首页 |元器件品牌

GS74108AGP-6 [GSI]

Standard SRAM, 512KX8, 6ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44;
GS74108AGP-6
型号： GS74108AGP-6
厂家： GSI TECHNOLOGY    GSI TECHNOLOGY
描述：

Standard SRAM, 512KX8, 6ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44

静态存储器 光电二极管 内存集成电路
文件： 总14页 (文件大小：424K)
中文：  中文翻译
下载：  下载PDF数据表文档文件
 查看货源
GS74108ATP/J/X  
SOJ, TSOP, FP-BGA  
Commercial Temp  
Industrial Temp  
6, 7, 8, 10, 12 ns  
3.3 V VDD  
Center VDD and VSS  
512K x 8  
4Mb Asynchronous SRAM  
SOJ 512K x 8-Pin Configuration  
Features  
• Fast access time: 6, 7, 8, 10, 12 ns  
• CMOS low power operation: 155/135/120/95/85 mA at  
minimum cycle time  
36  
1
A4  
NC  
35  
A5  
2
A3  
34  
A6  
3
A2  
• Single 3.3 V power supply  
33  
A7  
4
A1  
• All inputs and outputs are TTL-compatible  
• Fully static operation  
• Industrial Temperature Option: –40° to 85°C  
• Package line up  
32  
A8  
5
A0  
31  
6
CE  
OE  
30  
7
DQ1  
DQ2  
VDD  
VSS  
DQ3  
DQ4  
WE  
A17  
A16  
A15  
A14  
A13  
DQ8  
J: 400 mil, 36-pin SOJ package  
TP: 400 mil, 44-pin TSOP Type II package  
X: 6 mm x 10 mm Fine Pitch Ball Grid Array  
package  
29  
8
DQ7  
36-pin  
400 mil SOJ  
28  
9
VSS  
27  
26  
25  
24  
23  
22  
21  
20  
19  
10  
11  
12  
13  
14  
15  
16  
17  
18  
VDD  
DQ6  
DQ5  
A9  
Description  
The GS74108A is a high speed CMOS Static RAM organized  
as 524,288 words by 8 bits. Static design eliminates the need  
for external clocks or timing strobes. The GS74108A operates  
on a single 3.3 V power supply and all inputs and outputs are  
TTL-compatible. The GS74108A is available in 400 mil SOJ,  
400 mil TSOP Type-II, and 6 mm x 10 mm FP-BGA packages.  
A10  
A11  
A12  
A18  
NC  
FP-BGA 256K x 16 Bump Configuration (Package X)  
Pin Descriptions  
1
2
3
4
5
6
Symbol  
A0–A18  
DQ1–DQ8  
CE  
Description  
Address input  
A
B
C
D
E
F
LB  
OE  
A0  
A3  
A1  
A4  
A6  
A7  
A2  
NC  
Data input/output  
Chip enable input  
Write enable input  
Output enable input  
+3.3 V power supply  
DQ16 UB  
CE DQ1  
DQ2 DQ3  
DQ4 VDD  
WE  
DQ14 DQ15 A5  
VSS DQ13 A17  
VDD DQ12 NC  
DQ11 DQ10 A8  
OE  
V
DD  
A16 DQ5 VSS  
V
Ground  
SS  
A9  
DQ7 DQ6  
WE DQ8  
NC  
No connect  
G
H
DQ9 NC  
NC A12  
A10  
A13  
A11  
A14  
A15  
NC  
6 x 10 mm Bump Pitch  
Rev: 1.02 3/2002  
1/14  
© 2001, Giga Semiconductor, Inc.  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  
GS74108ATP/J/X  
TSOP-II 512K x 8-Pin Configuration  
NC  
NC  
A4  
1
44  
NC  
NC  
NC  
A5  
2
43  
42  
3
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
4
A3  
5
A2  
A6  
6
A1  
A7  
7
A0  
A8  
8
CE  
OE  
DQ8  
DQ7  
VSS  
VDD  
DQ6  
DQ5  
A9  
9
DQ1  
DQ2  
VDD  
VSS  
DQ3  
DQ4  
WE  
A17  
A16  
10  
11  
12  
13  
14  
15  
16  
17  
18  
44-pin  
400 mil TSOP II  
A10  
A11  
A12  
A18  
NC  
A15  
A14  
19  
20  
21  
22  
A13  
NC  
NC  
24  
23  
NC  
NC  
Block Diagram  
A0  
Row  
Decoder  
Memory Array  
Address  
Input  
Buffer  
Column  
Decoder  
A18  
CE  
WE  
OE  
I/O Buffer  
