GS832218AGD-333IT [GSI]
Cache SRAM, 2MX18, 4.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165;型号: | GS832218AGD-333IT |
厂家: | GSI TECHNOLOGY |
描述: | Cache SRAM, 2MX18, 4.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 时钟 静态存储器 内存集成电路 |
文件: | 总39页 (文件大小:562K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
GS832218/36A(B/D)-400/375/333/250/200/150
119 & 165 BGA
Commercial Temp
Industrial Temp
400 MHz–150 MHz
2M x 18, 1M x 36
36Mb S/DCD Sync Burst SRAMs
2.5 V or 3.3 V V
DD
2.5 V or 3.3 V I/O
either linear or interleave order with the Linear Burst Order (LBO)
input. The Burst function need not be used. New addresses can be
loaded on every cycle with no degradation of chip performance.
Features
• FT pin for user-configurable flow through or pipeline operation
• Single/Dual Cycle Deselect selectable
• IEEE 1149.1 JTAG-compatible Boundary Scan
• ZQ mode pin for user-selectable high/low output drive
• 2.5 V +10%/–10% core power supply
• 3.3 V +10%/–10% core power supply
• 2.5 V or 3.3 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to SCD x18/x36 Interleaved Pipeline mode
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by the
user via the FT mode . Holding the FT mode pin low places the
RAM in Flow Through mode, causing output data to bypass the
Data Output Register. Holding FT high places the RAM in
Pipeline mode, activating the rising-edge-triggered Data Output
Register.
SCD and DCD Pipelined Reads
The GS832218/36A is a SCD (Single Cycle Deselect) and DCD
(Dual Cycle Deselect) pipelined synchronous SRAM. DCD
SRAMs pipeline disable commands to the same degree as read
commands. SCD SRAMs pipeline deselect commands one stage
less than read commands. SCD RAMs begin turning off their
outputs immediately after the deselect command has been
captured in the input registers. DCD RAMs hold the deselect
command for one full cycle and then begin turning off their
outputs just after the second rising edge of clock. The user may
configure this SRAM for either mode of operation using the SCD
mode input.
• Automatic power-down for portable applications
• JEDEC-standard 119-bump and 165-bump BGA packages
• RoHS-compliant packages available
Functional Description
Applications
The GS832218/36A is a 37,748,736-bit high performance
synchronous SRAM with a 2-bit burst address counter. Although
of a type originally developed for Level 2 Cache applications
supporting high performance CPUs, the device now finds
application in synchronous SRAM applications, ranging from
DSP main store to networking chip set support.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write control
inputs.
Controls
Addresses, data I/Os, chip enable (E1), address burst control
inputs (ADSP, ADSC, ADV), and write control inputs (Bx, BW,
GW) are synchronous and are controlled by a positive-edge-
triggered clock input (CK). Output enable (G) and power down
control (ZZ) are asynchronous inputs. Burst cycles can be initiated
with either ADSP or ADSC inputs. In Burst mode, subsequent
burst addresses are generated internally and are controlled by
ADV. The burst address counter may be configured to count in
FLXDrive™
The ZQ pin allows selection between high drive strength (ZQ low)
for multi-drop bus applications and normal drive strength (ZQ
floating or high) point-to-point applications. See the Output Driver
Characteristics chart for details.
Parameter Synopsis
-400
-375
-333
-250
-200
-150
Unit
t
2.5
2.5
2.5
2.66
2.5
3.3
2.5
4.0
3.0
5.0
3.8
6.7
ns
ns
KQ
Pipeline
3-1-1-1
tCycle
Curr (x18)
Curr (x32/x36)
395
475
390
455
355
415
280
335
240
280
205
230
mA
mA
t
4.0
4.0
4.2
4.2
4.5
4.5
5.5
5.5
6.5
6.5
7.5
7.5
ns
ns
KQ
Flow
Through
2-1-1-1
tCycle
Curr (x18)
Curr (x32/x36)
290
335
275
320
260
305
235
270
200
240
190
220
mA
mA
Rev: 1.03 8/2013
1/39
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
165-Bump BGA—x18 Commom I/O—Top View (Package D)
1
2
3
4
5
6
7
8
9
10
A
11
A
A
B
C
D
E
F
NC
A
E1
BB
NC
E3
BW
ADSC
ADV
A
B
C
D
E
F
NC
NC
A
E2
NC
BA
CK
GW
G
ADSP
A
NC
NC
NC
NC
NC
ZQ
NC
DQPA
DQA
DQA
DQA
DQA
ZZ
NC
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
DDQ
DDQ
DDQ
DDQ
DDQ
SS
DD
DD
DD
DD
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD
DD
DD
DD
DD
DD
DD
DD
DD
DDQ
DDQ
DDQ
DDQ
DDQ
NC
DQB
DQB
DQB
DQB
MCL
NC
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
NC
NC
G
H
J
NC
G
H
J
FT
NC
NC
DQB
DQB
DQB
DQB
DQPB
NC
V
V
DQA
DQA
DQA
DQA
NC
A
NC
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
K
L
NC
V
V
V
V
V
V
V
V
NC
K
L
NC
NC
M
N
P
R
NC
NC
M
N
P
R
SCD
NC
V
NC
TDI
A
NC
V
NC
DDQ
SS
SS
DDQ
A
A
A
A1
A0
TDO
TCK
A
A
A
A
LBO
A
A
TMS
A
A
A
11 x 15 Bump BGA—13 mm x 15 mm Body—1.0 mm Bump Pitch
Rev: 1.03 8/2013
2/39
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
165-Bump BGA—x36 Common I/O—Top View (Package D)
1
2
3
4
5
6
7
8
9
10
A
11
A
B
C
D
E
F
NC
A
E1
BC
BB
E3
BW
ADSC
ADV
NC
A
B
C
D
E
F
NC
DQPC
DQC
DQC
DQC
DQC
FT
A
E2
BD
BA
CK
GW
G
ADSP
A
NC
DQPB
