GS880ZV36BGT-333 [GSI]
9Mb Pipelined and Flow Through Synchronous NBT SRAM; 9MB流水线和流量通过同步NBT SRAM型号: | GS880ZV36BGT-333 |
厂家: | GSI TECHNOLOGY |
描述: | 9Mb Pipelined and Flow Through Synchronous NBT SRAM |
文件: | 总23页 (文件大小:575K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
GS880ZV18/36BT-333/300/250/200
100-Pin TQFP
Commercial Temp
Industrial Temp
333 MHz–200 MHz
9Mb Pipelined and Flow Through
Synchronous NBT SRAM
1.8 V V
DD
1.8 V I/O
rail for proper operation. Asynchronous inputs include the
Features
Sleep mode enable (ZZ) and Output Enable. Output Enable can
be used to override the synchronous control of the output
drivers and turn the RAM's output drivers off at any time.
Write cycles are internally self-timed and initiated by the rising
edge of the clock input. This feature eliminates complex off-
chip write pulse generation required by asynchronous SRAMs
and simplifies input signal timing.
• NBT (No Bus Turn Around) functionality allows zero wait
read-write-read bus utilization; Fully pin-compatible with
both pipelined and flow through NtRAM™, NoBL™ and
ZBT™ SRAMs
• 1.8 V +10%/–10% core power supply
• 1.8 V I/O supply
• User-configurable Pipeline and Flow Through mode
• LBO pin for Linear or Interleave Burst mode
• Pin compatible with 2M, 4M, and 18M devices
• Byte write operation (9-bit Bytes)
• 3 chip enable signals for easy depth expansion
• ZZ Pin for automatic power-down
• JEDEC-standard 100-lead TQFP package
• Pb-Free 100-lead TQFP package available
The GS880ZV18/36BT may be configured by the user to
operate in Pipeline or Flow Through mode. Operating as a
pipelined synchronous device, meaning that in addition to the
rising edge triggered registers that capture input signals, the
device incorporates a rising-edge-triggered output register. For
read cycles, pipelined SRAM output data is temporarily stored
by the edge triggered output register during the access cycle
and then released to the output drivers at the next rising edge of
clock.
Functional Description
The GS880ZV18/36BT is a 9Mbit Synchronous Static SRAM.
GSI's NBT SRAMs, like ZBT, NtRAM, NoBL or other
pipelined read/double late write or flow through read/single
late write SRAMs, allow utilization of all available bus
bandwidth by eliminating the need to insert deselect cycles
when the device is switched from read to write cycles.
The GS880ZV18/36BT is implemented with GSI's high
performance CMOS technology and is available in a JEDEC-
Standard 100-pin TQFP package.
Because it is a synchronous device, address, data inputs, and
read/ write control inputs are captured on the rising edge of the
input clock. Burst order control (LBO) must be tied to a power
Paramter Synopsis
-333
-300
-250
-200
Unit
tKQ
2.5
3.0
2.5
3.3
2.5
4.0
3.0
5.0
ns
ns
tCycle
Pipeline
3-1-1-1
Curr (x18)
Curr (x32/x36)
245
275
225
250
195
220
165
185
mA
mA
tKQ
4.5
4.5
5.0
5.0
5.5
5.5
6.5
6.5
ns
ns
tCycle
Flow Through
2-1-1-1
Curr (x18)
Curr (x32/x36)
195
220
180
200
155
175
140
155
mA
mA
Rev: 1.02 3/2005
1/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
GS880ZV18BT 100-Pin TQFP Pinout (Package T)
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
A
NC
NC
1
2
3
4
5
6
7
8
9
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
NC
NC
V
NC
V
DDQ
DDQ
SS
V
NC
DQPA
DQA
DQA
V
V
V
SS
NC
NC
DQB
DQB
512K x 18
Top View
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
V
SS
DDQ
SS
V
DDQ
DQA
DQA
DQB
DQB
V
FT
SS
NC
V
V
DD
DD
V
DD
ZZ
V
SS
DQA
DQA
DQB
DQB
DDQ
V
V
V
DQA
DQA
NC
NC
V
V
NC
NC
NC
DDQ
SS
V
SS
DQB
DQB
DQPB
NC
V
SS
DDQ
SS
V
DDQ
NC
NC
NC
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
Rev: 1.02 3/2005
2/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
GS880ZV36BT 100-Pin TQFP Pinout (Package T)
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
DQPB
DQB
DQPC
DQC
1
2
3
4
5
6
7
8
9
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
DQB
DQC
V
V
V
DDQ
DDQ
SS
V
SS
DQB
DQB
DQB
DQB
DQC
DQC
DQC
DQC
256K x 36
Top View
V
V