Control  
DQ8  
DQ1  
Rev: 1.02 3/2002  
2/14  
© 2001, Giga Semiconductor, Inc.  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  
GS74108ATP/J/X  
Truth Table  
CE  
V
Current  
OE  
WE  
DQ1 to DQ8  
DD  
H
L
L
L
X
L
X
H
L
Not Selected  
Read  
ISB1, ISB2  
X
H
Write  
IDD  
H
High Z  
Note: X: “H” or “L”  
Absolute Maximum Ratings  
Parameter  
Symbol  
Rating  
Unit  
Supply Voltage  
VDD  
–0.5 to +4.6  
V
–0.5 to V +0.5  
DD  
Input Voltage  
VIN  
V
(≤ 4.6 V max.)  
–0.5 to V +0.5  
DD  
Output Voltage  
VOUT  
V
(≤ 4.6 V max.)  
Allowable power dissipation  
Storage temperature  
PD  
0.7  
W
o
TSTG  
–55 to 150  
C
Note:  
Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation shall be restricted to Rec-  
ommended Operating Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device  
reliability.  
Rev: 1.02 3/2002  
3/14  
© 2001, Giga Semiconductor, Inc.  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  
GS74108ATP/J/X  
Recommended Operating Conditions  
Parameter  
Supply Voltage for -7/-8/-10/-12  
Supply Voltage for -6  
Input High Voltage  
Symbol  
Min  
3.0  
Typ  
3.3  
3.3  
—
Max  
3.6  
Unit  
V
V
V
V
V
DD  
V
3.135  
2.0  
3.6  
DD  
V
+0.3  
VIH  
VIL  
DD  
Input Low Voltage  
–0.3  
—
0.8  
Ambient Temperature,  
Commercial Range  
o
TAc  
TAI  
0
—
—
70  
85  
C
Ambient Temperature,  
Industrial Range  
o
–40  
C
Note:  
1. Input overshoot voltage should be less than V +2 V and not exceed 20 ns.  
DD  
2. Input undershoot voltage should be greater than –2 V and not exceed 20 ns.  
Capacitance  
Parameter  
Input Capacitance  
Output Capacitance  
Symbol  
CIN  
Test Condition  
VIN = 0 V  
Max  
Unit  
pF  
5
7
COUT  
VOUT = 0 V  
pF  
Notes:  
1. Tested at TA = 25°C, f = 1 MHz  
2. These parameters are sampled and are not 100% tested.  
DC I/O Pin Characteristics  
Parameter  
Symbol  
Test Conditions  
Min  
Max  
Input Leakage  
Current  
VIN = 0 to V  
DD  
IIL  
– 1 uA  
–1 uA  
1 uA  
1 uA  
Output High Z  
Output Leakage  
Current  
ILO  
VOUT = 0 to V  
DD  
Output High Voltage  
Output Low Voltage  
VOH  
VOL  
IOH = –4 mA  
ILO = +4 mA  
2.4  
—
—
0.4 V  
Rev: 1.02 3/2002  
4/14  
© 2001, Giga Semiconductor, Inc.  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  
GS74108ATP/J/X  
Power Supply Currents  
0 to 70°C  
8 ns  
–40 to 85°C  
8 ns  
Parameter Symbol Test Conditions  
6 ns  
7 ns  
10 ns  
12 ns  
6 ns  
7 ns  
10 ns  
12 ns  
CE ≤ VIL  
Operating  
Supply  
Current  
All other inputs  
≥ VIH or ≤ VIL  
Min. cycle time  
IOUT = 0 mA  
IDD  
155 mA 135 mA 120 mA 95 mA 85 mA 165 mA 145 mA 130 mA 105 mA 95 mA  
CE ≥ VIH  
Standby  
Current  
All other inputs  
≥ VIH or ≤VIL  
Min. cycle time  
ISB1  
40 mA 35 mA 30 mA 25 mA 22 mA 50 mA 45 mA 40 mA 35 mA 32 mA  
CE ≥ VDD - 0.2V  
All other inputs  
≥ VDD - 0.2V or ≤  
0.2V  
Standby  
Current  
ISB2  
10 mA  
20 mA  
AC Test Conditions  
Output Load 1  
Parameter  
Input high level  
Input low level  
Conditions  
VIH = 2.4 V  
VIL = 0.4 V  
tr = 1 V/ns  
