GS8342S18E-167T_技术文档

Preliminary

GS8342S08/09/18/36E-333/300/250/200/167

167 MHz–333 MHz

165-Bump BGA

Commercial Temp

Industrial Temp

36Mb Burst of 2

DDR SigmaSIO-II SRAM

1.8 V V

DD

1.8 V and 1.5 V I/O

Features

• Simultaneous Read and Write SigmaSIO™ Interface

• JEDEC-standard pinout and package

• Dual Double Data Rate interface

• Byte Write controls sampled at data-in time

• DLL circuitry for wide output data valid window and future

frequency scaling

• Burst of 2 Read and Write

• 1.8 V +100/–100 mV core power supply

• 1.5 V or 1.8 V HSTL Interface

• Pipelined read operation

• Fully coherent read and write pipelines

• ZQ mode pin for programmable output drive strength

• IEEE 1149.1 JTAG-compliant Boundary Scan

• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package

• RoHS-compliant 165-bump BGA package available

• Pin-compatible with future 72Mb and 144Mb devices

Bottom View

165-Bump, 15 mm x 17 mm BGA

1 mm Bump Pitch, 11 x 15 Bump Array

JEDEC Std. MO-216, Variation CAB-1

SigmaRAM™ Family Overview

Clocking and Addressing Schemes

GS8342S08/09/18/36 are built in compliance with the

SigmaSIO-II SRAM pinout standard for Separate I/O

synchronous SRAMs. They are 37,748,736-bit (36Mb)

SRAMs. These are the first in a family of wide, very low

voltage HSTL I/O SRAMs designed to operate at the speeds

needed to implement economical high performance

networking systems.

A Burst of 2 SigmaSIO-II SRAM is a synchronous device. It

employs dual input register clock inputs, K and K. The device

also allows the user to manipulate the output register clock

input quasi independently with dual output register clock

inputs, C and C. If the C clocks are tied high, the K clocks are

routed internally to fire the output registers instead. Each Burst

of 2 SigmaSIO-II SRAM also supplies Echo Clock outputs,

CQ and CQ, which are synchronized with read data output.

When used in a source synchronous clocking scheme, the Echo

Clock outputs can be used to fire input registers at the data’s

destination.

Because Separate I/O Burst of 2 RAMs always transfer data in

two packets, A0 is internally set to 0 for the first read or write

transfer, and automatically incremented by 1 for the next

transfer. Because the LSB is tied off internally, the address

field of a Burst of 2 RAM is always one address pin less than

the advertised index depth (e.g., the 2M x 18 has a 1M

addressable index).

Parameter Synopsis

- 333

3.0 ns

0.45 ns

-300

3.3 ns

-250

4.0 ns

0.45 ns

-200

5.0 ns

0.45 ns

-167

tKHKH

tKHQV

6.0 ns

0.5 ns

0.45 ns

Rev: 1.02 8/2005

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Preliminary

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4M x 8 SigmaQuad SRAM—Top View

1

2

3

4

5

6

7

8

9

10

11

V

/SA

SS

A

CQ

SA

R/W

NW1

K

NC

LD

SA

CQ

(72Mb)

B

C

D

E

F

NC

Q4

NC

Q5

SA

NC

SA

K

NW0

SA

NC

D2

Q3

D3

NC

Q2

NC

ZQ

D1

NC

Q0

D0

NC

TDI

NC

D4

NC

D5

V

SA

V

SS

V

SS

DD

SS

DD

V

DDQ

V

NC

DDQ

G

H

J

V

D

V

REF

OFF

REF

DDQ

NC

Q6

NC

Q1

K

L

NC

D6

NC

Q7

SA

V

NC

SA

NC

V

DDQ

SS

M

N

P

R

NC

D7

V

NC

SS

NC

V

SA

C

SA

V

NC

TCK

SA

NC

TDO

C

TMS

11 x 15 Bump BGA—15 x 17 mm Body—1 mm Bump Pitch

2

Notes:

1. Expansion addresses: A2 for 72Mb

2. NW0 controls writes to D0:D3. NW1 controls writes to D4:D7.

3. It is recommended that H1 be tied low for compatibility with future devices.

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Preliminary

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4M x 9 SigmaQuad SRAM—Top View

1

2

3

4

5

6

7

8

9

10

11

A

B

C

D

E

F

CQ

V

SA

R/W

NC

K

NC

LD

SA

CQ

SS

NC

Doff

NC

TDO

NC

Q5

NC

Q6

SA

NC

SA

K

BW

SA

NC

D3

Q4

D4

NC

Q3

NC

ZQ

D2

NC

Q1

D1

NC

TDI

NC

D5

NC

D6

V

SA

V

SS

V

SS

DD

SS

DD

V

DDQ

V

NC

DDQ

G

H

J

V

REF

DDQ

NC

Q2

K

L

NC

Q7

NC

D7

NC

Q8

SA

V

NC

SA

NC

V

DDQ

SS

M

N

P

R

NC

D8

V

NC

SS

V

SA

C

SA

V

NC

TCK

SA

D0

C

TMS

2

11 x 15 Bump BGA—15 x 17 mm Body—1 mm Bump Pitch

Notes:

4. Expansion addresses: A2 for 72Mb

5. NW0 controls writes to D0:D3. NW1 controls writes to D4:D7.

6. It is recommended that H1 be tied low for compatibility with future devices.

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Preliminary

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2M x 18 SigmaQuad SRAM—Top View

1

2

3

4

5

6

7

8

9

10

/SA

11

V

/SA

V

SS

A

CQ

SA

R/W

BW1

K

NC

LD

SA

CQ

(144Mb)

(72Mb)

B

C

D

E

F

NC

Q9

D9

SA

NC

SA

K

BW0

SA

NC

Q8

D8

D7

Q6

Q5

D5

ZQ

D4

Q3

Q2

D2

D1

Q0

TDI

NC

D11

NC

D10

Q10

Q11

D12

Q13

V

SA

V

Q7

NC

D6

NC

SS

V

SS

DD

SS

DD

V

DDQ

Q12

D13

V

DDQ

G

H

J

V

D

V

REF

OFF

REF

DDQ

NC

D14

Q14

D15

D16

Q16

Q17

SA

NC

Q4

D3

K

L

NC

V

NC

SA

Q15

NC

V

NC

Q1

DDQ

SS

M

N

P

R

NC

V

SS

NC

D17

NC

V

SA

C

SA

V

NC

D0

NC

SA

TDO

TCK

C

TMS

2

11 x 15 Bump BGA—15 x 17 mm Body—1 mm Bump Pitch

Notes:

1. Expansion addresses: A10 for 72Mb, A2 for 144Mb

2. BW0 controls writes to D0:D8. BW1 controls writes to D9:D17.

3. It is recommended that H1 be tied low for compatibility with future devices.

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Preliminary

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1M x 36 SigmaQuad SRAM—Top View

1

2

3

4

5

6

7

8

9

10

/SA

11

V

/SA

NC/SA

V

SS

A

CQ

R/W

BW2

K

BW1

LD

SA

CQ

(288Mb) (72Mb)

(144Mb)

B

C

D

E

F

Q27

D27

D28

Q29

Q30

D30

Q18

Q28

D20

D29

Q21

D22

D18

D19

Q19

Q20

D21

Q22

SA

BW3

SA

K

BW0

SA

D17

D16

Q16

Q15

D14

Q13

Q17

Q8

D8

D7

Q6

Q5

D5

ZQ

D4

Q3

Q2

D2

D1

Q0

TDI

V

SA

V

Q7

D15

D6

SS

V

SS

DD

SS

DD

V

DDQ

V

Q14

D13

DDQ

G

H

J

V

D

V

REF

OFF

REF

DDQ

D31

Q31

D23

Q23

D24

D25

Q25

Q26

SA

D12

Q12

D11

D10

Q10

Q9

Q4

D3

K

L

Q32

Q33

D33

D34

Q35

TDO

D32

Q24

Q34

D26

D35

TCK

V

Q11

Q1

DDQ

SS

M

N

P

R

V

SS

V

SA

C

SA

V

D9

SA

D0

C

SA

TMS

2

11 x 15 Bump BGA—15 x 17 mm Body—1 mm Bump Pitch

Notes:

1. Expansion addresses: A3 for 72Mb, A10 for 144Mb, A2 for 288Mb

2. BW0 controls writes to D0:D8. BW1 controls writes to D9:D17.

3. BW2 controls writes to D18:D26. BW3 controls writes to D27:D35.

4. It is recommended that H1 be tied low for compatibility with future devices.

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Preliminary

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Pin Description Table

Symbol

SA

Description

Synchronous Address Inputs

No Connect

Type

Input

—

Comments

—

NC

—

R/W

Read/Write Contol Pin

Input

Write Active Low; Read Active High

Active Low

x08 Version

NW0–NW1

BW0–BW1

BW0–BW3

Synchronous Nybble Writes

Synchronous Byte Writes

Input

Active Low

x18 Version

Active Low

x36 Version

K

Input Clock

Output Clock

Input

Output

Input

Output

—

Active High

—

C

TMS

TDI

TCK

TDO

Test Mode Select

Test Data Input

—

Test Clock Input

—

Test Data Output

—

V

HSTL Input Reference Voltage

Output Impedance Matching Input

Input Clock

—

REF

ZQ

K

—

Active Low

Active High

C

Output Clock

D

DLL Disable

OFF

LD

CQ

Dn

Qn

Synchronous Load Pin

Output Echo Clock

Synchronous Data Inputs

Synchronous Data Outputs

Power Supply

—

Output

Input

Output

Supply

V

1.8 V Nominal

1.8 or 1.5 V Nominal

—

DD

V

Isolated Output Buffer Supply

Power Supply: Ground

Supply

DDQ

V

SS

Notes:

1. C, C, K, or K cannot be set to V

voltage.

REF

2. When ZQ pin is directly connected to V , output impedance is set to minimum value and it cannot be connected to ground or left

DD

unconnected.

3. NC = Not Connected to die or any other pin

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Preliminary

GS8342S08/09/18/36E-333/300/250/200/167

Background

Separate I/O SRAMs, like SigmaQuad SRAMs, are attractive in applications where alternating reads and writes are needed. On the

other hand, Common I/O SRAMs like the SigmaCIO family are popular in applications where bursts of read or write traffic are

needed. The SigmaSIO SRAM is a hybrid of these two devices. Like the SigmaQuad family devices, the SigmaSIO features a

separate I/O data path, offering the user independent Data In and Data Out pins. However, the SigmaSIO devices offer a control

protocol like that offered on the SigmaCIO devices. Therefore, while SigmaQuad SRAMs allow a user to operate both data ports at

the same time, they force alternating loads of read and write addresses. SigmaSIO SRAMs allow continuous loads of read or write

addresses like SigmaCIO SRAMs, but in a separate I/O configuration.

Like a SigmaQuad SRAM, a SigmaSIO-II SRAM can execute an alternating sequence of reads and writes. However, doing so

results in the Data In port and the Data Out port stalling with nothing to do on alternate transfers. A SigmaQuad device would keep

both ports running at capacity full time. On the other hand, the SigmaSIO device can accept a continuous stream of read commands

and read data or a continuous stream of write commands and write data. The SigmaQuad device, by contrast, restricts the user from

loading a continuous stream of read or write addresses. The advantage of the SigmaSIO device is that it allows twice the random

address bandwidth for either reads or writes than could be acheived with a SigmaQuad version of the device. SigmaCIO SRAMs

offer this same advantage, but do not have the separate Data In and Data Out pins offered on the SigmaSIO SRAMs. Therefore,

SigmaSIO devices are useful in psuedo dual port SRAM applications where communication of burst traffic between two

electrically independent busses is desired.

Each of the three SigmaQuad Family SRAMs—SigmaQuad, SigmaCIO, and SigmaSIO—supports similar address rates because

random address rate is determined by the internal performance of the RAM. In addition, all three SigmaQuad Family SRAMs are

based on the same internal circuits. Differences between the truth tables of the different devices proceed from differences in how

the RAM’s interface is contrived to interact with the rest of the system. Each mode of operation has its own advantages and

disadvantages. The user should consider the nature of the work to be done by the RAM to evaluate which version is best suited to

the application at hand.

