GS8672T20 [GSI]
72Mb SigmaDDR-IITM Burst of 2 ECCRAMTM;型号: | GS8672T20 |
厂家: | GSI TECHNOLOGY |
描述: | 72Mb SigmaDDR-IITM Burst of 2 ECCRAMTM 双倍数据速率 |
文件: | 总27页 (文件大小:376K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
GS8672T20/38BE-633/550/500/450/400
633 MHz–400 MHz
72Mb SigmaDDR-II+TM
Burst of 2 ECCRAMTM
165-Bump BGA
Commercial Temp
Industrial Temp
1.8 V V
DD
1.5 V I/O
Features
Clocking and Addressing Schemes
• 2.5 Clock Latency
The GS8672T20/38BE SigmaDDR-II+ SRAMs are
• On-Chip ECC with virtually zero SER
• Simultaneous Read and Write SigmaDDR™ Interface
• Common I/O bus
synchronous devices. They employ two input register clock
inputs, K and K. K and K are independent single-ended clock
inputs, not differential inputs to a single differential clock input
buffer.
• JEDEC-standard package
• Double Data Rate interface
• Byte Write capability
• Burst of 2 Read and Write
• On-Die Termination (ODT) on Data (DQ), Byte Write (BW),
and Clock (K, K) outputs
• 1.8 V +100/–100 mV core power supply
• 1.5 V HSTL Interface
• Pipelined read operation with self-timed Late Write
• Fully coherent read and write pipelines
• ZQ pin for programmable output drive strength
• IEEE 1149.1 JTAG-compliant Boundary Scan
• Pin-compatible with 36Mb and 144Mb devices
• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package
• RoHS-compliant 165-bump BGA package available
Each internal read and write operation in a SigmaDDR-II+ B2
ECCRAM is two times wider than the device I/O bus. An input
data bus de-multiplexer is used to accumulate incoming data
before it is simultaneously written to the memory array. An
output data multiplexer is used to capture the data produced
from a single memory array read and then route it to the
appropriate output drivers as needed. Therefore the address
field of a SigmaDDR-II+ B2 ECCRAM is always one address
pin less than the advertised index depth (e.g., the 4M x 18 has
an 2M addressable index).
On-Chip Error Correction Code
GSI's ECCRAMs implement an ECC algorithm that detects
and corrects all single-bit memory errors, including those
induced by Soft Error Rate (SER) events such as cosmic rays,
alpha particles etc. The resulting SER of these devices is
anticipated to be <0.002 FITs/Mb — a 5-order-of-magnitude
improvement over comparable SRAMs with no On-Chip ECC,
which typically have an SER of 200 FITs/Mb or more. SER
quoted above is based on reading taken at sea level.
SigmaDDR™ ECCRAM Overview
The GS8672T20/38BE SigmaDDR-II+ ECCRAMs are built in
compliance with the SigmaDDR-II+ SRAM pinout standard
for Common I/O synchronous SRAMs. They are
75,497,472-bit (72Mb) SRAMs. The GS8672T20/38BE
SigmaDDR SRAMs are just one element in a family of low
power, low voltage HSTL I/O SRAMs designed to operate at
the speeds needed to implement economical high performance
networking systems.
However, the On-Chip Error Correction (ECC) will be
disabled if a “Half Write” operation is initiated. See the Byte
Write Contol section for further information.
Parameter Synopsis
-633
-550
1.81 ns
0.45 ns
-500
2.0 ns
0.45 ns
-450
2.2 ns
0.45 ns
-400
2.5 ns
0.45 ns
tKHKH
tKHQV
1.57 ns
0.45 ns
Rev: 1.02a 6/2013
1/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
2M x 36 SigmaDDR-II+ SRAM—Top View
1
2
3
4
5
6
7
8
9
10
11
NF
(144Mb)
A
CQ
SA
R/W
BW2
K
BW1
LD
SA
SA
CQ
B
C
D
E
F
NC
NC
NC
NC
NC
NC
Doff
NC
NC
NC
NC
NC
NC
TDO
DQ27
NC
DQ18
DQ28
DQ19
DQ20
DQ21
DQ22
SA
BW3
SA
K
BW0
SA
SA
NC
NC
NC
NC
NC
NC
NC
DQ17
NC
DQ8
DQ7
DQ16
DQ6
DQ5
DQ14
ZQ
V
V
NF
V
SS
SS
SS
SS
DQ29
NC
V
V
V
V
V
V
SS
SS
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD
DD
DD
DD
DD
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
DQ15
NC
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DQ30
DQ31
V
V
V
V
V
V
V
V
V
V
V
DDQ
DDQ
DDQ
DDQ
DDQ
G
H
J
V
V
V
NC
V
V
V
V
REF
REF
DDQ
DDQ
NC
NC
DQ32
DQ23
DQ24
DQ34
DQ25
DQ26
SA
NC
DQ13
DQ12
NC
DQ4
DQ3
DQ2
DQ1
DQ10
DQ0
TDI
K
L
V
NC
NC
NC
NC
NC
SA
DQ33
NC
V
V
V
V
V
DDQ
SS
SS
SS
SS
M
N
P
R
V
V
DQ11
NC
SS
SS
SS
SS
DQ35
NC
V
SA
SA
SA
SA
SA
SA
SA
V
SA
SA
QVLD
ODT
SA
SA
DQ9
TMS
TCK
2
11 x 15 Bump BGA—13 x 15 mm Body—1 mm Bump Pitch
Note:
BW0 controls writes to DQ0:DQ8; BW1 controls writes to DQ9:DQ17; BW2 controls writes to DQ18:DQ26; BW3 controls writes to DQ27:DQ35
Rev: 1.02a 6/2013
2/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
4M x 18 SigmaDDR-II+ SRAM—Top View
1
2
3
4
5
6
7
8
9
10
11
A
B
C
D
E
F
CQ
SA
SA
R/W
BW1
K
NF
LD
SA
SA
CQ
NC
NC
NC
NC
NC
NC
Doff
NC
NC
NC
NC
NC
NC
TDO
DQ9
NC
NF
NF
SA
NF
SA
K
BW0
SA
SA
NC
NC
NC
NC