tf = 1 V/ns  
1.4 V  
DQ  
1
30pF  
50Ω  
Input rise time  
VT = 1.4 V  
Input fall time  
Input reference level  
Output reference level  
Output load  
Output Load 2  
1.4 V  
3.3 V  
Fig. 1& 2  
589Ω  
434Ω  
DQ  
Note:  
1
1. Include scope and jig capacitance.  
5pF  
2. Test conditions as specified with output loading as shown in Fig. 1  
unless otherwise noted.  
3. Output load 2 for tLZ, tHZ, tOLZ and tOHZ  
Rev: 1.02 3/2002  
5/14  
© 2001, Giga Semiconductor, Inc.  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  
GS74108ATP/J/X  
AC Characteristics  
Read Cycle  
-6  
-7  
-8  
-10  
-12  
Parameter  
Symbol  
Unit  
Min Max Min Max Min Max Min Max Min Max  
Read cycle time  
tRC  
tAA  
tAC  
tOE  
tOH  
6
—
—
—
3
—
6
7
—
—
—
3
—
7
8
—
—
—
3
—
8
10  
—
—
—
3
—
10  
10  
4
12  
—
—
—
3
—
12  
12  
5
ns  
ns  
ns  
ns  
ns  
ns  
Address access time  
Chip enable access time (CE)  
Output enable to output valid (OE)  
Output hold from address change  
Chip enable to output in low Z (CE)  
6
7
8
3
3
3.5  
—
—
—
—
—
—
—
—
—
—
*
3
3
3
3
3
tLZ  
*
Output enable to output in low Z (OE)  
Chip disable to output in High Z (CE)  
Output disable to output in High Z (OE)  
0
—
3
0
—
3.5  
3
0
—
4
0
—
5
0
—
6
ns  
ns  
ns  
tOLZ  
*
—
—
—
—
—
—
—
—
—
—
tHZ  
*
3
3.5  
4
5
tOHZ  
* These parameters are sampled and are not 100% tested.  
Read Cycle 1: CE = OE = V , WE = V  
IL  
IH  
tRC  
Address  
Data Out  
tAA  
tOH  
Previous Data  
Data valid  
Rev: 1.02 3/2002  
6/14  
© 2001, Giga Semiconductor, Inc.  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  
GS74108ATP/J/X  
Read Cycle 2: WE = V  
IH  
tRC  
Address  
CE  
tAA  
tAC  
tHZ  
tLZ  
OE  
tOE  
tOHZ  
tOLZ  
DATA VALID  
Data Out  
High impedance  
Write Cycle  
-6  
-7  
-8  
-10  
-12  
Parameter  
Symbol  
Unit  
Min Max Min Max Min Max Min Max Min Max  
Write cycle time  
tWC  
tAW  
tCW  
tDW  
tDH  
6
5
5
3
0
5
0
0
0
3
—
—
—
—
—
—
—
—
—
—
7
5
—
—
—
—
—
—
—
—
—
—
8
5.5  
5.5  
4
—
—
—
—
—
—
—
—
—
—
10  
7
—
—
—
—
—
—
—
—
—
—
12  
8
—
—
—
—
—
—
—
—
—
—
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Address valid to end of write  
Chip enable to end of write  
Data set up time  
5
7
8
3.5  
0
5
6
Data hold time  
0
0
0
Write pulse width  
tWP  
tAS  
5
5.5  
0
7
8
Address set up time  
0
0
0
Write recovery time (WE)  
Write recovery time (CE)  
Output Low Z from end of write  
tWR  
tWR1  
0
0
0
0
0
0
0
0
*
3
3
3
3
tWLZ  
tWHZ  
*
Write to output in High Z  
—
3
—
3
—
3.5  
—
4
—
5
ns  
* These parameters are sampled and are not 100% tested.  
Rev: 1.02 3/2002  
7/14  
© 2001, Giga Semiconductor, Inc.  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  
GS74108ATP/J/X  
Write Cycle 1: WE control  
tWC  
Address  
tAW  
tWR  
OE  
tCW  
CE  
tAS  
tWP  
WE  
tDW  
tDH  
DATA VALID  
Data In  
Data Out  
tWHZ  
tWLZ  
HIGH IMPEDANCE  
Write Cycle 2: CE control  
tWC  
Address  
tAW  
tWR1  
OE  
CE  
tAS  
tCW  
tWP  
WE  
tDW  
tDH  
DATA VALID  
Data In  
Data Out  
HIGH IMPEDANCE  
Rev: 1.02 3/2002  
