15 mm Body—1.0 mm Bump Pitch
Rev: 1.01 8/2016
6/32
© 2015, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Advanced Information
GS8256418/36(GB/GD)-xxxV
165-Bump BGA Pin Description
Symbol
A0, A1
A
Type
Description
I
I
Address field LSBs and Address Counter Preset Inputs
Address Inputs
DQA
DQB
DQC
DQD
I/O
Data Input and Output pins
BA, BB, BC, BD
I
I
I
I
I
I
I
I
I
I
I
Byte Write Enable for DQA, DQB, DQC, DQD I/Os; active low (x36 Version)
Clock Input Signal; active high
CK
BW
Byte Write—Writes all enabled bytes; active low
Global Write Enable—Writes all bytes; active low
Chip Enable; active low
GW
E1
G
ADV
Output Enable; active low
Burst address counter advance enable; active l0w
Address Strobe (Processor, Cache Controller); active low
Sleep mode control; active high
ADSC, ADSP
ZZ
FT
Flow Through or Pipeline mode; active low
Linear Burst Order mode; active low
LBO
FLXDrive Output Impedance Control (Low = Low Impedance [High Drive], High = High Impedance [Low
Drive])
ZQ
I
I
I
Scan Test Mode Select
Scan Test Data In
Scan Test Data Out
Scan Test Clock
TMS
TDI
O
I
TDO
TCK
MCL
—
I
Must Connect Low
Core power supply
I/O and Core Ground
V
DD
V
I
SS
V
I
Output driver power supply
No Connect
DDQ
NC
NU
—
—
Not Used
Rev: 1.01 8/2016
7/32
© 2015, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Advanced Information
GS8256418/36(GB/GD)-xxxV
GS8256418/36 Block Diagram
Register
A0–An
D
Q
A0
A0
A1
D0
D1
Q0
A1
Q1
Counter
Load
A
LBO
ADV
Memory
Array
CK
ADSC
ADSP
Q
D
Register
GW
BW
BA
D
Q
Register
36
36
D
Q
BB
BC
BD
4
Register
D
Q
Register
D
Q
Register
D
Q
Register
E1
D
Q
Register
D
Q
FT
G
1
Power Down
Control
DQx1–DQx9
ZZ
Note: Only x36 version shown for simplicity.
Rev: 1.01 8/2016
8/32
© 2015, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Advanced Information
GS8256418/36(GB/GD)-xxxV
Mode Pin Functions
Mode Name
Pin Name
State
Function
Linear Burst
Interleaved Burst
Flow Through
Pipeline
L
Burst Order Control
LBO
H
L
Output Register Control
FT
ZZ
ZQ
H or NC
L or NC
H
Active
Power Down Control
Standby, I = I
DD SB
L
High Drive (Low Impedance)
Low Drive (High Impedance)
FLXDrive Output Impedance Control
H or NC
Note:
There are pull-up devices on the ZQ and FT pins and a pull-down device on the ZZ pin, so those input pins can be unconnected and the chip
will operate in the default states as specified in the above tables.
Burst Counter Sequences
Linear Burst Sequence
A[1:0] A[1:0] A[1:0] A[1:0]
Interleaved Burst Sequence
A[1:0] A[1:0] A[1:0] A[1:0]
1st address
2nd address
3rd address
4th address
00
01
10
11
01
10
11
00
10
11
00
01
11
00
01
10
1st address
2nd address
3rd address
4th address
00
01
10
11
01
00
11
10
10
11
00
01
11
10
01
00
Note:
The burst counter wraps to initial state on the 5th clock.
Note:
The burst counter wraps to initial state on the 5th clock.
Rev: 1.01 8/2016
9/32
© 2015, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Advanced Information
GS8256418/36(GB/GD)-xxxV
Byte Write Truth Table
Function
Read
GW
H
BW
H
L
BA
X
BB
X
BC
X
BD
X
Notes
1
Write No Bytes
Write byte a
Write byte b
Write byte c
Write byte d
Write all bytes
H
H
L
H
H
L
H
H
H
L
H
H
H
H
L
1
H
L
2, 3
H
L
H
H
H
L
2, 3
H
L
H
H
L
2, 3, 4
2, 3, 4
2, 3, 4
H
L
H
L
H
L
L
Write all bytes
L
X
X
X
X
X
Notes:
1. All byte outputs are active in read cycles regardless of the state of Byte Write Enable inputs, BA, BB, BC and/or BD.
2. Byte Write Enable inputs BA, BB, BC and/or BD may be used in any combination with BW to write single or multiple bytes.