Burst of 2 Sigma SIO-II SRAM DDR Read

The status of the Address Input, R/W, and LD pins are sampled at each rising edge of K. LD high causes chip disable. A high on

the R/W pin begins a read cycle. The two resulting data output transfers begin after the next rising edge of the K clock. Data is

clocked out by the next rising edge of the C if it is active. Otherwise, data is clocked out at the next rising edge of K. The next data

chunk is clocked out on the rising edge of C, if active. Otherwise, data is clocked out on the rising edge of K.

Burst of 2 Sigma SIO-II SRAM DDR Write

The status of the Address Input, R/W, and LD pins are sampled at each rising edge of K. LD high causes chip disable. A low on the

R/W pin, begins a write cycle. Data is clocked in by the next rising edge of K and then the rising edge of K.

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Preliminary

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Special Functions

Byte Write and Nybble Write Control

Byte Write Enable pins are sampled at the same time that Data In is sampled. A high on the Byte Write Enable pin associated with

a particular byte (e.g., BW0 controls D0–D8 inputs) will inhibit the storage of that particular byte, leaving whatever data may be

stored at the current address at that byte location undisturbed. Any or all of the Byte Write Enable pins may be driven high or low

during the data in sample times in a write sequence.

Each write enable command and write address loaded into the RAM provides the base address for a 2 beat data transfer. The x18

version of the RAM, for example, may write 36 bits in association with each address loaded. Any 9-bit byte may be masked in any

write sequence.

Nybble Write (4-bit) control is implemented on the 8-bit-wide version of the device. For the x8 version of the device, “Nybble

Write Enable” and “NWx” may be substituted in all the discussion above.

Example x18 RAM Write Sequence using Byte Write Enables

Data In Sample

BW0

BW1

D0–D8

D9–D17

Time

Beat 1

Beat 2

0

1

0

Data In

Don’t Care

Data In

Don’t Care

Resulting Write Operation

Beat 1

Beat 2

D9–D17

D0–D8

D9–D17

D0–D8

Written

Unchanged

Written

Output Register Control

SigmaSIO-II SRAMs offer two mechanisms for controlling the output data registers. Typically, control is handled by the Output

Register Clock inputs, C and C. The Output Register Clock inputs can be used to make small phase adjustments in the firing of the

output registers by allowing the user to delay driving data out as much as a few nanoseconds beyond the next rising edges of the K

and K clocks. If the C and C clock inputs are tied high, the RAM reverts to K and K control of the outputs.

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Preliminary

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Example Four Bank Depth Expansion Schematic

R/W

3

LD

3

R/W

2

LD

2

R/W

1

LD

R/W

1

0

LD

0

A –A

0

n

K

D –D

1

n

Bank 3

Bank 1

Bank 2

Bank 0

A

R/W

LD

K

LD

K

LD

K

D

C

Q

D

C

Q

D

C

Q

D

C

Q

C

Q –Q

1

n

Note:

For simplicity BWn is not shown.

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Preliminary

GS8342S08/09/18/36E-333/300/250/200/167

Rev: 1.02 8/2005

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Preliminary

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FLXDrive-II Output Driver Impedance Control

HSTL I/O SigmaSIO-II SRAMs are supplied with programmable impedance output drivers. The ZQ pin must be connected to V

SS

via an external resistor, RQ, to allow the SRAM to monitor and adjust its output driver impedance. The value of RQ must be 5X the

value of the intended line impedance driven by the SRAM. The allowable range of RQ to guarantee impedance matching with a

vendor-specified tolerance is between 150Ω and 300Ω. Periodic readjustment of the output driver impedance is necessary as the

impedance is affected by drifts in supply voltage and temperature. The SRAM’s output impedance circuitry compensates for drifts

in supply voltage and temperature every 1024 cycles. A clock cycle counter periodically triggers an impedance evaluation, resets

and counts again. Each impedance evaluation may move the output driver impedance level one step at a time towards the optimum

level. The output driver is implemented with discrete binary weighted impedance steps. Impedance updates for “0s” occur

whenever the SRAM is driving “1s” for the same DQs (and vice-versa for “1s”) or the SRAM is in HI-Z.

Separate I/O Burst of 2 Sigma SIO-II SRAM Truth Table

Current

A

LD

R/W

D

Q

Operation

K ↑

(t )

(t

)

(t

)

(t

)

(t

)

n

n+1

Hi-Z

Q0

n+1

X

V

1

0

X

1

0

Deselect

Read

X

—

X

—

Q1

—

V

Write

D0

D1

Hi-Z

Notes:

1. “1” = input “high”; “0” = input “low”; “V” = input “valid”; “X” = input “don’t care”

2. “—” indicates that the input requirement or output state is determined by the next operation.

3. Q0 and Q1 indicate the first and second pieces of output data transferred during Read operations.

4. D0 and D1 indicate the first and second pieces of input data transferred during Write operations.

5. Qs are tristated for one cycle in response to Deselect and Write commands, one cycle after the command is sampled, except when pre-

ceded by a Read command.

6. CQ is never tristated.

7. Users should not clock in metastable addresses.

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Preliminary

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x18 Byte Write Clock Truth Table

BW

Current Operation

D

K ↑

(t

)

(t

)

(t )

(t

)

(t

)

n+1

n+2

n

n+1

n+2

Write

T

D1

D2

Dx stored if BWn = 0 in both data transfers

Write

T

F

T

F

D1

X

D2

X

Dx stored if BWn = 0 in 1st data transfer only

Write

Dx stored if BWn = 0 in 2nd data transfer only

Write Abort

No Dx stored in either data transfer

X

Notes:

1. “1” = input “high”; “0” = input “low”; “X” = input “don’t care”; “T” = input “true”; “F” = input “false”.