NC
NC
NC
DQ7
NC
NF
DQ8
NF
V
V
NF
V
SS
SS
SS
SS
NF
DQ10
DQ11
NF
V
V
V
V
V
V
NF
SS
SS
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD
DD
DD
DD
DD
NC
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
DQ6
DQ5
NF
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DQ12
NF
V
V
V
V
V
V
V
V
V
V
V
NC
NC
DDQ
DDQ
DDQ
DDQ
DDQ
G
H
J
DQ13
V
V
V
V
V
V
V
REF
ZQ
REF
DDQ
DDQ
NC
NC
NF
DQ14
NF
NC
DQ4
NF
NF
K
L
V
NC
NC
NC
NC
NC
SA
DQ3
DQ2
NF
DQ15
NC
V
V
V
V
V
NC
DDQ
SS
SS
SS
SS
M
N
P
R
NF
V
V
DQ1
NC
SS
SS
SS
SS
NF
DQ16
DQ17
SA
V
SA
SA
SA
SA
SA
SA
SA
V
NF
NC
SA
SA
QVLD
ODT
SA
SA
NF
DQ0
TDI
TCK
TMS
2
11 x 15 Bump BGA—13 x 15 mm Body—1 mm Bump Pitch
Note:
BW0 controls writes to DQ0:DQ8; BW1 controls writes to DQ9:DQ17
Rev: 1.02a 6/2013
3/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
Pin Description Table
Description
Type
Comments
Symbol
Synchronous Address Inputs
Input
—
SA
High: Read
Low: Write
Synchronous Read/Write
Input
R/W
Synchronous Byte Writes
Synchronous Load Pin
Input Clock
Input
Input
Input
Input
Input
Input
Input
Output
Input
Active Low
BW0–BW3
LD
Active Low
Active High
K
Input Clock
Active Low
K
Test Mode Select
Test Data Input
—
—
—
—
—
TMS
TDI
Test Clock Input
TCK
TDO
VREF
Test Data Output
HSTL Input Reference Voltage
Output Impedance Matching Input
Data I/O
Input
Input/Output
Input
—
Three State
Active Low
—
ZQ
DQ
Disable DLL when low
Output Echo Clock
Output Echo Clock
Doff
CQ
Output
Output
—
CQ
Power Supply
Supply
Supply
Supply
1.8 V Nominal
1.5 V Nominal
—
VDD
Isolated Output Buffer Supply
Power Supply: Ground
VDDQ
VSS
Q Valid Output
On-Die Termination
No Connect
Output
Input
—
—
—
—
—
QVLD
ODT
NC
No Function
—
NF
Notes:
1. NC = Not Connected to die or any other pin
2. NF = No Function. There is an electrical connection to this input pin, but the signal has no function in the device. It can be left unconnected,
or tied to V or V
SS
DDQ.
3. K, or K cannot be set to V
voltage.
REF
Rev: 1.02a 6/2013
4/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
Background
Common I/O SRAMs, from a system architecture point of view, are attractive in read dominated or block transfer applications.
Therefore, the SigmaDDR-II+ ECCRAM interface and truth table are optimized for burst reads and writes. Common I/O SRAMs
are unpopular in applications where alternating reads and writes are needed because bus turnaround delays can cut high speed
Common I/O SRAM data bandwidth in half.
Burst Operations
Read and write operations are burst operations. In every case where a read or write command is accepted by the ECCRAM, it will
respond by issuing or accepting two beats of data, executing a data transfer on subsequent rising edges of K and K, as illustrated in
the timing diagrams. This means that it is possible to load new addresses every K clock cycle. Addresses can be loaded less often,
if intervening deselect cycles are inserted.
Deselect Cycles
Chip Deselect commands are pipelined to the same degree as read commands. This means that if a deselect command is applied to
the ECCRAM on the next cycle after a read command captured by the ECCRAM, the device will complete the two beat read data
transfer and then execute the deselect command, returning the output drivers to High-Z. A high on the LD pin prevents the RAM
from loading read or write command inputs and puts the RAM into deselect mode as soon as it completes all outstanding burst
transfer operations.
SigmaDDR-II+ B2 ECCRAM Read Cycles
The SRAM executes pipelined reads. The status of the Address, LD and R/W pins are evaluated on the rising edge of K. The read
command (LD low and R/W high) is clocked into the SRAM by a rising edge of K.
SigmaDDR-II+ B2 ECCRAM Write Cycles
The status of the Address, LD and R/W pins are evaluated on the rising edge of K. The ECCRAM executes Late write data
transfers. Data in is due at the device inputs on the rising edge of K following the rising edge of K clock used to clock in the write
command (LD and R/W low) and the write address. To complete the remaining beat of the burst of two write transfer, the
ECCRAM captures data in on the next rising edge of K, for a total of two transfers per address load.
Rev: 1.02a 6/2013
5/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
Power-Up Sequence for SigmaDDR-II+ ECCRAMs
SigmaDDR-II+ ECCRAMs must be powered-up in a specific sequence in order to avoid undefined operations.
1. After power supplies power-up and clocks (K, K) are stablized, 163,840 cycles are required to set Output Driver
Impedance.