3. All byte I/Os remain High-Z during all write operations regardless of the state of Byte Write Enable inputs.
4. Bytes “C” and “D” are only available on the x32 and x36 versions.
Rev: 1.01 8/2016
10/32
© 2015, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Advanced Information
GS8256418/36(GB/GD)-xxxV
Synchronous Truth Table
State
Diagram
Key
Address
Used
3
Operation
E1
ADSP
ADSC
ADV
W
DQ
Deselect Cycle, Power Down
Read Cycle, Begin Burst
None
External
External
External
Next
X
R
H
L
X
L
L
X
L
X
X
X
X
L
L
L
L
H
H
H
H
X
X
F
T
F
F
T
T
F
F
T
T
High-Z
Q
Q
D
Q
Q
D
D
Q
Q
D
D
Read Cycle, Begin Burst
R
L
H
H
H
X
H
X
H
X
H
X
Write Cycle, Begin Burst
Read Cycle, Continue Burst
Read Cycle, Continue Burst
Write Cycle, Continue Burst
Write Cycle, Continue Burst
Read Cycle, Suspend Burst
Read Cycle, Suspend Burst
Write Cycle, Suspend Burst
Write Cycle, Suspend Burst
W
L
L
CR
CR
CW
CW
X
H
X
H
X
H
X
H
H
H
H
H
H
H
H
H
Next
Next
Next
Current
Current
Current
Current
Notes:
1. X = Don’t Care, H = High, L = Low
2. E = T (True) when E1 = 0
3. W = T (True) and F (False) is defined in the Byte Write Truth Table preceding.
4. G is an asynchronous input. G can be driven high at any time to disable active output drivers. G low can only enable active drivers (shown
as “Q” in the Truth Table above).
5. All input combinations shown above are tested and supported. Input combinations shown in gray boxes need not be used to accomplish
basic synchronous or synchronous burst operations and may be avoided for simplicity.
6. Tying ADSP high and ADSC low allows simple non-burst synchronous operations. See BOLD items above.
7. Tying ADSP high and ADV low while using ADSC to load new addresses allows simple burst operations. See ITALIC items above.
Rev: 1.01 8/2016
11/32
© 2015, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Advanced Information
GS8256418/36(GB/GD)-xxxV
Simplified State Diagram
X
Deselect
W
R
W
R
X
R
X
First Write
First Read
CW
CR
CR
W
R
R
X
Burst Write
X
Burst Read
CR
CW
CR
Notes:
1. The diagram shows only supported (tested) synchronous state transitions. The diagram presumes G is tied low.
2. The upper portion of the diagram assumes active use of only the Enable (E1) and Write (BA, BB, BC, BD, BW, and GW) control inputs, and
that ADSP is tied high and ADSC is tied low.
3. The upper and lower portions of the diagram together assume active use of only the Enable, Write, and ADSC control inputs and
assumes ADSP is tied high and ADV is tied low.
Rev: 1.01 8/2016
12/32
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Advanced Information
GS8256418/36(GB/GD)-xxxV
Simplified State Diagram with G
X
Deselect
W
R
W
R
X
W
R
X
First Write
First Read
CR
CW
CW
CR
W
R
R
W
X
Burst Write
X
Burst Read
CR
CW
CW
CR
Notes:
1. The diagram shows supported (tested) synchronous state transitions plus supported transitions that depend upon the use of G.
2. Use of “Dummy Reads” (Read Cycles with G High) may be used to make the transition from read cycles to write cycles without passing
through a Deselect cycle. Dummy Read cycles increment the address counter just like normal read cycles.
3. Transitions shown in grey tone assume G has been pulsed high long enough to turn the RAM’s drivers off and for incoming data to meet
Data Input Set Up Time.