DQB
DQB
DQB
DQB
ZZ
NC
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
NC
DDQ
DDQ
DDQ
DDQ
DDQ
SS
DD
DD
DD
DD
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD
DD
DD
DD
DD
DD
DD
DD
DD
DDQ
DDQ
DDQ
DDQ
DDQ
DQC
DQC
DQC
DQC
MCL
DQD
DQD
DQD
DQD
SCD
NC
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
DQB
DQB
DQB
DQB
ZQ
G
H
J
G
H
J
NC
NC
DQD
DQD
DQD
DQD
DQPD
NC
V
V
DQA
DQA
DQA
DQA
NC
DQA
DQA
DQA
DQA
DQPA
A
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
K
L
V
V
V
V
V
V
V
V
K
L
M
N
P
R
M
N
P
R
V
NC
TDI
A
NC
V
SS
DDQ
SS
DDQ
A
A
A
A1
A0
TDO
TCK
A
A
A
A
LBO
A
A
TMS
A
A
A
11 x 15 Bump BGA—13 mm x 15 mm Body—1.0 mm Bump Pitch
Rev: 1.03 8/2013
3/39
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
GS832218/36A 165-Bump BGA Pin Description
Symbol
A0, A1
An
Type
Description
I
I
Address field LSBs and Address Counter Preset Inputs
Address Inputs
DQA
DQB
DQC
DQD
I/O
Data Input and Output pins
BA, BB, BC, BD
I
I
I
I
I
I
I
I
I
I
I
I
I
Byte Write Enable for DQA, DQB, DQC, DQD I/Os; active low (x36 Version)
Clock Input Signal; active high
CK
BW
Byte Write—Writes all enabled bytes; active low
Global Write Enable—Writes all bytes; active low
Chip Enable; active low
GW
E1
E3
Chip Enable; active low
E2
Chip Enable; active high
G
ADV
Output Enable; active low
Burst address counter advance enable; active l0w
Address Strobe (Processor, Cache Controller); active low
Sleep mode control; active high
ADSC, ADSP
ZZ
FT
Flow Through or Pipeline mode; active low
Linear Burst Order mode; active low
LBO
FLXDrive Output Impedance Control (Low = Low Impedance [High Drive], High = High Impedance [Low
Drive])
ZQ
I
I
I
Scan Test Mode Select
Scan Test Data In
TMS
TDI
O
I
Scan Test Data Out
TDO
TCK
MCL
SCD
Scan Test Clock
—
—
I
Must Connect Low
Single Cycle Deselect/Dual Cyle Deselect Mode Control
Core power supply
V
DD
V
I
I/O and Core Ground
SS
V
I
Output driver power supply
No Connect
DDQ
NC
—
Rev: 1.03 8/2013
4/39
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
119-Bump BGA—x36 Common I/O—Top View
1
2
A
3
A
A
A
4
5
A
A
A
6
A
7
V
V
DDQ
A
B
C
D
E
F
ADSP
ADSC
A
B
C
D
E
F
DDQ
NC
NC
A
A
NC
NC
V
A
A
DD
V
V
DQC
DQC
DQPC
DQC
DQC
DQC
DQC
ZQ
E1
DQPB
DQB
DQB
DQB
DQB
DQB
DQB
SS
SS
SS
SS
SS
SS
V
V
V
V
V
V
DDQ
G
DDQ
G
H
J
DQC2
BC
ADV
GW
BB
DQB
G
H
J
V
V
SS
DQC
DQB
SS
V
V
V
V
V
NC
NC
DDQ
DD
DD
DD
DDQ
DQA
DQA
V
V
K
L
DQD
DQD
DQD
DQD
DQD
DQD
DQPD
A
CK
SCD
BW
A1
DQA
DQA
DQA
DQA
DQPA
A
K
L
SS
SS
BD
BA
V
V
V
V
DDQ
M
N
P
R
T
M
N
P
R
T
DDQ
SS
SS
V
V
DQD
DQD
NC
DQA
SS
SS
V
V
A0
DQA
NC
ZZ
SS
SS
V
LBO
A
FT
A
DD
NC
NC
A
TCK
2
A
V
V
DDQ
U
TMS
TDI
TDO
NC
U
DDQ
7 x 17 Bump BGA—14 x 22 mm Body—1.27 mm Bump Pitch
Rev: 1.03 8/2013
5/39
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
119-Bump BGA—x18 Common I/O—Top View
1
2
A
3
A
A
A
4
5
A
A
A
6
A
7
V
V
DDQ
A
B
C
D
E
F
ADSP
ADSC
A
B
C
D
E
F
DDQ
NC
NC
A
A
NC
NC
V
A
A
DD
V
V
DQB
NC
NC
DQB
NC
DQB
NC
ZQ
E1
DQPA
NC
DQA
NC
DQA
NC
SS
SS
SS
SS
SS
SS
V
V
V
V
DQA
V
V
DDQ
G
DDQ
G
H
J
NC
BB
ADV
GW
NC
DQA
G
H
J
V
V
DQB
NC
SS
SS
V
V
V
V
V
NC
NC
DDQ
DD
DD
DD
DDQ
DQA
NC
V
V
K
L
NC
DQB
NC
CK
SCD
BW
A1
NC
DQA
NC
DQA
NC
A
K
L
SS
SS
DQB
NC
BA
V
V
V
V
DDQ
M
N
P
R
T
DQB
NC
M
N
P
R
T
DDQ
SS
SS
V
V
DQB
NC
SS
SS
V
V
NC
NC
NC
DQPB
A
A0
DQA
NC
ZZ
SS
SS
V
LBO
A
FT
A
DD
A
A
TCK
2
A
V
V
DDQ
U
TMS
TDI
TDO
NC
U
DDQ
7 x 17 Bump BGA—14 x 22 mm Body—1.27 mm Bump Pitch
Rev: 1.03 8/2013
6/39
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
GS832218/36A 119-Bump BGA Pin Description
Symbol
A0, A1
An
Type
Description
I
I
Address field LSBs and Address Counter Preset Inputs
Address Inputs
DQA
DQB
DQC
DQD
I/O
Data Input and Output pins
BA, BB, BC, BD
I
I
I
I
I
I
I
I
I
I
I
Byte Write Enable for DQA, DQB, DQC, DQD I/Os; active low
Clock Input Signal; active high
CK
BW
Byte Write—Writes all enabled bytes; active low
Global Write Enable—Writes all bytes; active low
Chip Enable; active low
GW
E1
G
ADV
Output Enable; active low
Burst address counter advance enable; active low
Address Strobe (Processor, Cache Controller); active low
Sleep mode control; active high
ADSP, ADSC
ZZ
FT
Flow Through or Pipeline mode; active low
Linear Burst Order mode; active low
LBO
FLXDrive Output Impedance Control (Low = Low Impedance [High Drive], High = High Impedance [Low
Drive])
ZQ
I
SCD
TMS
TDI
I
I
Single Cycle Deselect/Dual Cyle Deselect Mode Control
Scan Test Mode Select
Scan Test Data In
I
O
I
Scan Test Data Out
TDO
TCK
Scan Test Clock
V
I
Core power supply
DD
V
I
I/O and Core Ground
SS
V
I
I/O and Core Ground
SS
V
I
Output driver power supply
No Connect
DDQ
NC
—
Rev: 1.03 8/2013
7/39
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
GS832218/36A Block Diagram
Register
A0–An
D
Q
A0
A1
A0
A1
D0
D1
Q0
Q1
Counter
Load
A
LBO
ADV
Memory
Array
CK
ADSC
ADSP
Q
D
Register
GW
BW
BA
D
Q
36
36
Register
D
Q
BB
BC
BD
4
Register
D
Q
Register
D
Q
Register
36
D
Q
36
36
Register
D
E1
Q
Register
D
Q
FT
G
36
SCD
Power Down
Control
DQx1–DQx9
ZZ
Note: Only x36 version shown for simplicity.