2. Thereafter, an additional 65,536 clock cycles are required to lock the DLL after it has been enabled.
3. Begin Read and Write operations.
For more information, read AN1021 SigmaQuad and SigmaDDR Power-Up.
On-Chip Error Correction
SigmaDDR-II ECCRAMs implement a single-bit error detection and correction algorithm (specifically, a Hamming Code) on each
DDR data word (comprising two 9-bit data bytes) transmitted on each 9-bit data bus (i.e., transmitted on D/Q[8:0], D/Q[17:9], D/
Q[26:18], or D/Q[35:27]). To accomplish this, 5 ECC parity bits (invisible to the user) are utilized per every 18 data bits (visible to
the user).
The ECC algorithm neither corrects nor detects multi-bit errors. However, GSI ECCRAMs are architected in such a way that a
single SER event very rarely causes a multi-bit error across any given "transmitted data unit", where a "transmitted data unit"
represents the data transmitted as the result of a single read or write operation to a particular address. The extreme rarity of multi-
bit errors results in the SER mentioned previously (i.e., <0.002 FITs/Mb measured at sea level.)
Not only does the on-chip ECC significantly improve SER performance, but it also frees up the entire memory array for data
storage. Very often SRAM applications allocate 1/9th of the memory array (i.e., one "error bit" per eight "data bits", in any 9-bit
"data byte") for error detection (either simple parity error detection, or system-level ECC error detection and correction). Such
error-bit allocation is unnecessary with ECCRAMs the entire memory array can be utilized for data storage, effectively providing
12.5% greater storage capacity compared to SRAMs of the same density not equipped with on-chip ECC.
Rev: 1.02a 6/2013
6/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
Special Functions
Byte Write Control
Byte Write Enable pins are sampled at the same time that Data In is sampled. A High on the Byte Write Enable pin associated with
a particular byte (e.g., BW0 controls D0–D8 inputs) will inhibit the storage of that particular byte, leaving whatever data may be
stored at the current address at that byte location undisturbed. Any or all of the Byte Write Enable pins may be driven High or Low
during the data in sample times in a write sequence.
Each write enable command and write address loaded into the RAM provides the base address for a -beat data transfer. The x18
version of the RAM, for example, may write bits in association with each address loaded. Any 9-bit byte may be masked in any
write sequence.
Note: If “Half Write” operations (i.e., write operations in which a BWn pin is asserted for only half of a DDR write data transfer
on the associated 9-bit data bus, causing only 9 bits of the 18-bit DDR data word to be written) are initiated, the on-chip ECC will
be disabled for as long as the SRAM remains powered up thereafter. This must be done because ECC is implemented across entire
18-bit data words, rather than across individual 9-bit data bytes.
Byte Write Truth Table
The truth table below applies to write operations to Address "m", where Address "m" is the 18-bit memory location comprising the
2 beats of DDR write data associated with each BWn pin in a given clock cycle.
BWn
Input Data Byte n
Operation
Result
K
K
K
K
(Beat 1)
(Beat 2)
(Beat 1)
(Beat 2)
0
0
1
1
0
1
0
1
D0
D0
X
D1
X
Full Write
Half Write
Half Write
Abort
D0 and D1 written to Address m
Only D0 written to Address m
Only D1 written to Address m
Address m unchanged
D1
X
X
Notes:
1. BW0 is associated with Input Data Byte D[8:0].
2. BW1 is associated with Input Data Byte D[17:9].
3. BW2 is associated with Input Data Byte D[26:18] (in x36 only).
4. BW3 is associated with Input Data Byte D[35:27] (in x36 only).
5. ECC is disabled if a “Half Write” operation is initiated.
Rev: 1.02a 6/2013
7/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
FLXDrive-II Output Driver Impedance Control
HSTL I/O SigmaDDR-II ECCRAMs are supplied with programmable impedance output drivers. The ZQ pin must be connected to
VSS via an external resistor, RQ, to allow the ECCRAM to monitor and adjust its output driver impedance. The value of RQ must
be 5X the value of the desired RAM output impedance. The allowable range of RQ to guarantee impedance matching continuously
is between 175 and 275. Periodic readjustment of the output driver impedance is necessary as the impedance is affected by
drifts in supply voltage and temperature. The ECCRAM’s output impedance circuitry compensates for drifts in supply voltage and
temperature. A clock cycle counter periodically triggers an impedance evaluation, resets and counts again. Each impedance
evaluation may move the output driver impedance level one step at a time towards the optimum level. The output driver is
implemented with discrete binary weighted impedance steps.
Input Termination Impedance Control
These SigmaDDR-II+ ECCRAMs are supplied with programmable input termination on Data (DQ), Byte Write (BW), and Clock
(K, K) input receivers. Input termination can be enabled or disabled via the ODT pin (6R). When the ODT pin is tied Low (or left
floating–the pin has a small pull-down resistor), input termination is disabled. When the ODT pin is tied High, input termination is
enabled. Termination impedance is programmed via the same RQ resistor (connected between the ZQ pin and V ) used to
SS
program output driver impedance, and is nominally RQ*0.6 Thevenin-equivalent when RQ is between 175 and 225. Periodic
readjustment of the termination impedance occurs to compensate for drifts in supply voltage and temperature, in the same manner
as for driver impedance (see above).
Notes:
1. When ODT = 1, Byte Write (BW), and Clock (K, K) input termination is always enabled.Consequently, BW, K, K inputs
should always be driven High or Low; they should never be tri-stated (i.e., in a High-Z state). If the inputs are tri-stated, the
input termination will pull the signal to V
/2 (i.e., to the switch point of the diff-amp receiver), which could cause the
DDQ
receiver to enter a meta-stable state, resulting in the receiver consuming more power than it normally would. This could result
in the device’s operating currents being higher..