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
V
SS
DDQ
SS
V
DDQ
DQB
DQB
DQC
DQC
FT
V
SS
NC
V
V
DD
DD
SS
V
ZZ
DD
V
DQA
DQA
DQD
DQD
V
V
V
DDQ
DDQ
SS
V
SS
DQA
DQA
DQA
DQA
DQD
DQD
DQD
DQD
V
V
SS
DDQ
SS
V
V
DDQ
DQA
DQD
DQA
DQD
DQPA
DQPD
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
Rev: 1.02 3/2005
3/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
100-Pin TQFP Pin Descriptions
Symbol
A0, A1
A
Type
In
Description
Burst Address Inputs; Preload the burst counter
Address Inputs
In
CK
In
Clock Input Signal
BA
In
Byte Write signal for data inputs DQA1–DQA9; active low
Byte Write signal for data inputs DQB1–DQB9; active low
Byte Write signal for data inputs DQC1–DQC9; active low
Byte Write signal for data inputs DQD1–DQD9; active low
Write Enable; active low
BB
In
BC
In
BD
In
W
In
E1
In
Chip Enable; active low
E2
In
Chip Enable; Active High. For self decoded depth expansion
Chip Enable; Active Low. For self decoded depth expansion
Output Enable; active low
E3
In
G
In
ADV
CKE
NC
DQA
DQB
DQC
DQD
ZZ
In
Advance/Load; Burst address counter control pin
Clock Input Buffer Enable; active low
No Connect
In
—
I/O
I/O
I/O
I/O
In
Byte A Data Input and Output pins
Byte B Data Input and Output pins
Byte C Data Input and Output pins
Byte D Data Input and Output pins
Power down control; active high
FT
In
Pipeline/Flow Through Mode Control; active low
Linear Burst Order; active low
LBO
In
V
In
Core power supply
DD
V
In
In
Ground
SS
V
Output driver power supply
DDQ
Rev: 1.02 3/2005
4/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
GS880ZV18/36B NBT SRAM Functional Block Diagram
s
n s e e S A m p
i t r e W D r i v e r
s
Rev: 1.02 3/2005
5/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
Functional Details
Clocking
Deassertion of the Clock Enable (CKE) input blocks the Clock input from reaching the RAM's internal circuits. It may be used to
suspend RAM operations. Failure to observe Clock Enable set-up or hold requirements will result in erratic operation.
Pipeline Mode Read and Write Operations
All inputs (with the exception of Output Enable, Linear Burst Order and Sleep) are synchronized to rising clock edges. Single cycle
read and write operations must be initiated with the Advance/Load pin (ADV) held low, in order to load the new address. Device
activation is accomplished by asserting all three of the Chip Enable inputs (E1, E2 and E3). Deassertion of any one of the Enable
inputs will deactivate the device.
Function
Read
W
H
L
BA
X
BB
X
BC
X
BD
X
Write Byte “a”
Write Byte “b”
Write Byte “c”
Write Byte “d”
Write all Bytes
Write Abort/NOP
L
H
L
H
H
L
H
H
H
L
L
H
H
H
L
L
H
H
L
L
H
L
L
L
L
H
H
H
H
Read operation is initiated when the following conditions are satisfied at the rising edge of clock: CKE is asserted Low, all three
chip enables (E1, E2, and E3) are active, the write enable input signals W is deasserted high, and ADV is asserted low. The address
presented to the address inputs is latched in to address register and presented to the memory core and control logic. The control
logic determines that a read access is in progress and allows the requested data to propagate to the input of the output register. At
the next rising edge of clock the read data is allowed to propagate through the output register and onto the output pins.
Write operation occurs when the RAM is selected, CKE is active, and the Write input is sampled low at the rising edge of clock.
The Byte Write Enable inputs (BA, BB, BC, & BD) determine which bytes will be written. All or none may be activated. A write
cycle with no Byte Write inputs active is a no-op cycle. The pipelined NBT SRAM provides double late write functionality,
matching the write command versus data pipeline length (2 cycles) to the read command versus data pipeline length (2 cycles). At
the first rising edge of clock, Enable, Write, Byte Write(s), and Address are registered. The Data In associated with that address is
required at the third rising edge of clock.
