GS8342S09E-250 [GSI]
36Mb Burst of 2 DDR SigmaSIO-II SRAM; 2个DDR SigmaSIO -II SRAM 36MB爆型号: | GS8342S09E-250 |
厂家: | GSI TECHNOLOGY |
描述: | 36Mb Burst of 2 DDR SigmaSIO-II SRAM |
文件: | 总39页 (文件大小:1709K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
167 MHz–333 MHz
165-Bump BGA
Commercial Temp
Industrial Temp
36Mb Burst of 2
DDR SigmaSIO-II SRAM
1.8 V V
DD
1.8 V and 1.5 V I/O
Features
• Simultaneous Read and Write SigmaSIO™ Interface
• JEDEC-standard pinout and package
• Dual Double Data Rate interface
• Byte Write controls sampled at data-in time
• DLL circuitry for wide output data valid window and future
frequency scaling
• Burst of 2 Read and Write
• 1.8 V +100/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• Pipelined read operation
• Fully coherent read and write pipelines
• ZQ mode pin for programmable output drive strength
• IEEE 1149.1 JTAG-compliant Boundary Scan
• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package
• RoHS-compliant 165-bump BGA package available
• Pin-compatible with future 72Mb and 144Mb devices
Bottom View
165-Bump, 15 mm x 17 mm BGA
1 mm Bump Pitch, 11 x 15 Bump Array
JEDEC Std. MO-216, Variation CAB-1
SigmaRAM™ Family Overview
Clocking and Addressing Schemes
GS8342S08/09/18/36 are built in compliance with the
SigmaSIO-II SRAM pinout standard for Separate I/O
synchronous SRAMs. They are 37,748,736-bit (36Mb)
SRAMs. These are the first in a family of wide, very low
voltage HSTL I/O SRAMs designed to operate at the speeds
needed to implement economical high performance
networking systems.
A Burst of 2 SigmaSIO-II SRAM is a synchronous device. It
employs dual input register clock inputs, K and K. The device
also allows the user to manipulate the output register clock
input quasi independently with dual output register clock
inputs, C and C. If the C clocks are tied high, the K clocks are
routed internally to fire the output registers instead. Each Burst
of 2 SigmaSIO-II SRAM also supplies Echo Clock outputs,
CQ and CQ, which are synchronized with read data output.
When used in a source synchronous clocking scheme, the Echo
Clock outputs can be used to fire input registers at the data’s
destination.
Because Separate I/O Burst of 2 RAMs always transfer data in
two packets, A0 is internally set to 0 for the first read or write
transfer, and automatically incremented by 1 for the next
transfer. Because the LSB is tied off internally, the address
field of a Burst of 2 RAM is always one address pin less than
the advertised index depth (e.g., the 2M x 18 has a 1M
addressable index).
Parameter Synopsis
- 333
3.0 ns
0.45 ns
-300
3.3 ns
-250
4.0 ns
0.45 ns
-200
5.0 ns
0.45 ns
-167
tKHKH
tKHQV
6.0 ns
0.5 ns
0.45 ns
Rev: 1.02 8/2005
1/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
4M x 8 SigmaQuad SRAM—Top View
1
2
3
4
5
6
7
8
9
10
11
V
/SA
SS
A
CQ
SA
R/W
NW1
K
NC
LD
SA
SA
CQ
(72Mb)
B
C
D
E
F
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
Q4
NC
Q5
SA
NC
SA
K
NW0
SA
SA
NC
NC
NC
NC
NC
NC
NC
NC
NC
D2
Q3
D3
NC
Q2
NC
NC
ZQ
D1
NC
Q0
D0
NC
NC
TDI
NC
D4
NC
NC
D5
V
V
SA
V
SS
SS
SS
SS
V
V
V
V
V
V
SS
SS
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD
DD
DD
DD
DD
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
V
V
V
V
V
V
V
V
V
V
V
NC
NC
DDQ
DDQ
DDQ
DDQ
DDQ
G
H
J
V
V
V
D
V
V
V
V
REF
OFF
REF
DDQ
DDQ
NC
NC
NC
Q6
NC
NC
Q1
K
L
NC
NC
NC
D6
NC
NC
Q7
SA
V
NC
NC
NC
NC
NC
SA
NC
NC
V
V
V
V
V
DDQ
SS
SS
SS
SS
M
N
P
R
NC
NC
D7
V
V
NC
SS
SS
SS
SS
NC
V
SA
SA
SA
SA
C
SA
SA
SA
V
NC
NC
NC
TCK
SA
SA
SA
SA
NC
TDO
C
TMS
11 x 15 Bump BGA—15 x 17 mm Body—1 mm Bump Pitch
2
Notes:
1. Expansion addresses: A2 for 72Mb
2. NW0 controls writes to D0:D3. NW1 controls writes to D4:D7.
3. It is recommended that H1 be tied low for compatibility with future devices.
Rev: 1.02 8/2005
2/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
4M x 9 SigmaQuad SRAM—Top View
1
2
3
4
5
6
7
8
9
10
11
A
B
C
D
E
F
CQ
V
SA
R/W
NC
K
NC
LD
SA
SA
CQ
SS
NC
NC
NC
NC
NC
NC
Doff
NC
NC
NC
NC
NC
NC
TDO
NC
NC
NC
NC
Q5
NC
Q6
SA
NC
SA
K
BW
SA
SA
NC
NC
NC
NC
NC
NC
NC
NC
NC
D3
Q4
D4
NC
Q3
NC
NC
ZQ
D2
NC
Q1
D1
NC
NC
TDI
NC
D5
NC
NC
D6
V
V
SA
V
SS
SS
SS
SS
V
V
V
V
V
V
SS
SS
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD
DD
DD
DD
DD
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
V
V
V
V
V
V
V
V
V
V
V
NC
NC
DDQ
DDQ
DDQ
DDQ
DDQ
G
H
J
V
V
V
V
V
V
V
REF
REF
DDQ
DDQ
NC
NC
NC
Q2
K
L
NC
Q7
NC
D7
NC
NC
Q8
SA
V
NC
NC
NC
NC
NC
SA
NC
NC
V
V
V
V
V
DDQ
SS
SS
SS
SS
M
N
P
R
NC
D8
V
V
NC
SS
SS
SS
SS
V
SA
SA
SA
SA
C
SA
SA
SA
V
NC
NC
TCK
SA
SA
SA
SA
D0
C
TMS
2
11 x 15 Bump BGA—15 x 17 mm Body—1 mm Bump Pitch
Notes:
4. Expansion addresses: A2 for 72Mb
5. NW0 controls writes to D0:D3. NW1 controls writes to D4:D7.
6. It is recommended that H1 be tied low for compatibility with future devices.
Rev: 1.02 8/2005
3/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
2M x 18 SigmaQuad SRAM—Top View
1
2
3
4
5
6
7
8
9
10
/SA
11
V
/SA
V
SS
SS
A
CQ
SA
R/W
BW1
K
NC
LD
SA
CQ
(144Mb)
(72Mb)
B
C
D
E
F
NC
NC
NC
NC
NC
NC
Q9
D9
SA
NC
SA
K
BW0
SA
SA
NC
NC
NC
NC
NC
NC
NC
Q8
D8
D7
Q6
Q5
D5
ZQ
D4
Q3
Q2
D2
D1
Q0
TDI
NC
D11
NC
D10
Q10
Q11
D12
Q13
V
V
SA
V
Q7
NC
D6
NC
NC
SS
SS
SS
SS
V
V
V
V
V
V
SS
SS
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD
DD
DD
DD
DD
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
Q12
D13
V
V
V
V
V
V
V
V
V
V
V
DDQ
DDQ
DDQ
DDQ
DDQ
G
H
J
V
V
V
D
V
V
V
V
REF
OFF
REF
DDQ
DDQ
NC
NC
NC
D14
Q14
D15
D16
Q16
Q17
SA
NC
Q4
D3
K
L
NC
NC
V
NC
NC
NC
NC
NC
SA
Q15
NC
V
V
V
V
V
NC
Q1
DDQ
SS
SS
SS
SS
M
N
P
R
NC
V
V
SS
SS
SS
SS
NC
D17
NC
V
SA
SA
SA
SA
C
SA
SA
SA
V
NC
D0
NC
SA
SA
SA
SA
TDO
TCK
C
TMS
2
11 x 15 Bump BGA—15 x 17 mm Body—1 mm Bump Pitch
Notes:
1. Expansion addresses: A10 for 72Mb, A2 for 144Mb
2. BW0 controls writes to D0:D8. BW1 controls writes to D9:D17.
3. It is recommended that H1 be tied low for compatibility with future devices.
Rev: 1.02 8/2005
4/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
1M x 36 SigmaQuad SRAM—Top View
1
2
3
4
5
6
7
8
9
10
/SA
11
V
/SA
NC/SA
V
SS
SS
A
CQ
R/W
BW2
K
BW1
LD
SA
CQ
(288Mb) (72Mb)
(144Mb)
B
C
D
E
F
Q27
D27
D28
Q29
Q30
D30
Q18
Q28
D20
D29
Q21
D22
D18
D19
Q19
Q20
D21
Q22
SA
BW3
SA
K
BW0
SA
SA
D17
D16
Q16
Q15
D14
Q13
Q17
Q8
D8
D7
Q6
Q5
D5
ZQ
D4
Q3
Q2
D2
D1
Q0
TDI
V
V
SA
V
Q7
D15
D6
SS
SS
SS
SS
V
V
V
V
V
V
SS
SS
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD
DD
DD
DD
DD
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
V
V
V
V
V
V
V
V
V
V
V
Q14
D13
DDQ
DDQ
DDQ
DDQ
DDQ
G
H
J
V
V
V
D
V
V
V
V
REF
OFF
REF
DDQ
DDQ
D31
Q31
D23
Q23
D24
D25
Q25
Q26
SA
D12
Q12
D11
D10
Q10
Q9
Q4
D3
K
L
Q32
Q33
D33
D34
Q35
TDO
D32
Q24
Q34
D26
D35
TCK
V
V
V
V
V
V
Q11
Q1
DDQ
SS
SS
SS
SS
M
N
P
R
V
V
SS
SS
SS
SS
V
SA
SA
SA
SA
C
SA
SA
SA
V
D9
SA
SA
SA
SA
D0
C
SA
TMS
2
11 x 15 Bump BGA—15 x 17 mm Body—1 mm Bump Pitch
Notes:
1. Expansion addresses: A3 for 72Mb, A10 for 144Mb, A2 for 288Mb
2. BW0 controls writes to D0:D8. BW1 controls writes to D9:D17.
3. BW2 controls writes to D18:D26. BW3 controls writes to D27:D35.
4. It is recommended that H1 be tied low for compatibility with future devices.
Rev: 1.02 8/2005
5/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
Pin Description Table
Symbol
SA
Description
Synchronous Address Inputs
No Connect
Type
Input
—
Comments
—
NC
—
R/W
Read/Write Contol Pin
Input
Write Active Low; Read Active High
Active Low
x08 Version
NW0–NW1
BW0–BW1
BW0–BW3
Synchronous Nybble Writes
Synchronous Byte Writes
Synchronous Byte Writes
Input
Input
Input
Active Low
x18 Version
Active Low
x36 Version
K
Input Clock
Output Clock
Input
Input
Input
Input
Input
Output
Input
Input
Input
Output
—
Active High
Active High
—
C
TMS
TDI
TCK
TDO
Test Mode Select
Test Data Input
—
Test Clock Input
—
Test Data Output
—
V
HSTL Input Reference Voltage
Output Impedance Matching Input
Input Clock
—
REF
ZQ
K
—
Active Low
Active Low
Active Low
Active Low
Active Low
Active High
C
Output Clock
D
DLL Disable
OFF
LD
CQ
CQ
Dn
Qn
Synchronous Load Pin
Output Echo Clock
Output Echo Clock
Synchronous Data Inputs
Synchronous Data Outputs
Power Supply
—
Output
Output
Input
Output
Supply
V
1.8 V Nominal
1.8 or 1.5 V Nominal
—
DD
V
Isolated Output Buffer Supply
Power Supply: Ground
Supply
Supply
DDQ
V
SS
Notes:
1. C, C, K, or K cannot be set to V
voltage.
REF
2. When ZQ pin is directly connected to V , output impedance is set to minimum value and it cannot be connected to ground or left
DD
unconnected.
3. NC = Not Connected to die or any other pin
Rev: 1.02 8/2005
6/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
Background
Separate I/O SRAMs, like SigmaQuad SRAMs, are attractive in applications where alternating reads and writes are needed. On the
other hand, Common I/O SRAMs like the SigmaCIO family are popular in applications where bursts of read or write traffic are
needed. The SigmaSIO SRAM is a hybrid of these two devices. Like the SigmaQuad family devices, the SigmaSIO features a
separate I/O data path, offering the user independent Data In and Data Out pins. However, the SigmaSIO devices offer a control
protocol like that offered on the SigmaCIO devices. Therefore, while SigmaQuad SRAMs allow a user to operate both data ports at
the same time, they force alternating loads of read and write addresses. SigmaSIO SRAMs allow continuous loads of read or write
addresses like SigmaCIO SRAMs, but in a separate I/O configuration.