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GS8256418/36(GB/GD)-xxxV
Absolute Maximum Ratings
(All voltages reference to V
)
SS
Symbol
VDD
VDDQ
VI/O
Description
Value
Unit
V
Voltage on VDD Pins
Voltage in VDDQ Pins
–0.5 to 4.6
–0.5 to 4.6
V
–0.5 to VDDQ +0.5 ( 4.6 V max.)
–0.5 to VDD +0.5 ( 4.6 V max.)
Voltage on I/O Pins
Voltage on Other Input Pins
Input Current on Any Pin
Output Current on Any I/O Pin
Package Power Dissipation
Storage Temperature
V
VIN
V
IIN
+/–20
+/–20
mA
mA
W
IOUT
PD
1.5
oC
oC
TSTG
–55 to 125
–55 to 125
TBIAS
Temperature Under Bias
Note:
Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended
Operating Conditions. Exposure to conditions exceeding the Absolute Maximum Ratings, for an extended period of time, may affect reliability of
this component.
Power Supply Voltage Ranges (1.8 V/2.5 V Version)
Parameter
Symbol
Min.
1.7
Typ.
1.8
Max.
2.0
Unit
V
1.8 V Supply Voltage
2.5 V Supply Voltage
V
V
V
V
DD1
V
2.3
2.5
2.7
DD2
1.8 V V
I/O Supply Voltage
V
V
1.7
1.8
DDQ
DDQ
DDQ1
DD
2.5 V V
I/O Supply Voltage
V
V
2.3
2.5
DDQ2
DD
V
& V
Range Logic Levels
Parameter
DDQ2
DDQ1
Symbol
Min.
Typ.
—
Max.
Unit
V
V
Input High Voltage
Input Low Voltage
V
0.6*V
V
+ 0.3
DD
DD
IH
DD
V
V
0.3*V
DD
–0.3
—
V
DD
IL
Note:
Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device.
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Advanced Information
GS8256418/36(GB/GD)-xxxV
Recommended Operating Temperatures
Parameter
Symbol
Min.
0
Typ.
25
Max.
85
Unit
C
TJ
TJ
Junction Temperature (Commercial Range Versions)
Junction Temperature (Industrial Range Versions)*
–40
25
100
C
Note:
* The part numbers of Industrial Temperature Range versions end with the character “I”. Unless otherwise noted, all performance specifications
quoted are evaluated for worst case in the temperature range marked on the device.
Thermal Impedance
Test PCB
Substrate
JA (C°/W)
Airflow = 0 m/s
JA (C°/W)
Airflow = 1 m/s
JA (C°/W)
Airflow = 2 m/s
Package
JB (C°/W)
JC (C°/W)
119 BGA
165 BGA
4-layer
4-layer
TBD
TBD
TBD
TBD
9.14
TBD
2.96
20.70
17.51
16.44
Notes:
1. Thermal Impedance data is based on a number of samples from multiple lots and should be viewed as a typical number.
2. Please refer to JEDEC standard JESD51-6.
3. The characteristics of the test fixture PCB influence reported thermal characteristics of the device. Be advised that a good thermal path to
the PCB can result in cooling or heating of the RAM depending on PCB temperature.
Undershoot Measurement and Timing
Overshoot Measurement and Timing
V
IH
20% tKC
V
+ 2.0 V
DD
V
SS
50%
50%
V
DD
V
– 2.0 V
SS
20% tKC
V
IL
Note:
Input Under/overshoot voltage must be –2 V > Vi < V +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
DDn
Capacitance
o
(T = 25 C, f = 1 MHZ, V = 2.5 V)
A
DD
Parameter
Symbol
CIN
Test conditions
VIN = 0 V
Typ.
Max.
Unit
pF
Input Capacitance
4
6
5
7
CI/O
VOUT = 0 V
Input/Output Capacitance
pF
Note:
These parameters are sample tested.