Flow Through Mode Read and Write Operations
Operation of the RAM in Flow Through mode is very similar to operations in Pipeline mode. Activation of a Read Cycle and the
use of the Burst Address Counter is identical. In Flow Through mode the device may begin driving out new data immediately after
new address are clocked into the RAM, rather than holding new data until the following (second) clock edge. Therefore, in Flow
Through mode the read pipeline is one cycle shorter than in Pipeline mode.
Write operations are initiated in the same way, but differ in that the write pipeline is one cycle shorter as well, preserving the ability
to turn the bus from reads to writes without inserting any dead cycles. While the pipelined NBT RAMs implement a double late
write protocol, in Flow Through mode a single late write protocol mode is observed. Therefore, in Flow Through mode, address
and control are registered on the first rising edge of clock and data in is required at the data input pins at the second rising edge of
clock.
Rev: 1.02 3/2005
6/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
Synchronous Truth Table
Operation
Type Address CK CKE ADV W Bx E1 E2 E3 G ZZ DQ Notes
Read Cycle, Begin Burst
Read Cycle, Continue Burst
NOP/Read, Begin Burst
R
B
R
B
W
B
B
D
D
D
External
Next
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L
L
L
L
L
L
L
L
L
L
L
H
L
H
X
H
X
L
X
X
X
X
L
L
X
L
H
X
H
X
H
X
X
X
X
L
L
X
L
L
L
L
L
L
L
L
L
L
L
L
L
Q
Q
1,10
2
External
Next
H
H
X
X
X
X
X
X
High-Z
Dummy Read, Continue Burst
Write Cycle, Begin Burst
H
L
X
L
X
L
High-Z 1,2,10
External
Next
D
D
3
Write Cycle, Continue Burst
Write Abort, Continue Burst
Deselect Cycle, Power Down
Deselect Cycle, Power Down
Deselect Cycle, Power Down
H
H
L
X
X
X
X
X
L
X
X
H
X
X
X
X
X
H
X
1,3,10
Next
H
X
X
X
High-Z 1,2,3,10
High-Z
None
None
L
High-Z
None
L
High-Z
1
Deselect Cycle
D
D
None
L-H
L
L
L
H
L
H
L
X
L
High-Z
Deselect Cycle, Continue
Sleep Mode
None
None
L-H
X
L
X
H
H
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
L
H
L
High-Z
High-Z
-
1
4
Clock Edge Ignore, Stall
Current
L-H
Notes:
1. Continue Burst cycles, whether read or write, use the same control inputs. A Deselect continue cycle can only be entered into if a Dese-
lect cycle is executed first.
2. Dummy Read and Write abort can be considered NOPs because the SRAM performs no operation. A Write abort occurs when the W
pin is sampled low but no Byte Write pins are active so no write operation is performed.
3. G can be wired low to minimize the number of control signals provided to the SRAM. Output drivers will automatically turn off during
write cycles.
4. If CKE High occurs during a pipelined read cycle, the DQ bus will remain active (Low Z). If CKE High occurs during a write cycle, the bus
will remain in High Z.
5. X = Don’t Care; H = Logic High; L = Logic Low; Bx = High = All Byte Write signals are high; Bx = Low = One or more Byte/Write
signals are Low
6. All inputs, except G and ZZ must meet setup and hold times of rising clock edge.
7. Wait states can be inserted by setting CKE high.
8. This device contains circuitry that ensures all outputs are in High Z during power-up.
9. A 2-bit burst counter is incorporated.
10. The address counter is incriminated for all Burst continue cycles.
Rev: 1.02 3/2005
7/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
Pipeline and Flow Through Read Write Control State Diagram
D
B
Deselect
R
D
D
W
New Read
New Write
R
R
W
B
B
R
W
W
R
Burst Read
Burst Write
B
B
D
D
Key
Notes:
Input Command Code
1. The Hold command (CKE Low) is not
shown because it prevents any state change.
ƒ
Transition
2. W, R, B and D represent input command
codes ,as indicated in the Synchronous Truth Table.