2. If one or more BWn = 0, then BW = “T”, else BW = “F”.

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Preliminary

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x36 Byte Write Enable (BWn) Truth Table

BW3 BW2 BW1 BW0

D27–D35

Don’t Care

Data In

D18–D26

Don’t Care

Data In

D9–D17

Don’t Care

Data In

D0–D8

Don’t Care

Data In

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

Don’t Care

Data In

Don’t Care

Data In

Don’t Care

Data In

Don’t Care

Data In

Don’t Care

Data In

Don’t Care

Data In

Don’t Care

Data In

Don’t Care

Data In

Don’t Care

Data In

Don’t Care

Data In

Don’t Care

Data In

x8 Nybble Write Enable (NWn) Truth Table

NW1 NW0

D9–D17

Don’t Care

Data In

D0–D8

Don’t Care

Data In

1

0

1

0

1

0

Don’t Care

Data In

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

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State Diagram

Power-Up

LOAD

NOP

LOAD

Load New

LOAD

READ

WRITE

LOAD

DDR Read

DDR Write

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Preliminary

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Absolute Maximum Ratings

(All voltages reference to V

)

SS

Symbol

Description

Value

Unit

V

Voltage on V Pins

DD

–0.5 to 2.9

V

DD

V

Voltage in V

Pins

–0.5 to V

V

DDQ

REF

DD

V

–0.5 to V

REF

DDQ

V

–0.5 to V

+0.3 (≤ 2.9 V max.)

Voltage on I/O Pins

V

I/O

DDQ

V

+0.3 (≤ 2.9 V max.)

Voltage on Other Input Pins

Input Current on Any Pin

V

IN

I

+/–100

125

mA dc

IN

I

Output Current on Any I/O Pin

Maximum Junction Temperature

Storage Temperature

OUT

o

T

C

J

o

T

–55 to 125

C

STG

Note:

Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended

Operating Conditions. Exposure to conditions exceeding the Recommended Operating Conditions, for an extended period of time, may affect

reliability of this component.

Recommended Operating Conditions

Power Supplies

Parameter

Supply Voltage

Symbol

Min.

1.7

Typ.

1.8

Max.

1.9

Unit

V

DD

V

I/O Supply Voltage

Reference Voltage

1.7

1.8

1.9

DDQ

V

0.68

—

0.95

REF

Notes:

1. Unless otherwise noted, all performance specifications quoted are evaluated for worst case at both 1.4 V ≤ V

≤ 1.6 V (i.e., 1.5 V I/O)

DDQ

and 1.7 V ≤ V

≤ 1.95 V (i.e., 1.8 V I/O) and quoted at whichever condition is worst case.

DDQ

2. The power supplies need to be powered up simultaneously or in the following sequence: V , V , V , followed by signal inputs. The

DD DDQ REF

power down sequence must be the reverse. V

must not exceed V .

DD

DDQ

Operating Temperature

Parameter

Symbol

Min.

Typ.

Max.

Unit

Ambient Temperature

(Commercial Range Versions)

T

0

25

70

°C

A

Ambient Temperature

(Industrial Range Versions)

T

–40

25

85

°C

A

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Preliminary

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HSTL I/O DC Input Characteristics

Parameter

DC Input Logic High

Symbol

Min

Max

Units

mV

Notes

V

(dc)

V

+ 0.1

V

+ 0.3

DDQ

1

IH

REF

V (dc)

V

– 0.1

REF

DC Input Logic Low

–0.3

mV

IL

Note:

Compatible with both 1.8 V and 1.5 V I/O drivers

HSTL I/O AC Input Characteristics

Parameter

AC Input Logic High

Symbol

Min

Max

Units

Notes

3,4

V

(ac)

V

+ 0.2

REF

—

mV

IH

V (ac)

V

– 0.2

REF

AC Input Logic Low

—

3,4

IL

V

Peak to Peak AC Voltage

V

(ac)

5% V

(DC)

REF

1

REF

Notes:

1. The peak to peak AC component superimposed on V

may not exceed 5% of the DC component of V

.

REF

2. To guarantee AC characteristics, V ,V , Trise, and Tfall of inputs and clocks must be within 10% of each other.

IH IL

3. For devices supplied with HSTL I/O input buffers. Compatible with both 1.8 V and 1.5 V I/O drivers.

4. See AC Input Definition drawing below.

HSTL I/O AC Input Definitions

V

(ac)

IH

V

REF

V (ac)

IL

Undershoot Measurement and Timing

Overshoot Measurement and Timing

V

IH

20% tKHKH

V

+ 1.0 V

DD

V

SS

50%

V

DD

V

– 1.0 V

SS

20% tKHKH

V

IL

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Preliminary

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Capacitance

o

(T = 25 C, f = 1 MHZ, V = 3.3 V)

A

DD

Parameter

Symbol

Test conditions

Typ.

Max.

Unit

pF

C

V

= 0 V

Input Capacitance

Output Capacitance

4

6

5

7

IN

C

V

OUT

= 0 V

pF

OUT

Note: This parameter is sample tested.

AC Test Conditions

Parameter

Conditions

V

Input high level

Input low level

DDQ

0 V

Max. input slew rate

Input reference level

2 V/ns

V

/2

DDQ

Output reference level

Note:

Test conditions as specified with output loading as shown unless otherwise noted.

AC Test Load Diagram

DQ

RQ = 250 Ω (HSTL I/O)

V

= 0.75 V

REF

50Ω

VT = V /2

DDQ

Input and Output Leakage Characteristics

Parameter

Symbol

Test Conditions

Min.

Max

Notes

Input Leakage Current

(except mode pins)

I

V = 0 to V

IN DD

–2 uA

2 uA

IL

V

≥ V ≥ V

IN

–100 uA

–2 uA

2 uA

DD

IL

I

Doff

INDOFF

0 V ≤ V ≤ V

IN

Output Disable,

= 0 to V

I

Output Leakage Current

–2 uA

2 uA

OL

V

OUT

DDQ

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Preliminary

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Programmable Impedance HSTL Output Driver DC Electrical Characteristics

Parameter

Symbol

Min.

Max.

Units Notes

V

/2 – 0.12

V

/2 + 0.12

DDQ

Output High Voltage

Output Low Voltage

Output High Voltage

V

1, 3

2, 3

4, 5

4, 6

OH1

DDQ

V

/2 – 0.12

– 0.2

/2 + 0.12

DDQ

OL1

DDQ

V

DDQ

OH2

DDQ

V

Output Low Voltage

Vss

0.2

OL2

Notes:

1.