Rev: 1.03 8/2013
8/39
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
Mode Pin Functions
Mode Name
Pin Name
State
Function
Linear Burst
Interleaved Burst
Flow Through
Pipeline
L
Burst Order Control
LBO
H
L
H or NC
L or NC
H
Output Register Control
FT
ZZ
Active
Power Down Control
Standby, I = I
DD SB
L
Dual Cycle Deselect
Single Cycle Deselect
Single/Dual Cycle Deselect Control
FLXDrive Output Impedance Control
SCD
ZQ
H or NC
L
High Drive (Low Impedance)
Low Drive (High Impedance)
H or NC
Note:
There are pull-up devices on the ZQ, SCD, and FT pins and a pull-down device on the ZZ pin, so those input pins can be unconnected and the
chip will operate in the default states as specified in the above tables.
Burst Counter Sequences
Linear Burst Sequence
A[1:0] A[1:0] A[1:0] A[1:0]
Interleaved Burst Sequence
A[1:0] A[1:0] A[1:0] A[1:0]
1st address
2nd address
3rd address
4th address
00
01
10
11
01
10
11
00
10
11
00
01
11
00
01
10
1st address
2nd address
3rd address
4th address
00
01
10
11
01
00
11
10
10
11
00
01
11
10
01
00
Note:
The burst counter wraps to initial state on the 5th clock.
Note:
The burst counter wraps to initial state on the 5th clock.
BPR 1999.05.18
Rev: 1.03 8/2013
9/39
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
Byte Write Truth Table
Function
Read
GW
H
BW
H
L
BA
X
BB
X
BC
X
BD
X
Notes
1
Write No Bytes
Write byte a
Write byte b
Write byte c
Write byte d
Write all bytes
H
H
L
H
H
L
H
H
H
L
H
H
H
H
L
1
H
L
2, 3
H
L
H
H
H
L
2, 3
H
L
H
H
L
2, 3, 4
2, 3, 4
2, 3, 4
H
L
H
L
H
L
L
Write all bytes
L
X
X
X
X
X
Notes:
1. All byte outputs are active in read cycles regardless of the state of Byte Write Enable inputs, BA, BB, BC and/or BD.
2. Byte Write Enable inputs BA, BB, BC and/or BD may be used in any combination with BW to write single or multiple bytes.
3. All byte I/Os remain High-Z during all write operations regardless of the state of Byte Write Enable inputs.
4. Bytes “C” and “D” are only available on the x32 and x36 versions.
Rev: 1.03 8/2013
10/39
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
Synchronous Truth Table
State
Diagram
Key
Address
Used
3
Operation
E1
E2
E3
ADSP
ADSC
ADV
W
DQ
Deselect Cycle, Power Down
Deselect Cycle, Power Down
Deselect Cycle, Power Down
Deselect Cycle, Power Down
Deselect Cycle, Power Down
Read Cycle, Begin Burst
Read Cycle, Begin Burst
Write Cycle, Begin Burst
Read Cycle, Continue Burst
Read Cycle, Continue Burst
Write Cycle, Continue Burst
Write Cycle, Continue Burst
Read Cycle, Suspend Burst
Read Cycle, Suspend Burst
Write Cycle, Suspend Burst
Write Cycle, Suspend Burst
Notes:
None
None
X
X
L
L
L
L
H
L
L
L
X
H
X
H
X
H
X
H
X
L
H
X
H
X
X
L
L
L
X
X
X
X
X
X
X
X
X
X
L
L
L
X
X
X
X
X
X
X
X
L
L
L
L
H
H
H
H
X
X
X
X
X
X
F
T
F
F
T
T
F
F
T
T
High-Z
High-Z
None
X
X
L
X
X
L
High-Z
None
X
L
High-Z
None
X
X
H
H
H
X
X
X
X
X
X
X
X
X
L
High-Z
External
External
External
Next
R
X
L
Q
Q
D
Q
Q
D
D
Q
Q
D
D
R
H
H
H
X
H
X
H
X
H
X
W
CR
CR
CW
CW
L
H
H
H
H
H
H
H
H
Next
Next
Next
Current
Current
Current
Current
1. X = Don’t Care, H = High, L = Low
2. E = T (True) if E2 = 1 and E1 = E3 = 0; E = F (False) if E2 = 0 or E1 = 1 or E3 = 1
3. W = T (True) and F (False) is defined in the Byte Write Truth Table preceding.
4. G is an asynchronous input. G can be driven high at any time to disable active output drivers. G low can only enable active drivers (shown
as “Q” in the Truth Table above).
5. All input combinations shown above are tested and supported. Input combinations shown in gray boxes need not be used to accomplish
basic synchronous or synchronous burst operations and may be avoided for simplicity.
6. Tying ADSP high and ADSC low allows simple non-burst synchronous operations. See BOLD items above.
7. Tying ADSP high and ADV low while using ADSC to load new addresses allows simple burst operations. See ITALIC items above.
Rev: 1.03 8/2013
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GS832218/36A(B/D)-400/375/333/250/200/150
Simplified State Diagram
X
Deselect
W
R
W
R
X
R
X
First Write
First Read
CW
CR
CR
W
R
R
X
Burst Write
X
Burst Read
CR
CW
CR
Notes:
1. The diagram shows only supported (tested) synchronous state transitions. The diagram presumes G is tied low.
2. The upper portion of the diagram assumes active use of only the Enable (E1) and Write (BA, BB, BC, BD, BW, and GW) control inputs, and
that ADSP is tied high and ADSC is tied low.
3. The upper and lower portions of the diagram together assume active use of only the Enable, Write, and ADSC control inputs and
assumes ADSP is tied high and ADV is tied low.
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GS832218/36A(B/D)-400/375/333/250/200/150
Simplified State Diagram with G
X
Deselect
W
R
W
R
X
W
R
X
First Write
First Read
CR
CW
CW
CR
W
R
R
W
X
Burst Write
X
Burst Read
CR
CW
CW
CR
Notes:
1. The diagram shows supported (tested) synchronous state transitions plus supported transitions that depend upon the use of G.
