GS71116AJ-6T [GSI]
Standard SRAM, 64KX16, 6ns, CMOS, PDSO44, 0.400 INCH, SOJ-44;型号: | GS71116AJ-6T |
厂家: | GSI TECHNOLOGY |
描述: | Standard SRAM, 64KX16, 6ns, CMOS, PDSO44, 0.400 INCH, SOJ-44 静态存储器 光电二极管 内存集成电路 |
文件: | 总15页 (文件大小:468K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
GS71116ATP/J/U
6, 8, 10, 12 ns
SOJ, TSOP, FP-BGA
Commercial Temp
Industrial Temp
64K x 16
3.3 V V
DD
Center V and V
DD
SS
1Mb Asynchronous SRAM
SOJ 64K x 16-Pin Configuration
Features
• Fast access time: 6, 8, 10, 12 ns
• CMOS low power operation: 165/125/100/85 mA at
minimum cycle time
• Single 3.3 V power supply
• All inputs and outputs are TTL-compatible
• Byte control
• Fully static operation
• Industrial Temperature Option: –40° to 85°C
• Package line up
A4
1
A5
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A3
A6
2
A2
A7
3
A1
OE
4
Top view
A0
UB
5
CE
LB
6
DQ1
DQ2
DQ3
DQ4
DQ16
DQ15
DQ14
7
8
9
10
11
12
13
14
15
DQ13
J: 400 mil, 44-pin SOJ package
TP: 400 mil, 44-pin TSOP Type II package
U: 6 mm x 8 mm Fine Pitch Ball Grid Array package
44-pin
SOJ
V
DD
V
V
SS
V
SS
DD
DQ5
DQ6
DQ7
DQ8
WE
DQ12
DQ11
DQ10
DQ9
NC
Description
16
17
18
The GS71116A is a high speed CMOS static RAM organized
as 65,536-words by 16-bits. Static design eliminates the need
for external clocks or timing strobes. Operating on a single
3.3 V power supply and all inputs and outputs are TTL-
compatible. The GS71116A is available in a 6 mm x 8 mm
Fine Pitch BGA package, as well as in 400 mil SOJ and 400
mil TSOP Type-II packages.
A15
A14
A13
A12
NC
A8
A9
19
20
21
22
A10
A11
NC
Package J
Pin Descriptions
Fine Pitch BGA 64K x 16-Bump Configuration
Symbol
A0–A15
Description
Address input
1
2
3
4
5
6
DQ1–DQ16
Data input/output
Chip enable input
CE
A
B
C
LB
OE
A0
A3
A1
A4
A6
A2
NC
Lower byte enable input
(DQ1 to DQ8)
LB
DQ16 UB
CE
DQ1
Upper byte enable input
(DQ9 to DQ16)
DQ14 DQ15 A5
DQ2 DQ3
UB
VSS
VDD
VDD
VSS
D
E
DQ13 NC
DQ12 NC
A7
DQ4
WE
OE
Write enable input
Output enable input
+3.3 V power supply
NC DQ5
VDD
F
G
H
DQ11 DQ10 A8
A9
DQ7 DQ6
WE DQ8
VSS
NC
Ground
DQ9 NC
NC A12
A10
A13
A11
A14
No connect
A15
NC
6 mm x 8 mm, 0.75 mm Bump Pitch (Package U)
© 2001, Giga Semiconductor, Inc.
Rev: 1.03 3/2002
1/15
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS71116ATP/J/U
Top View
TSOP-II 64K x 16-Pin Configuration
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
1
A4
A3
A5
2
A6
3
A2
A7
4
A1
OE
Top view
5
A0
UB
6
CE
LB
7
DQ1
DQ2
DQ3
DQ4
DQ16
DQ15
DQ14
8
9
10
11
12
13
14
15
DQ13
44-pin
V
DD
V
V
SS
DD
V
SS
TSOP II
DQ5
DQ6
DQ7
DQ8
WE
DQ12
DQ11
DQ10
DQ9
NC
16
17
18
19
20
21
22
A15
A14
A13
A12
NC
A8
A9
A10
A11
NC
Package TP
Block Diagram
A0
Row
Decoder
Memory Array
Address
Input
Buffer
Column
Decoder
A15
CE
WE
OE
UB
LB
I/O Buffer
Control
_____
_____
DQ16
DQ1
Rev: 1.03 3/2002
2/15
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS71116ATP/J/U
Truth Table
V
Current
CE
OE
WE
LB
UB
DQ1 to DQ8
DQ9 to DQ16
DD
H
X
X
X
L
X
L
Not Selected
Read
Not Selected
Read
ISB1, ISB2
L
L
L
H
L
L
H
L
Read
High Z
H
L
High Z
Read
L
Write
Write
IDD
X
L
H
L
Write
Not Write, High Z
Write
H
X
H
Not Write, High Z
High Z
L
L
H
X
H
X
X
H
High Z
High Z
High Z
Note: X: “H” or “L”
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Supply Voltage
VDD
–0.5 to +4.6
V
–0.5 to VDD +0.5
(£ 4.6 V max.)