8/14  
© 2001, Giga Semiconductor, Inc.  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  
GS74108ATP/J/X  
36-Pin SOJ, 400 mil  
Dimension in inch  
Dimension in mm  
Symbol  
min  
nom  
—
max  
min  
—
nom  
—
max  
3.70  
—
A
A1  
A2  
B
—
0.146  
—
L
0.026  
—
0.66  
2.67  
0.33  
0.61  
0.15  
—
D
c
0.105 0.110 0.115  
0.013 0.017 0.021  
0.024 0.028 0.032  
0.006 0.008 0.012  
2.80  
0.43  
0.71  
0.20  
2.92  
0.53  
0.81  
0.30  
B1  
c
1
e
D
0.920 0.924 0.929 23.37 23.47 23.60  
0.395 0.400 0.405 10.04 10.16 10.28  
A
E
e
—
0.05  
—
—
1.27  
—
HE  
GE  
L
0.430 0.435 0.440 10.93 11.05 11.17  
B
B1  
y
0.354 0.366 0.378  
9.00  
2.08  
—
9.30  
—
9.60  
—
Q
Detail A  
0.082  
—
—
—
—
—
y
0.004  
—
0.10  
o
o
o
o
Q
—
0
10  
0
10  
Notes:  
1. Dimension D& E do not include interlead flash.  
2. Dimension B1 does not include dambar protrusion/intrusion.  
3. Controlling dimension: inches  
Rev: 1.02 3/2002  
9/14  
© 2001, Giga Semiconductor, Inc.  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  
GS74108ATP/J/X  
44-Pin, 400 mil TSOP-II  
Dimension in inch Dimension in mm  
min nom max min nom max  
D
Symbol  
c
44  
23  
22  
A
—
—
—
0.047  
—
—
—
1.20  
—
A1  
0.002  
0.05  
—
A2  
0.037 0.039 0.041 0.95  
0.01 0.014 0.018 0.25  
1.00  
0.35  
0.15  
1.05  
0.45  
—
A
B
c
—
0.006  
—
—
D
0.721 0.725 0.729 18.31 18.41 18.51  
0.396 0.400 0.404 10.06 10.16 10.26  
1
e
E
B
e
—
0.031  
—
—
0.80  
—
HE  
0.455 0.463 0.471 11.56 11.76 11.96  
L
L1  
0.016 0.020 0.024 0.40  
0.50  
0.80  
—
0.60  
—
y
—
—
0.031  
—
—
—
—
y
0.004  
0.10  
o
o
o
o
Q
Q
—
—
0
5
0
5
Detail A  
Notes:  
1. Dimension D& E do not include interlead flash.  
2. Dimension B does not include dambar protrusion/intrusion.  
3. Controlling dimension: mm  
Rev: 1.02 3/2002  
10/14  
© 2001, Giga Semiconductor, Inc.  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  
GS74108ATP/J/X  
6 mm x 10 mm FP-BGA  
Symbol  
Unit: mm  
D
A
1.10±0.10  
0.20~0.30  
f0.30~0.40  
0.36(TYP)  
10.0±0.05  
5.25  
A1  
fb  
c
E
D
Pin A1  
D1  
E
Index  
6.0±0.05  
3.75  
E1  
e
0.75(TYP)  
0.10  
Top View  
aaa  
A
c
Side View  
A1  
aaa  
E1  
Pin A1  
A B C D E F G H  
fb Solder Ball  
Index  
1
2
3
4
5
6
e
e
D1  
Bottom View  
Rev: 1.02 3/2002  
11/14  
© 2001, Giga Semiconductor, Inc.  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  
GS74108ATP/J/X  
Ordering Information  
*
Package  
Access Time  
Temp. Range  
Status  
Part Number  
GS74108ATP-6  
GS74108ATP-7  
GS74108ATP-8  
GS74108ATP-10  
GS74108ATP-12  
GS74108ATP-6I  
GS74108ATP-7I  
GS74108ATP-8I  
GS74108ATP-10I  
GS74108ATP-12I  
GS74108AJ-6  
400 mil TSOP-II  
400 mil TSOP-II  
400 mil TSOP-II  
400 mil TSOP-II  
400 mil TSOP-II  
400 mil TSOP-II  
400 mil TSOP-II  
400 mil TSOP-II  
400 mil TSOP-II  
400 mil TSOP-II  
400 mil SOJ  
6 ns  
7 ns  
Commercial  
Commercial  
Commercial  
Commercial  
Commercial  
Industrial  
8 ns  
10 ns  
12 ns  
6 ns  
7 ns  
Industrial  
8 ns  
Industrial  
10 ns  
12 ns  
6 ns  
Industrial  