I

= (V /2) / (RQ/5) +/– 15% @ V = V /2 (for: 175Ω ≤ RQ ≤ 350Ω).

DDQ OH DDQ

OH

2.

I

= (V /2) / (RQ/5) +/– 15% @ V = V /2 (for: 175Ω ≤ RQ ≤ 350Ω).

OL

DDQ

OL

DDQ

3. Parameter tested with RQ = 250Ω and V

= 1.5 V or 1.8 V

DDQ

4. Minimum Impedance mode, ZQ = V

SS

5.

6.

I

= –1.0 mA

= 1.0 mA

OH

OL

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Preliminary

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Operating Currents

-333

-300

-250

-200

-167

Parameter

Symbol

Test Conditions

Notes

0

to

–40

to

0

to

–40

to

0

to

–40

to

0

to

–40

to

0

to

–40

to

70°C 85°C 70°C 85°C 70°C 85°C 70°C 85°C 70°C 85°C

V_DD= Max, I_OUT= 0 mA

960

mA

980

mA

900

mA

920

mA

800

mA

820

mA

670

mA

690

mA

590

mA

610

mA

I_DD

Operating Current (x36): DDR

Operating Current (x18): DDR

Operating Current (x9): DDR

Operating Current (x8): DDR

2, 3

Cycle Time ≥ t_KHKHMin

V_DD= Max, I_OUT= 0 mA

900

mA

920

mA

840

mA

860

mA

740

mA

760

mA

620

mA

640

mA

550

mA

570

mA

Cycle Time ≥ t_KHKHMin

V_DD= Max, I_OUT= 0 mA

900

mA

920

mA

840

mA

860

mA

740

mA

760

mA

620

mA

640

mA

550

mA

570

mA

Cycle Time ≥ t_KHKHMin

V_DD= Max, I_OUT= 0 mA

900

mA

920

mA

840

mA

860

mA

740

mA

760

mA

620

mA

640

mA

550

mA

570

mA

Cycle Time ≥ t_KHKHMin

Device deselected,

I^OUT= 0 mA, f = Max,

350

mA

360

mA

330

mA

340

mA

300

mA

310

mA

280

mA

290

mA

260

mA

270

mA

I_SB1

Standby Current (NOP): DDR

2, 4

^{All Inputs}≤ 0.2 V or ≥ V_DD– 0.2 V

Notes:

1.

2.

Power measured with output pins floating.

Minimum cycle, I_OUT= 0 mA

Operating current is calculated with 50% read cycles and 50% write cycles.

Standby Current is only after all pending read and write burst operations are completed.

3.

4.

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Preliminary

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AC Electrical Characteristics

-333

-300

-250

-200

-167

Parameter

Symbol

Units

Min

Max

Min

Max

Min

Max

Min

Max

Min

Max

Clock

t_KHKH

t_CHCH

K, K Clock Cycle Time

C, C Clock Cycle Time

3.0

—

3.5

0.2

—

3.3

—

4.2

0.2

—

4.0

—

6.3

0.2

—

5.0

—

7.9

0.2

—

6.0

—

8.4

0.2

—

ns

t_KCVar

tTKC Variable

5

t_KHKL

t_CHCL

K, K Clock High Pulse Width

C, C Clock High Pulse Width

1.2

1.32

1.6

2.0

2.4

t_KLKH

t_CLCH

K, K Clock Low Pulse Width

C, C Clock Low Pulse Width

1.2

—

1.32

—

1.6

—

2.0

—

2.4

—

ns

K to K High

C to C High

t_KHKH

1.35

0

1.49

0

1.8

0

2.2

0

2.7

0

t_KHCH

t_KCLock

t_KCReset

K, K Clock High to C, C Clock High

DLL Lock Time

1.3

—

1.45

—

1.8

—

2.3

—

2.8

—

ns

cycle

ns

1024

30

1024

30

1024

30

1024

30

1024

30

6

K Static to DLL reset

—

Output Times

t_KHQV

t_CHQV

K, K Clock High to Data Output Valid

C, C Clock High to Data Output Valid

—

0.45

—

0.45

—

0.45

—

0.45

—

–0.5

—

0.5

—

ns

3

t_KHQX

t_CHQX

K, K Clock High to Data Output Hold

C, C Clock High to Data Output Hold

–0.45

—

–0.45

—

–0.45

—

–0.45

—

t_KHCQV

t_CHCQV

K, K Clock High to Echo Clock Valid

C, C Clock High to Echo Clock Valid

0.45

—

0.45

—

0.45

—

0.45

—

0.5

—

t_KHCQX

t_CHCQX

K, K Clock High to Echo Clock Hold

C, C Clock High to Echo Clock Hold

–0.45

–0.5

t_CQHQV

t_CQHQX

t_KHQZ

t_CHQZ

t_KHQX1

t_CHQX1

CQ, CQ High Output Valid

CQ, CQ High Output Hold

—

0.25

—

0.27

—

0.30

—

0.35

—

0.40

—

ns

7

–0.25

–0.27

–0.30

–0.35

–0.40

K Clock High to Data Output High-Z

C Clock High to Data Output High-Z

—

0.45

—

0.45

—

0.45

—

0.45

—

0.5

—

ns

3

K Clock High to Data Output Low-Z

C Clock High to Data Output Low-Z

–0.45

–0.5

Setup Times

t_AVKH

t_IVKH

Address Input Setup Time

0.4

—

0.4

0.3

—

0.5

—

0.6

0.4

—

0.7

0.5

—

ns

Control Input Setup Time

Data Input Setup Time

2

t_DVKH

0.28

0.35

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Preliminary

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AC Electrical Characteristics (Continued)

-333

-300

-250

-200

-167

Parameter

Symbol

Units

Min

Max

Min

Max

Min

Max

Min

Max

Min

Max

Hold Times

t_KHAX

t_KHIX

Address Input Hold Time

0.4

—

0.4

0.3

—

0.5

—

0.6

0.4

—

0.7

0.5

—

ns

Control Input Hold Time

t_KHDX

Data Input Hold Time

0.28

0.35

Notes:

1. All Address inputs must meet the specified setup and hold times for all latching clock edges.

2. Control singles are R, W, BW0, BW1, and (NW0, NW1 for x8) and (BW2, BW3 for x36).

3. If C, C are tied high, K, K become the references for C, C timing parameters

4. To avoid bus contention, at a given voltage and temperature tCHQX1 is bigger than tCHQZ. The specs as shown do not imply bus conten-

tion because tCHQX1 is a MIN parameter that is worst case at totally different test conditions (0°C, 1.9 V) than tCHQZ, which is a MAX

parameter (worst case at 70°C, 1.7 V). It is not possible for two SRAMs on the same board to be at such different voltages and tempera-

tures.