Current State (n)
Next State (n+1)
n
n+1
n+2
n+3
Clock (CK)
Command
ƒ
ƒ
ƒ
ƒ
Current State
Next State
Current State and Next State Definition for Pipeline and Flow Through Read/Write Control State Diagram
Rev: 1.02 3/2005
8/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
Pipeline Mode Data I/O State Diagram
Intermediate
Intermediate
R
W
B
Intermediate
B
R
Data Out
(Q Valid)
High Z
(Data In)
W
D
Intermediate
D
Intermediate
W
R
High Z
B
D
Intermediate
Key
Notes:
Input Command Code
1. The Hold command (CKE Low) is not
shown because it prevents any state change.
ƒ
Transition
Transition
2. W, R, B, and D represent input command
codes as indicated in the Truth Tables.
Current State (n)
Next State (n+2)
Intermediate State (N+1)
n
n+1
n+2
n+3
Clock (CK)
Command
ƒ
ƒ
ƒ
ƒ
Intermediate
State
Current State
Next State
Current State and Next State Definition for Pipeline Mode Data I/O State Diagram
Rev: 1.02 3/2005
9/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
Flow Through Mode Data I/O State Diagram
R
W
B
B
R
Data Out
(Q Valid)
High Z
(Data In)
W
D
D
W
R
High Z
B
D
Key
Notes
Input Command Code
1. The Hold command (CKE Low) is not
shown because it prevents any state change.
ƒ
Transition
2. W, R, B and D represent input command
codes as indicated in the Truth Tables.
Current State (n)
Next State (n+1)
n
n+1
n+2
n+3
Clock (CK)
Command
ƒ
ƒ
ƒ
ƒ
Current State
Next State
Current State and Next State Definition for: Pipeline and Flow Through Read Write Control State Diagram
Rev: 1.02 3/2005
10/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
Burst Cycles
Although NBT RAMs are designed to sustain 100% bus bandwidth by eliminating turnaround cycle when there is transition from
read to write, multiple back-to-back reads or writes may also be performed. NBT SRAMs provide an on-chip burst address
generator that can be utilized, if desired, to further simplify burst read or write implementations. The ADV control pin, when
driven high, commands the SRAM to advance the internal address counter and use the counter generated address to read or write
the SRAM. The starting address for the first cycle in a burst cycle series is loaded into the SRAM by driving the ADV pin low, into
Load mode.
Burst Order
The burst address counter wraps around to its initial state after four addresses (the loaded address and three more) have been
accessed. The burst sequence is determined by the state of the Linear Burst Order pin (LBO). When this pin is low, a linear burst
sequence is selected. When the RAM is installed with the LBO pin tied high, Interleaved burst sequence is selected. See the tables
below for details.
Mode Pin Functions
Mode Name
Pin Name
State
Function
Linear Burst
Interleaved Burst
Flow Through
Pipeline
L
Burst Order Control
LBO
H
L
Output Register Control
Power Down Control
FT
ZZ
H or NC
L or NC
H
Active
Standby, I = I
DD SB
Note:
Thereis a pull-up device onthe FT pin and a pull-down device on the ZZ pin, so this input pin can be unconnected and the chip will operate in
the default states as specified in the above tables.
Burst Counter Sequences
Linear Burst Sequence
A[1:0] A[1:0] A[1:0] A[1:0]
Interleaved Burst Sequence
A[1:0] A[1:0] A[1:0] A[1:0]
1st address
2nd address
3rd address
4th address
00
01
10
11
01
10
11
00
10
11
00
01
11
00
01
10
1st address
2nd address
3rd address
4th address
00
01
10
11
01
00
11
10
10
11
00
01
11
10
01
00
Note:
The burst counter wraps to initial state on the 5th clock.
Note:
The burst counter wraps to initial state on the 5th clock.
BPR 1999.05.18
Rev: 1.02 3/2005
11/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
Sleep Mode
During normal operation, ZZ must be pulled low, either by the user or by it’s internal pull down resistor. When ZZ is pulled high,
the SRAM will enter a Power Sleep mode after 2 cycles. At this time, internal state of the SRAM is preserved. When ZZ returns to
low, the SRAM operates normally after ZZ recovery time.
Sleep mode is a low current, power-down mode in which the device is deselected and current is reduced to I 2. The duration of
SB
Sleep mode is dictated by the length of time the ZZ is in a high state. After entering Sleep mode, all inputs except ZZ become
disabled and all outputs go to High-Z The ZZ pin is an asynchronous, active high input that causes the device to enter Sleep mode.