Input Voltage
VIN
V
V
–0.5 to VDD +0.5
(£ 4.6 V max.)
Output Voltage
VOUT
Allowable power dissipation
Storage temperature
PD
0.7
W
oC
TSTG
–55 to 150
Note:
Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation shall be restricted to Rec-
ommended Operating Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device
reliability.
Rev: 1.03 3/2002
3/15
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS71116ATP/J/U
Recommended Operating Conditions
Parameter
Supply Voltage for -8/-10/-12
Supply Voltage for -6
Input High Voltage
Symbol
VDD
Min
3.0
Typ
3.3
3.3
—
Max
3.6
Unit
V
V
V
V
VDD
3.135
2.0
3.6
VDD +0.3
0.8
VIH
VIL
Input Low Voltage
–0.3
—
Ambient Temperature,
Commercial Range
oC
oC
TAc
TAI
0
—
—
70
85
Ambient Temperature,
Industrial Range
–40
Notes:
1. Input overshoot voltage should be less than VDD +2 V and not exceed 20 ns.
2. Input undershoot voltage should be greater than –2 V and not exceed 20 ns.
Capacitance
Parameter
Input Capacitance
Output Capacitance
Symbol
CIN
Test Condition
VIN = 0 V
Max
Unit
pF
5
7
COUT
VOUT = 0 V
pF
Notes:
1. Tested at TA = 25°C, f = 1 MHz
2. These parameters are sampled and are not 100% tested.
DC I/O Pin Characteristics
Parameter
Symbol
Test Conditions
Min
Max
VIN = 0 to VDD
Input Leakage Current
IIL
–1 uA
–1 uA
2.4
1uA
Output High Z
VOUT = 0 to VDD
Output Leakage
Current
ILO
1uA
Output High Voltage
Output Low Voltage
VOH
VOL
IOH = –4 mA
ILO = +4 mA
0.4V
Rev: 1.03 3/2002
4/15
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS71116ATP/J/U
Power Supply Currents
0 to 70°C
8 ns 10 ns 12 ns
–40 to 85°C
Parameter
Symbol
Test Conditions
6 ns
6 ns
8 ns
10 ns 12 ns
CE £ VIL
Operating
Supply
Current
All other inputs
³ VIH or £ VIL
Min. cycle time
IOUT = 0 mA
IDD
165 mA 125 mA 100 mA 85 mA 170 mA 130 mA 105 mA 90 mA
CE ³ VIH
Standby
Current
All other inputs
³ VIH or £VIL
Min. cycle time
ISB1
ISB2
25 mA 20 mA 20 mA 15 mA 30 mA
25 mA 25 mA 20 mA
CE ³ VDD – 0.2 V
All other inputs
³ VDD – 0.2 V or £ 0.2 V
Standby
Current
2 mA
5 mA
Rev: 1.03 3/2002
5/15
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS71116ATP/J/U
AC Test Conditions
Output Load 1
Parameter
Input high level
Input low level
Conditions
VIH = 2.4 V
VI L= 0.4 V
tr = 1V/ns
tf = 1 V/ns
1.4 V
DQ
30pF1
50W
Input rise time
VT = 1.4 V
Input fall time
Input reference level
Output reference level
Output load
Output Load 2
1.4 V
3.3 V
Fig. 1& 2
589W
434W
DQ
Notes:
5pF1
1. Include scope and jig capacitance.
2. Test conditions as specified with output loading as shown in Fig. 1
unless otherwise noted.