5. Clock phase jitter is the variance from clock rising edge to the next expected clock rising edge.

6.

V

slew rate must be less than 0.1 V DC per 50 ns for DLL lock retention. DLL lock time begins once V and input clock are stable.

D

7. Echo clock is very tightly controlled to data valid/data hold. By design, there is a ±0.1 ns variation from echo clock to data. The datasheet

parameters reflect tester guard bands and test setup variations.

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Preliminary

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Preliminary

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Preliminary

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JTAG Port Operation

Overview

The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan

interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with V . The JTAG output

DD

drivers are powered by V

.

DDQ

Disabling the JTAG Port

It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless

clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG

Port unused, TCK, TDI, and TMS may be left floating or tied to either V or V . TDO should be left unconnected.

DD

SS

JTAG Pin Descriptions

Pin Name

I/O

Description

Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate

from the falling edge of TCK.

TCK

Test Clock

In

The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP

TMS

TDI

Test Mode Select

Test Data In

In controller state machine. An undriven TMS input will produce the same result as a logic one input

level.

The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers

placed between TDI and TDO. The register placed between TDI and TDO is determined by the

In state of the TAP Controller state machine and the instruction that is currently loaded in the TAP

Instruction Register (refer to the TAP Controller State Diagram). An undriven TDI pin will produce

the same result as a logic one input level.

Output that is active depending on the state of the TAP state machine. Output changes in

Out response to the falling edge of TCK. This is the output side of the serial registers placed between

TDI and TDO.

TDO

Test Data Out

Note:

This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is

held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up.

JTAG Port Registers

Overview

The various JTAG registers, refered to as Test Access Port orTAP Registers, are selected (one at a time) via the sequences of 1s and

0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the rising

edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the TDI

and TDO pins.

Instruction Register

The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or

the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the

TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the

controller is placed in Test-Logic-Reset state.

Bypass Register

The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through

the RAM’s JTAG Port to another device in the scan chain with as little delay as possible.

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Boundary Scan Register

The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins.

The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The

Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the

device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan

Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in

Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z,

SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register.

JTAG TAP Block Diagram

·

Boundary Scan Register

·

0

Bypass Register

2

1 0

Instruction Register

TDI

TDO

ID Code Register

31 30 29

2 1

0

·

· · ·

Control Signals

Test Access Port (TAP) Controller

TMS

TCK

Identification (ID) Register

The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in

Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM.

It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the

controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins.

ID Register Contents TBD for this part.

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Preliminary

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ID Register Contents (TBD)

Die

Revision

Code

GSI Technology

JEDEC Vendor

Configuration

ID Code

I/O

Not Used

Bit # 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

0

x36

x18

Tap Controller Instruction Set

Overview

There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific

(Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be

implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load

address, data or control signals into the RAM or to preload the I/O buffers.

When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01.

When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired

instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the

TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this

device is listed in the following table.

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Preliminary

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JTAG Tap Controller State Diagram

Test Logic Reset

1

0

1

Run Test Idle

Select DR

Select IR

0

1

Capture DR

Capture IR

0

Shift DR

Shift IR

0

1

Exit1 DR

Exit1 IR

0

Pause DR

Pause IR

0

1

Exit2 DR

Exit2 IR

1

Update DR

Update IR

1

0

1

0

Instruction Descriptions

BYPASS

When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This

occurs when the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facili-

tate testing of other devices in the scan path.

SAMPLE/PRELOAD

SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is

loaded in the Instruction Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and

I/O buffers into the Boundary Scan Register. Boundary Scan Register locations are not associated with an input or I/O pin, and

are loaded with the default state identified in the Boundary Scan Chain table at the end of this section of the datasheet. Because

the RAM clock is independent from the TAP Clock (TCK) it is possible for the TAP to attempt to capture the I/O ring contents

while the input buffers are in transition (i.e. in a metastable state). Although allowing the TAP to sample metastable inputs will

not harm the device, repeatable results cannot be expected. RAM input signals must be stabilized for long enough to meet the

TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP

operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-DR state then

places the boundary scan register between the TDI and TDO pins.

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EXTEST

EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with

all logic 0s. The EXTEST command does not block or override the RAM’s input pins; therefore, the RAM’s internal state is

still determined by its input pins.

Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command.

Then the EXTEST command is used to output the Boundary Scan Register’s contents, in parallel, on the RAM’s data output

drivers on the falling edge of TCK when the controller is in the Update-IR state.

Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruc-

tion is selected, the sate of all the RAM’s input and I/O pins, as well as the default values at Scan Register locations not asso-

ciated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR

state, the RAM’s output pins drive out the value of the Boundary Scan Register location with which each output pin is associ-

ated.

IDCODE

The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and

places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction

loaded in at power up and any time the controller is placed in the Test-Logic-Reset state.

SAMPLE-Z

If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (high-

Z) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR

state.

RFU

These instructions are Reserved for Future Use. In this device they replicate the BYPASS instruction.

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JTAG TAP Instruction Set Summary

Instruction

EXTEST

Code

000

Description

Notes

1

Places the Boundary Scan Register between TDI and TDO.

Preloads ID Register and places it between TDI and TDO.

IDCODE

001

1, 2

Captures I/O ring contents. Places the Boundary Scan Register between TDI and

SAMPLE-Z

RFU

010

011

TDO.

1

Forces all RAM output drivers to High-Z.

Do not use this instruction; Reserved for Future Use.

Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.

SAMPLE/

PRELOAD

Captures I/O ring contents. Places the Boundary Scan Register between TDI and

TDO.