2. When ODT = 1, DQ input termination is enabled during Write and NOP operations, and disabled during Read operations.
Specifically, DQ input termination is disabled 0.5 cycles before the SRAM enables its DQ drivers and starts driving valid Read
Data, and remains disabled until 0.5 cycles after the SRAM stops driving valid Read Data and disables its DQ drivers; DQ
input termination is enabled at all other times. Consequently, the SRAM Controller should disable its DQ input termination,
enable its DQ drivers, and drive DQ inputs (High or Low) during Write and NOP operations. And, it should enable its DQ
input termination and disable its DQ drivers during Read operations. Care should be taken during Write or NOP -> Read
transitions, and during Read -> NOP transitions, to minimize the time during which one device (SRAM or SRAM Controller)
has enabled its DQ input termination while the other device has not yet enabled its DQ driver. Otherwise, the input termination
will pull the signal to VDDQ/2 (i.e., to the switch point of the diff-amp receiver), which could cause the receiver to enter a meta-
stable state, resulting in the receiver consuming more power than it normally would. This could result in the device’s operating
currents being higher..
Rev: 1.02a 6/2013
8/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
Common I/O SigmaDDR-II+ ECCRAM Truth Table
DQ
K
LD
R/W
Operation
n
A + 0
Hi-Z / *
A + 1
Hi-Z / *
1
0
0
X
0
1
Deselect
Write
D@Kn+1
Q@Kn+2
D@Kn+1
Q@Kn+3
Read
Notes:
1. “1” = input “high”; “0” = input “low”; “V” = input “valid”; “X” = input “don’t care”.
2. When On-Die Termination is disabled (ODT = 0), DQ drivers are disabled (i.e., DQ pins are tri-stated) for one cycle in responseto NOP
and Write commands, 2.5 cycles after the command is sampled.
3. When On-Die Termination is enabled (ODT = 1), DQ drivers are disabled for one cycle in response to NOP and Write commands, 2.5
cycles after the command is sampled. The state of the DQ pins during that time (denoted by “*” in the table above) is determined by the
state of the DQ input termination. See the Input Termination Impedance Control section for more information.
Byte Write Clock Truth Table
BW
BW
Current Operation
D
D
K
K
K
K
K
(t
)
(t
)
(t )
(t
)
(t
)
n + 1
n + 1½
n
n + 1
n + 1½
Write
T
T
F
T
F
D1
D2
X
Dx stored if BWn = 0 in both data transfers
Write
T
F
F
D1
X
Dx stored if BWn = 0 in 1st data transfer only
Write
D2
X
Dx stored if BWn = 0 in 2nd data transfer only
Write Abort
No Dx stored in either data transfer
X
Notes:
1. “1” = input “high”; “0” = input “low”; “X” = input “don’t care”; “T” = input “true”; “F” = input “false”.
2. If one or more BWn = 0, then BW = “T”, else BW = “F”.
Rev: 1.02a 6/2013
9/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
x36 Byte Write Enable (BWn) Truth Table
BW0
BW1
BW2
BW3
D0–D8
Don’t Care
Data In
D9–D17
Don’t Care
Don’t Care
Data In
D18–D26
Don’t Care
Don’t Care
Don’t Care
Don’t Care
Data In
D27–D35
Don’t Care
Don’t Care
Don’t Care
Don’t Care
Don’t Care
Don’t Care
Don’t Care
Don’t Care
Data In
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
Don’t Care
Data In
Data In
Don’t Care
Data In
Don’t Care
Don’t Care
Data In
Data In
Don’t Care
Data In
Data In
Data In
Data In
Don’t Care
Data In
Don’t Care
Don’t Care
Data In
Don’t Care
Don’t Care
Don’t Care
Don’t Care
Data In
Data In
Don’t Care
Data In
Data In
Data In
Data In
Don’t Care
Data In
Don’t Care
Don’t Care
Data In
Data In
Data In
Data In
Don’t Care
Data In
Data In
Data In
Data In
Data In
Data In
x18 Byte Write Enable (BWn) Truth Table
BW0
BW1
D0–D8
Don’t Care
Data In
D9–D17
Don’t Care
Don’t Care
Data In
1
0
1
0
1
1
0
0
Don’t Care
Data In
Data In
Rev: 1.02a 6/2013
10/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
Absolute Maximum Ratings
(All voltages reference to V
)
SS
Symbol
VDD
Description
Value
–0.5 to 2.4
Unit
Voltage on VDD Pins
Voltage in VDDQ Pins
Voltage in VREF Pins
V
VDDQ
VREF
VI/O
–0.5 to VDD
V
V
–0.5 to VDDQ
–0.5 to VDDQ +0.5 ( 2.4 V max.)
–0.5 to VDDQ +0.5 ( 2.4 V max.)
Voltage on I/O Pins
V
VIN
Voltage on Other Input Pins
Input Current on Any Pin
V
IIN
+/–100
+/–100
125
mA dc
mA dc
IOUT
Output Current on Any I/O Pin
Maximum Junction Temperature
Storage Temperature
oC
oC
TJ
TSTG
–55 to 125
Note:
Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended
Operating Conditions. Exposure to conditions exceeding the Recommended Operating Conditions, for an extended period of time, may affect
reliability of this component.
Recommended Operating Conditions
Power Supplies
Parameter
Supply Voltage
Symbol
VDD
Min.
1.7
Typ.
1.8
—
Max.
1.9
Unit
V
VDDQ
VREF
I/O Supply Voltage
Reference Voltage
1.4
1.6
V
VDDQ/2 – 0.05
VDDQ/2 + 0.05
—
V
Note:.