3. Output load 2 for tLZ, tHZ, tOLZ and tOHZ
Rev: 1.03 3/2002
6/15
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS71116ATP/J/U
AC Characteristics
Read Cycle
-6
-8
-10
-12
Parameter
Symbol
Unit
Min
6
Max
—
Min
8
Max
—
Min
10
—
—
—
—
3
Max
—
10
10
4
Min
12
—
—
—
—
3
Max
—
12
12
5
Read cycle time
tRC
tAA
tAC
tAB
tOE
tOH
ns
ns
ns
ns
ns
ns
ns
Address access time
—
—
—
—
3
6
—
—
—
—
3
8
Chip enable access time (CE)
Byte enable access time (UB, LB)
Output enable to output valid (OE)
Output hold from address change
Chip enable to output in low Z (CE)
6
8
3.0
3.0
—
3.5
3.5
—
4
5
—
—
—
—
*
3
—
3
—
3
3
tLZ
*
Output enable to output in low Z (OE)
Byte enable to output in low Z (UB, LB)
Chip disable to output in High Z (CE)
Output disable to output in High Z (OE)
Byte disable to output in High Z (UB, LB)
0
—
—
0
—
—
0
—
—
5
0
0
—
—
6
ns
ns
ns
ns
—
tOLZ
*
0
0
0
tBLZ
*
—
—
—
3
—
—
—
4
—
—
—
—
—
—
tHZ
*
3.0
3.0
3.5
3.5
4
5
tOHZ
*
4
5
tBHZ
* These parameters are sampled and are not 100% tested.
Read Cycle 1: CE = OE = V , WE = V , UB and, or LB = V
IL
IH
IL
tRC
Address
tAA
tOH
Data Out
Previous Data
Data valid
Rev: 1.03 3/2002
7/15
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS71116ATP/J/U
Read Cycle 2: WE = V
IH
tRC
Address
CE
tAA
tAC
tHZ
tLZ
tAB
UB, LB
OE
tBHZ
tOHZ
tBLZ
tOLZ
tOE
Data valid
Data Out
High impedance
Write Cycle
-6
-8
-10
-12
Parameter
Symbol
Unit
Min
6
Max
—
—
—
—
—
—
—
—
—
—
—
Min
8
Max
—
—
—
—
—
—
—
—
—
—
—
Min
10
7
Max
—
—
—
—
—
—
—
—
—
—
—
Min
Max
—
—
—
—
—
—
—
—
—
—
—
Write cycle time
tWC
tAW
tCW
tBW
tDW
tDH
12
8
8
8
6
0
8
0
0
0
3
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Address valid to end of write
Chip enable to end of write
Byte enable to end of write
Data set up time
5.0
5.0
5.0
3.0
0
5.5
5.5
5.5
4
7
7
5
Data hold time
0
0
Write pulse width
tWP
tAS
5.0
0
5.5
0
7
Address set up time
0
Write recovery time (WE)
Write recovery time (CE)
Output Low Z from end of write
tWR
tWR1
0
0
0
0
0
0
tWLZ*
tWHZ*
3
3
3
Write to output in High Z
—
3.0
—
3.5
—
4
—
5
ns
* These parameters are sampled and are not 100% tested.
Rev: 1.03 3/2002
8/15
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS71116ATP/J/U
Write Cycle 1: WE control
tWC
Address
tAW
tWR
OE
CE
tCW
tBW
UB, LB
WE
tAS
tWP
tDW
tDH
Data valid
Data In
tWHZ
tWLZ
High impedance
Data Out
Write Cycle 2: CE control
tWC
Address
OE
tAW
tWR1
tAS
tCW
tBW
CE
UB, LB
WE
tWP
tDW
tDH
Data valid
Data In
Data Out
High impedance
Rev: 1.03 3/2002
9/15
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS71116ATP/J/U
Write Cycle 3: UB, LB control
tWC
Address
tAW
tWR1
OE
CE
tAS
tCW
tBW
UB, LB
WE
tWP
tDW
tDH
Data valid
Data In
Data Out
High impedance
Rev: 1.03 3/2002
10/15
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS71116ATP/J/U
44-Pin, 400 mil SOJ
Dimension in inch
min nom max
Dimension in mm
Symbol
min
—
nom
—
max
3.759
—
L
D
A
A1
A2
B
—
—
—
0.148
—
c
44
23
22
0.025
0.635
—
0.105 0.110 0.115 2.667
0.018
0.026 0.028 0.032 0.660
0.008
1.120 1.125 1.130 28.44
2.794
0.457
0.711
0.203
28.58
2.921
—
—
—
—
B1
c
0.813
—
—
—
—
1
D
28.70
e
A
E
0.395 0.400 0.405 10.033 10.160 10.287
0.05 1.27
0.435 0.440 0.445 11.049 11.176 11.303
e
—
—
—
—
HE
GE
L
B
y
0.360 0.370 0.380 9.144
0.082 0.087 0.106 2.083
9.398
2.210
—
9.652
2.70
B1
Q
Detail A
y
—
0o
—
—
0.004
7o
—
0o
0.102
7o
Q
—
Notes:
1. Dimension D& E do not include interlead flash.
2. Dimension B1 does not include dambar protrusion/intrusion.
3. Controlling dimension: inches
Rev: 1.03 3/2002
11/15
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS71116ATP/J/U
44 Pin, 400 mil TSOP-II
Dimension in inch
Dimension in mm
Symbol
min
—
nom max
min
—
nom max
D
c
44
23
22
A
A1
A2
B
—
—
0.047
—
—
1.20
—
0.002
0.05
—
0.037 0.039 0.041 0.95
0.01 0.014 0.018 0.25
1.00
0.35
0.15
1.05
0.45
—
A
c
—
0.006
—
—
D
0.721 0.725 0.729 18.31 18.41 18.51
0.396 0.400 0.404 10.06 10.16 10.26
1
E
e
B
e
—
0.031
—
—
0.80
—
HE
L
0.455 0.463 0.471 11.56 11.76 11.96
0.016 0.020 0.024 0.40
0.50
0.80
—
0.60
—
y
L1
y
—
—
0.031
—
—
—
—
0.004
0.10
0o
5o
0o
5o
Q
—
—
Q
Detail A
Notes:
1. Dimension D& E do not include interlead flash.
2. Dimension B does not include dambar protrusion/intrusion.
3. Controlling dimension: mm
Rev: 1.03 3/2002
12/15
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS71116ATP/J/U
6 mm x 8 mm Fine Pitch BGA
0 1 . 0 ± 0 0 . 8
0.10
5 2 . 5
Rev: 1.03 3/2002
13/15
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS71116ATP/J/U
Ordering Information
*
Package
Access Time
Temp. Range
Status
Part Number
GS71116ATP-6
GS71116ATP-8
GS71116ATP-10
GS71116ATP-12
GS71116ATP-6I
GS71116ATP-8I
GS71116ATP-10I
GS71116ATP-12I
GS71116AJ-6
400 mil TSOP-II
400 mil TSOP-II
6 ns
8 ns
Commercial
Commercial
Commercial
Commercial
Industrial
400 mil TSOP-II
10 ns
12 ns
6 ns
400 mil TSOP-II
400 mil TSOP-II
400 mil TSOP-II
8 ns
Industrial
400 mil TSOP-II
10 ns
12 ns
6 ns
Industrial
400 mil TSOP-II
Industrial
400 mil SOJ
Commercial
Commercial
Commercial
Commercial
Industrial
GS71116AJ-8
400 mil SOJ
8 ns
GS71116AJ-10
GS71116AJ-12
GS71116AJ-6I
GS71116AJ-8I
GS71116AJ-10I
GS71116AJ-12I
GS71116AU-6
GS71116AU-8
GS71116AU-10
GS71116AU-12
GS71116AU-6I
GS71116AU-8I
GS71116AU-10I
GS71116AU-12I
400 mil SOJ
10 ns
12 ns
6 ns
400 mil SOJ
400 mil SOJ
400 mil SOJ
8 ns
Industrial
400 mil SOJ
10 ns
12 ns
6 ns
Industrial
400 mil SOJ
Industrial
6 mm x 8 mm Fine Pitch BGA
6 mm x 8 mm Fine Pitch BGA
6 mm x 8 mm Fine Pitch BGA
6 mm x 8 mm Fine Pitch BGA
6 mm x 8 mm Fine Pitch BGA
6 mm x 8 mm Fine Pitch BGA
6 mm x 8 mm Fine Pitch BGA
6 mm x 8 mm Fine Pitch BGA
Commercial
Commercial
Commercial
Commercial
Industrial
8 ns
10 ns
12 ns
6 ns
8 ns
Industrial
10 ns
12 ns
Industrial
Industrial
* Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. For example:
GS71116ATP-10T
Rev: 1.03 3/2002
14/15
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS71116ATP/J/U
1Mb Asynchronous Datasheet Revision History
Rev. Code: Old;
New
Types of Changes
Format or Content
Page #/Revisions/Reason
• Creation of new datasheet
71116A_r1
• Added 6 ns speed bin to entire document
71116A_r1; 71116_r1_01
Content
Content
• Updated all power numbers
• Changed 6 mm x 10 mm FPBGA package designator from U to X
71116A_r1_01; 71116A
_r1_02
• Updated Recommended Operating Conditions table on page 4
• Changed FPBGA package from 6 x 10 to 6 x 8 (package U)
• Updated Read Cycle AC Characteristics table
71116A_r1_02; 71116A
_r1_03
Content
Rev: 1.03 3/2002
15/15
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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