2. Use of “Dummy Reads” (Read Cycles with G High) may be used to make the transition from read cycles to write cycles without passing
through a Deselect cycle. Dummy Read cycles increment the address counter just like normal read cycles.
3. Transitions shown in grey tone assume G has been pulsed high long enough to turn the RAM’s drivers off and for incoming data to meet
Data Input Set Up Time.
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GS832218/36A(B/D)-400/375/333/250/200/150
Absolute Maximum Ratings
(All voltages reference to V
)
SS
Symbol
VDD
VDDQ
VI/O
Description
Value
Unit
V
Voltage on VDD Pins
Voltage in VDDQ Pins
–0.5 to 4.6
–0.5 to VDD
V
–0.5 to VDD +0.5 ( 4.6 V max.)
–0.5 to VDD +0.5 ( 4.6 V max.)
Voltage on I/O Pins
Voltage on Other Input Pins
Input Current on Any Pin
Output Current on Any I/O Pin
Package Power Dissipation
Storage Temperature
V
VIN
V
IIN
+/–20
+/–20
mA
mA
W
IOUT
PD
1.5
oC
oC
TSTG
–55 to 125
–55 to 125
TBIAS
Temperature Under Bias
Note:
Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended
Operating Conditions. Exposure to conditions exceeding the Absolute Maximum Ratings, for an extended period of time, may affect reliability of
this component.
Power Supply Voltage Ranges
Parameter
Symbol
VDD3
Min.
3.0
Typ.
3.3
Max.
3.6
Unit
V
3.3 V Supply Voltage
VDD2
2.5 V Supply Voltage
2.3
2.5
2.7
V
3.3 V VDDQ I/O Supply Voltage
2.5 V VDDQ I/O Supply Voltage
VDDQ3
VDDQ2
3.0
3.3
3.6
V
2.3
2.5
2.7
V
V
Range Logic Levels
DD3
Parameter
Symbol
VIH
Min.
2.0
Typ.
—
Max.
Unit
V
VDD + 0.3
Input High Voltage
Input Low Voltage
VIL
–0.3
—
0.8
V
Notes:
1.
V
(max) must be met for any instantaneous value of V .
DD
IH
2.
V
needs to power-up before or at the same time as V
to make sure V (max) is not exceeded.
IH
DD
DDQ
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V
Range Logic Levels
DD2
Parameter
Symbol
VIH
Min.
Typ.
—
Max.
Unit
V
0.6*VDD
VDD + 0.3
0.3*VDD
Input High Voltage
Input Low Voltage
VIL
–0.3
—
V
Notes:
1.
V
(max) must be met for any instantaneous value of V .
DD
IH
2.
V
needs to power-up before or at the same time as V
to make sure V (max) is not exceeded.
IH
DD
DDQ
Operating Temperature
Parameter
Symbol
Min.
Typ.
Max.
Unit
Junction Temperature
(Commercial Range Versions)
TJ
0
25
85
C
C
Junction Temperature
(Industrial Range Versions)*
TJ
–40
25
100
Note:
* The part numbers of Industrial Temperature Range versions end with the character “I”. Unless otherwise noted, all performance specifications
quoted are evaluated for worst case in the temperature range marked on the device.
Thermal Impedance
Test PCB
Substrate
JA (C°/W)
Airflow = 0 m/s
JA (C°/W)
Airflow = 1 m/s
JA (C°/W)
Airflow = 2 m/s
Package
JB (C°/W)
JC (C°/W)
119 BGA
165 BGA
4-layer
4-layer
25.7
24.4
21.5
21.0
20.6
20.0
15.0
11.6
5.3
3.7
Notes:
1. Thermal Impedance data is based on a number of of samples from mulitple lots and should be viewed as a typical number.
2. Please refer to JEDEC standard JESD51-6.
3. The characteristics of the test fixture PCB influence reported thermal characteristics of the device. Be advised that a good thermal path to
the PCB can result in cooling or heating of the RAM depending on PCB temperature.
Undershoot Measurement and Timing
Overshoot Measurement and Timing
V
IH
20% tKC
V
+ 2.0 V
DD
V
SS
50%
50%
V
DD
V
– 2.0 V
SS
20% tKC
V
IL
Note:
Input Under/overshoot voltage must be –2 V > Vi < V +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
DDn
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GS832218/36A(B/D)-400/375/333/250/200/150
Capacitance
o
(T = 25 C, f = 1 MHZ, V = 2.5 V)
A
DD
Parameter
Symbol
CIN
Test conditions
VIN = 0 V
Typ.
Max.
Unit
pF
Input Capacitance
4
6
5
7
CI/O
VOUT = 0 V
Input/Output Capacitance
pF
Note:
These parameters are sample tested.
AC Test Conditions
Parameter
Conditions
VDD – 0.2 V
Input high level
Input low level
0.2 V
1 V/ns
VDD/2
Input slew rate
Input reference level
VDDQ/2
Output reference level
Output load
Fig. 1
Notes:
1. Include scope and jig capacitance.
2. Test conditions as specified with output loading as shown in Fig. 1 unless otherwise noted.
3. Device is deselected as defined by the Truth Table.
Output Load 1
DQ
*
50
30pF
V
DDQ/2
* Distributed Test Jig Capacitance
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GS832218/36A(B/D)-400/375/333/250/200/150
DC Electrical Characteristics
Parameter
Symbol
Test Conditions
Min
Max
Input Leakage Current
(except mode pins)
IIL
VIN = 0 to VDD
–1 uA
1 uA
VDD VIN VIH
0 V VIN VIH
–1 uA
–1 uA
1 uA
100 uA
IIN1
ZZ Input Current
VDD VIN VIL
0 V VIN VIL
–100 uA
–1 uA
1 uA
1 uA
IIN2
FT, SCD, ZQ Input Current
IOL
Output Disable, VOUT = 0 to VDD
IOH = –8 mA, VDDQ = 2.375 V
IOH = –8 mA, VDDQ = 3.135 V
IOL = 8 mA
Output Leakage Current
Output High Voltage
Output High Voltage
Output Low Voltage
–1 uA
1.7 V
2.4 V
—
1 uA
—
VOH2
VOH3
VOL
—
0.4 V
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GS832218/36A(B/D)-400/375/333/250/200/150
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GS832218/36A(B/D)-400/375/333/250/200/150
AC Electrical Characteristics
-400
-375
-333
-250
-200
-150
Parameter
Symbol
Min Max Min Max Min Max Min Max Min Max Min Max
Clock Cycle Time
tKC
tKQ
2.5
—
—
2.5
—
—
—
—
—
4.0
—
—
—
—
—
—
2.66
—
—
2.5
—
—
—
—
—
4.2
—
—
—
—
—
—
3.3
—
—
2.5
—
—
—
—
—
4.5
—
—
—
—
—
—
4.0
—
—
2.5
—
—
—
—
—
5.5
—
—
—
—
—
—
5.0
—
—
3.0
—
—
—
—
—
6.5
—
—
—
—
—
—
6.7
—
—
ns
Clock to Output Valid
3.8 ns
Clock to Output Invalid
Pipeline
tKQX
1.5
1.5
0.9
0.1
4.0
—
1.5
1.5
0.9
0.1
4.2
—
1.5
1.5
1.0
0.1
4.5
—
1.5
1.5
1.2
0.2
5.5
—
1.5
1.5
1.4
0.4
6.5
—
1.5
1.5
1.5
0.5
7.5
—
—
—
—
—
—
ns
ns
ns
ns
ns
1
Clock to Output in Low-Z
tLZ
Setup time
Hold time
tS
tH
Clock Cycle Time
Clock to Output Valid
tKC
tKQ
tKQX
7.5 ns
Clock to Output Invalid
2.0
2.0
1.2
0.2
0.9
1.1
2.0
2.0
1.2
0.2
0.9
1.1
2.0
2.0
1.3
0.3
1.0
1.2
2.0
2.0
1.5
0.5
1.3
1.5
2.0
2.0
1.5
0.5
1.3
1.5
2.0
2.0
1.5
0.5
1.5
1.7
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
Flow
Through
1
Clock to Output in Low-Z
Setup time
tLZ
tS
tH
Hold time
Clock HIGH Time
Clock LOW Time
tKH
tKL
Clock to Output in
High-Z
1
1.5
2.5
1.5
2.5
1.5 2.5 1.5 2.5 1.5
3.0 1.5 3.8 ns
tHZ
G to Output Valid
G to output in Low-Z
G to output in High-Z
ZZ setup time
tOE
—
0
2.5
—
2.5
—
—
—
—
0
2.5
—
2.5
—
—
—
—
0
2.5
—
2.5
—
—
—
—
0
2.5
—
2.5
—
—
—
—
0
3.0
—
3.0
—
—
—
—
0
3.8 ns
ns
3.8 ns
1
—
tOLZ
1
—
5
—
5
—
5
—
5
—
5
—
5
tOHZ
2
—
—
—
ns
ns
ns
tZZS
2
ZZ hold time
1
1
1
1
1
1
tZZH
ZZ recovery
tZZR
20
20
20
20
20
20
Notes:
1. These parameters are sampled and are not 100% tested.
2. ZZ is an asynchronous signal. However, in order to be recognized on any given clock cycle, ZZ must meet the specified setup and hold
times as specified above.
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Pipeline Mode Timing (SCD)
Begin
Read A Cont
Single Read
Cont
Deselect Write B Read C Read C+1 Read C+2 Read C+3 Cont
Deselect
Single Write
tKL
Burst Read
tKH
tKC
CK
ADSP
tS
tS
tH
ADSC initiated read
ADSC
ADV
tS
tH
tH
A
B
C
A0–An
GW
tS
tS
tH
tH
BW
tS
Ba–Bd
E1
tS
tS
tS
Deselected with E1
tH
E1 masks ADSP
tH
tH
E2 and E3 only sampled with ADSP and ADSC
E2
E3
G
tS
D(B)
tKQ
tKQX
tHZ
tOE
tOHZ
Q(A)
tH
tLZ
Q(C)
Q(C+1)
Q(C+2) Q(C+3)
DQa–DQd
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Flow Through Mode Timing (SCD)
Begin
Read A Cont
tKH
Cont
Write B Read C Read C+1 Read C+2 Read C+3 Read C Cont
Deselect
tKL
tKC
CK
Fixed High
ADSP
tS
tH
tS
tH
ADSC initiated read
ADSC
ADV
A0–An
GW
tS
tH
tS
tH
A
B
C
tS
tH
tS
tH
BW
tS
tH
Ba–Bd
E1
tS
tS
Deselected with E1
tH
tH
E2 and E3 only sampled with ADSC
E2
tS
tH
E3
G
tH
tS
tKQ
tLZ
tHZ
tOE
tOHZ
D(B)
tKQX
Q(A)
Q(C)
Q(C+1)
Q(C+2)
Q(C+3)
Q(C)
DQa–DQd
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Pipeline Mode Timing (DCD)
Begin
Read A Cont
Deselect Deselect Write B Read C Read C+1 Read C+2 Read C+3 Cont
tKL
Deselect Deselect
tKH
tKC
CK
ADSP
tS
tS
ADSC initiated read
tH
ADSC
ADV
tS
tH
tH
A
B
C
Ao–An
GW
tS
tS
tH
tH
BW
tS
Ba–Bd
E1
tS
tS
tS
Deselected with E1
tH
E2 and E3 only sampled with ADSC
tH
tH
E2
E3
G
tS
D(B)
tKQ
tHZ
tOE
tOHZ
Q(A)
tH
tLZ
tKQX
Hi-Z
Q(C)
Q(C+1)
Q(C+2)
Q(C+3)
DQa–DQd
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Flow Through Mode Timing (DCD)
Begin
Read A Cont
tKH
Deselect Write B
tKC
Read C Read C+1 Read C+2 Read C+3 Read C Deselect
tKL
CK
Fixed High
ADSP
tS
tH
tS
tH
ADSC initiated read
ADSC
ADV
Ao–An
GW
tH
tS
tS
tH
tS
tH
A
B
C
tS
tH
tS
tH
BW
tH
tS
Ba–Bd
E1
tS
Deselected with E1
tH
E1 masks ADSP
tS
tH
E2 and E3 only sampled with ADSP and ADSC
E1 masks ADSP
E2
tS
tH
E3
G
tH
tS
tOE
tKQ
tKQX
tHZ
tOHZ
D(B)
tLZ
Q(A)
Q(C)
Q(C+1)
Q(C+2)
Q(C+3)
Q(C)
DQa–DQd
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Sleep Mode
During normal operation, ZZ must be pulled low, either by the user or by its internal pull down resistor. When ZZ is pulled high,
the SRAM will enter a Power Sleep mode after 2 cycles. At this time, internal state of the SRAM is preserved. When ZZ returns to
low, the SRAM operates normally after ZZ recovery time.
Sleep mode is a low current, power-down mode in which the device is deselected and current is reduced to I 2. The duration of
SB
Sleep mode is dictated by the length of time the ZZ is in a High state. After entering Sleep mode, all inputs except ZZ become
disabled and all outputs go to High-Z The ZZ pin is an asynchronous, active high input that causes the device to enter Sleep mode.