The power supplies need to be powered up simultaneously or in the following sequence: V , V , V , followed by signal inputs. The power
DD DDQ REF
down sequence must be the reverse. V
must not exceed V . For more information, read AN1021 SigmaQuad and SigmaDDR Power-Up.
DD
DDQ
Operating Temperature
Parameter
Symbol
Min.
Typ.
Max.
Unit
Junction Temperature
(Commercial Range Versions)
TJ
0
25
85
C
Junction Temperature
(Industrial Range Versions)*
TJ
–40
25
100
C
Note:
* The part numbers of Industrial Temperature Range versions end with the character “I”. Unless otherwise noted, all performance specifications
quoted are evaluated for worst case in the temperature range marked on the device.
Rev: 1.02a 6/2013
11/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
Thermal Impedance
Test PCB
Substrate
JA (C°/W)
Airflow = 0 m/s
JA (C°/W)
Airflow = 1 m/s
JA (C°/W)
Airflow = 2 m/s
JB (C°/W)
JC (C°/W)
Package
165 BGA
4-layer
15.25
12.38
11.41
4.79
1.31
Notes:
1. Thermal Impedance data is based on a number of of samples from mulitple lots and should be viewed as a typical number.
2. Please refer to JEDEC standard JESD51-6.
3. The characteristics of the test fixture PCB influence reported thermal characteristics of the device. Be advised that a good thermal path to
the PCB can result in cooling or heating of the RAM depending on PCB temperature.
HSTL I/O DC Input Characteristics
Parameter
Input Reference Voltage
Symbol
VREF
VIH1
Min
Max
Units
Notes
—
VDDQ /2 – 0.05
VREF + 0.1
VDDQ /2 + 0.05
VDDQ + 0.3
VREF – 0.1
VDDQ + 0.3
0.3 * VDDQ
V
V
V
V
V
Input High Voltage
Input Low Voltage
Input High Voltage
1
VIL1
–0.3
1
VIH2
0.7 * VDDQ
2,3
2,3
VIL2
–0.3
Input Low Voltage
Notes:
1. Parameters apply to K, K, SA, DQ, LD, R/W, BW during normal operation and JTAG boundary scan testing.
2. Parameters apply to Doff, ODT during normal operation and JTAG boundary scan testing.
3. Parameters apply to ZQ during JTAG boundary scan testing only.
HSTL I/O AC Input Characteristics
Parameter
Input Reference Voltage
Symbol
VREF
VIH1
Min
Max
Units
Notes
—
VDDQ /2 – 0.08
VREF + 0.2
VDDQ /2 + 0.08
VDDQ + 0.5
V
V
V
V
V
1,2,3
1,2,3
4,5
Input High Voltage
Input Low Voltage
Input High Voltage
VIL1
VREF – 0.2
–0.5
VIH2
VDDQ – 0.2
VDDQ + 0.5
0.2
VIL2
Input Low Voltage
–0.5
4,5
Notes:
1.
V
and V
apply for pulse widths less than one-quarter of the cycle time.
IL(MIN)
IH(MAX)
2. Input rise and fall times myust be a minimum of 1 V/ns, and within 10% of each other.
3. Parameters apply to K, K, SA, DQ, LD, R/W, BW during normal operation and JTAG boundary scan testing.
4. Parameters apply to Doff, ODT during normal operation and JTAG boundary scan testing.
Rev: 1.02a 6/2013
12/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
Capacitance
o
(T = 25 C, f = 1 MHZ, V = 1.8 V)
A
DD
Parameter
Symbol
CIN
Test conditions
VIN = 0 V
Typ.
4
Max.
5
Unit
pF
Input Capacitance
Output Capacitance
COUT
VOUT = 0 V
4.5
5.5
pF
Note:
This parameter is sample tested.
AC Test Conditions
Parameter
Input high level
Input low level
Conditions
1.25
0 V
Max. input slew rate
Input reference level
Output reference level
2 V/ns
0.75
VDDQ/2
Note:
Test conditions as specified with output loading as shown unless otherwise noted.
AC Test Load Diagram
DQ
RQ = 250 (HSTL I/O)
= 0.75 V
V
REF
50
VT = V /2
DDQ
Input and Output Leakage Characteristics
Parameter
Symbol
IIL
Test Conditions
Min.
–2 uA
Max
Input Leakage Current
(except mode pins)
VIN = 0 to VDDQ
2 uA
IILDOFF
IILODT
VIN = 0 to VDDQ
VIN = 0 to VDDQ
Doff
–100 uA
–2 uA
2 uA
ODT
100 uA
Output Disable,
VOUT = 0 to VDDQ
IOL
Output Leakage Current
–2 uA
2 uA
Rev: 1.02a 6/2013
13/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
HSTL I/O Output Driver DC Electrical Characteristics
Parameter
Output High Voltage
Symbol
VOH1
Min.
Max.
Units
Notes
1
VDDQ/2 – 0.12
VDDQ/2 – 0.12
VDDQ – 0.2
VDDQ/2 + 0.12
VDDQ/2 + 0.12
V
V
VOL1
2
Output Low Voltage
VOH2
—
0.2
V
3, 4
3, 5
6, 7
Output High Voltage
VOL2
—
V
Output Low Voltage
ROUT
(RQ/5) * 0.88
(RQ/5) * 1.12
Output Driver Impedance
Notes:
1.
I
= (V /2) / (RQ/5) +/– 15% @ V = V /2 (for: 175 RQ 275
DDQ OH DDQ
OH
2.
I
= (V /2) / (RQ/5) +/– 15% @ V = V /2 (for: 175 RQ 275.
OL
DDQ
OL
DDQ
3. 0RQ
4.
I
= –1.0 mA
OH
5.