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Advanced Information
GS8256418/36(GB/GD)-xxxV
AC Test Conditions
Parameter
Input high level
Input low level
Conditions
VDD – 0.2 V
0.2 V
1 V/ns
VDD/2
Input slew rate
Input reference level
V
DDQ/2
Output reference level
Output load
Fig. 1
Notes:
1. Include scope and jig capacitance.
2. Test conditions as specified with output loading as shown in Fig. 1 unless otherwise noted.
3. Device is deselected as defined by the Truth Table.
Output Load 1
DQ
*
50
30pF
V
DDQ/2
* Distributed Test Jig Capacitance
DC Electrical Characteristics
Parameter
Symbol
Test Conditions
Min
Max
Input Leakage Current
(except mode pins)
IIL
VIN = 0 to VDD
–1 uA
1 uA
VDD VIN VIH
0 V VIN VIH
–1 uA
–1 uA
1 uA
100 uA
IIN1
ZZ Input Current
VDD VIN VIL
0 V VIN VIL
–100 uA
–1 uA
1 uA
1 uA
IIN2
FT, ZQ Input Current
IOL
Output Disable, VOUT = 0 to VDD
IOH = –8 mA, VDDQ = 2.375 V
IOH = –8 mA, VDDQ = 3.135 V
IOL = 8 mA
Output Leakage Current
Output High Voltage
Output High Voltage
Output Low Voltage
–1 uA
1.7 V
2.4 V
—
1 uA
—
VOH2
VOH3
VOL
—
0.4 V
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Advanced Information
GS8256418/36(GB/GD)-xxxV
Operating Currents
-333
-250
-200
0
to
–40
to
0
to
–40
to
0
to
–40
to
Parameter
Test Conditions
Mode
Symbol
Unit
85°C
100°C
85°C
100°C
85°C
100°C
IDD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Pipeline
mA
mA
mA
mA
IDDQ
(x36)
(x18)
IDD
IDDQ
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Device Selected;
All other inputs
VIH or VIL
Flow Through
Pipeline
Operating
Current
IDD
IDDQ
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Output open
IDD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Flow Through
IDDQ
ISB
ISB
IDD
Pipeline
Flow Through
Pipeline
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
mA
mA
mA
Standby
Current
ZZ VDD – 0.2 V
—
—
Device Deselected;
All other inputs
VIH or VIL
Deselect
Current
IDD
Flow Through
TBD
TBD
TBD
TBD
TBD
TBD
mA
Notes:
1.
2. All parameters listed are worst case scenario.
I
and I
apply to any combination of V , V , V
, and V operation.
DDQ2
DD
DDQ
DD3 DD2 DDQ3
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GS8256418/36(GB/GD)-xxxV
AC Electrical Characteristics
-333
-250
-200
Parameter
Symbol
Min
3.0
—
Max
—
2.5
—
—
—
—
—
4.5
—
—
—
—
—
—
Min
4.0
—
Max
—
2.5
—
—
—
—
—
5.5
—
—
—
—
—
—
Min
5.0
—
Max
—
3.0
—
—
—
—
—
6.5
—
—
—
—
—
—
Clock Cycle Time
Clock to Output Valid
Clock to Output Invalid
Clock to Output in Low-Z
Setup time
tKC
tKQ
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tKQX
1.5
1.5
1.0
0.1
4.5
—
1.5
1.5
1.2
0.2
5.5
—
1.5
1.5
1.4
0.4
6.5
—
Pipeline
1
tLZ
tS
tH
Hold time
Clock Cycle Time
Clock to Output Valid
Clock to Output Invalid
Clock to Output in Low-Z
Setup time
tKC
tKQ
tKQX
2.0
2.0
1.3
0.3
1.0
1.2
2.0
2.0
1.5
0.5
1.3
1.5
2.0
2.0
1.5
0.5
1.3
1.5
Flow Through
1
tLZ
tS
tH
Hold time
Clock HIGH Time
Clock LOW Time
tKH
tKL
Clock to Output in
High-Z
1
1.5
2.5
1.5
2.5
1.5
3.0
ns
tHZ
G to Output Valid
G to output in Low-Z
G to output in High-Z
ZZ setup time
tOE
—
0
2.5
—
2.5
—
—
—
—
0
2.5
—
2.5
—
—
—
—
0
3.0
—
3.0
—
—
—
ns
ns
ns
ns
ns
ns
1
tOLZ
1
—
5
—
5
—
5
tOHZ
2
tZZS
2
ZZ hold time
1
1
1
tZZH
ZZ recovery
tZZR
20
20
20
Notes:
1. These parameters are sampled and are not 100% tested.
ZZ is an asynchronous signal. However, in order to be recognized on any given clock cycle, ZZ must meet the specified setup and hold times as
specified above
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Advanced Information
GS8256418/36(GB/GD)-xxxV
Pipeline Mode Timing (DCD)
Begin
Read A
Cont
Deselect Deselect Write B
tKL
Read C
Read C+1 Read C+2 Read C+3 Cont
Deselect Deselect
tKH
tKC
CK
ADSP
tS
tH
ADSC initiated read
ADSC
ADV
tS
tH
tS
tH
Ao-An
GW
A
B
C
tS
tS
tH
tH
BW
tS
Ba -Bd
tS
tH
Deselected with E1
E1
G
tS
tKQ
tLZ
tHZ
tOE
tOHZ
Q(A)
tH
tKQX
DQa-DQd
Hi-Z
D(B)
Q(C)
Q(C+1)
Q(C+2)
Q(C+3)
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GS8256418/36(GB/GD)-xxxV
Flow Through Mode Timing (DCD)
Begin
Read A
Cont
tKH
Deselect
tKC
Write B
Read C
Read C+1 Read C+2 Read C+3 Read C
Deselect
tKL
CK
ADSP
Fixed High
tS
ADSC initiated read
tH
ADSC
ADV
tS
tH
tS
tH
Ao-An
GW
A
B
C
tS
tH
tS
tH
BW
tH
tS
Ba -Bd
tS
E1 masks ADSP
tH
Deselected with E1
E1
G
tOE
tKQ
tS
tHZ
tKQX
tOHZ
tH
tLZ
DQa-DQd
Q(A)
D(B)
Q(C)
Q(C+1)
Q(C+2)
Q(C+3)
Q(C)
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GS8256418/36(GB/GD)-xxxV
Sleep Mode
During normal operation, ZZ must be pulled low, either by the user or by its internal pull down resistor. When ZZ is pulled high,
the SRAM will enter a Power Sleep mode after 2 cycles. At this time, internal state of the SRAM is preserved. When ZZ returns to
low, the SRAM operates normally after ZZ recovery time.
Sleep mode is a low current, power-down mode in which the device is deselected and current is reduced to I 2. The duration of
SB
Sleep mode is dictated by the length of time the ZZ is in a High state. After entering Sleep mode, all inputs except ZZ become
disabled and all outputs go to High-Z The ZZ pin is an asynchronous, active high input that causes the device to enter Sleep mode.
When the ZZ pin is driven high, I 2 is guaranteed after the time tZZI is met. Because ZZ is an asynchronous input, pending
SB
operations or operations in progress may not be properly completed if ZZ is asserted. Therefore, Sleep mode must not be initiated
until valid pending operations are completed. Similarly, when exiting Sleep mode during tZZR, only a Deselect or Read commands
may be applied while the SRAM is recovering from Sleep mode.
Sleep Mode Timing
tKH
tKC
tKL
CK
Setup
Hold
ADSP
ADSC
tZZR
tZZS
tZZH
ZZ
Application Tips
Dual Cycle Deselect
DCD SRAMs do not waste bandwidth on dummy cycles and are logically simpler to manage in a multiple bank application (wait
states need not be inserted at bank address boundary crossings), but greater care must be exercised to avoid excessive bus
contention.
JTAG Port Operation
Overview
The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan
interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with V . The JTAG output
DD
drivers are powered by V
.
DDQ
Disabling the JTAG Port
It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless
clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG
Port unused, TCK, TDI, and TMS may be left floating or tied to either V or V . TDO should be left unconnected.
DD
SS
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JTAG Pin Descriptions
Pin
Pin Name
I/O
Description
Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate
from the falling edge of TCK.
TCK
Test Clock
In
The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP
TMS
TDI
Test Mode Select
Test Data In
In controller state machine. An undriven TMS input will produce the same result as a logic one input
level.
The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers
placed between TDI and TDO. The register placed between TDI and TDO is determined by the
In state of the TAP Controller state machine and the instruction that is currently loaded in the TAP
Instruction Register (refer to the TAP Controller State Diagram). An undriven TDI pin will produce
the same result as a logic one input level.