100

101

110

111

1

GSI

RFU

GSI private instruction.

Do not use this instruction; Reserved for Future Use.

Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.

BYPASS

Places Bypass Register between TDI and TDO.

Notes:

1. Instruction codes expressed in binary, MSB on left, LSB on right.

2. Default instruction automatically loaded at power-up and in test-logic-reset state.

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JTAG Port Recommended Operating Conditions and DC Characteristics

Parameter

Symbol

Min.

Max.

Unit Notes

V

2.0

V

+0.3

DD3

3.3 V Test Port Input High Voltage

3.3 V Test Port Input Low Voltage

2.5 V Test Port Input High Voltage

2.5 V Test Port Input Low Voltage

TMS, TCK and TDI Input Leakage Current

TDO Output Leakage Current

V

1

IHJ3

V

0.8

+0.3

–0.3

ILJ3

V

0.6 * V

V

1

IHJ2

DD2

V

0.3 * V

1

–0.3

–300

–1

V

1

ILJ2

DD2

I

uA

V

2

INHJ

I

100

1

3

INLJ

I

–1

4

OLJ

V

Test Port Output High Voltage

1.7

—

5, 6

5, 7

5, 8

5, 9

OHJ

V

Test Port Output Low Voltage

—

0.4

V

OLJ

V

– 100 mV

DDQ

Test Port Output CMOS High

—

V

OHJC

V

Test Port Output CMOS Low

—

100 mV

V

OLJC

Notes:

1. Input Under/overshoot voltage must be –2 V > Vi < V

+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tTKC.

DDn

2.

V

≤ V ≤ V

ILJ

IN

DDn

3. 0 V ≤ V ≤ V

IN

ILJn

4. Output Disable, V

= 0 to V

DDn

OUT

5. The TDO output driver is served by the V

supply.

DDQ

6.

7.

8.

9.

I

= –4 mA

OHJ

= + 4 mA

OLJ

= –100 uA

= +100 uA

OHJC

JTAG Port AC Test Conditions

Parameter

Conditions

JTAG Port AC Test Load

DQ

V

– 0.2 V

Input high level

Input low level

DD

0.2 V

1 V/ns

*

50Ω

30pF

Input slew rate

V

/2

DDQ

V

/2

Input reference level

DDQ

* Distributed Test Jig Capacitance

/2

Output reference level

DDQ

Notes:

1. Include scope and jig capacitance.

2. Test conditions as as shown unless otherwise noted.

Rev: 1.02 8/2005

32/39

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Preliminary

GS8342S08/09/18/36E-333/300/250/200/167

JTAG Port Timing Diagram

tTKC

tTKH

tTKL

TCK

TDI

tTH

tTS

TMS

TDO

tTKQ

tTH

tTS

Parallel SRAM input

JTAG Port AC Electrical Characteristics

Parameter

Symbol

tTKC

tTKQ

tTKH

tTKL

tTS

Min

Max

—

Unit

TCK Cycle Time

50

—

ns

TCK Low to TDO Valid

TCK High Pulse Width

TCK Low Pulse Width

TDI & TMS Set Up Time

TDI & TMS Hold Time

20

—

20

10

—

tTH

—

Rev: 1.02 8/2005

33/39

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Preliminary

GS8342S08/09/18/36E-333/300/250/200/167

Package Dimensions—165-Bump FPBGA (Package E)

A1 CORNER

TOP VIEW

BOTTOM VIEW

A1 CORNER

M

Ø0.08

C

Ø0.15 C A B

Ø0.40~0.50 (165x)

1

2 3 4 5 6 7 8 9 10 11

11 10 9 8

7 6 5 4 3 2 1

A

B

C

D

E

F

A

B

C

D

E

F

G

H

J

G

H

J

K

L

K

L

M

N

P

R

M

N

P

R

A

1.0

10.0

1.0

15±0.05

B

0.15(4x)

SEATING PLANE

C

Rev: 1.02 8/2005

34/39

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Preliminary

GS8342S08/09/18/36E-333/300/250/200/167

Ordering Information—GSI SigmaSIO-II SRAM

Speed

(MHz)

3

1

Org

Type

Package

Status

T

Part Number

A

1M x 36

2M x 18

4M x 9

GS8342S36E-333

GS8342S36E-300

GS8342S36E-250

GS8342S36E-200

GS8342S36E-167

GS8342S36E-333I

GS8342S36E-300I

GS8342S36E-250I

GS8342S36E-200I

GS8342S36E-167I

GS8342S18E-333

GS8342S18E-300

GS8342S18E-250

GS8342S18E-200

GS8342S18E-167

GS818S18D-100

GS8342S18E-333I

GS8342S18E-300I

GS8342S18E-250I

GS8342S18E-200I

GS8342S18E-167I

GS8342S09E-333

GS8342S09E-300

GS8342S09E-250

GS8342S09E-200

GS8342S09E-167

GS8342S09E-333I

GS8342S09E-300I

SigmaSIO-II SRAM

165-Pin BGA

333

300

250

200

167

333

300

250

200

167

333

300

250

200

167

100

333

300

250

200

167

333

300

250

200

167

333

300

C

I

ES

I

C

I

C

I

4M x 9

I

Notes:

1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS834x36E-300T.

2. T = C = Commercial Temperature Range. T = I = Industrial Temperature Range.

A

3. MP = Mass Production. PQ = Pre-Qualification. ES = Engineering Samples.

Rev: 1.02 8/2005

35/39

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Preliminary

GS8342S08/09/18/36E-333/300/250/200/167

Ordering Information—GSI SigmaSIO-II SRAM

Speed

(MHz)

3

1

Org

Type

Package

Status

T

Part Number

A

4M x 9

4M x 8

GS8342S09E-250I

GS8342S09E-200I

GS8342S09E-167I

GS8342S08E-333

GS8342S08E-300

GS8342S08E-250

GS8342S08E-200

GS8342S08E-167

GS818S18D-100

GS8342S08E-333I

GS8342S08E-300I

GS8342S08E-250I

GS8342S08E-200I

GS8342S08E-167I

SigmaSIO-II SRAM

165-Pin BGA

250

200

167

333

300

250

200

167

100

333

300

250

200

167

I

ES

I

C

I

RoHS-compliant

165-Pin BGA

1M x 36

GS8342S36GE-333

GS8342S36GE-300

GS8342S36GE-250

GS8342S36GE-200

GS8342S36GE-167

GS8342S36GE-333I

GS8342S36GE-300I

GS8342S36GE-250I

GS8342S36GE-200I

SigmaSIO-II SRAM

333

300

250

200

167

333

300

250

200

C

I

ES

RoHS-compliant

165-Pin BGA

RoHS-compliant

165-Pin BGA

RoHS-compliant

165-Pin BGA

RoHS-compliant

165-Pin BGA

RoHS-compliant

165-Pin BGA

RoHS-compliant

165-Pin BGA

I

RoHS-compliant

165-Pin BGA

I

RoHS-compliant

165-Pin BGA

I

Notes:

1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS834x36E-300T.