When the ZZ pin is driven high, I 2 is guaranteed after the time tZZI is met. Because ZZ is an asynchronous input, pending
SB
operations or operations in progress may not be properly completed if ZZ is asserted. Therefore, Sleep mode must not be initiated
until valid pending operations are completed. Similarly, when exiting Sleep mode during tZZR, only a deselect or read commands
may be applied while the SRAM is recovering from Sleep mode.
Sleep Mode Timing Diagram
tKH
tKC
tKL
CK
ZZ
tZZR
tZZS
tZZH
Designing for Compatibility
The GSI NBT SRAMs offer users a configurable selection between Flow Through mode and Pipeline mode via the FT signal
found on Pin 14. Not all vendors offer this option, however most mark Pin 14 as V or V
on pipelined parts and V on flow
SS
DD
DDQ
through parts. GSI NBT SRAMs are fully compatible with these sockets.
Pin 66, a No Connect (NC) on GSI’s GS880ZV18B/36 NBT SRAM, the Parity Error open drain output on GSI’s GS881Z18/36B
NBT SRAM, is often marked as a power pin on other vendor’s NBT compatible SRAMs. Specifically, it is marked V or V
DD
DDQ
on pipelined parts and V on flow through parts. Users of GSI NBT devices who are not actually using the ByteSafe™ parity
SS
feature may want to design the board site for the RAM with Pin 66 tied high through a 1k ohm resistor in Pipeline mode
applications or tied low in Flow Through mode applications in order to keep the option to use non-configurable devices open. By
using the pull-up resistor, rather than tying the pin to one of the power rails, users interested in upgrading to GSI’s ByteSafe NBT
SRAMs (GS881Z18/36B), featuring Parity Error detection and JTAG Boundary Scan, will be ready for connection to the active
low, open drain Parity Error output driver at Pin 66 on GSI’s TQFP ByteSafe RAMs.
Rev: 1.02 3/2005
12/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
Absolute Maximum Ratings
(All voltages reference to V )
SS
Symbol
Description
Value
Unit
V
V
Voltage on V Pins
–0.5 to 3.6
DD
DD
V
Voltage in V
Pins
DDQ
–0.5 to 3.6
V
DDQ
V
–0.5 to V
+0.5 (≤ 3.6 V max.)
DDQ
Voltage on I/O Pins
Voltage on Other Input Pins
Input Current on Any Pin
Output Current on Any I/O Pin
Package Power Dissipation
Storage Temperature
V
I/O
V
–0.5 to V +0.5 (≤ 3.6 V max.)
V
IN
DD
I
+/–20
+/–20
mA
mA
W
IN
I
OUT
P
1.5
D
o
T
–55 to 125
–55 to 125
C
STG
o
T
Temperature Under Bias
C
BIAS
Note:
Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended
Operating Conditions. Exposure to conditions exceeding the Absolute Maximum Ratings, for an extended period of time, may affect reliability of
this component.
Power Supply Voltage Ranges
Parameter
Symbol
Min.
1.6
Typ.
1.8
Max.
2.0
Unit
V
Notes
V
1.8 V Supply Voltage
DD
1.8 V V
I/O Supply Voltage
V
1.6
1.8
2.0
V
DDQ
DDQ
Notes:
1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-
tions quoted are evaluated for worst case in the temperature range marked on the device.
2. Input Under/overshoot voltage must be –2 V > Vi < V +2 V not to exceed 3.6 V maximum, with a pulse width not to exceed 20% tKC.
DDn
Recommended Operating Temperatures
Parameter
Symbol
Min.
0
Typ.
25
Max.
70
Unit
°C
Notes
T
Ambient Temperature (Commercial Range Versions)
2
2
A
T
Ambient Temperature (Industrial Range Versions)
–40
25
85
°C
A
Notes:
1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-
tions quoted are evaluated for worst case in the temperature range marked on the device.
2. Input Under/overshoot voltage must be –2 V > Vi < V +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
DDn
Rev: 1.02 3/2005
13/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
Logic Levels
Parameter
Symbol
Min.
Typ.
—
Max.
Unit
Notes
V
Input High Voltage
Input Low Voltage
V
0.6*V
V
+ 0.3
DD
V
V
V
V
1
DD
IH
DD
V
V
0.3*V
DD
–0.3
—
1
DD
IL
V
I/O Input High Voltage
I/O Input Low Voltage
V
0.6*V
V
+ 0.3
DDQ
—
1,3
1,3
DDQ
IHQ
DD
V
V
0.3*V
DD
–0.3
—
DDQ
ILQ
Notes:
1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-
tions quoted are evaluated for worst case in the temperature range marked on the device.