Like a SigmaQuad SRAM, a SigmaSIO-II SRAM can execute an alternating sequence of reads and writes. However, doing so
results in the Data In port and the Data Out port stalling with nothing to do on alternate transfers. A SigmaQuad device would keep
both ports running at capacity full time. On the other hand, the SigmaSIO device can accept a continuous stream of read commands
and read data or a continuous stream of write commands and write data. The SigmaQuad device, by contrast, restricts the user from
loading a continuous stream of read or write addresses. The advantage of the SigmaSIO device is that it allows twice the random
address bandwidth for either reads or writes than could be acheived with a SigmaQuad version of the device. SigmaCIO SRAMs
offer this same advantage, but do not have the separate Data In and Data Out pins offered on the SigmaSIO SRAMs. Therefore,
SigmaSIO devices are useful in psuedo dual port SRAM applications where communication of burst traffic between two
electrically independent busses is desired.
Each of the three SigmaQuad Family SRAMs—SigmaQuad, SigmaCIO, and SigmaSIO—supports similar address rates because
random address rate is determined by the internal performance of the RAM. In addition, all three SigmaQuad Family SRAMs are
based on the same internal circuits. Differences between the truth tables of the different devices proceed from differences in how
the RAM’s interface is contrived to interact with the rest of the system. Each mode of operation has its own advantages and
disadvantages. The user should consider the nature of the work to be done by the RAM to evaluate which version is best suited to
the application at hand.
Burst of 2 Sigma SIO-II SRAM DDR Read
The status of the Address Input, R/W, and LD pins are sampled at each rising edge of K. LD high causes chip disable. A high on
the R/W pin begins a read cycle. The two resulting data output transfers begin after the next rising edge of the K clock. Data is
clocked out by the next rising edge of the C if it is active. Otherwise, data is clocked out at the next rising edge of K. The next data
chunk is clocked out on the rising edge of C, if active. Otherwise, data is clocked out on the rising edge of K.
Burst of 2 Sigma SIO-II SRAM DDR Write
The status of the Address Input, R/W, and LD pins are sampled at each rising edge of K. LD high causes chip disable. A low on the
R/W pin, begins a write cycle. Data is clocked in by the next rising edge of K and then the rising edge of K.
Rev: 1.02 8/2005
7/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
Special Functions
Byte Write and Nybble Write Control
Byte Write Enable pins are sampled at the same time that Data In is sampled. A high on the Byte Write Enable pin associated with
a particular byte (e.g., BW0 controls D0–D8 inputs) will inhibit the storage of that particular byte, leaving whatever data may be
stored at the current address at that byte location undisturbed. Any or all of the Byte Write Enable pins may be driven high or low
during the data in sample times in a write sequence.
Each write enable command and write address loaded into the RAM provides the base address for a 2 beat data transfer. The x18
version of the RAM, for example, may write 36 bits in association with each address loaded. Any 9-bit byte may be masked in any
write sequence.
Nybble Write (4-bit) control is implemented on the 8-bit-wide version of the device. For the x8 version of the device, “Nybble
Write Enable” and “NWx” may be substituted in all the discussion above.
Example x18 RAM Write Sequence using Byte Write Enables
Data In Sample
BW0
BW1
D0–D8
D9–D17
Time
Beat 1
Beat 2
0
1
1
0
Data In
Don’t Care
Data In
Don’t Care
Resulting Write Operation
Beat 1
Beat 2
D9–D17
D0–D8
D9–D17
D0–D8
Written
Unchanged
Unchanged
Written
Output Register Control
SigmaSIO-II SRAMs offer two mechanisms for controlling the output data registers. Typically, control is handled by the Output
Register Clock inputs, C and C. The Output Register Clock inputs can be used to make small phase adjustments in the firing of the
output registers by allowing the user to delay driving data out as much as a few nanoseconds beyond the next rising edges of the K
and K clocks. If the C and C clock inputs are tied high, the RAM reverts to K and K control of the outputs.
Rev: 1.02 8/2005
8/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
Example Four Bank Depth Expansion Schematic
R/W
3
LD
3
R/W
2
LD
2
R/W
1
LD
R/W
1
0
LD
0
A –A
0
n
K
D –D
1
n
Bank 3
Bank 1
Bank 2
Bank 0
A
A
A
A
R/W
R/W
R/W
R/W
LD
LD
K
LD
K
LD
K
K
D
C
Q
D
C
Q
D
C
Q
D
C
Q
C
Q –Q
1
n
Note:
For simplicity BWn is not shown.
Rev: 1.02 8/2005
9/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
Rev: 1.02 8/2005
10/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
FLXDrive-II Output Driver Impedance Control
HSTL I/O SigmaSIO-II SRAMs are supplied with programmable impedance output drivers. The ZQ pin must be connected to V
SS
via an external resistor, RQ, to allow the SRAM to monitor and adjust its output driver impedance. The value of RQ must be 5X the
value of the intended line impedance driven by the SRAM. The allowable range of RQ to guarantee impedance matching with a
vendor-specified tolerance is between 150Ω and 300Ω. Periodic readjustment of the output driver impedance is necessary as the
impedance is affected by drifts in supply voltage and temperature. The SRAM’s output impedance circuitry compensates for drifts
in supply voltage and temperature every 1024 cycles. A clock cycle counter periodically triggers an impedance evaluation, resets
and counts again. Each impedance evaluation may move the output driver impedance level one step at a time towards the optimum
level. The output driver is implemented with discrete binary weighted impedance steps. Impedance updates for “0s” occur
whenever the SRAM is driving “1s” for the same DQs (and vice-versa for “1s”) or the SRAM is in HI-Z.
Separate I/O Burst of 2 Sigma SIO-II SRAM Truth Table
Current
A
LD
R/W
D
D
Q
Q
Operation
K ↑
K ↑
K ↑
K ↑
K ↑
K ↑
K ↑
K ↑
(t )
(t )
(t )
(t )
(t
)
(t
)
(t
)
(t
)
n
n
n
n
n+1
n+1
n+1
Hi-Z
Q0
n+1
X
V
1
0
0
X
1
0
Deselect
Read
X
—
—
X
—
Q1
—
V
Write
D0
D1
Hi-Z
Notes:
1. “1” = input “high”; “0” = input “low”; “V” = input “valid”; “X” = input “don’t care”
2. “—” indicates that the input requirement or output state is determined by the next operation.
3. Q0 and Q1 indicate the first and second pieces of output data transferred during Read operations.
4. D0 and D1 indicate the first and second pieces of input data transferred during Write operations.
5. Qs are tristated for one cycle in response to Deselect and Write commands, one cycle after the command is sampled, except when pre-
ceded by a Read command.