When the ZZ pin is driven high, I 2 is guaranteed after the time tZZI is met. Because ZZ is an asynchronous input, pending
SB
operations or operations in progress may not be properly completed if ZZ is asserted. Therefore, Sleep mode must not be initiated
until valid pending operations are completed. Similarly, when exiting Sleep mode during tZZR, only a Deselect or Read commands
may be applied while the SRAM is recovering from Sleep mode.
Sleep Mode Timing
tKH
tKC
tKL
CK
Setup
Hold
ADSP
ADSC
tZZR
tZZS
tZZH
ZZ
Application Tips
Single and Dual Cycle Deselect
SCD devices (like this one) force the use of “dummy read cycles” (read cycles that are launched normally, but that are ended with
the output drivers inactive) in a fully synchronous environment. Dummy read cycles waste performance, but their use usually
assures there will be no bus contention in transitions from reads to writes or between banks of RAMs. DCD SRAMs do not waste
bandwidth on dummy cycles and are logically simpler to manage in a multiple bank application (wait states need not be inserted at
bank address boundary crossings), but greater care must be exercised to avoid excessive bus contention.
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JTAG Port Operation
Overview
The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan
interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with V . The JTAG output
DD
drivers are powered by V
.
DDQ
Disabling the JTAG Port
It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless
clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG
Port unused, TCK, TDI, and TMS may be left floating or tied to either V or V . TDO should be left unconnected.
DD
SS
JTAG Pin Descriptions
Pin
Pin Name
I/O
Description
Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate
from the falling edge of TCK.
TCK
Test Clock
In
The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP
TMS
TDI
Test Mode Select
Test Data In
In controller state machine. An undriven TMS input will produce the same result as a logic one input
level.
The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers
placed between TDI and TDO. The register placed between TDI and TDO is determined by the
In state of the TAP Controller state machine and the instruction that is currently loaded in the TAP
Instruction Register (refer to the TAP Controller State Diagram). An undriven TDI pin will produce
the same result as a logic one input level.
Output that is active depending on the state of the TAP state machine. Output changes in
Out response to the falling edge of TCK. This is the output side of the serial registers placed between
TDI and TDO.
TDO
Test Data Out
Note:
This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is
held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up.
JTAG Port Registers
Overview
The various JTAG registers, refered to as Test Access Port orTAP Registers, are selected (one at a time) via the sequences of 1s
and 0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the
rising edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the
TDI and TDO pins.
Instruction Register
The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or
the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the
TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the
controller is placed in Test-Logic-Reset state.
Bypass Register
The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through
the RAM’s JTAG Port to another device in the scan chain with as little delay as possible.
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Boundary Scan Register
The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins.
The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The
Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the
device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan
Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in
Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z,
SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register.
JTAG TAP Block Diagram
·
·
·
·
·
·
·
·
Boundary Scan Register
·
·
·
0
Bypass Register
2
1 0
Instruction Register
TDI
TDO
ID Code Register
31 30 29
2 1
0
·
· · ·
Control Signals
Test Access Port (TAP) Controller
TMS
TCK
* For the value of M, see the BSDL file, which is available at by contacting us at apps@gsitechnology.com.
Identification (ID) Register
The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in
Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM.
It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the
controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins.
Rev: 1.03 8/2013
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© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
ID Register Contents
GSI Technology
JEDEC Vendor
ID Code
Not Used
Bit # 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
0 1 1 0 1 1 0 0 1
0
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
0
Tap Controller Instruction Set
Overview
There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific
(Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be
implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load
address, data or control signals into the RAM or to preload the I/O buffers.
When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01.
When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired
instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the
TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this
device is listed in the following table.
Rev: 1.03 8/2013
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© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
JTAG Tap Controller State Diagram
Test Logic Reset
1
0
1
1
1
Run Test Idle
Select DR
Select IR
0
0
0
1
1
1
1
Capture DR
Capture IR
0
0
Shift DR
Shift IR
0
0
1
1
Exit1 DR
Exit1 IR
0
0
Pause DR
Pause IR
0
0
0
0
1
1
Exit2 DR
Exit2 IR
1
1
Update DR
Update IR
1
0
1
0
Instruction Descriptions
BYPASS
When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This
occurs when the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facili-
tate testing of other devices in the scan path.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is
loaded in the Instruction Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and
I/O buffers into the Boundary Scan Register. Boundary Scan Register locations are not associated with an input or I/O pin, and
are loaded with the default state identified in the Boundary Scan Chain table at the end of this section of the datasheet. Because
the RAM clock is independent from the TAP Clock (TCK) it is possible for the TAP to attempt to capture the I/O ring contents
while the input buffers are in transition (i.e. in a metastable state). Although allowing the TAP to sample metastable inputs will
not harm the device, repeatable results cannot be expected. RAM input signals must be stabilized for long enough to meet the
TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP
operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-DR state then
places the boundary scan register between the TDI and TDO pins.
EXTEST
EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with
all logic 0s. The EXTEST command does not block or override the RAM’s input pins; therefore, the RAM’s internal state is
still determined by its input pins.
Rev: 1.03 8/2013
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© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command.
Then the EXTEST command is used to output the Boundary Scan Register’s contents, in parallel, on the RAM’s data output
drivers on the falling edge of TCK when the controller is in the Update-IR state.
Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruc-
tion is selected, the sate of all the RAM’s input and I/O pins, as well as the default values at Scan Register locations not asso-
ciated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR
state, the RAM’s output pins drive out the value of the Boundary Scan Register location with which each output pin is associ-
ated.
IDCODE
The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and
places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction
loaded in at power up and any time the controller is placed in the Test-Logic-Reset state.
SAMPLE-Z
If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (high-
Z) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR
state.
RFU
These instructions are Reserved for Future Use. In this device they replicate the BYPASS instruction.
JTAG TAP Instruction Set Summary
Instruction
EXTEST
Code
000
Description
Notes
1
Places the Boundary Scan Register between TDI and TDO.
Preloads ID Register and places it between TDI and TDO.
IDCODE
001
1, 2
Captures I/O ring contents. Places the Boundary Scan Register between TDI and
SAMPLE-Z
RFU
010
011
TDO.
1
1
Forces all RAM output drivers to High-Z.
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
SAMPLE/
PRELOAD
Captures I/O ring contents. Places the Boundary Scan Register between TDI and
TDO.
100
101
110
111
1
1
1
1
GSI
RFU
GSI private instruction.
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
BYPASS
Places Bypass Register between TDI and TDO.