2. Input Under/overshoot voltage must be –2 V > Vi < V +2 V not to exceed 3.6 V maximum, with a pulse width not to exceed 20% tKC.
DDn
3.
V
(max) is voltage on V
pins plus 0.3 V.
IHQ
DDQ
Undershoot Measurement and Timing
Overshoot Measurement and Timing
V
IH
20% tKC
V
+ 2.0 V
50%
DD
V
SS
50%
V
DD
V
– 2.0 V
SS
20% tKC
V
IL
Capacitance
o
(T = 25 C, f = 1 MHZ, V = 2.5 V)
A
DD
Parameter
Symbol
Test conditions
Typ.
Max.
Unit
pF
C
V
= 0 V
Input Capacitance
4
6
5
7
IN
IN
C
V
OUT
= 0 V
Input/Output Capacitance
pF
I/O
Note:
These parameters are sample tested.
Rev: 1.02 3/2005
14/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
AC Test Conditions
Parameter
Conditions
V
– 0.2 V
Input high level
Input low level
DD
0.2 V
1 V/ns
/2
Input slew rate
V
Input reference level
DD
V
/2
Output reference level
Output load
DDQ
Fig. 1
Notes:
1. Include scope and jig capacitance.
2. Test conditions as specified with output loading as shown in Fig. 1
unless otherwise noted.
3. Device is deselected as defined by the Truth Table.
Output Load 1
DQ
*
50Ω
30pF
V
DDQ/2
* Distributed Test Jig Capacitance
DC Electrical Characteristics
Parameter
Symbol
Test Conditions
Min
Max
Input Leakage Current
(except mode pins)
I
V = 0 to V
IN DD
–1 uA
1 uA
IL
V
≥ V ≥ V
IN
–1 uA
–1 uA
1 uA
100 uA
DD
IH
IH
I
I
ZZ Input Current
FT Input Current
IN1
IN2
0 V ≤ V ≤ V
IN
V
≥ V ≥ V
IN
–100 uA
–1 uA
1 uA
1 uA
DD
IL
IL
0 V ≤ V ≤ V
IN
I
Output Disable, V
= 0 to V
= 1.6 V
Output Leakage Current
Output High Voltage
Output Low Voltage
–1 uA
1 uA
—
OL
OUT
DD
V
I
= –4 mA, V
V
– 0.4 V
DDQ
OH1
OH
DDQ
V
I
= 4 mA, V = 1.6 V
OL DD
—
0.4 V
OL1
Rev: 1.02 3/2005
15/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
Operating Currents
-333
-300
-250
-200
0
to
–40
0
to
–40
0
to
–40
0
to
–40
Parameter
Test Conditions
Mode
Symbol
Unit
to
to
to
to
70°C 85°C 70°C 85°C 70°C 85°C 70°C 85°C
IDD
250
25
270
25
230
20
250
20
200
20
220
20
170
15
190
15
Pipeline
mA
mA
mA
mA
IDDQ
(x32/
x36)
IDD
Flow
Through
205
15
225
15
185
15
205
15
160
15
180
15
140
15
160
15
Device Selected;
All other inputs
≥VIH or ≤ VIL
IDDQ
Operating
Current
IDD
230
15
250
15
210
15
230
15
185
10
205
10
155
10
175
10
Pipeline
Output open
IDDQ
(x18)
IDD
Flow
Through
185
10
205
10
170
10
190
10
145
10
165
10
130
10
150
10
IDDQ
ISB
ISB
IDD
IDD
Pipeline
40
40
95
65
50
50
40
40
90
60
50
50
95
65
40
40
85
60
50
50
90
65
40
40
75
50
50
50
80
55
mA
mA
mA
mA
Standby
Current
ZZ ≥ VDD – 0.2 V
—
—
Flow
Through
Pipeline
100
60
Device Deselected;
All other inputs
≥ VIH or ≤ VIL
Deselect
Current
Flow
Through
Notes:
1.
2. All parameters listed are worst case scenario.
I
and I
apply to any combination of V , V , V
, and V
operation.