6. CQ is never tristated.
7. Users should not clock in metastable addresses.
Rev: 1.02 8/2005
11/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
x18 Byte Write Clock Truth Table
BW
BW
Current Operation
D
D
K ↑
K ↑
K ↑
K ↑
K ↑
(t
)
(t
)
(t )
(t
)
(t
)
n+1
n+2
n
n+1
n+2
Write
T
T
D1
D2
Dx stored if BWn = 0 in both data transfers
Write
T
F
F
F
T
F
D1
X
X
D2
X
Dx stored if BWn = 0 in 1st data transfer only
Write
Dx stored if BWn = 0 in 2nd data transfer only
Write Abort
No Dx stored in either data transfer
X
Notes:
1. “1” = input “high”; “0” = input “low”; “X” = input “don’t care”; “T” = input “true”; “F” = input “false”.
2. If one or more BWn = 0, then BW = “T”, else BW = “F”.
Rev: 1.02 8/2005
12/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
x36 Byte Write Enable (BWn) Truth Table
BW3 BW2 BW1 BW0
D27–D35
Don’t Care
Don’t Care
Don’t Care
Don’t Care
Don’t Care
Don’t Care
Don’t Care
Don’t Care
Data In
D18–D26
Don’t Care
Don’t Care
Don’t Care
Don’t Care
Data In
D9–D17
Don’t Care
Don’t Care
Data In
D0–D8
Don’t Care
Data In
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
Don’t Care
Data In
Data In
Don’t Care
Don’t Care
Data In
Don’t Care
Data In
Data In
Data In
Don’t Care
Data In
Data In
Data In
Don’t Care
Don’t Care
Don’t Care
Don’t Care
Data In
Don’t Care
Don’t Care
Data In
Don’t Care
Data In
Data In
Data In
Don’t Care
Data In
Data In
Data In
Data In
Don’t Care
Don’t Care
Data In
Don’t Care
Data In
Data In
Data In
Data In
Data In
Don’t Care
Data In
Data In
Data In
Data In
x8 Nybble Write Enable (NWn) Truth Table
NW1 NW0
D9–D17
Don’t Care
Don’t Care
Data In
D0–D8
Don’t Care
Data In
1
0
1
0
1
1
0
0
Don’t Care
Data In
Data In
Rev: 1.02 8/2005
13/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
State Diagram
Power-Up
LOAD
NOP
LOAD
Load New
LOAD
LOAD
LOAD
READ
WRITE
LOAD
DDR Read
DDR Write
Rev: 1.02 8/2005
14/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
Absolute Maximum Ratings
(All voltages reference to V
)
SS
Symbol
Description
Value
Unit
V
Voltage on V Pins
DD
–0.5 to 2.9
V
DD
V
Voltage in V
Voltage in V
Pins
Pins
–0.5 to V
V
V
DDQ
DDQ
REF
DD
V
–0.5 to V
REF
DDQ
V
–0.5 to V
–0.5 to V
+0.3 (≤ 2.9 V max.)
Voltage on I/O Pins
V
I/O
DDQ
DDQ
V
+0.3 (≤ 2.9 V max.)
Voltage on Other Input Pins
Input Current on Any Pin
V
IN
I
+/–100
+/–100
125
mA dc
mA dc
IN
I
Output Current on Any I/O Pin
Maximum Junction Temperature
Storage Temperature
OUT
o
T
C
J
o
T
–55 to 125
C
STG
Note:
Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended
Operating Conditions. Exposure to conditions exceeding the Recommended Operating Conditions, for an extended period of time, may affect
reliability of this component.
Recommended Operating Conditions
Power Supplies
Parameter
Supply Voltage
Symbol
Min.
1.7
Typ.
1.8
Max.
1.9
Unit
V
V
V
V
DD
V
I/O Supply Voltage
Reference Voltage
1.7
1.8
1.9
DDQ
V
0.68
—
0.95
REF
Notes:
1. Unless otherwise noted, all performance specifications quoted are evaluated for worst case at both 1.4 V ≤ V
≤ 1.6 V (i.e., 1.5 V I/O)
DDQ
and 1.7 V ≤ V
≤ 1.95 V (i.e., 1.8 V I/O) and quoted at whichever condition is worst case.
DDQ
2. The power supplies need to be powered up simultaneously or in the following sequence: V , V , V , followed by signal inputs. The
DD DDQ REF
power down sequence must be the reverse. V
must not exceed V .
DD
DDQ
Operating Temperature
Parameter
Symbol
Min.
Typ.
Max.
Unit
Ambient Temperature
(Commercial Range Versions)
T
0
25
70
°C
A
Ambient Temperature
(Industrial Range Versions)
T
–40
25
85
°C
A
Rev: 1.02 8/2005
15/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
HSTL I/O DC Input Characteristics
Parameter
DC Input Logic High
Symbol
Min
Max
Units
mV
Notes
V
(dc)
V
+ 0.1
V
+ 0.3
DDQ
1
1
IH
REF
V (dc)
V
– 0.1
REF
DC Input Logic Low
–0.3
mV
IL
Note:
Compatible with both 1.8 V and 1.5 V I/O drivers
HSTL I/O AC Input Characteristics
Parameter
AC Input Logic High
Symbol
Min
Max
Units
Notes
3,4
V
(ac)
V
+ 0.2
REF
—
mV
mV
mV
IH
V (ac)
V
– 0.2
REF
AC Input Logic Low
—
—
3,4
IL
V
Peak to Peak AC Voltage
V
(ac)
5% V
(DC)
REF
1
REF
REF
Notes:
1. The peak to peak AC component superimposed on V
may not exceed 5% of the DC component of V
.
REF
REF
2. To guarantee AC characteristics, V ,V , Trise, and Tfall of inputs and clocks must be within 10% of each other.
IH IL
3. For devices supplied with HSTL I/O input buffers. Compatible with both 1.8 V and 1.5 V I/O drivers.
4. See AC Input Definition drawing below.
HSTL I/O AC Input Definitions
V
(ac)
IH
V
REF
V (ac)
IL
Undershoot Measurement and Timing
Overshoot Measurement and Timing
V
IH
20% tKHKH
V
+ 1.0 V
DD
V
SS
50%
50%
V
DD
V
– 1.0 V
SS
20% tKHKH
V
IL
Rev: 1.02 8/2005
16/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
Capacitance
o
(T = 25 C, f = 1 MHZ, V = 3.3 V)
A
DD
Parameter
Symbol
Test conditions
Typ.
Max.
Unit
pF
C
V
= 0 V
Input Capacitance
Output Capacitance
4
6
5
7
IN
IN
C
V
OUT
= 0 V
pF
OUT
Note: This parameter is sample tested.