Output that is active depending on the state of the TAP state machine. Output changes in
Out response to the falling edge of TCK. This is the output side of the serial registers placed between
TDI and TDO.
TDO
Test Data Out
Note:
This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is
held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up.
JTAG Port Registers
Overview
The various JTAG registers, refered to as Test Access Port orTAP Registers, are selected (one at a time) via the sequences of 1s
and 0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the
rising edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the
TDI and TDO pins.
Instruction Register
The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or
the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the
TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the
controller is placed in Test-Logic-Reset state.
Bypass Register
The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through
the RAM’s JTAG Port to another device in the scan chain with as little delay as possible.
Boundary Scan Register
The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins.
The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The
Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the
device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan
Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in
Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z,
SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register.
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GS8256418/36(GB/GD)-xxxV
JTAG TAP Block Diagram
·
·
·
·
·
·
·
·
Boundary Scan Register
·
·
·
0
Bypass Register
2
1 0
Instruction Register
TDI
TDO
ID Code Register
31 30 29
2 1
0
·
· · ·
Control Signals
Test Access Port (TAP) Controller
TMS
TCK
Identification (ID) Register
The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in
Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM.
It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the
controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins.
ID Register Contents
GSI Technology
Not Used
JEDEC Vendor
ID Code
Bit # 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
0 1 1 0 1 1 0 0 1
0
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
0
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GS8256418/36(GB/GD)-xxxV
Tap Controller Instruction Set
Overview
There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific
(Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be
implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load
address, data or control signals into the RAM or to preload the I/O buffers.
When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01.
When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired
instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the
TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this
device is listed in the following table.
JTAG Tap Controller State Diagram
Test Logic Reset
1
0
1
1
1
Run Test Idle
Select DR
Select IR
0
0
0
1
1
1
1
Capture DR
Capture IR
0
0
Shift DR
Shift IR
0
0
1
1
Exit1 DR
Exit1 IR
0
0
Pause DR
Pause IR
0
0
0
0
1
1
Exit2 DR
Exit2 IR
1
1
Update DR
Update IR
1
0
1
0
Instruction Descriptions
BYPASS
When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This
occurs when the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facili-
tate testing of other devices in the scan path.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is
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GS8256418/36(GB/GD)-xxxV
loaded in the Instruction Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and
I/O buffers into the Boundary Scan Register. Boundary Scan Register locations are not associated with an input or I/O pin, and
are loaded with the default state identified in the Boundary Scan Chain table at the end of this section of the datasheet. Because
the RAM clock is independent from the TAP Clock (TCK) it is possible for the TAP to attempt to capture the I/O ring contents
while the input buffers are in transition (i.e. in a metastable state). Although allowing the TAP to sample metastable inputs will
not harm the device, repeatable results cannot be expected. RAM input signals must be stabilized for long enough to meet the
TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP
operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-DR state then
places the boundary scan register between the TDI and TDO pins.
EXTEST
EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with
all logic 0s. The EXTEST command does not block or override the RAM’s input pins; therefore, the RAM’s internal state is
still determined by its input pins.
Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command.
Then the EXTEST command is used to output the Boundary Scan Register’s contents, in parallel, on the RAM’s data output
drivers on the falling edge of TCK when the controller is in the Update-IR state.
Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruc-
tion is selected, the sate of all the RAM’s input and I/O pins, as well as the default values at Scan Register locations not asso-
ciated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR
state, the RAM’s output pins drive out the value of the Boundary Scan Register location with which each output pin is associ-
ated.
IDCODE
The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and
places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction
loaded in at power up and any time the controller is placed in the Test-Logic-Reset state.
SAMPLE-Z
If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (high-
Z) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR
state.
RFU
These instructions are Reserved for Future Use. In this device they replicate the BYPASS instruction.
Rev: 1.01 8/2016
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© 2015, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Advanced Information
GS8256418/36(GB/GD)-xxxV
JTAG TAP Instruction Set Summary
Instruction
EXTEST
Code
000
Description
Notes
1
Places the Boundary Scan Register between TDI and TDO.
Preloads ID Register and places it between TDI and TDO.