2. T = C = Commercial Temperature Range. T = I = Industrial Temperature Range.

A

3. MP = Mass Production. PQ = Pre-Qualification. ES = Engineering Samples.

Rev: 1.02 8/2005

36/39

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Preliminary

GS8342S08/09/18/36E-333/300/250/200/167

Ordering Information—GSI SigmaSIO-II SRAM

Speed

(MHz)

3

1

Org

Type

Package

Status

T

Part Number

A

RoHS-compliant

165-Pin BGA

1M x 36

2M x 18

4M x 9

GS8342S36GE-167I

GS8342S18GE-333

GS8342S18GE-300

GS8342S18GE-250

GS8342S18GE-200

GS8342S18GE-167

GS818S18D-100

SigmaSIO-II SRAM

167

333

300

250

200

167

100

333

300

250

200

167

333

300

250

200

167

333

I

ES

RoHS-compliant

165-Pin BGA

C

I

RoHS-compliant

165-Pin BGA

RoHS-compliant

165-Pin BGA

RoHS-compliant

165-Pin BGA

RoHS-compliant

165-Pin BGA

RoHS-compliant

165-Pin BGA

RoHS-compliant

165-Pin BGA

GS8342S18GE-333I

GS8342S18GE-300I

GS8342S18GE-250I

GS8342S18GE-200I

GS8342S18GE-167I

GS8342S09GE-333

GS8342S09GE-300

GS8342S09GE-250

GS8342S09GE-200

GS8342S09GE-167

GS8342S09GE-333I

RoHS-compliant

165-Pin BGA

I

RoHS-compliant

165-Pin BGA

I

RoHS-compliant

165-Pin BGA

I

RoHS-compliant

165-Pin BGA

I

RoHS-compliant

165-Pin BGA

C

I

RoHS-compliant

165-Pin BGA

4M x 9

RoHS-compliant

165-Pin BGA

4M x 9

RoHS-compliant

165-Pin BGA

4M x 9

RoHS-compliant

165-Pin BGA

4M x 9

RoHS-compliant

165-Pin BGA

4M x 9

Notes:

1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS834x36E-300T.

2. T = C = Commercial Temperature Range. T = I = Industrial Temperature Range.

A

3. MP = Mass Production. PQ = Pre-Qualification. ES = Engineering Samples.

Rev: 1.02 8/2005

37/39

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Preliminary

GS8342S08/09/18/36E-333/300/250/200/167

Ordering Information—GSI SigmaSIO-II SRAM

Speed

(MHz)

3

1

Org

Type

Package

Status

T

Part Number

A

RoHS-compliant

165-Pin BGA

4M x 9

4M x 8

GS8342S09GE-300I

GS8342S09GE-250I

GS8342S09GE-200I

GS8342S09GE-167I

GS8342S08GE-333

GS8342S08GE-300

GS8342S08GE-250

GS8342S08GE-200

GS8342S08GE-167

GS818S18D-100

SigmaSIO-II SRAM

300

250

200

167

333

300

250

200

167

100

333

300

250

200

167

I

ES

RoHS-compliant

165-Pin BGA

RoHS-compliant

165-Pin BGA

I

RoHS-compliant

165-Pin BGA

I

RoHS-compliant

165-Pin BGA

C

I

RoHS-compliant

165-Pin BGA

RoHS-compliant

165-Pin BGA

RoHS-compliant

165-Pin BGA

RoHS-compliant

165-Pin BGA

RoHS-compliant

165-Pin BGA

RoHS-compliant

165-Pin BGA

GS8342S08GE-333I

GS8342S08GE-300I

GS8342S08GE-250I

GS8342S08GE-200I

GS8342S08GE-167I

RoHS-compliant

165-Pin BGA

I

RoHS-compliant

165-Pin BGA

I

RoHS-compliant

165-Pin BGA

I

RoHS-compliant

165-Pin BGA

I

Notes:

1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS834x36E-300T.

2. T = C = Commercial Temperature Range. T = I = Industrial Temperature Range.

A

3. MP = Mass Production. PQ = Pre-Qualification. ES = Engineering Samples.

Rev: 1.02 8/2005

38/39

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Preliminary

GS8342S08/09/18/36E-333/300/250/200/167

SigmaSIO-II Revision History

File Name

Format/Content

Description of changes

8342Sxx_r1

Creation of datasheet

• Updated format

• Updated timing diagrams

8342Sxx_r1; 8342Sxx_r1_01

Format/Content

• Updated timing diagrams

• Removed 400 MHz speed bin

• Added 333 MHz speed bin

• Added x9 part

8342Sxx_r1_01; 8342Sxx_r1_02

Content

• Added RoHS-compliant information

Rev: 1.02 8/2005

39/39

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.


型号：	GS8342S18E-167T
厂家：	GSI TECHNOLOGY
描述：	Standard SRAM, 2MX18, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 静态存储器内存集成电路
文件：	总39页 (文件大小：1577K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

GS8342S18E-167T [GSI]

相关型号：

GS8342S18E-200

GS8342S18E-200I

GS8342S18E-200IT

GS8342S18E-200T

GS8342S18E-250

GS8342S18E-250I

GS8342S18E-250IT

GS8342S18E-300

GS8342S18E-300I

GS8342S18E-333

GS8342S18E-333I

GS8342S18E-333IT