AC Test Conditions
Parameter
Conditions
V
Input high level
Input low level
DDQ
0 V
Max. input slew rate
Input reference level
2 V/ns
V
V
/2
/2
DDQ
DDQ
Output reference level
Note:
Test conditions as specified with output loading as shown unless otherwise noted.
AC Test Load Diagram
DQ
RQ = 250 Ω (HSTL I/O)
V
= 0.75 V
REF
50Ω
VT = V /2
DDQ
Input and Output Leakage Characteristics
Parameter
Symbol
Test Conditions
Min.
Max
Notes
Input Leakage Current
(except mode pins)
I
V = 0 to V
IN DD
–2 uA
2 uA
IL
V
≥ V ≥ V
IN
–100 uA
–2 uA
2 uA
2 uA
DD
IL
IL
I
Doff
INDOFF
0 V ≤ V ≤ V
IN
Output Disable,
= 0 to V
I
Output Leakage Current
–2 uA
2 uA
OL
V
OUT
DDQ
Rev: 1.02 8/2005
17/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
Programmable Impedance HSTL Output Driver DC Electrical Characteristics
Parameter
Symbol
Min.
Max.
Units Notes
V
V
V
/2 – 0.12
V
V
/2 + 0.12
DDQ
Output High Voltage
Output Low Voltage
Output High Voltage
V
V
V
V
1, 3
2, 3
4, 5
4, 6
OH1
DDQ
V
/2 – 0.12
– 0.2
/2 + 0.12
DDQ
OL1
DDQ
V
V
V
DDQ
OH2
DDQ
V
Output Low Voltage
Vss
0.2
OL2
Notes:
1.
I
= (V /2) / (RQ/5) +/– 15% @ V = V /2 (for: 175Ω ≤ RQ ≤ 350Ω).
DDQ OH DDQ
OH
2.
I
= (V /2) / (RQ/5) +/– 15% @ V = V /2 (for: 175Ω ≤ RQ ≤ 350Ω).
OL
DDQ
OL
DDQ
3. Parameter tested with RQ = 250Ω and V
= 1.5 V or 1.8 V
DDQ
4. Minimum Impedance mode, ZQ = V
SS
5.
6.
I
I
= –1.0 mA
= 1.0 mA
OH
OL
Rev: 1.02 8/2005
18/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
Operating Currents
-333
-300
-250
-200
-167
Parameter
Symbol
Test Conditions
Notes
0
to
–40
to
0
to
–40
to
0
to
–40
to
0
to
–40
to
0
to
–40
to
70°C 85°C 70°C 85°C 70°C 85°C 70°C 85°C 70°C 85°C
VDD = Max, IOUT = 0 mA
960
mA
980
mA
900
mA
920
mA
800
mA
820
mA
670
mA
690
mA
590
mA
610
mA
IDD
IDD
IDD
IDD
Operating Current (x36): DDR
Operating Current (x18): DDR
Operating Current (x9): DDR
Operating Current (x8): DDR
2, 3
2, 3
2, 3
2, 3
Cycle Time ≥ tKHKH Min
VDD = Max, IOUT = 0 mA
900
mA
920
mA
840
mA
860
mA
740
mA
760
mA
620
mA
640
mA
550
mA
570
mA
Cycle Time ≥ tKHKH Min
VDD = Max, IOUT = 0 mA
900
mA
920
mA
840
mA
860
mA
740
mA
760
mA
620
mA
640
mA
550
mA
570
mA
Cycle Time ≥ tKHKH Min
VDD = Max, IOUT = 0 mA
900
mA
920
mA
840
mA
860
mA
740
mA
760
mA
620
mA
640
mA
550
mA
570
mA
Cycle Time ≥ tKHKH Min
Device deselected,
IOUT = 0 mA, f = Max,
350
mA
360
mA
330
mA
340
mA
300
mA
310
mA
280
mA
290
mA
260
mA
270
mA
ISB1
Standby Current (NOP): DDR
2, 4
All Inputs ≤ 0.2 V or ≥ VDD – 0.2 V
Notes:
1.
2.
Power measured with output pins floating.
Minimum cycle, IOUT = 0 mA
Operating current is calculated with 50% read cycles and 50% write cycles.
Standby Current is only after all pending read and write burst operations are completed.
3.
4.
Rev: 1.02 8/2005
19/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
AC Electrical Characteristics
-333
-300
-250
-200
-167
Parameter
Symbol
Units
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Clock
tKHKH
tCHCH
K, K Clock Cycle Time
C, C Clock Cycle Time
3.0
—
3.5
0.2
—
3.3
—
4.2
0.2
—
4.0
—
6.3
0.2
—
5.0
—
7.9
0.2
—
6.0
—
8.4
0.2
—
ns
ns
ns
tKCVar
tTKC Variable
5
tKHKL
tCHCL
K, K Clock High Pulse Width
C, C Clock High Pulse Width
1.2
1.32
1.6
2.0
2.4
tKLKH
tCLCH
K, K Clock Low Pulse Width
C, C Clock Low Pulse Width
1.2
—
—
1.32
—
—
1.6
—
—
2.0
—
—
2.4
—
—
ns
ns
K to K High
C to C High
tKHKH
1.35
0
1.49
0
1.8
0
2.2
0
2.7
0
tKHCH
tKCLock
tKCReset
K, K Clock High to C, C Clock High
DLL Lock Time
1.3
—
1.45
—
1.8
—
2.3
—
2.8
—
ns
cycle
ns
1024
30
1024
30
1024
30
1024
30
1024
30
6
K Static to DLL reset
—
—
—
—
—
Output Times
tKHQV
tCHQV
K, K Clock High to Data Output Valid
C, C Clock High to Data Output Valid
—
0.45
—
—
0.45
—
—
0.45
—
—
0.45
—
—
–0.5
—
0.5
—
ns
ns
ns
ns
3
3
tKHQX
tCHQX
K, K Clock High to Data Output Hold
C, C Clock High to Data Output Hold
–0.45
—
–0.45
—
–0.45
—
–0.45
—
tKHCQV
tCHCQV
K, K Clock High to Echo Clock Valid
C, C Clock High to Echo Clock Valid
0.45
—
0.45
—
0.45
—
0.45
—
0.5
—
tKHCQX
tCHCQX
K, K Clock High to Echo Clock Hold
C, C Clock High to Echo Clock Hold
–0.45
–0.45
–0.45
–0.45
–0.5
tCQHQV
tCQHQX
tKHQZ
tCHQZ
tKHQX1
tCHQX1
CQ, CQ High Output Valid
CQ, CQ High Output Hold
—
0.25
—
—
0.27
—
—
0.30
—
—
0.35
—
—
0.40
—
ns
ns
7
7
–0.25
–0.27
–0.30
–0.35
–0.40
K Clock High to Data Output High-Z
C Clock High to Data Output High-Z
—
0.45
—
—
0.45
—
—
0.45
—
—
0.45
—
—
0.5
—
ns
ns
3
3
K Clock High to Data Output Low-Z
C Clock High to Data Output Low-Z
–0.45
–0.45
–0.45
–0.45
–0.5
Setup Times
tAVKH
tIVKH
Address Input Setup Time
0.4
0.4
—
—
—
0.4
0.4
0.3
—
—
—
0.5
0.5
—
—
—
0.6
0.6
0.4
—
—
—
0.7
0.7
0.5
—
—
—
ns
ns
ns
Control Input Setup Time
Data Input Setup Time
2
tDVKH
0.28
0.35
Rev: 1.02 8/2005
20/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
AC Electrical Characteristics (Continued)
-333
-300
-250
-200
-167
Parameter
Symbol
Units
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Hold Times
tKHAX
tKHIX
Address Input Hold Time
0.4
0.4
—
—
—
0.4
0.4
0.3
—
—
—
0.5
0.5
—
—
—
0.6
0.6
0.4
—
—
—
0.7
0.7
0.5
—
—
—
ns
ns
ns
Control Input Hold Time
tKHDX
Data Input Hold Time
0.28
0.35
Notes:
1. All Address inputs must meet the specified setup and hold times for all latching clock edges.
2. Control singles are R, W, BW0, BW1, and (NW0, NW1 for x8) and (BW2, BW3 for x36).
3. If C, C are tied high, K, K become the references for C, C timing parameters
4. To avoid bus contention, at a given voltage and temperature tCHQX1 is bigger than tCHQZ. The specs as shown do not imply bus conten-
tion because tCHQX1 is a MIN parameter that is worst case at totally different test conditions (0°C, 1.9 V) than tCHQZ, which is a MAX
parameter (worst case at 70°C, 1.7 V). It is not possible for two SRAMs on the same board to be at such different voltages and tempera-
tures.
5. Clock phase jitter is the variance from clock rising edge to the next expected clock rising edge.
6.
V
slew rate must be less than 0.1 V DC per 50 ns for DLL lock retention. DLL lock time begins once V and input clock are stable.
D
D
D
D
7. Echo clock is very tightly controlled to data valid/data hold. By design, there is a ±0.1 ns variation from echo clock to data. The datasheet
parameters reflect tester guard bands and test setup variations.
Rev: 1.02 8/2005
21/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
Rev: 1.02 8/2005
22/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
Rev: 1.02 8/2005
23/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
Rev: 1.02 8/2005
24/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
Rev: 1.02 8/2005
25/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
JTAG Port Operation
Overview
The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan
interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with V . The JTAG output
DD
drivers are powered by V
.
DDQ
Disabling the JTAG Port
It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless
clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG
Port unused, TCK, TDI, and TMS may be left floating or tied to either V or V . TDO should be left unconnected.
DD
SS
JTAG Pin Descriptions
Pin
Pin Name
I/O
Description
Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate
from the falling edge of TCK.
TCK
Test Clock
In
The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP
TMS
TDI
Test Mode Select
Test Data In
In controller state machine. An undriven TMS input will produce the same result as a logic one input
level.
The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers
placed between TDI and TDO. The register placed between TDI and TDO is determined by the
In state of the TAP Controller state machine and the instruction that is currently loaded in the TAP
Instruction Register (refer to the TAP Controller State Diagram). An undriven TDI pin will produce
the same result as a logic one input level.
Output that is active depending on the state of the TAP state machine. Output changes in
Out response to the falling edge of TCK. This is the output side of the serial registers placed between
TDI and TDO.
TDO
Test Data Out
Note:
This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is
held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up.
JTAG Port Registers
Overview
The various JTAG registers, refered to as Test Access Port orTAP Registers, are selected (one at a time) via the sequences of 1s and
0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the rising
edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the TDI
and TDO pins.
Instruction Register
The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or
the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the
TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the
controller is placed in Test-Logic-Reset state.
Bypass Register
The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through
the RAM’s JTAG Port to another device in the scan chain with as little delay as possible.
Rev: 1.02 8/2005
26/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
Boundary Scan Register
The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins.
The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The
Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the
device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan
Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in
Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z,
SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register.
JTAG TAP Block Diagram
·
·
·
·
·
·
·
·
Boundary Scan Register
·
·
·
0
Bypass Register
2
1 0
Instruction Register
TDI
TDO
ID Code Register
31 30 29
2 1
0
·
· · ·
Control Signals
Test Access Port (TAP) Controller
TMS
TCK
Identification (ID) Register
The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in
Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM.
It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the
controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins.
ID Register Contents TBD for this part.
Rev: 1.02 8/2005
27/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
ID Register Contents (TBD)
Die
Revision
Code
GSI Technology
JEDEC Vendor
Configuration
ID Code
I/O
Not Used
Bit # 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
0
x36
x18
Tap Controller Instruction Set
Overview
There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific
(Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be
implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load
address, data or control signals into the RAM or to preload the I/O buffers.
When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01.
When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired
instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the
TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this
device is listed in the following table.
Rev: 1.02 8/2005
28/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
JTAG Tap Controller State Diagram
Test Logic Reset
1
0
1
1
1
Run Test Idle
Select DR
Select IR
0
0
0
1
1
1
1
Capture DR
Capture IR
0
0
Shift DR
Shift IR
0
0
1
1
Exit1 DR
Exit1 IR
0
0
Pause DR
Pause IR
0
0
0
0
1
1
Exit2 DR
Exit2 IR
1
1
Update DR
Update IR
1
0
1
0
Instruction Descriptions
BYPASS
When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This
occurs when the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facili-
tate testing of other devices in the scan path.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is
loaded in the Instruction Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and
I/O buffers into the Boundary Scan Register. Boundary Scan Register locations are not associated with an input or I/O pin, and
are loaded with the default state identified in the Boundary Scan Chain table at the end of this section of the datasheet. Because
the RAM clock is independent from the TAP Clock (TCK) it is possible for the TAP to attempt to capture the I/O ring contents
while the input buffers are in transition (i.e. in a metastable state). Although allowing the TAP to sample metastable inputs will
not harm the device, repeatable results cannot be expected. RAM input signals must be stabilized for long enough to meet the
TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP
operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-DR state then
places the boundary scan register between the TDI and TDO pins.
Rev: 1.02 8/2005
29/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
EXTEST
EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with
all logic 0s. The EXTEST command does not block or override the RAM’s input pins; therefore, the RAM’s internal state is
still determined by its input pins.
Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command.
Then the EXTEST command is used to output the Boundary Scan Register’s contents, in parallel, on the RAM’s data output
drivers on the falling edge of TCK when the controller is in the Update-IR state.
Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruc-
tion is selected, the sate of all the RAM’s input and I/O pins, as well as the default values at Scan Register locations not asso-
ciated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR
state, the RAM’s output pins drive out the value of the Boundary Scan Register location with which each output pin is associ-
ated.
IDCODE
The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and
places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction
loaded in at power up and any time the controller is placed in the Test-Logic-Reset state.
SAMPLE-Z
If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (high-
Z) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR
state.
RFU
These instructions are Reserved for Future Use. In this device they replicate the BYPASS instruction.
Rev: 1.02 8/2005
30/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
JTAG TAP Instruction Set Summary
Instruction
EXTEST
Code
000
Description
Notes
1
Places the Boundary Scan Register between TDI and TDO.
Preloads ID Register and places it between TDI and TDO.
IDCODE
001
1, 2
Captures I/O ring contents. Places the Boundary Scan Register between TDI and
SAMPLE-Z
RFU
010
011
TDO.
1
1
Forces all RAM output drivers to High-Z.
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
SAMPLE/
PRELOAD
Captures I/O ring contents. Places the Boundary Scan Register between TDI and
TDO.
100
101
110
111
1
1
1
1
GSI
RFU
GSI private instruction.
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
BYPASS
Places Bypass Register between TDI and TDO.
Notes:
1. Instruction codes expressed in binary, MSB on left, LSB on right.
2. Default instruction automatically loaded at power-up and in test-logic-reset state.
Rev: 1.02 8/2005
31/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
JTAG Port Recommended Operating Conditions and DC Characteristics
Parameter
Symbol
Min.
Max.
Unit Notes
V
2.0
V
V
+0.3
DD3
3.3 V Test Port Input High Voltage
3.3 V Test Port Input Low Voltage
2.5 V Test Port Input High Voltage
2.5 V Test Port Input Low Voltage
TMS, TCK and TDI Input Leakage Current
TMS, TCK and TDI Input Leakage Current
TDO Output Leakage Current
V
V
1
1
IHJ3
V
0.8
+0.3
–0.3
ILJ3
V
0.6 * V
V
1
IHJ2
DD2
DD2
V
0.3 * V
1
–0.3
–300
–1
V
1
ILJ2
DD2
I
uA
uA
uA
V
2
INHJ
I
100
1
3
INLJ
I
–1
4
OLJ
V
Test Port Output High Voltage
1.7
—
5, 6
5, 7
5, 8
5, 9
OHJ
V
Test Port Output Low Voltage
—
0.4
V
OLJ
V
V
– 100 mV
DDQ
Test Port Output CMOS High
—
V
OHJC
V
Test Port Output CMOS Low
—
100 mV
V
OLJC
Notes:
1. Input Under/overshoot voltage must be –2 V > Vi < V
+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tTKC.
DDn
2.
V
≤ V ≤ V
ILJ
IN
DDn
3. 0 V ≤ V ≤ V
IN
ILJn
4. Output Disable, V
= 0 to V
DDn
OUT
5. The TDO output driver is served by the V
supply.
DDQ
6.
7.
8.
9.
I
I
I
I
= –4 mA
OHJ
= + 4 mA
OLJ
= –100 uA
= +100 uA
OHJC
OHJC
JTAG Port AC Test Conditions
Parameter
Conditions
JTAG Port AC Test Load
DQ
V
– 0.2 V
Input high level
Input low level
DD
0.2 V
1 V/ns
*
50Ω
30pF
Input slew rate
V
/2
DDQ
V
V
/2
Input reference level
DDQ
* Distributed Test Jig Capacitance
/2
Output reference level
DDQ
Notes:
1. Include scope and jig capacitance.
2. Test conditions as as shown unless otherwise noted.
Rev: 1.02 8/2005
32/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
JTAG Port Timing Diagram
tTKC
tTKH
tTKL
TCK
TDI
tTH
tTH
tTS
tTS
TMS
TDO
tTKQ
tTH
tTS
Parallel SRAM input
JTAG Port AC Electrical Characteristics
Parameter
Symbol
tTKC
tTKQ
tTKH
tTKL
tTS
Min
Max
—
Unit
TCK Cycle Time
50
—
ns
ns
ns
ns
ns
ns
TCK Low to TDO Valid
TCK High Pulse Width
TCK Low Pulse Width
TDI & TMS Set Up Time
TDI & TMS Hold Time
20
—
20
20
10
10
—
—
tTH
—
Rev: 1.02 8/2005
33/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
Package Dimensions—165-Bump FPBGA (Package E)
A1 CORNER
TOP VIEW
BOTTOM VIEW
A1 CORNER
M
M
Ø0.08
C
Ø0.15 C A B
Ø0.40~0.50 (165x)
1
2 3 4 5 6 7 8 9 10 11
11 10 9 8
7 6 5 4 3 2 1
A
B
C
D
E
F
A
B
C
D
E
F
G
H
J
G
H
J
K
L
K
L
M
N
P
R
M
N
P
R
A
1.0
10.0
1.0
15±0.05
B
0.15(4x)
SEATING PLANE
C
Rev: 1.02 8/2005
34/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
Ordering Information—GSI SigmaSIO-II SRAM
Speed
(MHz)
3
1
Org
Type
Package
Status
T
Part Number
A
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
4M x 9
GS8342S36E-333
GS8342S36E-300
GS8342S36E-250
GS8342S36E-200
GS8342S36E-167
GS8342S36E-333I
GS8342S36E-300I
GS8342S36E-250I
GS8342S36E-200I
GS8342S36E-167I
GS8342S18E-333
GS8342S18E-300
GS8342S18E-250
GS8342S18E-200
GS8342S18E-167
GS818S18D-100
GS8342S18E-333I
GS8342S18E-300I
GS8342S18E-250I
GS8342S18E-200I
GS8342S18E-167I
GS8342S09E-333
GS8342S09E-300
GS8342S09E-250
GS8342S09E-200
GS8342S09E-167
GS8342S09E-333I
GS8342S09E-300I
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
333
300
250
200
167
333
300
250
200
167
333
300
250
200
167
100
333
300
250
200
167
333
300
250
200
167
333
300
C
C
C
C
C
I
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
I
I
I
I
C
C
C
C
C
C
I
I
I
I
I
C
C
C
C
C
I
4M x 9
4M x 9
4M x 9
4M x 9
4M x 9
4M x 9
I
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS834x36E-300T.