IDCODE
001
1, 2
Captures I/O ring contents. Places the Boundary Scan Register between TDI and
SAMPLE-Z
010
011
TDO.
1
1
Forces all RAM output drivers to High-Z.
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
RFU
SAMPLE/
PRELOAD
Captures I/O ring contents. Places the Boundary Scan Register between TDI and
TDO.
100
101
110
111
1
1
1
1
GSI
GSI private instruction.
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
RFU
BYPASS
Places Bypass Register between TDI and TDO.
Notes:
1. Instruction codes expressed in binary, MSB on left, LSB on right.
2. Default instruction automatically loaded at power-up and in test-logic-reset state.
Rev: 1.01 8/2016
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© 2015, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Advanced Information
GS8256418/36(GB/GD)-xxxV
JTAG Port Recommended Operating Conditions and DC Characteristics
Parameter
Symbol
Min.
2.0
Max.
Unit Notes
V
V
V
+0.3
DD3
3.3 V Test Port Input High Voltage
3.3 V Test Port Input Low Voltage
2.5 V Test Port Input High Voltage
2.5 V Test Port Input Low Voltage
TMS, TCK and TDI Input Leakage Current
TMS, TCK and TDI Input Leakage Current
TDO Output Leakage Current
V
V
1
1
IHJ3
V
–0.3
0.8
+0.3
ILJ3
V
0.6 * V
V
1
IHJ2
DD2
DD2
V
0.3 * V
1
–0.3
–300
–1
V
1
ILJ2
DD2
I
uA
uA
uA
V
2
INHJ
I
100
1
3
INLJ
I
–1
4
OLJ
V
Test Port Output High Voltage
1.7
—
5, 6
5, 7
5, 8
5, 9
OHJ
V
Test Port Output Low Voltage
—
0.4
V
OLJ
V
V
– 100 mV
DDQ
Test Port Output CMOS High
—
V
OHJC
V
Test Port Output CMOS Low
—
100 mV
V
OLJC
Notes:
1. Input Under/overshoot voltage must be –2 V < Vi < V
+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tTKC.
DDn
2.
V
V V
ILJ
IN
DDn
ILJn
3. 0 V V V
IN
4. Output Disable, V
= 0 to V
DDn
OUT
5. The TDO output driver is served by the V
supply.
DDQ
6.
7.
8.
9.
I
I
I
I
= –4 mA
OHJ
= + 4 mA
OLJ
= –100 uA
= +100 uA
OHJC
OLJC
JTAG Port AC Test Conditions
Parameter
Conditions
JTAG Port AC Test Load
V
– 0.2 V
Input high level
Input low level
DQ
DD
0.2 V
1 V/ns
*
50
Input slew rate
30pF
V
V
/2
Input reference level
DDQ
V
/2
DDQ
/2
Output reference level
DDQ
* Distributed Test Jig Capacitance
Notes:
1. Include scope and jig capacitance.
2. Test conditions as shown unless otherwise noted.
Rev: 1.01 8/2016
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© 2015, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Advanced Information
GS8256418/36(GB/GD)-xxxV
JTAG Port Timing Diagram
tTKC
tTKH
tTKL
TCK
TDI
tTH
tTH
tTS
tTS
TMS
TDO
tTKQ
tTH
tTS
Parallel SRAM input
JTAG Port AC Electrical Characteristics
Parameter
Symbol
tTKC
tTKQ
tTKH
tTKL
tTS
Min
Max
—
Unit
TCK Cycle Time
50
—
ns
ns
ns
ns
ns
ns
TCK Low to TDO Valid
TCK High Pulse Width
TCK Low Pulse Width
TDI & TMS Set Up Time
TDI & TMS Hold Time
20
—
20
20
10
10
—
—
tTH
—
Boundary Scan (BSDL Files)
For information regarding the Boundary Scan Chain, or to obtain BSDL files for this part, please contact our Applications
Engineering Department at: apps@gsitechnology.com.