Notes:
1. Instruction codes expressed in binary, MSB on left, LSB on right.
2. Default instruction automatically loaded at power-up and in test-logic-reset state.
Rev: 1.03 8/2013
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© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
JTAG Port Recommended Operating Conditions and DC Characteristics (2.5/3.3 V Version)
Parameter
Symbol
Min.
Max.
Unit Notes
V
0.6 * V
V
+0.3
DD2
2.5 V Test Port Input High Voltage
2.5 V Test Port Input Low Voltage
3.3 V Test Port Input High Voltage
3.3 V Test Port Input Low Voltage
TMS, TCK and TDI Input Leakage Current
TMS, TCK and TDI Input Leakage Current
TDO Output Leakage Current
V
V
1
1
IHJ2
DD2
V
–0.3
0.3 * V
DD2
ILJ2
V
V
+0.3
DD3
2.0
–0.3
–300
–1
V
1
IHJ3
V
0.8
V
1
ILJ3
I
1
100
1
uA
uA
uA
V
2
INHJ
I
3
INLJ
I
–1
4
OLJ
V
Test Port Output High Voltage
1.7
—
0.4
—
5, 6
5, 7
5, 8
5, 9
OHJ
V
Test Port Output Low Voltage
—
V
OLJ
V
V
– 100 mV
DDQ
Test Port Output CMOS High
V
OHJC
V
Test Port Output CMOS Low
—
100 mV
V
OLJC
Notes:
1. Input Under/overshoot voltage must be –2 V < Vi < V
+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tTKC.
DDn
2.
V
V V
ILJ
IN
DDn
3. 0 V V V
IN
ILJn
4. Output Disable, V
= 0 to V
DDn
OUT
5. The TDO output driver is served by the V
supply.
DDQ
6.
7.
8.
9.
I
I
I
I
= –4 mA
OHJ
= + 4 mA
OLJ
= –100 uA
= +100 uA
OHJC
OLJC
JTAG Port AC Test Conditions
Parameter
Conditions
JTAG Port AC Test Load
DQ
V
– 0.2 V
Input high level
Input low level
DD
0.2 V
1 V/ns
*
50
30pF
Input slew rate
V
/2
DDQ
V
V
/2
Input reference level
DDQ
* Distributed Test Jig Capacitance
/2
Output reference level
DDQ
Notes:
1. Include scope and jig capacitance.
2. Test conditions as shown unless otherwise noted.
Rev: 1.03 8/2013
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© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
JTAG Port Timing Diagram
tTKC
tTKH
tTKL
TCK
tTH
tTH
tTS
tTS
TDI
TMS
TDO
tTKQ
tTH
tTS
Parallel SRAM input
JTAG Port AC Electrical Characteristics
Parameter
Symbol
tTKC
tTKQ
tTKH
tTKL
tTS
Min
Max
—
Unit
TCK Cycle Time
50
—
ns
ns
ns
ns
ns
ns
TCK Low to TDO Valid
TCK High Pulse Width
TCK Low Pulse Width
TDI & TMS Set Up Time
TDI & TMS Hold Time
Boundary Scan (BSDL Files)
20
—
20
20
10
10
—
—
tTH
—
For information regarding the Boundary Scan Chain, or to obtain BSDL files for this part, please contact our Applications
Engineering Department at: apps@gsitechnology.com.
Rev: 1.03 8/2013
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© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
Package Dimensions—119-Bump FPBGA (Package B, Variation 2)
TOP VIEW
BOTTOM VIEW
A1
A1
S
Ø0.10
C
S
S
S
Ø0.30 C A
B
Ø0.60~0.90 (119x)
1
2
3
4
5
6
7
7
6
5
4 3
2
1
A
B
C
D
E
F
A
B
C
D
E
F
G
H
J
G
H
J
K
L
M
N
P
R
T
U
K
L
M
N
P
R
T
U
B
1.27
7.62
14±0.10
A
0.20(4x)
SEATING PLANE
C
Rev: 1.03 8/2013
32/39
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
Package Dimensions—165-Bump FPBGA (Package D)
A1 CORNER
TOP VIEW
BOTTOM VIEW
A1 CORNER
M
M
Ø0.10
C
Ø0.25 C A B
Ø0.40~0.60 (165x)
1
2 3 4 5 6 7 8 9 10 11
11 10 9 8
7 6 5 4 3 2 1
A
B
C
D
E
F
A
B
C
D
E
F
G
H
J
G
H
J
K
L
K
L
M
N
P
R
M
N
P
R
A
1.0
10.0
1.0
13±0.05
B
0.20(4x)
SEATING PLANE
C
Rev: 1.03 8/2013
33/39
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
Ordering Information for GSI Synchronous Burst RAMs
2
Speed
3
1
Org
Type
Package
T
Part Number
J
(MHz/ns)
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
GS832218AB-400
GS832218AB-375
GS832218AB-333
GS832218AB-300
GS832218AB-250
GS832218AB-200
GS832218AB-150
GS832218AD-400
GS832218AD-375
GS832218AD-333
GS832218AD-300
GS832218AD-250
GS832218AD-200
GS832218AD-150
GS832236AB-400
GS832236AB-375
GS832236AB-333
GS832236AB-300
GS832236AB-250
GS832236AB-200
GS832236AB-150
GS832236AD-400
GS832236AD-375
GS832236AD-333
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
119 BGA (var.2)
119 BGA (var.2)
119 BGA (var.2)
119 BGA (var.2)
119 BGA (var.2)
119 BGA (var.2)
119 BGA (var.2)
165 BGA
400/4.0
375/4.2
333/4.5
300/5.0
250/5.5
200/6.5
150/7.5
400/4.0
375/4.2
333/4.5
300/5.0
250/5.5
200/6.5
150/7.5
400/4.0
375/4.2
333/4.5
300/5.0
250/5.5
200/6.5
150/7.5
400/4.0
375/4.2
333/4.5
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
165 BGA
165 BGA
165 BGA
165 BGA
165 BGA
165 BGA
119 BGA (var.2)
119 BGA (var.2)
119 BGA (var.2)
119 BGA (var.2)
119 BGA (var.2)
119 BGA (var.2)
119 BGA (var.2)
165 BGA
165 BGA
165 BGA
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS832218AB-150IB.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3. C = Commercial Temperature Range. I = Industrial Temperature Range.