Industrial  
Commercial  
Commercial  
Commercial  
Commercial  
Commercial  
Industrial  
GS74108AJ-7  
400 mil SOJ  
7 ns  
GS74108AJ-8  
400 mil SOJ  
8 ns  
GS74108AJ-10  
GS74108AJ-12  
GS74108AJ-6I  
GS74108AJ-7I  
GS74108AJ-8I  
GS74108AJ-10I  
GS74108AJ-12I  
GS74108AX-6  
GS74108AX-7  
400 mil SOJ  
10 ns  
12 ns  
6 ns  
400 mil SOJ  
400 mil SOJ  
400 mil SOJ  
7 ns  
Industrial  
400 mil SOJ  
8 ns  
Industrial  
400 mil SOJ  
10 ns  
12 ns  
6 ns  
Industrial  
400 mil SOJ  
Industrial  
6 mm x 10 mm FP-BGA  
6 mm x 10 mm FP-BGA  
Commercial  
Commercial  
7 ns  
Rev: 1.02 3/2002  
12/14  
© 2001, Giga Semiconductor, Inc.  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  
GS74108ATP/J/X  
Ordering Information  
*
Package  
Access Time  
Temp. Range  
Status  
Part Number  
GS74108AX-8  
GS74108AX-10  
GS74108AX-12  
GS74108AX-6I  
GS74108AX-7I  
GS74108AX-8I  
GS74108AX-10I  
GS74108AX-12I  
6 mm x 10 mm FP-BGA  
6 mm x 10 mm FP-BGA  
6 mm x 10 mm FP-BGA  
6 mm x 10 mm FP-BGA  
6 mm x 10 mm FP-BGA  
6 mm x 10 mm FP-BGA  
6 mm x 10 mm FP-BGA  
6 mm x 10 mm FP-BGA  
8 ns  
10 ns  
12 ns  
6 ns  
Commercial  
Commercial  
Commercial  
Industrial  
7 ns  
Industrial  
8 ns  
Industrial  
10 ns  
12 ns  
Industrial  
Industrial  
*
Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. For example:  
GS74108ATP-8T  
Rev: 1.02 3/2002  
13/14  
© 2001, Giga Semiconductor, Inc.  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  
GS74108ATP/J/X  
4 M Asynchronous Datasheet Revision History  
Rev. Code: Old;  
New  
Types of Changes  
Format or Content  
Page #/Revisions/Reason  
• Creation of new datasheet  
74108A_r1  
Format/Content  
• Added 6 ns speed bin  
• Updated all power numbers  
74108A_r1; 74108A_r1_01  
Content  
• Updated Recommended Operating Conditions table on page 4  
• Added 7 ns bin to entire document  
74108A_r1_01; 74108A_r1_02  
Content  
• Added X package  
Rev: 1.02 3/2002  
14/14  
© 2001, Giga Semiconductor, Inc.  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  

相关型号：

GS74108AGP-6I

 Standard SRAM, 512KX8, 6ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44
GSI

GS74108AGP-6IT

 Standard SRAM, 512KX8, 6ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44
GSI

GS74108AGP-6T

 Standard SRAM, 512KX8, 6ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44
GSI

GS74108AGP-7

 Standard SRAM, 512KX8, 7ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44
GSI

GS74108AGP-7IT

 Standard SRAM, 512KX8, 7ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44
GSI

GS74108AGP-7T

 Standard SRAM, 512KX8, 7ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44
GSI

GS74108AGP-8

 512K x 8 4Mb Asynchronous SRAM
GSI

GS74108AGP-8I

 512K x 8 4Mb Asynchronous SRAM
GSI

GS74108AGP-8IT

 Standard SRAM, 512KX8, 8ns, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, TSOP2-44
GSI

GS74108AGP-8T

 暂无描述
GSI

GS74108AGX-10

 512K x 8 4Mb Asynchronous SRAM
GSI

GS74108AGX-10I

 512K x 8 4Mb Asynchronous SRAM
GSI
©2020 ICPDF网 联系我们和版权申明