I
= 1.0 mA
OL
6. Parameter applies when 175 RQ 275
7. Tested at V = V * 0.2 and V * 0.8
OUT
DDQ
DDQ
Rev: 1.02a 6/2013
14/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
Rev: 1.02a 6/2013
15/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
AC Electrical Characteristics
-633
-550
-500
-450
-400
Parameter
Symbol
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Clock
tKHKH
tKVar
K, K Clock Cycle Time
1.57
—
6.0
0.15
—
1.81
—
6.0
0.15
—
2.0
—
6.0
0.15
—
2.2
—
6.0
0.15
—
2.5
—
6.0
0.2
—
—
—
—
—
—
ns
ns
tK Variable
4
tKHKL
tKLKH
tKHKH
tKHKH
tKLock
tKReset
K, K Clock High Pulse Width
K, K Clock Low Pulse Width
K to K High
0.4
0.4
0.4
0.4
0.4
cycle
cycle
ns
0.4
—
0.4
—
0.4
—
0.4
—
0.4
0.67
0.67
—
0.77
0.77
—
0.85
0.85
—
0.94
0.94
—
1.06
1.06
K to K High
—
—
—
—
ns
DLL Lock Time
65,536
30
—
65,536
30
—
65,536
30
—
65,536
30
—
65,536
30
cycle
ns
5
K Static to DLL reset
—
—
—
—
Output Times
tKHQV
tKHQX
K, K Clock High to Data Output Valid
—
–0.45
—
—
–0.45
—
—
0.45
—
—
0.45
—
—
–0.45
—
0.45
—
ns
ns
ns
ns
ns
ns
ns
K, K Clock High to Data Output Hold
K, K Clock High to Echo Clock Valid
K, K Clock High to Echo Clock Hold
CQ, CQ High Output Valid
–0.45
—
–0.45
—
–0.45
—
–0.45
—
tKHCQV
tKHCQX
tCQHQV
tCQHQX
tQVLD
–0.45
—
–0.45
—
0.45
—
0.45
—
0.45
—
–0.45
—
–0.45
—
–0.45
—
–0.45
—
–0.45
—
0.15
—
0.15
—
0.15
—
0.15
—
0.2
—
CQ, CQ High Output Hold
–0.15
–0.15
–0.15
–0.15
–0.15
–0.15
–0.15
–0.15
–0.2
–0.2
CQ, CQ High to QVLD
0.15
0.15
0.15
0.15
0.2
tCQHCQH
tCQHCQH
CQ Phase Distortion
0.55
—
0.65
—
0.75
—
0.85
—
1.0
—
ns
tKHQZ
K Clock High to Data Output High-Z
—
0.45
—
—
0.45
—
—
0.45
—
—
0.45
—
—
0.45
—
ns
ns
5
5
tKHQX1
K Clock High to Data Output Low-Z
Setup Times
–0.45
–0.45
–0.45
–0.45
–0.45
tAVKH
tIVKH
Address Input Setup Time
0.23
0.23
—
—
0.23
0.23
—
—
0.25
0.25
—
—
0.275
0.275
—
—
0.4
0.4
—
—
ns
ns
1
2
Control Input Setup Time
(R/W)
Control Input Setup Time
(BWX)
tIVKH
0.18
0.18
—
—
0.18
0.18
—
—
0.2
0.2
—
—
0.22
0.22
—
—
0.28
0.28
—
—
ns
ns
3
tDVKH
Data Input Setup Time
Hold Times
tKHAX
tKHIX
Address Input Hold Time
0.23
0.23
—
—
0.23
0.23
—
—
0.25
0.25
—
—
0.275
0.275
—
—
0.4
0.4
—
—
ns
ns
1
2
Control Input Hold Time
(R/W)
Control Input Hold Time
(BWX)
tKHIX
0.18
0.18
—
—
0.18
0.18
—
—
0.2
0.2
—
—
0.22
0.22
—
—
0.28
0.28
—
—
ns
ns
3
tKHDX
Data Input Hold Time
Notes:
1. All Address inputs must meet the specified setup and hold times for all latching clock edges.
2. Control signals are LD, R/W.
3. Control signals are BW0, BW1 and (BW2, BW3 for x36).
4. Clock phase jitter is the variance from clock rising edge to the next expected clock rising edge.
5. slew rate must be less than 0.1 V DC per 50 ns for DLL lock retention. DLL lock time begins once V and input clock are stable.
V
DD
DD
Rev: 1.02a 6/2013
16/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
Rev: 1.02a 6/2013
17/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
Rev: 1.02a 6/2013
18/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
JTAG Port Operation
Overview
The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan
interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with V . The JTAG output
DD
drivers are powered by V
.
DD
Disabling the JTAG Port
It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless
clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG
Port unused, TCK, TDI, and TMS may be left floating or tied to either V or V . TDO should be left unconnected.
DD
SS
JTAG Pin Descriptions
Pin
Pin Name
I/O
Description
Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate from the
falling edge of TCK.
TCK
Test Clock
In
The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP controller state
machine. An undriven TMS input will produce the same result as a logic one input level.
TMS
TDI
Test Mode Select
Test Data In
In
The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers placed
between TDI and TDO. The register placed between TDI and TDO is determined by the state of the TAP
In Controller state machine and the instruction that is currently loaded in the TAP Instruction Register (refer to
the TAP Controller State Diagram). An undriven TDI pin will produce the same result as a logic one input
level.
Output that is active depending on the state of the TAP state machine. Output changes in response to the
falling edge of TCK. This is the output side of the serial registers placed between TDI and TDO.
TDO
Test Data Out
Out
Note:
This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is
held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up.
JTAG Port Registers
Overview
The various JTAG registers, refered to as Test Access Port or TAP Registers, are selected (one at a time) via the sequences of 1s
and 0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the
rising edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the
TDI and TDO pins.