4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are
covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.03 8/2013
34/39
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
Ordering Information for GSI Synchronous Burst RAMs (Continued)
2
Speed
3
1
Org
Type
Package
T
Part Number
J
(MHz/ns)
300/5.0
250/5.5
200/6.5
150/7.5
400/4.0
375/4.2
333/4.5
300/5.0
250/5.5
200/6.5
150/7.5
400/4.0
375/4.2
333/4.5
300/5.0
250/5.5
200/6.5
150/7.5
400/4.0
375/4.2
333/4.5
300/5.0
250/5.5
200/6.5
150/7.5
1M x 36
1M x 36
1M x 36
1M x 36
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
GS832236AD-300
GS832236AD-250
GS832236AD-200
GS832236AD-150
GS832218AB-400I
GS832218AB-375I
GS832218AB-333I
GS832218AB-300I
GS832218AB-250I
GS832218AB-200I
GS832218AB-150I
GS832218AD-400I
GS832218AD-375I
GS832218AD-333I
GS832218AD-300I
GS832218AD-250I
GS832218AD-200I
GS832218AD-150I
GS832236AB-400I
GS832236AB-375I
GS832236AB-333I
GS832236AB-300I
GS832236AB-250I
GS832236AB-200I
GS832236AB-150I
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
165 BGA
165 BGA
C
C
C
C
I
165 BGA
165 BGA
119 BGA (var.2)
119 BGA (var.2)
119 BGA (var.2)
119 BGA (var.2)
119 BGA (var.2)
119 BGA (var.2)
119 BGA (var.2)
165 BGA
I
I
I
I
I
I
I
165 BGA
I
165 BGA
I
165 BGA
I
165 BGA
I
165 BGA
I
165 BGA
I
119 BGA (var.2)
119 BGA (var.2)
119 BGA (var.2)
119 BGA (var.2)
119 BGA (var.2)
119 BGA (var.2)
119 BGA (var.2)
I
I
I
I
I
I
I
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS832218AB-150IB.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3. C = Commercial Temperature Range. I = Industrial Temperature Range.
4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are
covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.03 8/2013
35/39
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
Ordering Information for GSI Synchronous Burst RAMs (Continued)
2
Speed
3
1
Org
Type
Package
T
Part Number
J
(MHz/ns)
400/4.0
375/4.2
333/4.5
300/5.0
250/5.5
200/6.5
150/7.5
400/4.0
375/4.2
333/4.5
300/5.0
250/5.5
200/6.5
150/7.5
400/4.0
375/4.2
333/4.5
300/5.0
250/5.5
200/6.5
150/7.5
400/4.0
375/4.2
333/4.5
300/5.0
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
1M x 36
1M x 36
1M x 36
1M x 36
GS832236AD-400I
GS832236AD-375I
GS832236AD-333I
GS832236AD-300I
GS832236AD-250I
GS832236AD-200I
GS832236AD-150I
GS832218AGB-400
GS832218AGB-375
GS832218AGB-333
GS832218AGB-300
GS832218AGB-250
GS832218AGB-200
GS832218AGB-150
GS832218AGD-400
GS832218AGD-375
GS832218AGD-333
GS832218AGD-300
GS832218AGD-250
GS832218AGD-200
GS832218AGD-150
GS832236AGB-400
GS832236AGB-375
GS832236AGB-333
GS832236AGB-300
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
165 BGA
I
I
I
I
I
I
I
165 BGA
165 BGA
165 BGA
165 BGA
165 BGA
165 BGA
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS832218AB-150IB.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3. C = Commercial Temperature Range. I = Industrial Temperature Range.
4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are
covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.03 8/2013
36/39
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
Ordering Information for GSI Synchronous Burst RAMs (Continued)
2
Speed
3
1
Org
Type
Package
T
Part Number
J
(MHz/ns)
250/5.5
200/6.5
150/7.5
400/4.0
375/4.2
333/4.5
300/5.0
250/5.5
200/6.5
150/7.5
400/4.0
375/4.2
333/4.5
300/5.0
250/5.5
200/6.5
150/7.5
400/4.0
375/4.2
333/4.5
300/5.0
250/5.5
200/6.5
150/7.5
400/4.0
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
1M x 36
GS832236AGB-250
GS832236AGB-200
GS832236AGB-150
GS832236AGD-400
GS832236AGD-375
GS832236AGD-333
GS832236AGD-300
GS832236AGD-250
GS832236AGD-200
GS832236AGD-150
GS832218AGB-400I
GS832218AGB-375I
GS832218AGB-333I
GS832218AGB-300I
GS832218AGB-250I
GS832218AGB-200I
GS832218AGB-150I
GS832218AGD-400I
GS832218AGD-375I
GS832218AGD-333I
GS832218AGD-300I
GS832218AGD-250I
GS832218AGD-200I
GS832218AGD-150I
GS832236AGB-400I
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 165 BGA
C
C
C
C
C
C
C
C
C
C
I
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 165 BGA
I
I
I
I
I
I
I
RoHS-compliant 165 BGA
I
RoHS-compliant 165 BGA
I
RoHS-compliant 165 BGA
I
RoHS-compliant 165 BGA
I
RoHS-compliant 165 BGA
I
RoHS-compliant 165 BGA
I
RoHS-compliant 119 BGA (var.2)
I
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS832218AB-150IB.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3. C = Commercial Temperature Range. I = Industrial Temperature Range.
4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are
covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.03 8/2013
37/39
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
Ordering Information for GSI Synchronous Burst RAMs (Continued)
2
Speed
3
1
Org
Type
Package
T
Part Number
J
(MHz/ns)
375/4.2
333/4.5
300/5.0
250/5.5
200/6.5
150/7.5
400/4.0
375/4.2
333/4.5
300/5.0
250/5.5
200/6.5
150/7.5
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
GS832236AGB-375I
GS832236AGB-333I
GS832236AGB-300I
GS832236AGB-250I
GS832236AGB-200I
GS832236AGB-150I
GS832236AGD-400I
GS832236AGD-375I
GS832236AGD-333I
GS832236AGD-300I
GS832236AGD-250I
GS832236AGD-200I
GS832236AGD-150I
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 119 BGA (var.2)
RoHS-compliant 165 BGA
I
I
I
I
I
I
I
I
I
I
I
I
I
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
RoHS-compliant 165 BGA
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS832218AB-150IB.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3. C = Commercial Temperature Range. I = Industrial Temperature Range.
4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are
covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.03 8/2013
38/39
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS832218/36A(B/D)-400/375/333/250/200/150
36Mb Sync SRAM Datasheet Revision History
Types of Changes
File Name
Page;Revisions;Reason
Format or Content
• Creation of new datasheet
8322xxA_r1
• Updated Absolute Maximum Ratings
• Added thermal information
8322xxA_r1_01
Content
• Updated to reflect MP status
• Updated Op current numbers
8322xxA_r1_02
8322xxA_r1_03
Content
Content
Rev: 1.03 8/2013
39/39
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
相关型号:
GS832218AGD-375
Cache SRAM, 2MX18, 4.2ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
GSI
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