DD
DDQ
DD3 DD2 DDQ3
DDQ2
Rev: 1.02 3/2005
16/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
AC Electrical Characteristics
-333
-300
-250
-200
Parameter
Symbol
Unit
Min
3.0
—
Max
—
2.5
—
—
—
—
—
4.5
—
—
—
—
—
Min
3.3
—
Max
—
2.5
—
—
—
—
—
5.0
—
—
—
—
—
Min
4.0
—
Max
—
2.5
—
—
—
—
—
5.5
—
—
—
—
—
Min
5.0
—
Max
—
3.0
—
—
—
—
—
6.5
—
—
—
—
—
Clock Cycle Time
Clock to Output Valid
Clock to Output Invalid
tKC
tKQ
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tKQX
1.5
1.5
1.0
0.1
4.5
—
1.5
1.5
1.0
0.1
5.0
—
1.5
1.5
1.2
0.2
5.5
—
1.5
1.5
1.4
0.4
6.5
—
Pipeline
tLZ1
tS
Clock to Output in Low-Z
Setup time
Hold time
tH
Clock Cycle Time
Clock to Output Valid
tKC
tKQ
tKQX
Clock to Output Invalid
Clock to Output in Low-Z
Setup time
2.0
2.0
1.3
0.3
1.0
2.0
2.0
1.4
0.4
1.0
2.0
2.0
1.5
0.5
1.3
2.0
2.0
1.5
0.5
1.3
Flow
Through
tLZ1
tS
Hold time
tH
Clock HIGH Time
tKH
Clock LOW Time
tKL
1.2
1.5
—
1.2
1.5
—
1.5
1.5
—
1.5
1.5
—
ns
ns
Clock to Output in
High-Z
tHZ1
2.5
2.5
2.5
3.0
G to Output Valid
G to output in Low-Z
G to output in High-Z
ZZ setup time
tOE
—
0
2.5
—
2.5
—
—
—
—
0
2.5
—
2.5
—
—
—
—
0
2.5
—
2.5
—
—
—
—
0
3.0
—
3.0
—
—
—
ns
ns
ns
ns
ns
ns
tOLZ1
tOHZ1
tZZS2
tZZH2
tZZR
—
5
—
5
—
5
—
5
ZZ hold time
1
1
1
1
ZZ recovery
20
20
20
20
Notes:
1. These parameters are sampled and are not 100% tested.
2. ZZ is an asynchronous signal. However, in order to be recognized on any given clock cycle, ZZ must meet the specified setup and hold
times as specified above.
Rev: 1.02 3/2005
17/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
Pipeline Mode Timing (NBT)
Write A
Write B
Write B+1
tKL
tKH
Read C
tKC
Cont
Read D
Write E
Read F
Write G
Deselect
CK
CKE
tH
tH
tH
tH
tH
tH
tS
tS
tS
tS
tS
tS
E*
ADV
W
Bn
A0–An
DQa–DQd
A
B
C
D
E
F
G
tH
tLZ
tHZ
tS
D(A)
tKQ
tKQX
D(B)
D(B+1)
Q(C)
Q(D)
D(E)
Q(F)
D(G)
tOLZ
tOHZ
tOE
G
*Note: E = High(False) if E1 = 1 or E2 = 0 or E3 = 1
Rev: 1.02 3/2005
18/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
Flow Through Mode Timing (NBT)
Write A
Write B
Write B+1
tKL
tKH
Read C
tKC
Cont
Read D
Write E
Read F
Write G
CK
CKE
E*
tH
tH
tH
tH
tH
tH
tS
tS
tS
tS
tS
tS
ADV
W
Bn
A0–An
DQ
A
B
C
D
E
F
G
tH
tKQ
tLZ
tKQX
tKQ
tLZ
tS
D(A)
tHZ
tKQX
D(B)
D(B+1)
Q(C)
Q(D)
D(E)
Q(F)
D(G)
tOLZ
tOE
tOHZ
G
*Note: E = High(False) if E1 = 1 or E2 = 0 or E3 = 1
Rev: 1.02 3/2005
19/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
TQFP Package Drawing (Package T)
θ
L
c
L1
Symbol
Description
Standoff
Min. Nom. Max
A1
A2
b
0.05
1.35
0.20
0.09
0.10
1.40
0.30
—
0.15
1.45
0.40
0.20
22.1
20.1
16.1
14.1
—
Body Thickness
Lead Width
c
Lead Thickness
D
Terminal Dimension 21.9
Package Body 19.9
Terminal Dimension 15.9
22.0
20.0
16.0
14.0
0.65
0.60
1.00
e
D1
E
b
E1
e
Package Body
Lead Pitch
13.9
—
L
Foot Length
Lead Length
Coplanarity
Lead Angle
0.45
—
0.75
—
L1
Y
A1
A2
E1
E
0.10
7°
θ
0°
—
Notes:
1. All dimensions are in millimeters (mm).
2. Package width and length do not include mold protrusion.
Rev: 1.02 3/2005
20/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
Ordering Information—GSI NBT Synchronous SRAM
2
Speed
3
1
Org
Type
Package
Status
T
Part Number
A
(MHz/ns)
512K x 18
512K x 18
512K x 18
512K x 18
256K x 36
256K x 36
256K x 36
256K x 36
512K x 18
512K x 18
512K x 18
512K x 18
256K x 36
256K x 36
256K x 36
256K x 36
512K x 18
512K x 18
512K x 18
512K x 18
256K x 36
GS880ZV18BT-333
GS880ZV18BT-300
GS880ZV18BT-250
GS880ZV18BT-200
GS880ZV36BT-333
GS880ZV36BT-300
GS880ZV36BT-250
GS880ZV36BT-200
GS880ZV18BT-333I
GS880ZV18BT-300I
GS880ZV18BT-250I
GS880ZV18BT-200I
GS880ZV36BT-333I
GS880ZV36BT-300I
GS880ZV36BT-250I
GS880ZV36BT-200I
GS880ZV18BGT-333
GS880ZV18BGT-300
GS880ZV18BGT-250
GS880ZV18BGT-200
GS880ZV36BGT-333
GS880ZV36BGT-300
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
TQFP
TQFP
333/4.5
300/5
C
C
C
C
C
C
C
C
I
TQFP
250/5.5
200/6.5
333/4.5
300/5
TQFP
TQFP
TQFP
TQFP
250/5.5
200/6.5
333/4.5
300/5
TQFP
TQFP
TQFP
I
TQFP
250/5.5
200/6.5
333/4.5
300/5
I
TQFP
I
TQFP
I
TQFP
I
TQFP
250/5.5
200/6.5
333/4.5
300/5
I
TQFP
I
Pb-free TQFP
Pb-free TQFP
Pb-free TQFP
Pb-free TQFP
Pb-free TQFP
Pb-free TQFP
C
C
C
C
C
C
250/5.5
200/6.5
333/4.5
300/5
256K x 36
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: Gs880ZV18BT-200IT.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3. T = C = Commercial Temperature Range. T = I = Industrial Temperature Range.
A
A
4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are
covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings
Rev: 1.02 3/2005
21/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
Ordering Information—GSI NBT Synchronous SRAM
2
Speed
3
1
Org
Type
Package
Status
T
Part Number
A
(MHz/ns)
256K x 36
256K x 36
512K x 18
512K x 18
512K x 18
512K x 18
256K x 36
256K x 36
256K x 36
GS880ZV36BGT-250
GS880ZV36BGT-200
GS880ZV18BGT-333I
GS880ZV18BGT-300I
GS880ZV18BGT-250I
GS880ZV18BGT-200I
GS880ZV36BGT-333I
GS880ZV36BGT-300I
GS880ZV36BGT-250I
GS880ZV36BGT-200I
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
NBT Pipeline/Flow Through
Pb-free TQFP
Pb-free TQFP
Pb-free TQFP
Pb-free TQFP
Pb-free TQFP
Pb-free TQFP
Pb-free TQFP
Pb-free TQFP
Pb-free TQFP
Pb-free TQFP
250/5.5
200/6.5
333/4.5
300/5
C
C
I
I
250/5.5
200/6.5
333/4.5
300/5
I
I
I
I
250/5.5
200/6.5
I
256K x 36
I
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: Gs880ZV18BT-200IT.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3. T = C = Commercial Temperature Range. T = I = Industrial Temperature Range.
A
A
4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are
covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings
Rev: 1.02 3/2005
22/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS880ZV18/36BT-333/300/250/200
9Mb Sync SRAM Data Sheet Revision History
DS/DateRev. Code: Old;
New
Types of Changes
Format or Content
Page;Revisions;Reason
• Creation of new datasheet
880ZVxxB_r1
• Added Pb-free information for TQFP
880ZVxxB_r1;
Content/Format
Content
880ZVxxB_r1_01
• 150 MHz speed bin removed
880ZVxxB_r1_01;
880ZVxxB_r1_02
Rev: 1.02 3/2005
23/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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