Instruction Register
The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or
the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the
TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the
controller is placed in Test-Logic-Reset state.
Bypass Register
The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through
the RAM’s JTAG Port to another device in the scan chain with as little delay as possible.
Boundary Scan Register
The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins.
The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The
Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the
device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan
Rev: 1.02a 6/2013
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© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in
Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z,
SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register.
JTAG TAP Block Diagram
·
·
·
·
·
·
·
·
Boundary Scan Register
·
·
·
0
Bypass Register
2
1 0
Instruction Register
TDI
TDO
ID Code Register
31 30 29
2 1
0
·
· · ·
Control Signals
Test Access Port (TAP) Controller
TMS
TCK
Identification (ID) Register
The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in
Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM.
It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the
controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins.
ID Register Contents
GSI Technology
Not Used
JEDEC Vendor
ID Code
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10
9
0
8
1
7
1
6
0
5
1
4
1
3
0
2
0
1
1
0
1
Bit #
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
0
Rev: 1.02a 6/2013
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© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
Tap Controller Instruction Set
Overview
There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific
(Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be
implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load
address, data or control signals into the RAM or to preload the I/O buffers.
When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01.
When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired
instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the
TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this
device is listed in the following table.
JTAG Tap Controller State Diagram
Test Logic Reset
1
0
1
1
1
Run Test Idle
Select DR
Select IR
0
0
0
1
1
1
1
Capture DR
Capture IR
0
0
Shift DR
Shift IR
0
0
1
1
Exit1 DR
Exit1 IR
0
0
Pause DR
Pause IR
0
0
0
0
1
1
Exit2 DR
Exit2 IR
1
1
Update DR
Update IR
1
0
1
0
Instruction Descriptions
BYPASS
When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This
occurs when the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facili-
tate testing of other devices in the scan path.
Rev: 1.02a 6/2013
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© 2011, GSI Technology
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GS8672T20/38BE-633/550/500/450/400
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is
loaded in the Instruction Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and
I/O buffers into the Boundary Scan Register. Boundary Scan Register locations are not associated with an input or I/O pin, and
are loaded with the default state identified in the Boundary Scan Chain table at the end of this section of the datasheet. Because
the RAM clock is independent from the TAP Clock (TCK) it is possible for the TAP to attempt to capture the I/O ring contents
while the input buffers are in transition (i.e. in a metastable state). Although allowing the TAP to sample metastable inputs will
not harm the device, repeatable results cannot be expected. RAM input signals must be stabilized for long enough to meet the
TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP
operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-DR state then
places the boundary scan register between the TDI and TDO pins.
EXTEST
EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with
all logic 0s. The EXTEST command does not block or override the RAM’s input pins; therefore, the RAM’s internal state is
still determined by its input pins.
Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command.
Then the EXTEST command is used to output the Boundary Scan Register’s contents, in parallel, on the RAM’s data output
drivers on the falling edge of TCK when the controller is in the Update-IR state.
Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruc-
tion is selected, the sate of all the RAM’s input and I/O pins, as well as the default values at Scan Register locations not asso-
ciated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR
state, the RAM’s output pins drive out the value of the Boundary Scan Register location with which each output pin is associ-
ated.
IDCODE
The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and
places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction
loaded in at power up and any time the controller is placed in the Test-Logic-Reset state.
SAMPLE-Z
If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (high-
Z) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR
state.
Rev: 1.02a 6/2013
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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
JTAG TAP Instruction Set Summary
Instruction
EXTEST
Code
000
Description
Notes
1
Places the Boundary Scan Register between TDI and TDO.
Preloads ID Register and places it between TDI and TDO.
IDCODE
001
1, 2
Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO.
Forces all RAM output drivers to High-Z except CQ.
SAMPLE-Z
010
1
GSI
SAMPLE/PRELOAD
GSI
101
100
101
101
111
GSI private instruction.
Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO.
GSI private instruction.
1
1
1
1
1
GSI
GSI private instruction.
BYPASS
Places Bypass Register between TDI and TDO.
Notes:
1. Instruction codes expressed in binary, MSB on left, LSB on right.
2. Default instruction automatically loaded at power-up and in test-logic-reset state.
JTAG Port Recommended Operating Conditions and DC Characteristics
Parameter
Symbol
VILJ
Min.
–0.3
Max.
Unit Notes
0.3 * VDD
VDD +0.3
Test Port Input Low Voltage
V
V
1
1
VIHJ
0.7 * VDD
Test Port Input High Voltage
IINHJ
TMS, TCK and TDI Input Leakage Current
TMS, TCK and TDI Input Leakage Current
TDO Output Leakage Current
Test Port Output High Voltage
Test Port Output Low Voltage
Test Port Output CMOS High
Test Port Output CMOS Low
–300
–1
1
100
1
uA
uA
uA
V
2
IINLJ
3
IOLJ
–1
4
VOHJ
VOLJ
VOHJC
VOLJC
VDD – 0.2
—
0.2
—
0.1
5, 6
5, 7
5, 8
5, 9
—
V
VDD – 0.1
V
—
V
Notes:
1. Input Under/overshoot voltage must be –1 V < Vi < V
+1 V not to exceed 2.4 V maximum, with a pulse width not to exceed 20% tTKC.
DDn
2.
V
V V
ILJ
IN
DDn
ILJn
3. 0 V V V
IN
4. Output Disable, V
= 0 to V
DDn
OUT
5. The TDO output driver is served by the V supply.
DD
6.
7.
8.
9.