2. T = C = Commercial Temperature Range. T = I = Industrial Temperature Range.
A
A
3. MP = Mass Production. PQ = Pre-Qualification. ES = Engineering Samples.
Rev: 1.02 8/2005
35/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
Ordering Information—GSI SigmaSIO-II SRAM
Speed
(MHz)
3
1
Org
Type
Package
Status
T
Part Number
A
4M x 9
4M x 9
4M x 9
4M x 8
4M x 8
4M x 8
4M x 8
4M x 8
4M x 8
4M x 8
4M x 8
4M x 8
4M x 8
4M x 8
GS8342S09E-250I
GS8342S09E-200I
GS8342S09E-167I
GS8342S08E-333
GS8342S08E-300
GS8342S08E-250
GS8342S08E-200
GS8342S08E-167
GS818S18D-100
GS8342S08E-333I
GS8342S08E-300I
GS8342S08E-250I
GS8342S08E-200I
GS8342S08E-167I
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
165-Pin BGA
250
200
167
333
300
250
200
167
100
333
300
250
200
167
I
I
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
I
C
C
C
C
C
C
I
I
I
I
I
RoHS-compliant
165-Pin BGA
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
1M x 36
GS8342S36GE-333
GS8342S36GE-300
GS8342S36GE-250
GS8342S36GE-200
GS8342S36GE-167
GS8342S36GE-333I
GS8342S36GE-300I
GS8342S36GE-250I
GS8342S36GE-200I
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
333
300
250
200
167
333
300
250
200
C
C
C
C
C
I
ES
ES
ES
ES
ES
ES
ES
ES
ES
RoHS-compliant
165-Pin BGA
RoHS-compliant
165-Pin BGA
RoHS-compliant
165-Pin BGA
RoHS-compliant
165-Pin BGA
RoHS-compliant
165-Pin BGA
RoHS-compliant
165-Pin BGA
I
RoHS-compliant
165-Pin BGA
I
RoHS-compliant
165-Pin BGA
I
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS834x36E-300T.
2. T = C = Commercial Temperature Range. T = I = Industrial Temperature Range.
A
A
3. MP = Mass Production. PQ = Pre-Qualification. ES = Engineering Samples.
Rev: 1.02 8/2005
36/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
Ordering Information—GSI SigmaSIO-II SRAM
Speed
(MHz)
3
1
Org
Type
Package
Status
T
Part Number
A
RoHS-compliant
165-Pin BGA
1M x 36
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
2M x 18
4M x 9
GS8342S36GE-167I
GS8342S18GE-333
GS8342S18GE-300
GS8342S18GE-250
GS8342S18GE-200
GS8342S18GE-167
GS818S18D-100
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
167
333
300
250
200
167
100
333
300
250
200
167
333
300
250
200
167
333
I
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
RoHS-compliant
165-Pin BGA
C
C
C
C
C
C
I
RoHS-compliant
165-Pin BGA
RoHS-compliant
165-Pin BGA
RoHS-compliant
165-Pin BGA
RoHS-compliant
165-Pin BGA
RoHS-compliant
165-Pin BGA
RoHS-compliant
165-Pin BGA
GS8342S18GE-333I
GS8342S18GE-300I
GS8342S18GE-250I
GS8342S18GE-200I
GS8342S18GE-167I
GS8342S09GE-333
GS8342S09GE-300
GS8342S09GE-250
GS8342S09GE-200
GS8342S09GE-167
GS8342S09GE-333I
RoHS-compliant
165-Pin BGA
I
RoHS-compliant
165-Pin BGA
I
RoHS-compliant
165-Pin BGA
I
RoHS-compliant
165-Pin BGA
I
RoHS-compliant
165-Pin BGA
C
C
C
C
C
I
RoHS-compliant
165-Pin BGA
4M x 9
RoHS-compliant
165-Pin BGA
4M x 9
RoHS-compliant
165-Pin BGA
4M x 9
RoHS-compliant
165-Pin BGA
4M x 9
RoHS-compliant
165-Pin BGA
4M x 9
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS834x36E-300T.
2. T = C = Commercial Temperature Range. T = I = Industrial Temperature Range.
A
A
3. MP = Mass Production. PQ = Pre-Qualification. ES = Engineering Samples.
Rev: 1.02 8/2005
37/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
Ordering Information—GSI SigmaSIO-II SRAM
Speed
(MHz)
3
1
Org
Type
Package
Status
T
Part Number
A
RoHS-compliant
165-Pin BGA
4M x 9
4M x 9
4M x 9
4M x 9
4M x 8
4M x 8
4M x 8
4M x 8
4M x 8
4M x 8
4M x 8
4M x 8
4M x 8
4M x 8
4M x 8
GS8342S09GE-300I
GS8342S09GE-250I
GS8342S09GE-200I
GS8342S09GE-167I
GS8342S08GE-333
GS8342S08GE-300
GS8342S08GE-250
GS8342S08GE-200
GS8342S08GE-167
GS818S18D-100
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
SigmaSIO-II SRAM
300
250
200
167
333
300
250
200
167
100
333
300
250
200
167
I
I
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
ES
RoHS-compliant
165-Pin BGA
RoHS-compliant
165-Pin BGA
I
RoHS-compliant
165-Pin BGA
I
RoHS-compliant
165-Pin BGA
C
C
C
C
C
C
I
RoHS-compliant
165-Pin BGA
RoHS-compliant
165-Pin BGA
RoHS-compliant
165-Pin BGA
RoHS-compliant
165-Pin BGA
RoHS-compliant
165-Pin BGA
RoHS-compliant
165-Pin BGA
GS8342S08GE-333I
GS8342S08GE-300I
GS8342S08GE-250I
GS8342S08GE-200I
GS8342S08GE-167I
RoHS-compliant
165-Pin BGA
I
RoHS-compliant
165-Pin BGA
I
RoHS-compliant
165-Pin BGA
I
RoHS-compliant
165-Pin BGA
I
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS834x36E-300T.
2. T = C = Commercial Temperature Range. T = I = Industrial Temperature Range.
A
A
3. MP = Mass Production. PQ = Pre-Qualification. ES = Engineering Samples.
Rev: 1.02 8/2005
38/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS8342S08/09/18/36E-333/300/250/200/167
SigmaSIO-II Revision History
File Name
Format/Content
Description of changes
8342Sxx_r1
Creation of datasheet
• Updated format
• Updated timing diagrams
8342Sxx_r1; 8342Sxx_r1_01
Format/Content
• Updated timing diagrams
• Removed 400 MHz speed bin
• Added 333 MHz speed bin
• Added x9 part
8342Sxx_r1_01; 8342Sxx_r1_02
Content
• Added RoHS-compliant information
Rev: 1.02 8/2005
39/39
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
相关型号:
©2020 ICPDF网 联系我们和版权申明