Rev: 1.01 8/2016
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© 2015, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Advanced Information
GS8256418/36(GB/GD)-xxxV
Package Dimensions—119-Bump FPBGA, Variation 2
TOP VIEW
BOTTOM VIEW
A1
A1
S
Ø0.10
C
S
S
S
Ø0.30 C A
B
Ø0.60~0.90 (119x)
1
2
3
4
5
6
7
7
6
5
4 3
2
1
A
B
C
D
E
F
A
B
C
D
E
F
G
H
J
G
H
J
K
L
M
N
P
K
L
M
N
P
R
T
U
R
T
U
B
1.27
7.62
14±0.10
A
0.20(4x)
SEATING PLANE
C
Rev: 1.01 8/2016
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© 2015, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Advanced Information
GS8256418/36(GB/GD)-xxxV
Package Dimensions—165-Bump FPBGA (Package GD)
A1 CORNER
TOP VIEW
BOTTOM VIEW
A1 CORNER
M
M
Ø0.10
C
Ø0.25 C A B
Ø0.40~0.60 (165x)
1
2 3 4 5 6 7 8 9 10 11
11 10 9 8
7 6 5 4 3 2 1
A
B
C
D
E
F
A
B
C
D
E
F
G
H
J
G
H
J
K
L
K
L
M
N
P
R
M
N
P
R
A
1.0
10.0
1.0
13±0.05
B
0.20(4x)
SEATING PLANE
C
Rev: 1.01 8/2016
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© 2015, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Advanced Information
GS8256418/36(GB/GD)-xxxV
Ordering Information for GSI Synchronous Burst RAMs
2
Speed
3
1
Org
Type
Package
T
Part Number
J
(MHz/ns)
16M x 18
16M x 18
16M x 18
8M x 36
8M x 36
8M x 36
16M x 18
16M x 18
16M x 18
8M x 36
8M x 36
8M x 36
16M x 18
16M x 18
16M x 18
8M x 36
8M x 36
8M x 36
16M x 18
16M x 18
16M x 18
8M x 36
8M x 36
8M x 36
GS8256418GB-333V
GS8256418GB-250V
GS8256418GB-200V
GS8256436GB-333V
GS8256436GB-250V
GS8256436GB-200V
GS8256418GB-333IV
GS256418GB-250IV
GS8256418GB-200IV
GS8256436GB-333IV
GS8256436GB-250IV
GS8256436GB-200IV
GS8256418GD-333V
GS8256418GD-250V
GS8256418GD-200V
GS8256436GD-333V
GS8256436GD-250V
GS8256436GD-200V
GS8256418GD-333IV
GS8256418GD-250IV
GS8256418GD-200IV
GS8256436GD-333IV
GS8256436GD-250IV
GS8256436GD-200IV
PL/FT
PL/FT
PL/FT
PL/FT
PL/FT
PL/FT
PL/FT
PL/FT
PL/FT
PL/FT
PL/FT
PL/FT
PL/FT
PL/FT
PL/FT
PL/FT
PL/FT
PL/FT
PL/FT
PL/FT
PL/FT
PL/FT
PL/FT
PL/FT
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 165 BGA
333/4.5
250/5.5
200/6.5
333/4.5
250/5.5
200/6.5
333/4.5
250/5.5
200/6.5
333/4.5
250/5.5
200/6.5
333/4.5
250/5.5
200/6.5
333/4.5
250/5.5
200/6.5
333/4.5
250/5.5
200/6.5
333/4.5
250/5.5
200/6.5
C
C
C
C
C
C
I
I
I
I
I
I
C
C
C
C
C
C
I
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
I
RoHS-compliant 165 BGA
I
RoHS-compliant 165 BGA
I
RoHS-compliant 165 BGA
I
RoHS-compliant 165 BGA
I
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS8256418GB-200IVT.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each device is Pipeline/
Flow Through mode-selectable by the user.
3. C = Commercial Temperature Range. I = Industrial Temperature Range.
4.
GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are covered in this
data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.01 8/2016
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© 2015, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Advanced Information
GS8256418/36(GB/GD)-xxxV
288Mb Sync SRAM Datasheet Revision History
Types of Changes
File Name
Revision(s)
Format or Content
• Creation of new datasheet
• Removed all SCD references
82564xx_V_r1
82564xx_V_r1_01
Content
Rev: 1.01 8/2016
32/32
© 2015, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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