I
I
I
I
= –2 mA
OHJ
= + 2 mA
OLJ
= –100 uA
= +100 uA
OHJC
OLJC
Rev: 1.02a 6/2013
23/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
JTAG Port AC Test Conditions
Parameter
Input high level
Input low level
Conditions
JTAG Port AC Test Load
TDO
VDD – 0.2 V
0.2 V
1 V/ns
VDD/2
*
50
30pF
Input slew rate
V
/2
Input reference level
DD
* Distributed Test Jig Capacitance
V
DD/2
Output reference level
Notes:
1. Include scope and jig capacitance.
2. Test conditions as shown unless otherwise noted.
JTAG Port Timing Diagram
tTKC
tTKH
tTKL
TCK
tTH
tTH
tTS
tTS
TDI
TMS
tTKQ
TDO
tTH
tTS
Parallel SRAM input
JTAG Port AC Electrical Characteristics
Parameter
Symbol
tTKC
tTKQ
tTKH
tTKL
tTS
Min
Max
—
Unit
TCK Cycle Time
50
—
ns
ns
ns
ns
ns
ns
TCK Low to TDO Valid
TCK High Pulse Width
TCK Low Pulse Width
TDI & TMS Set Up Time
TDI & TMS Hold Time
20
—
20
20
10
10
—
—
tTH
—
Rev: 1.02a 6/2013
24/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
Package Dimensions—165-Bump FPBGA (Package E)
A1 CORNER
TOP VIEW
BOTTOM VIEW
A1 CORNER
M
M
Ø0.10
C
Ø0.25 C A B
Ø0.40~0.60 (165x)
1
2 3 4 5 6 7 8 9 10 11
11 10 9 8
7 6 5 4 3 2 1
A
B
C
D
E
F
A
B
C
D
E
F
G
H
J
G
H
J
K
L
K
L
M
N
P
R
M
N
P
R
A
1.0
10.0
1.0
15±0.05
B
0.20(4x)
SEATING PLANE
C
Rev: 1.02a 6/2013
25/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
Ordering Information—GSI SigmaDDR-II+ ECCRAM
Speed
(MHz)
2
1
Org
Type
Package
T
Part Number
J
4M x 18
4M x 18
4M x 18
4M x 18
4M x 18
4M x 18
4M x 18
4M x 18
4M x 18
4M x 18
2M x 36
2M x 36
2M x 36
2M x 36
2M x 36
2M x 36
2M x 36
2M x 36
2M x 36
2M x 36
4M x 18
4M x 18
4M x 18
4M x 18
4M x 18
4M x 18
4M x 18
4M x 18
4M x 18
4M x 18
2M x 36
2M x 36
GS8672T20BE-633
GS8672T20BE-550
GS8672T20BE-500
GS8672T20BE-450
GS8672T20BE-400
GS8672T20BE-633I
GS8672T20BE-550I
GS8672T20BE-500I
GS8672T20BE-450I
GS8672T20BE-400I
GS8672T38BE-633
GS8672T38BE-550
GS8672T38BE-500
GS8672T38BE-450
GS8672T38BE-400
GS8672T38BE-633I
GS8672T38BE-550I
GS8672T38BE-500I
GS8672T38BE-450I
GS8672T38BE-400I
GS8672T20BGE-633
GS8672T20BGE-550
GS8672T20BGE-500
GS8672T20BGE-450
GS8672T20BGE-400
GS8672T20BGE-633I
GS8672T20BGE-550I
GS8672T20BGE-500I
GS8672T20BGE-450I
GS8672T20BGE-400I
GS8672T38BGE-633
GS8672T38BGE-550
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
165-bump BGA
165-bump BGA
633
550
500
450
400
633
550
500
450
400
633
550
500
450
400
633
550
500
450
400
633
550
500
450
400
633
550
500
450
400
633
550
C
C
C
C
C
I
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
I
165-bump BGA
I
165-bump BGA
I
165-bump BGA
I
165-bump BGA
C
C
C
C
C
I
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
I
165-bump BGA
I
165-bump BGA
I
165-bump BGA
I
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
C
C
C
C
C
I
I
I
I
I
C
C
Notes:
1. For Tape and Reel add the character “T” to the end of the part number. Example: GS8672TxxBE-500T.
2. C = Commercial Temperature Range. I = Industrial Temperature Range.
Rev: 1.02a 6/2013
26/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8672T20/38BE-633/550/500/450/400
Ordering Information—GSI SigmaDDR-II+ ECCRAM (Continued)
Speed
(MHz)
2
1
Org
Type
Package
T
Part Number
J
2M x 36
2M x 36
2M x 36
2M x 36
2M x 36
2M x 36
2M x 36
2M x 36
GS8672T38BGE-500
GS8672T38BGE-450
GS8672T38BGE-400
GS8672T38BGE-633I
GS8672T38BGE-550I
GS8672T38BGE-500I
GS8672T38BGE-450I
GS8672T38BGE-400I
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
SigmaDDR-II+ B2 ECCRAM
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
500
450
400
633
550
500
450
400
C
C
C
I
I
I
I
I
Notes:
1. For Tape and Reel add the character “T” to the end of the part number. Example: GS8672TxxBE-500T.
2. C = Commercial Temperature Range. I = Industrial Temperature Range.
Revision History
Types of Changes
Format or Content
File Name
Revisions
• Creation of datasheet
• Added 633 MHz
GS8672T20_38B_r1
GS8672T20_38B_r1a
Content
Content
• Added Operating Currents data
• (Rev1.01a: Editorial updates)
• (Rev1.01b: Corrected 165 thermal numbers)
GS8672T20_38B_r1_01
GS8672T20_38B_r1_02
• Updated to reflect MP status
• (Rev1.02a: Removed V reference in Abs Max section)
Content
TIN
Rev: 1.02a 6/2013
27/27
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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